Abrading patents - Monitor Patents
FreshPatents.com Logo    FreshPatents.com icons
Monitor Keywords Patent Organizer File a Provisional Patent Browse Inventors Browse Industry Browse Agents

USPTO Class 451  |  Browse by Industry: Previous - Next | All     monitor keywords
03/2009 | Recent  |  14: Jul | Jun | May | Apr | Mar | Feb | Jan | 13: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 12: Dec | Nov | Oct | Sep | Aug | July | June | May | April | Mar | Feb | Jan | 11: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | 10: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan |  | 09: Dec | Nov | Oct | Sep | Aug | Jl | Jn | May | Apr | Mar | Fb | Jn |  | 2008 | 2007 |

Abrading March listing by industry category 03/09

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
03/26/2009 > patent applications in patent subcategories. listing by industry category

20090081927 - Polishing composition and method utilizing abrasive particles treated with an aminosilane: The inventive method comprises chemically-mechanically polishing a substrate with an inventive polishing composition comprising a liquid carrier and abrasive particles that have been treated with a compound.... Agent: Steven Weseman Associate General Counsel, I.p.

20090081928 - Blasting treating method: A method of blasting hazardous substance or explosive in a pressure vessel is provided to improve efficiency while suppressing enlargement of the pressure vessel. To achieve it, the method includes an installing step of installing two or more articles to be treated at a certain spacing in the pressure vessel,... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090081929 - Smoothing and/or lapping tool particularly for finishing stone materials: m

20090081930 - Automatic machine and automatic method for grinding the perimetric edge of glass sheets: An automatic machine and an automatic method for grinding the perimetric edge of rectangular or nonrectangular of glass sheets arranged substantially vertically, comprising at least one conveyor and at least one workhead provided with an abrasive tool for grinding the glass sheet at its edge, following its perimetric profile by... Agent: Modiano & Associati

20090081931 - Blade dressing tool: A dressing device for sharpening or conditioning of a blade or the like includes one or more disk pairs each having a pair of disks respectively presenting a plurality of ribs. The disks are oriented in face-to-face relationship with the ribs thereof in meshed, intercalated relationship to thereby create circumferential... Agent: Hovey Williams LLP

20090081932 - Chemical mechanical polishing assembly with altered polishing pad topographical components: A chemical-mechanical polishing apparatus is provided that creates a uniform kinematical pattern on the surface of a wafer being polished. The apparatus may have a polishing pad comprising a polishing pad surface having a center point that lies within an axis of motion for the polishing pad and a plurality... Agent: Ingrassia Fisher & Lorenz, P.C.

20090081933 - Abrasives products with edges: A coated abrasive includes a substrate, where the substrate has a first edge and a first plurality of flaps defining a first edge. The flaps can be manufactured with different shapes and spacing between the flaps to improve the conformability of the coated abrasive.... Agent: Larson Newman Abel Polansky & White, LLP

03/19/2009 > patent applications in patent subcategories. listing by industry category

20090075563 - Method and apparatus for sharpening hardened tools: An application for an apparatus for sharpening a cutting blade includes a source of high pressure water stream capable of cutting steel and a sharpening jig for positioning and holding the cutting blade perpendicular to the high pressure water stream, the sharpening jig provides a mechanism for moving the cutting... Agent: Larson And Larson

20090075564 - Superabrasive tool and machining methods: A tool for use in an abrasive machining process has a body extending along a central longitudinal axis from a first end to a tip end. An abrasive material is located on the tip end. The body has a tip end protuberance. An abrasive material is located on the protuberance.... Agent: Bachman & Lapointe, P.C. (p&w)

20090075565 - Method of producing rotationally symmetrical surfaces on a workpiece: The invention relates to a method, in particular a turning method, for producing a rotationally symmetrical surface on a rotating workpiece (1), wherein a cutting edge (3) is inserted into the workpiece (1) many times. During each insertion (41), a new contour portion (11; 34), also referred to as a... Agent: Walter A. Hackler, Ph.d. Patent Law Office

20090075566 - Low ph barrier slurry based on titanium dioxide: The invention provides a method of chemically-mechanically polishing a substrate. A substrate is contacted with a polishing pad and a polishing composition comprising an abrasive consisting of (A) particles consisting of titanium dioxide having a rutile structure and (B) particles consisting of titanium dioxide having an anatase structure, wherein an... Agent: Steven Weseman Associate General Counsel, I.p.

