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Abrading February patent applications/inventions, industry category 02/09Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 02/26/2009 > patent applications in patent subcategories.
20090053976 - Customized polishing pads for cmp and methods of fabrication and use thereof: The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density... Agent: Morrison & Foerster LLP
20090053977 - Tool and method for discontinuous profile grinding: A gear grinding tool can be trued and re-profiled. The geometry of the individual profiles in the direction of the tool axis is designed so that at least more than two, preferably all, flanks of the tool are used for rough machining of the work piece flanks, and that during... Agent: Robert L. Mcdowell The Gleason Works
20090053978 - Double-disc grinding machine, static pressure pad, and double-disc grinding method using the same for semiconductor wafer: The present invention is a static pressure pad for supporting both sides of a raw wafer without contact by a static pressure of a fluid supplied to the both sides of the raw wafer in a double-disc grinding machine for a semiconductor wafer, wherein in patterns of lands to be... Agent: Oliff & Berridge, PLC
20090053979 - Jig: A jig intended in use to hold a set of blanks of rod-like or wire-like form during machining, said jig having a body adapted to be mounted to a drive shaft for rotation of the body about an axis of rotation, the body having an outer portion and an inner... Agent: Merchant & Gould PC
20090053980 - Optimized cmp conditioner design for next generation oxide/metal cmp: A study of several key conditioner design parameters has been conducted. The purpose was to improve conditioner performance by considering factors such as wafer defects, pad life, and conditioner life. For this study, several key conditioner design parameters such as diamond type, diamond size, diamond shape, diamond concentration and distribution,... Agent: Houston Eliseeva
20090053981 - Method of recycling abrasive slurry: A method of recycling an abrasive slurry for recycling a slurry that: contains colloidal silica; and has been used in polishing semiconductor wafer(s) is provided. The method includes: adding a dispersant to the used slurry having been collected so as to prevent the used slurry from being gelled; irradiating ultrasound... Agent: Frishauf, Holtz, Goodman & Chick, PC
20090053983 - Chemical mechanical polishing pad and method for manufacturing same: There is provided a chemical mechanical polishing pad which has a circular polishing surface and a non-polishing surface that is the back side of the polishing surface and incorporates an information recording medium that is readable or readable/writable by an electromagnetic wave in a noncontact manner and in which the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090053982 - Fibrous pad for cleaning/polishing floors: A cleaning/polishing pad for cleaning or polishing stone, terrazzo or concrete floors comprises a flexible, disk-shaped pad body having an upper mounting surface and a lower working surface, the pad body comprising natural wool fibers. A plurality of resin segments spaced apart from one another and affixed adjacent the lower... Agent: Gardner Groff Greenwald & Villanueva. PC
20090053984 - Profile strip with grinding element: The present invention relates to a profile strip (1), preferably for a cylinder drum (5) comprising a bottom strip (3) which is designed for replaceable retention of a bottom profile (2) comprising a number of brushes (6) and a number of grinding elements (8) and where the grinding element (8)... Agent: James C. Wray02/19/2009 > patent applications in patent subcategories.
20090047869 - Precision machining method: A precision machining method enabling grinding with high accuracy is provided. The method includes a first step of producing an intermediate ground workpiece by roughly grinding a workpiece (a) with a diamond grinding wheel (b), and a second step of producing a final ground workpiece by grinding the intermediate ground... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
20090047870 - Reverse shallow trench isolation process: A method of polishing a substrate surface containing silicon nitride and silicon oxide or silicon dioxide, comprising movably contacting the surface with a polishing pad and having a polishing composition disposed between the polishing pad and the surface, said polishing composition comprising 1) hydrous ceria abrasive; 2) polyvinylpyridine, vinyl pyridine... Agent: Air Products And Chemicals, Inc. Patent Department
20090047871 - Interpenetrating network for chemical mechanical polishing: Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continous non-fugitive phase and a substaintially co-continuous fugitive phase. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.
20090047872 - Polishing pad: To provide a polishing pad which is insusceptible to clogging of groove with abrasive particles and grinding dusts during polishing, and leads to little decrease in polishing rate even after long-term continuous use. A polishing pad of the present invention has a polishing layer formed of polyurethane resin foam having... Agent: Morrison & Foerster LLP
20090047873 - Substrate retainer: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward... Agent: Fish & Richardson P.C.
20090047874 - Lens surface cutting apparatus and lens surface cutting method for spectacle lens, and spectacle lens: A lens surface cutting method for a spectacle lens includes the steps of calculating the mean curvature of a lens surface (5) to be machined, calculating a helical machining path (4) that matches the mean curvature, and cutting the lens surface (5) to be machined by a cutting means. The... Agent: Blakely Sokoloff Taylor & Zafman LLP
20090047875 - Coolant nozzle positioning for machining work-pieces: A method of determining a position of a coolant nozzle relative to a rotating grinding wheel removing material from a work-piece and an apparatus for practicing the method are disclosed. The method includes the step of disposing a coolant nozzle having a base and a distal end for adjustable movement... Agent: Macmillan, Sobanski & Todd, LLC
20090047876 - Chemical mechanical polishing pad with controlled wetting: Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising a polishing texture that exhibits a dimensionless roughness, R, is between 0.01 and 0.75. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.
20090047877 - Layered-filament lattice for chemical mechanical polishing: The polishing pad (104) is useful for polishing at least one of a magnetic, optical and semiconductor substrate (112) in the presence of a polishing medium (120). The polishing pad 104 includes multiple layers of polishing filaments (200, 300, 400, 500) stacked on a base layer (204, 404, 504) of... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.
