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Abrading April category listing, related patent applications 04/09

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
04/30/2009 > patent applications in patent subcategories.

20090111358 - Polishing apparatus and polishing method: The present invention provides a apparatus for polishing an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090111359 - Polishing composition for hard disk substrate: A polishing composition for a hard disk substrate includes alumina particles, silica particles, and water. The volume median diameter of secondary particles of the alumina particles measured by a laser beam diffraction method is 0.1 to 0.8 μm. The volume median diameter of primary particles of the silica particles measured... Agent: Birch Stewart Kolasch & Birch

20090111360 - Polishing method, polishing device, glass substrate for magnetic recording medium, and magnetic recording medium: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is polished with an... Agent: Cook Alex Ltd

20090111361 - Method of supplying polishing liquid: The present invention relates to a method of supplying the polishing liquid by periodically interrupt the supply of the polishing liquid, thus avoid over-supply or wastage of the polishing liquid. Hence, the consumption of the polishing liquid can be decreased and the production cost can be lower.... Agent: J C Patents, Inc.

20090111362 - Polishing apparatus: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring body configured to hold and press a substrate against the polishing surface, a retainer ring provided at... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090111363 - Belt sanding attachment tool: A belt sanding attachment tool suitable for use with a driver such as a bench drill, the belt sanding attachment tool being a complete unit and removable from the driver, and suitable for work operations such as grinding, polishing, sanding, finishing and the like. The belt sanding attachment tool has... Agent: Terry Gosschalk

20090111364 - Power tool having an eccentric mass: A power tool having an eccentric mass for sanding a work surface is provided. The power tool may include a motor assembly, a sanding shaft, an eccentric mass, a base element, a fan shaft, a fan, a filter element and one or more dust channels. The motor assembly may be... Agent: Alston & Bird LLP

20090111365 - Swivel device and grinding machine incorporating the same: In a swivel device, a swivel head provided with a plurality of tool spindles thereon is mounted on a support base to be turnable about a swivel shaft being upright on the support base. An annular space portion is formed between the support base and the swivel head in coaxial... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

04/23/2009 > patent applications in patent subcategories.

20090104847 - Polishing monitoring method and polishing apparatus: The present invention provides a method of monitoring a change in film thickness during polishing using an eddy current sensor. This method includes acquiring an output signal of the eddy current sensor as a correction signal value during water-polishing of a substrate, during dressing of the polishing pad, or during... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090104846 - Simultaneous double-side grinding of semiconductor wafers: Correction of grinding spindle positions in double-side grinding machines for the simultaneous double-side machining of semiconductor wafers is achieved by torsionally coupling the two grinding spindles, each comprising a grinding disk flange for receiving a grinding disk, and providing a measuring unit with an inclinometer and two sensors for distance... Agent: Brooks Kushman P.C.

20090104848 - Calibration tool and a grinder machine including such a tool: The invention relates to a calibration tool (40) for a machine for milling an ophthalmic lens, comprising two lens holder shafts supported on a carriage, and means for moving said shafts. The calibration tool (40) includes a holder (68) mountable on the lens holder shafts, at least one piezoelectric element... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090104849 - Polishing pad and polishing method: A polishing pad and a polishing method for polishing a substrate are described. The polishing pad includes a polishing layer and at least two grooves. The grooves form polishing tracks respectively. The polishing tracks collectively construct an even tracking zone. A better polishing uniformity of a substrate surface is achieved... Agent: Ditthavong Mori & Steiner, P.C.

20090104851 - Polishing of sapphire with composite slurries: Improved slurry compositions comprising a mixture of a first type of particles and a second type of abrasive particles dispersed within an aqueous medium, and abrasive slurry compositions for use chemical mechanical planarization (CMP) processes, particularly abrasive slurry compositions for polishing of sapphire. These abrasive slurry compositions comprise a mixture... Agent: Edwards Angell Palmer & Dodge LLP

20090104850 - Polishing pad: An object of the present invention is to provide a polishing pad excellent in polishing rate and superior in longevity without generating center slow. Another object of the present invention is to provide a method of manufacturing a semiconductor device with the polishing pad. Disclosed is a polishing pad having... Agent: Morrison & Foerster LLP

20090104852 - Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers: Carriers suitable for receiving one or more semiconductor wafers for the machining thereof in lapping, grinding or polishing machines, comprise a core of a first material which has a high stiffness, the core being completely or partly coated with a second material, and also at least one cutout for receiving... Agent: Brooks Kushman P.C.