20090075567 - Polishing pad conditioner and method for conditioning polishing pad: A polishing pad conditioner is provided. The polishing pad includes a substrate, at least one surface-conditioning unit, and at least one groove-cleaning unit. The surface-conditioning unit and the groove-cleaning unit are both disposed on a surface of the substrate. In addition, the surface-conditioning unit is integrally formed with the groove-cleaning... Agent: Jianq Chyun Intellectual Property Office

20090075568 - Polishing pad, method of producing the same and method of producing semiconductor device by using the same: The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The... Agent: Morrison & Foerster LLP

20090075569 - Apparatus for supplying constant amount of abrasives: An apparatus for supplying a constant amount of abrasives that can accurately control the amount of the abrasives to be supplied to a blasting machine is provided. A horizontally rotating disc 20 is provided in an abrasive tank 10 so as to be embedded in the abrasives. An opening at... Agent: Mathews, Shepherd, Mckay, & Bruneau, P.A.

20090075570 - Universal rotary blade holder for sharpener: A blade-sharpening machine for sharpening any one of various sizes of rotary blades comprises a drive unit and a universal blade chuck for holding the blade to be sharpened. The drive unit further includes a sharpening assembly that sharpens the blade while the drive unit rotates the blade chuck. The... Agent: Hovey Williams LLP

20090075571 - Grinding machine, particularly a high-speed grinding machine: In order to be able to economically carry out machining of a turbine rotor having blades consisting of different materials, by a high-speed grinding machine, a magazine for the grinding wheels and an automatically operating grinding wheel changer are provided. A plurality of different grinding wheels to be held are... Agent: Crowell & Moring LLP Intellectual Property Group

20090075572 - Pneumatic die grinder operable as blow gun: A pneumatic grinding tool having a blower feature that can be selectively employed to blow debris away from a work area. The tool has a valve that directs input air that can be used to drive an output of the tool to a blower air passage. The blower air passage... Agent: Senniger Powers LLP

20090075573 - Floor resurfacing disk: An abrasive disk assembly is provided for a floor resurfacing machine wherein the floor machine has at least one shaft configured to rotate about an axis substantially orthogonal to a work surface, the abrasive disk assembly including a head assembly of predetermined dimension configured to be coupled to one end... Agent: Kane & Co., PLC

20090075574 - Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method: A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a carrier having a hole configured to house the work, and a fixing member that contacts and fixes the work located in the hole.... Agent: Staas & Halsey LLP

03/12/2009 > patent applications in patent subcategories. listing by industry category

20090068927 - Method for the discontinuous grinding of bevel gears and corresponding software for controlling a multiaxis grinding machine: Method for the chip-removing machining of the tooth flanks of a gear wheel having n teeth and n tooth gaps on a multiaxis grinding machine. A grinding disc which may be dressed is used for the machining and one of the n tooth gaps after another is machined using this... Agent: Mccormick, Paulding & Huber LLP

20090068928 - Grinding wheel for roll grinding and method of roll grinding: A method of grinding a ferrous roll may include: rotating a grinding wheel on a machine spindle to form a rotating grinding wheel; rotating a ferrous roll to form a rotating roll surface; bringing the rotating grinding wheel into contact with the rotating roll surface; traversing the rotating grinding wheel... Agent: Diamond Innovations

20090068929 - Surface-protection tape for semiconductor wafers for use during backgrinding process and substrate film for the surface-protection tape: m

20090068930 - Abrasive cleaning agent, method for manufacturing the same, and method for polishing using abrasive cleaning agent: An abrasive cleaning agent is provided which can be used for a polishing process for polishing a surface of a workpiece to form a mirror surface, which suppresses generation of static electricity and adhesion of stains to the workpiece, which decreases a crushing ratio, and which has a low environmental... Agent: Donn K. Harms Patent & Trademark Law Center

20090068932 - Method and device for trimming a lens by cutting said lens: The present invention relates to a device and to a method for shaping an optical lens. According to the invention, a selection is provided between either a first tool (50) for machining the edge face of the lens, and a cutter tool (637) for cutting through the material of the... Agent: Young & Thompson

