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Abrading May archived by USPTO category 05/09

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
05/28/2009 > patent applications in patent subcategories. archived by USPTO category

20090137187 - Diagnostic methods during cmp pad dressing and associated systems: A system for in-situ monitoring at least one aspect of a chemical mechanical planarization process can include a CMP pad, CMP pad dresser with at least a translucent portion, and an optical sensor. The optical sensor can be configured to optically engage the CMP pad through the translucent portion of... Agent: Thorpe North & Western, LLP.

20090137188 - Polishing pad: A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side). A method for manufacturing a semiconductor device includes a process of polishing the surface of a semiconductor wafer with this polishing pad. The polishing pad has a polishing layer containing a... Agent: Morrison & Foerster LLP

20090137189 - Polishing pad: An object of the present invention is to provide a polishing pad excellent in optical detection accuracy in a broad wavelength range (particularly at the short-wavelength side) and capable of preventing a slurry from leaking from the boundary between a polishing region and a light-transmitting region. Disclosed is a polishing... Agent: Morrison & Foerster LLP

20090137190 - Method and apparatus for dressing polishing pad, profile measuring method, substrate polishing apparatus, and substrate polishing method: The present invention provides a dressing method of dressing a polishing pad used in a polishing apparatus for polishing a substrate. This method includes repetitively moving the dresser on an upper surface of the polishing pad in a radial direction of the polishing pad so as to perform a dressing... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090137191 - Copper cmp polishing pad cleaning composition comprising of amidoxime compounds: The present invention relates to methods of using amidoxime compositions for cleaning polishing pads, particularly after chemical mechanical planarization or polishing is provided. A polishing pad is cleaned of Cu CMP by-products, subsequent to or during planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a... Agent: Morgan Lewis & Bockius LLP

20090137192 - Multi-zone pressure control system: A pressure control system that controls the pressure of a fluid in a plurality of zones includes a distribution manifold, at least one main manifold connected to the distribution manifold, and at least one disposable manifold connected to the distribution manifold and the main manifold. The disposable manifold is adapted... Agent: Mcdermott Will & Emery LLP

20090137193 - Centrifugally projecting machine: p

20090137194 - Polishing tool: There is provided a polishing tool which enables a polishing surface thereof to be in surface contact with a to-be-polished surface over a wide area of the polishing surface when polishing a corner portion, and which can reduce an impact of a polishing member caused when the polishing member hits... Agent: Wenderoth, Lind & Ponack, L.L.P.

  
05/21/2009 > patent applications in patent subcategories. archived by USPTO category

20090130955 - Loading device of chemical mechanical polishing equipment for semiconductor wafers: A loading device of chemical mechanical polishing (CMP) equipment for processing semiconductor wafers is provided. The loading device includes a loading cup having a cup-like bath, a cup plate installed in the bath, and a loading plate supported on the cup plate for absorbing shock and seating the wafer. A... Agent: Leydig Voit & Mayer, Ltd

20090130956 - Polishing apparatus and polishing method: A polishing apparatus makes it possible to polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering of the throughput. The polishing apparatus includes: a polishing table having a polishing surface; a top ring for holding a workpiece having a surface conductive film, and... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090130958 - Fixed abrasive pad having different real contact areas and fabrication method thereof: Disclosed is a method for fabricating a fixed abrasive pad in use of a chemical mechanical polishing process. The method includes: forming one or more etching molds providing a plurality of different real contact areas; attaching the etching mold(s) to a roller or press; and forming a fixed abrasive pad... Agent: The Law Offices Of Andrew D. Fortney, Ph.d., P.C.

20090130957 - System, method and apparatus for lapping workpieces with soluble abrasives: A soluble abrasive is used to lap workpieces to overcome the problem of embedding and retaining abrasive particles in the workpieces. The soluble abrasives are dissolved from the workpiece even if they become embedded in the workpiece. For example, the abrasives may be dissolved with water and comprise ionic salts.... Agent: Bracewell & Giuliani LLP

20090130959 - Blasting method and blasting machine: In blasting with an abrasive containing liquid to confer elasticity, the abrasive from which liquid evaporates in the course of continuance use is uniformly supplied with liquid. Liquid for swelling an elastic abrasive is sprayed in an air flow for transporting the abrasive in a blasting machine 1 including an... Agent: Mathews, Shepherd, Mckay, & Bruneau, P.A.