20090104853 - Method of manufacturing disk substrate: A method of manufacturing a disk substrate includes a disk substrate forming step of forming a disk substrate; and an outer chamfering step of chamfering an outer edge of the disk substrate. The outer chamfering step includes chamfering the outer edge by bringing an end surface of a cylindrical-shaped outer... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090104854 - Method for relief-grinding the cutting teeth of taps, thread formers, and similar tools, and grinding machine for carrying out said method: In prior art, an additional radial inward movement that is performed in accordance with a rotating cam disk is imparted on the grinding disk in order to relief-grind the cutting teeth and the chamfer of taps and the cutting teeth of thread formers. The invention relates to a cam disk... Agent: Jordan And Hamburg LLP

20090104855 - Method and apparatus for finishing a workpiece: A method for abrasive material removal that includes the steps of establishing an optimum force profile relating to the force or contact pressure applied by a processing tool on a workpiece. The actual force generated during the metal removal operation is monitored and compared to the optimum force profile. Based... Agent: Van Ophem & Vanophem, PC Remy J Vanophem, PC

20090104856 - Method for producing chemical mechanical polishing pad: m

20090104857 - In-line sander: An in-line profile sander is disclosed. The in-line profile sander includes a sander housing configured to be grasped by a user. A plurality of interchangeable profile sanding pads can be mounted at a head of the housing. The sander includes an in-line oscillating mechanism for moving the profile sanding pads... Agent: Brake Hughes Bellermann LLP

20090104858 - Grinding apparatus and method of grinding wafer: In order not to transmit an impact when grinding is started, or micro-vibrations of a grinding wheel during grinding to a wafer, a grinding apparatus at least includes: a chuck table that holds a wafer; a grinding unit having a grinding wheel configured to include a grinding wheel part that... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090104859 - Device for machining a strip or plate-shaped metal workpiece: The invention relates to a device for machining a strip or plate-shaped metal workpiece, which comprises at least one conveying device which is provided with machining elements. The conveying device guides the machining elements at an angle and/or in a transversal manner in relation to the direction of advancement of... Agent: Wells St. John P.s.

20090104861 - Handle assembly for a power tool: A handle assembly for a power tool, such as an angle grinder, including first and second handle portions for gripping the power tool, the first handle portion extending substantially transverse to the second handle portion. The handle assembly also having a trigger including an elongate portion associated with the first... Agent: Akerman Senterfitt

20090104860 - Portable power tool: A portable power tool having a housing (12) and a tool (70), in particular a cutting tool, which is arranged thereon in such a way that it can be driven in a rotary and/or oscillating manner and which can be operated as prescribed by means of a suction-air flow, in... Agent: Michael J. Striker

20090104862 - Expendable unitary quick mount abrasive discs and support pad therefor: The combination of an abrasive finishing device and a support member therefor. The support member includes a body having a threaded central opening with a flange at one end thereof. A fastening member having a threaded shaft and flange is permanently affixed to the abrasive finishing article by a resiliently... Agent: Connolly Bove Lodge & Hutz LLP

20090104863 - Pad conditioner for chemical mechanical polishing: A pad conditioner for chemical mechanical polishing includes a dressing component for conditioning a pad and a housing for accommodating the dressing component. The housing includes at least one fluid hole surrounding the dressing component for providing at least a fluid.... Agent: North America Intellectual Property Corporation

20090104864 - Tool for working on a surface: Embodiments of the present disclosure provide working tools that provide suction to a working surface and/or dust removal from a working surface. One embodiment of a tool includes a tool support having an upper surface and a sidewall defining a cavity defined by the sidewall and the upper surface. The... Agent: Brooks, Cameron & Huebsch , PLLC

04/16/2009 > patent applications in patent subcategories.

20090098804 - Apparatus for polishing a wafer and method for detecting a polishing end point by the same: A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head including a pusher pad, the pusher pad adapted to push the polishing tape against the surface of the... Agent: Lee & Morse, P.C.

20090098805 - Melamine methylol for abrasive products: An abrasive product includes a plurality of abrasive particles and a resin binder cured from a resin composition that includes an aqueous dispersion of melamine methylol having a melamine-to-formaldehyde molar equivalent ratio of between about 1:1 and about 1:3.2, wherein the aqueous dispersion has a pH in a range of... Agent: Hamilton, Brook, Smith & Reynolds, P.C.