20090068931 - Method of beveling an ophthalmic lens blank, machine programmed therefor, and computer program: The present invention is directed to a machine programmed to edge an ophthalmic lens blank. The machine includes an edger device for forming a bevel in a peripheral edge of the lens blank, a central processing unit operably associated with the edger device for controlling operation thereof, and a computer... Agent: Berenato, White & Stavish, LLC

20090068933 - System and method for directional grinding on backside of a semiconductor wafer: A backside grinding apparatus removes semiconductor material from a surface of a semiconductor wafer. The wafer is mounted to a backing plate. The backside surface undergoes a first grinding operation in a rotational motion to remove excess semiconductor material. The semiconductor wafer is then aligned such that edges of the... Agent: Quarles & Brady LLP

20090068934 - Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same: A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of the... Agent: Mills & Onello LLP

20090068935 - Polishing apparatus: A polishing apparatus has a top ring configured to hold a semiconductor wafer on a substrate holding surface, and a pushser configured to deliver the semiconductor wafer to the top ring and receive the semiconductor wafer from the top ring. The pushser includes a push stage having a substrate placement... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090068936 - Electric hand-held power tool: The invention relates to a hand-held electric power tool comprising at least one driven rotating part (3) that is mounted in at least one bearing (7, 13). According to the invention, the rotating part (3) is vibrationally decoupled from the bearing (7, 13).... Agent: Michael J. Striker

20090068937 - Cmp pad conditioners with mosaic abrasive segments and associated methods: A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently... Agent: Thorpe North & Western, LLP.

20090068938 - Grinding lamella and grinding wheel holding same: A grinding lamella (1) for being arranged on a rotatingly drivable grinding wheel (8), has at least two annular portions (4, 5, 6, 7, 24, 25, 26, 27, 34, 35, 36, 37, 44, 45, 46, 47) arranged at an angle (α) relative to one another. At least partially, the grinding... Agent: Harness, Dickey & Pierce, P.L.C

03/05/2009 > patent applications in patent subcategories. listing by industry category

20090061733 - Method and device for forecasting/detecting polishing end point and method and device for monitoring real-time film thickness: [Solution] In order to achieve the object, according to the present invention, there is provided a method wherein an inductor 36 in a high frequency inductor type sensor is arranged adjacent to a predetermined conductive film 28, and a magnetic flux change induced in the predetermined conductive film 28 by... Agent: Paul A. Fattibene Fattibene & Fattibene

20090061734 - Endpoint detection system for wafer polishing: An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact... Agent: Crockett & Crockett, P.C.

20090061735 - Systems and methods for in-situ recording head burnishing: Systems and methods are provided for burnishing a recording head in-situ in a magnetic recording disk drive. The burnishing process generates a tribocurrent, which is electricity generated by the rubbing of dissimilar materials. Different materials exhibit widely different tribocurrent characteristics while in sliding contact. The tribocurrent thus acts as an... Agent: Duft Bornsen & Fishman, LLP

20090061737 - Lapping apparatus and lapping method: A lap platen has a lapping surface contacting a surface of a work piece. A lap base has a support surface brought into contact with and supported by the lapping surface. An adapter has a first support part, a second support part and an arm part. The first support part... Agent: Greer, Burns & Crain

20090061736 - Superfinishing stone and superfinishing process using the same: A superfinishing stone 2 is slid on a rotating subject surface 7 as pressed against the subject surface 7 and is held in contact against the subject surface 7 as vibrated thereon in a different direction from the sliding direction. The superfinishing stone includes plural stone portions 3, 4 divided... Agent: Birch Stewart Kolasch & Birch

20090061738 - Method of surface modification for thermal shock resistance and a member thereof: A method for improving surface thermal shock resistance of a member made of ceramics to which thermal shock resistance is required comprising, forming homogeneously distributed linear dislocation structure on the surface of the member made of ceramics to which thermal shock resistance is required by blasting abrasives composed of fine... Agent: Hahn & Voight PLLC

20090061739 - Polishing apparatus and method for polishing semiconductor wafers using load-unload stations: A polishing apparatus and method for polishing semiconductor wafers uses multiple load-unload stations and at least one turn-over robotic wafer handing device to process the wafers so that the wafer can be polished at multiple polishing tables. The turn-over robotic wafer handing device operates to turn over the wafers so... Agent: Wilson & Ham