20090130960 - Method for producing a semiconductor wafer with a polished edge:

20090130961 - Hand-held power tool system: The invention relates to a portable power tool system comprising a portable power tool (12a-n), especially an angle grinder, a protective hood unit (14a-n) and a protective hood anti-rotation lock (16a-n) for providing anti-rotational locking between the protective hood unit (14a-n) and the portable power tool (12a-n) in the event... Agent: Michael J. Striker

  
05/14/2009 > patent applications in patent subcategories. archived by USPTO category

20090124169 - Cnc abrasive fluid-jet milling: A method and apparatus for milling a desired pocket in a solid workpiece uses an abrasive fluid-jet by moving and suitably orienting the abrasive fluid-jet relative to the workpiece. The method includes defining a path of the abrasive fluid-jet necessary to mill a desired pocket in the solid workpiece. The... Agent: Davis Wright Tremaine, LLP/seattle

20090124170 - Bit sharpening apparatus and method of using: Also disclosed is a sharpening apparatus for a cutting bit having a flat face comprising grinding wheel having a shaft and a flat annular grinding surface perpendicular to said shaft; a bit holder adapted to hold said cutting bit and to orient the bit flat face into a plane that... Agent: Richard H. Thomas

20090124171 - Grinding machine: Grinding machine with a machine bed, with a tool carriage that is linearly movable on the machine bed in a Y-axis, with a tool spindle, which is mounted in the tool carriage so as to rotate around an X-axis that is perpendicular to the Y-axis, and which can be rotationally... Agent: The Nath Law Group

20090124172 - Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, kit for chemical mechanical polishing, and kit for preparing aqueous dispersion for chemical mechanical polishing: i

20090124173 - Compositions and methods for ruthenium and tantalum barrier cmp: This invention provides a chemical-mechanical polishing composition comprising an abrasive, an aqueous carrier, an oxidizing agent having a standard reduction potential of greater than 0.7 V and less than 1.3 V relative to a standard hydrogen electrode, and optionally a source of borate anions, with the proviso that when the... Agent: Steven Weseman Associate General Counsel, I.p.

20090124174 - Substrate treating method and substrate treating apparatus: A substrate treating method includes rotating a substrate in a circumferential direction and polishing a peripheral portion of the substrate by pressing a polishing member to it using a pressing mechanism having a pressing pad. An angle of at least a part of the pressing pad with respect to an... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20090124175 - Double-side polishing method for wafer: There is provided a double-side polishing method for a wafer of sandwiching a wafer held in a carrier between upper and lower turn tables each having a polishing pad attached thereto and simultaneously polishing both surfaces of the wafer while supplying a slurry to a space between the upper and... Agent: Oliff & Berridge, PLC

20090124176 - Removable polishing pad for chemical mechanical polishing: The present invention offers a device for rendering CMP polishing pads easily and temporarily removable from and replaceable upon the platen of a CMP polishing apparatus comprising two sheets, the upper sheet attached to the said CMP polishing pad and the lower attached to the said platen, the said two... Agent: Sughrue Mion, PLLC

20090124177 - Vacuum-assisted sanding block: A vacuum-assisted sanding device removably connectable to a conventional sanding pad of the type used with mechanical sanders. The sanding device may include a swiveling connection tube for connecting dust removal channels and a recess of a handle block of the sanding device to a vacuum system. The manual sanding... Agent: Ruden, Mcclosky, Smith, Schuster & Russell, P.A.

20090124178 - Abrasive waterjet type cutting apparatus: A cutting apparatus includes a fixing table where a position of an encapsulated body that is an example of a workpiece is fixed, and a nozzle from which an abrasive waterjet containing abrasive grains for cutting the encapsulated body is sprayed out. The fixing table includes a plurality of protrusions... Agent: Birch Stewart Kolasch & Birch

20090124179 - Oscillating grinding machine: The present invention relates particularly to an oscillating grinding machine. The grinding machine comprises a driving motor (3) surrounded by a body (3), and a drive shaft (4) cooperating with the driving motor. The drive shaft comprises a grinding head (5) that constitutes a support for a grinding product (8).... Agent: Altera Law Group, LLC

20090124180 - Counter-balanced cup brush head assembly: An assembly for surface finishing, comprising a pair of heads which are movable on linear slides. Each head comprises a series of cup brushes that finish the surface of the workpiece. The two heads are tied to a single motor/gearbox combination by a crankshaft which allows each head to move... Agent: Moore & Hansen, Pllp

20090124181 - Knife blade dressing apparatus: A dressing device for sharpening or conditioning of a blade or the like includes one or more disk pairs each having a pair of disks respectively presenting a plurality of ribs. The disks are oriented in face-to-face relationship with the ribs thereof in meshed, intercalated relationship to thereby create circumferential... Agent: Hovey Williams LLP

20090124182 - Dust collection and containment in a rotary floor sanding machine: A rotary floor sanding machine has a vertically oriented bell housing with a backside floor support and a dust suction port for removing dust from within. The bell housing encloses the sides and backside of a disk casing and rotary sanding pad. The floor support is configured to place the... Agent: Vern Maine & Associates

20090124183 - Pneumatic adjustable sanding device: An attachment for an oscillatory sanding or abrading device has a pair of flexible support members for supporting the sanding or abrading material. The initial radius of curvature of the flexible support member may be adjusted by a pneumatic adjustment mechanism. An opposing pair of generally cylindrical bladders are disposed... Agent: Alfred F. Hoyte, Esq.