20090098807 - Composite slurries of nano silicon carbide and alumina: Improved slurry compositions comprising silicon carbide particles and alumina particles dispersed within an aqueous medium. Slurry compositions in the form of abrasive slurry compositions for use chemical mechanical planarization (CMP) processes, particularly abrasive slurry compositions for polishing of sapphire, and methods of use.... Agent: Edwards Angell Palmer & Dodge LLP

20090098806 - Compositions and methods for removing scratches from plastic surfaces: A composition including an abrasive, a suspension agent, a surfactant, and a lubricant, is provided for removing scratches, hazing, discoloration, and other defects from plastic surfaces. The composition is applied to a surface and used to polish the surface. The defects within the surface are removed without the removal of... Agent: Waddey & Patterson, P.C.

20090098808 - Grinding method for wafer: A grinding method for a wafer having a plurality of devices on the front side, wherein the back side of the wafer is ground by a grinding wheel to suppress the motion of heavy metal in the wafer by a gettering effect and also to maintain the die strength of... Agent: Greer, Burns & Crain

20090098809 - Bowling ball surface treatment device: A bowling ball surface treatment device for abrading, polishing or cleansing a bowling ball includes a housing, a ball displacing unit movably mounted to the housing for holding the bowling ball in a rotatable manner and for reciprocatingly displacing the bowling ball between a temporary waiting region and a surface... Agent: Lowe Hauptman Ham & Berner, LLP

20090098810 - Abrasive-recovery mechanism in blasting machine: A bottom wall surface of a blasting chamber of a blasting machine provided with hoppers for recovering an abrasive is formed at a lowest possible position. A cabinet 3 of a blasting machine 1 is compartmentalized at a predetermined position into an upper space and a lower space by mesh... Agent: Mathews, Shepherd, Mckay, & Bruneau, P.A.

20090098811 - Surface grinder for ball of ball valve: A surface grinder for a ball of a ball valve comprises a ball positioning device at an X axis for driving the ball to rotate about the X axis and a grinding device at a Z axis for driving a grindstone set to rotate about the Z axis, wherein the... Agent: Charles E. Baxley, Esquire

20090098812 - Guard anti-rotation lock: The invention relates to a protective hood anti-rotation lock for a portable power tool (12a-f), especially for an angle grinder, for providing anti-rotational locking between the portable power tool and a protective hood unit (14a-f). According to the invention, the protective hood anti-rotation lock has a non-positive unit (16a-f) which... Agent: Michael J. Striker

20090098813 - Grinding brush fixing device: The present invention discloses a grinding brush fixing device applying to a pneumatic tool for surface treatment. The spacing between the fixing arms and arc plates of the brush holder is reduced. Thereby, the press-fit face of the axially-extending fixing arm can press the brush collar onto the first press-fit... Agent: Joe Mckinney Muncy

20090098814 - Polymeric fiber cmp pad and associated methods: Polishing tools and their methods of manufacture and use are disclosed. In one aspect, a polishing device is provided, including a plurality of polymeric fibers longitudinally arranged and embedded in a polymeric binder, the polymeric binder having a stiffness that is less than a stiffness of the polymeric fibers, and... Agent: Thorpe North & Western, LLP.

04/09/2009 > patent applications in patent subcategories.

20090093191 - Control circuit for grinding machine: A circuit for a grinding machine has inputs for a sensor and a WHEEL START switch and an output to a grind wheel. The circuit initiates the wheel upon receiving a particular sensor signal after the WHEEL START switch is actuated. A grinding machine includes the circuit as well as... Agent: Michaud-duffy Group LLP

20090093192 - Device for and method of polishing peripheral edge of semiconductor wafer: A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the... Agent: Weaver Austin Villeneuve & Sampson LLP

20090093193 - Chemical mechanical polishing apparatus: Disclosed herein is a chemical mechanical polishing apparatus. The apparatus comprises a carrier to hold a wafer and being capable of lifting, lowering and rotating, a polishing pad compressed onto the wafer through the lowering of the carrier to polish the wafer, a contact pressure sensor to detect contact pressure... Agent: Drinker Biddle & Reath Attn: Intellectual Property Group

20090093194 - Method and a device for edging an ophthalmic lens for machining the edge face of the lens to a desired curve: A method and device for edging an ophthalmic lens, includes turning the lens about a first axis of rotation and working on the edge face of the lens with a beveling grindwheel or cutter having a beveling groove or chamfer and mounted to rotate about a second axis of rotation.... Agent: Young & Thompson

20090093195 - Cmp pad dressers with hybridized abrasive surface and related methods: A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently... Agent: Thorpe North & Western, LLP.