20090061740 - Method for manufacturing silicone wafers: A method of manufacturing silicon wafers that include a front surface and a block surface and lateral edges, includes forming a silicon wafer by separating a rectangular, in particular, silicon block with lateral surfaces and before separation, grounding and/or polishing the lateral surfaces of the silicon block parallel to the... Agent: Striker, Striker & Stenby

20090061741 - Ecmp polishing sequence to improve planarity and defect performance: A method for processing a substrate having a conductive layer disposed thereon is provided. The substrate is coupled with a planarizing head. The planarizing head is moved to a position above a polishing pad assembly. The planarizing pad is positioned relative to the polishing pad assembly without applying a voltage... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090061742 - Method for manufacturing storage medium: According to an aspect of an embodiment, a method for manufacturing a storage medium includes providing a medium plate member for forming the storage medium and a guide member; and aligning the medium plate member and the guide member so that the medium plate member and the guide member are... Agent: Greer, Burns & Crain

20090061743 - Method of soft pad preparation to reduce removal rate ramp-up effect and to stabilize defect rate: A method and apparatus for pre-conditioning a new soft polishing pad and processing a substrate on a soft polishing pad is described. The method includes coupling a soft polishing pad to a platen, contacting the processing surface of the soft polishing pad with a conditioning disk, applying a pressure conditioning... Agent: Patterson & Sheridan, LLP - - Appm/tx

20090061744 - Polishing pad and method of use: A polishing pad has one or more polishing elements made from a hydrogel material having an intrinsic ability to absorb water. The hydrogel material may or may not have micropores, but has a water absorption capability of 4%-60% by weight, a wet tensile strength greater than 1000 psi, a flexural... Agent: Sonnenschein Nath & Rosenthal LLP

20090061745 - Polishing head using zone control: A polishing head for a chemical mechanical polishing apparatus is provided which includes at least two polishing head zones configured to provide different temperatures for transferring heat to at least two zones of a substrate corresponding to the at least two polishing head zones. The present disclosure addresses chemical mechanical... Agent: J.mike Amerson Williams, Morgan & Amerson, P.C.,

20090061746 - Burr removing apparatus and method: Devices and methods for removing burrs from the outer radial surface of generally cylindrical components during rotation. A manual deburring tool is provided having a gripping handle portion and a “working end” head portion. The head portion preferably includes a curved working plate and gripping means for retaining an abrasive... Agent: Shawn Hunter

20090061747 - Arrangement in a mobile machine for screeding floor surfaces: The invention relates to an arrangement in a mobile machine for screeding floor surfaces. This comprises a housing with a planet disk (3), which is rotatably supported in the bottom of the said housing and driven by a drive motor (1). The planet disk carries a number of rotatably supported... Agent: Edwards Angell Palmer & Dodge LLP

20090061748 - Substrate holding apparatus: The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090061749 - Chamfering tool and method: A chamfering tool adapted to mount on a handheld grinder, the grinder having a guard and the grinder having a grinding face. The chamfering tool includes a fixed mount, to be attached to the guard on the handheld grinder. A moveable mount is attached to the fixed mount. A first... Agent: Husch Blackwell Sanders LLP

20090061750 - Apparatus for the deep cleaning of surfaces: An apparatus is disclosed for the deep cleaning of surfaces, which comprises a support for at least two reservoirs arranged side-by-side and provided with deformable walls having uniformly perforated faces essentially facing the direction of the surface to be cleaned. At least one reservoir can contain a granular material for... Agent: Themis Law

Previous industry: Foundation garments
Next industry: Butchering


RSS FEED for 20140710: xml
Integrate FreshPatents.com into your RSS reader/aggregator or website to track weekly updates.
For more info, read this article.


Thank you for viewing Abrading patents on the FreshPatents.com website. These are patent applications which have been filed in the United States. There are a variety ways to browse Abrading patent applications on our website including browsing by date, agent, inventor, and industry. If you are interested in receiving occasional emails regarding Abrading patents we recommend signing up for free keyword monitoring by email.

Results in 0.27395 seconds