20090124184 - Thumb-operated detachable liquid polish dispenser for a hand-held surface finishing power tool: An elongated liquid polish dispenser which can be longitudinally attached to a hand-held rotary buffer such that a thumb switch to operate the dispenser is placed opposite a trigger on the buffer's handle is described. The dispenser can be firmly attached by a built-in strap to several popular models of... Agent: Townsend And Townsend And Crew, LLP

  
05/07/2009 > patent applications in patent subcategories. archived by USPTO category

20090117827 - Grinding machine, computer software to operate such a machine, and their uses therefore: An extremely precise computer controlled grinding machine having the capability to write its own computer programs for controlling the grinding machine to perform individual tasks, including both grinding and dressing to several millionths of an inch. A new device for dressing is included which is directly on the machine, alleviating... Agent: Cargill & Associates, P.l.l.c.

20090117828 - Polishing apparatus and substrate processing apparatus: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing (3) for forming a polishing chamber (2) therein, a rotational table... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090117829 - Polishing slurry for metal, and polishing method: A polishing slurry for metal comprises an oxidizer, a metal oxide dissolving agent, a metal inhibitor, and water, wherein the metal inhibitor is at least one of a compound having an amino-triazole skeleton and a compound having an imidazole skeleton. The use of the polishing slurry for metal makes it... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20090117830 - Ophthalmic roughing wheel: Ophthalmic rough-cut and polishing wheels having a plurality of swarf clearance grooves formed across the shaping face are described. The grooves are spaced around the shaping face of the wheels, wherein the slots are configured so as to be substantially angled either towards or away from one another.... Agent: Warn Partners P.C.

20090117831 - Method of manufacturing treatment device and treatment device: A tapered cutting edge portion and a continuous raised portion from the tapered cutting edge portion are ground in an edge portion of a straight grinding raw material so that an eccentricity is not generated. In a method for grinding a treatment device, one end portion of a tapered grinding... Agent: Townsend & Banta C/o Portfolio Ip

20090117832 - Wafer polishing method: A wafer polishing method is provided. First, a wafer, having a first surface, a second surface, and a plurality of opening portions depressed on the first surface, is provided. A plastic adhesive is filled in the opening portions and cured later. A polishing step is performed to thin the thickness... Agent: J C Patents, Inc.

20090117833 - Floor sanding machine: A floor sanding machine (1) has a frame (1) which carries on its underside a motor-driven, vertically adjustable sanding plate (4) with a sanding disk, an annular dust suction nozzle (11) which surrounds the sanding plate, and two front running wheels (13) and a rear wheel (14) which support the... Agent: Cohen, Pontani, Lieberman & Pavane LLP

20090117834 - Heatless slurry system: A heatless slurry system for use with a glass removal apparatus for restoring a glass surface. The system comprises a slurry container and a pump mounted externally relative to the container to prevent heating of the slurry as the system is operated. Vacuum pressure is created by activation of the... Agent: Goudreau Gage Dubuc

20090117835 - Expandable polishing platen device: An expandable polishing platen device is disclosed, in which a polishing platen top includes a plurality of separate platen top sections. When the polishing platen device is not in an expanded configuration, the polishing platen top has a surface constructed from the surfaces of a first group of platen top... Agent: North America Intellectual Property Corporation

20090117836 - Holder for sanding block: A holder for releasably retaining an abrasive block includes a base having a bottom surface and a wall extending outward therefrom which together define a abrasive block receiving surface to friction fit receive the abrasive block, and a polyfoam handle connected to the base and which extends upward from a... Agent: A Patent Lawyer Corp, PLC R William Graham

20090117837 - Cmp pad and method for manufacturing the same: Embodiments relate to a chemical mechanical polishing (CMP) pad. According to embodiments, a CMP pad may include a pad body having a series of concave and convex patterns and a chemical reactant formed on and/or over the pad body. The CMP pad may uniformly perform a CMP process without using... Agent: Sherr & Vaughn, PLLC

20090117838 - Precision ceramic whetstone: The aim of the present invention is to provide a ceramic whetstone (3) which can accelerate sharpening cutlery smoothly. The ceramic whetstone (3) includes a rectilinear shaped stick (30) having a plastic nut (31) at a first end, a plastic handle (32) at a second end. A bump (311) disposed... Agent: Sally Chang

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