20090093196 - Particle blast system with synchronized feeder and particle generator: A particle blast apparatus has a particle generator the speed of which is synchronized with the speed of the feeder which introduces particles into the flow of transport gas.... Agent: Frost Brown Todd, LLC

20090093197 - Apparatus for grinding workpieces: An apparatus for grinding a planar work piece which is conveyed along a transport path defined by at least partly driven supporting rollers and pressure rollers, contains a revolving grinding element which extends into the transport path and which contacts the work piece circumferentially on its way along the transport... Agent: Lerner Greenberg Stemer LLP

20090093198 - Techniques for cylindrical grinding: Methods for cylindrical grinding a workpiece are disclosed. The method includes cylindrical grinding, with a bonded abrasive wheel having a permeable structure that includes interconnected porosity, a workpiece at a specific cutting energy of less than about 12 Hp/in3·min (29.7 J/mm3), and a material removal rate of at least about... Agent: Houston Eliseeva

20090093199 - Cleaning device for chemical mechanical polishing equipment: A cleaning device for chemical-mechanical equipment, which includes: an irrotatable center shaft irrotatably coupled with a spindle which is rotated, the irrotatable center shaft including a first channel and a second channel formed in an interior of the irrotatable center shaft, cleaning liquid flowing into the first channel and compressed... Agent: Intellectual Property / Technology Law

20090093200 - Polishing pad: The present invention provides a polishing pad whose unevenness in thickness hardly occurs and whose life can be improved. A polishing pad 1 is provided with a polyurethane sheet 2. Foams 3 having lengths of about ½ of the length of the polyurethane sheet 2 in its thickness direction and... Agent: Roberts Mlotkowski Safran & Cole, P.C. Intellectual Property Department

20090093202 - Method for manufacturing polishing pad: A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition onto a... Agent: Morrison & Foerster LLP

20090093201 - Polishing pad: An object of the invention is to provide a polishing pad which hardly generates a scratch on a surface of a polishing object, and is excellent in planarization property. In addition, an object of the invention is to provide a polishing pad which has a high polishing rate and is... Agent: Morrison & Foerster LLP

20090093203 - Flail sanding tool: A flail sanding tool suitable for use with a driver such as a portable drill or bench drill, the flail sanding tool assembly being suitable for work operations such as grinding, polishing, sanding, finishing and the like. The flail sanding tool provides a central shaft with a disk fixed at... Agent: T & T Design Pty Ltd

20090093204 - Sanding disk tool: A tool device suitable for use with a driver, the tool assembly being suitable for work operations such as grinding, polishing, sanding, finishing and the like, the tool device providing a disk shape of rigid or pliable material and a central driving spindle connectable to the driver, the disk being... Agent: T & T Design Pty Ltd

04/02/2009 > patent applications in patent subcategories.

20090088052 - Inline handheld power tool: A powerhead for a hand held power tool includes a powerhead assembly, the powerhead assembly being operably couplable to a hand held motive source, the powerhead assembly having a rotatable implement, the implement being selectively rotated by the motive source when the motive source is operably coupled to the powerhead... Agent: Marger Johnson & Mccollom, P.C.

20090088053 - Method and apparatus for sharpening a tool blade: A device for sharpening a tool blade has a pair of spaced guide rails and a bracket for mounting a sharpening stone on the guide rails. A carriage is slidably supported on the guide rails and has a pair of spaced slide plates adjustably supporting a blade angle plate thereon.... Agent: Sand & Sebolt

20090088054 - Sanding element: The invention concerns a sanding element with a succession of overlapping lamellas (3, 4) containing sanding grains (9), characterised in that these lamellas (3, 4) are alternately formed of sanding lamellas (3) and compressible lamellas (4), whereby each sanding lamella (3) rests on a compressible lamella (4).... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20090088055 - Polishing wheel: A polishing wheel (10) arranged to polish an article. The polishing wheel comprises a hub (12) pro-vided with an axial cavity (18) coaxial with an axis (26). The polishing wheel further comprises a substrate layer (14) being made of an elastomer material affixed to the hub (12) and coaxial with... Agent: Occhiuti Rohlicek & Tsao, LLP

20090088056 - Grinding wheel: In a grinding wheel comprising a disc-like core member and a ring-shape grinding wheel layer wherein superabrasive grains selected from cubic boron nitride particles and diamond particles are contained together with aggregates in a bonding material, the aggregates are made of porous ceramics particles and have an average particle size... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090088057 - Sharpening system having multiple abrasive components: An abrasive sharpening system having multiple sharpening stations supported on a base. One of the stations includes ceramic rods having a partial curved outer surface and a pair of flat intersecting surfaces forming a longitudinally extending abrasive edge. The base further supports a flat abrasive stone and a pair of... Agent: Edward D. Gilhooly

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