20090047878 - Shot-blasting machine: A loader arrangement 7 of a shot-blasting machine includes a bucket loader 29 having a tip opening that can be opened and closed by means of a lid 35. The loader arrangement 7 also includes a swivel arm 32, which is vertically and pivotally attached to a frame 4 via... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
20090047879 - Low load swinging mechanism for a sander: The invention relates to a low load swinging mechanism for a sander. The sander includes a roller unit that has a positioning base provided with two sliding rails for contacting with a connecting member of a sliding base. The sliding rail has an arc surface and the connecting member possesses... Agent: Sinorica, LLC
20090047880 - Grinding machine: A grinding machine enabling the easy maintenance and inspections of mechanisms arranged therein, an increase in visibility when the states of a workpiece and a grinding wheel are confirmed, and the easy loading/unloading of the workpiece and the easy replacement of the grinding wheel. The grinding machine comprises a workpiece... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090047881 - Combinatorial processing including rotation and movement within a region: Combinatorial processing including rotation and movement within a region is described, including defining multiple regions of at least one substrate, processing the multiple regions of the at least one substrate in a combinatorial manner, rotating a head in one of the multiple regions to perform the processing, and repositioning the... Agent: Intermolecular, Inc
20090047882 - Sanding tool: A sanding tool for sanding corners. This tool includes an elongated V-shaped member structured to uniformly contact adjacent corner positions; a sandpaper securing device configured to secure the sandpaper thereon. The device includes: a pair of threaded elongated members; a pair of adjustment mechanisms, having: a clamping member sized to... Agent: Advantia Law Group
20090047883 - Interconnected-multi-element-lattice polishing pad: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a plurality of polishing elements (402, 502, 602, 702). The polishing elements (402, 502, 602, 702) are aligned in... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.
20090047884 - Chemical mechanical polishing pad structure minimizing trapped air and polishing fluid intrusion: A polishing pad is attachable to a platen to minimize trapped air and polishing fluid intrusion. The pad comprises a polishing layer having a polishing surface on a first end of the pad and a polishing layer peripheral edge extending away from the polishing surface; a gas impermeable attaching layer... Agent: Deborah M. Altman Ppg Industries, Inc.02/12/2009 > patent applications in patent subcategories.
20090042479 - Grinding apparatus and method of controlling grinding apparatus: A grinding wheel formed on an outer peripheral surface with a grinding surface is attached to a grinding wheel spindle supported by axial active magnetic bearings and radial active magnetic bearings in a noncontact manner axially and radially and rotated by an electric motor. A casing is axially positioned and... Agent: Mcginn Intellectual Property Law Group, PLLC
20090042480 - Polishing pad and polishing apparatus: A polishing pad forms a planar surface on glass, semiconductors, dielectric material/metal composites and integrated circuits, as well as a polishing apparatus where it is difficult for the surface of the substrate to be scratched, the state of polishing can be accurately measured optically during polishing, and whether or not... Agent: Ip Group Of Dla Piper US LLP
20090042481 - Method of calibrating or compensating sensor for measuring property of a target surface: A method of calibrating or compensating a sensor for measuring property of target surface is provided. In one embodiment, a liquid reference surface is formed on a platen. A sensor is used to measure a feature property of the reference surface. The measured feature property of the reference surface may... Agent: Patterson & Sheridan, LLP - - Appm/tx
20090042482 - Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer: A rough-polishing method for conducting a rough polishing before mirror-finish polishing on a semiconductor wafer using a polishing apparatus includes a first polishing step for polishing the semiconductor wafer using slurry containing colloidal silica supplied by a slurry supplying unit and a second polishing step for polishing the semiconductor wafer... Agent: Frishauf, Holtz, Goodman & Chick, PC
20090042483 - Working system, method for detecting contact, and acoustic emission contact detection device: The object is to aim at the reduction in the influence of noises in an output of an AE sensor in a working machine. In a working system comprising a working device for working a work W by causing a tool 14 to come into contact work W, an AE... Agent: Christie, Parker & Hale, LLP
20090042484 - Surface grinding process and positioning member for securing movable jaw of adjustable wrench during surface grinding process: A positioning member is used to position the movable jaw to the sliding groove of the adjustable wrench and the adjustable wrench together with the positioning member are applied by vibrate grinding technology so as to make the outer surface of the movable jaw to be a mirror surface and... Agent: Dr. Banger Shia Int''l Patent Office Of Bang Shia
20090042485 - Polishing composition: A polishing composition containing a silica, an acid, a surfactant, and water, wherein (a) the acid has solubility in water at 25° C. of 1 g or more per 100 g of an aqueous saturated solution; (b) the surfactant is a sulfonic acid represented by the formula (1) or (2),... Agent: Birch Stewart Kolasch & Birch
20090042488 - Back grinding method for wafer: A back grinding method for a wafer includes covering a face-side surface of the wafer with a resin film, and cutting the surface of the resin film to form a flat surface parallel to the face-side surface of the wafer. The wafer is held with the surface of the resin... Agent: Greer, Burns & Crain
20090042487 - Polishing apparatus, polishing method, substrate manufacturing method, and electronic apparatus manufacturing method: A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a pair of stools rotating in opposite directions, a pair of detecting units configured to detect rotation rates of the stools, a pressurizing unit configured to compress the work between the pair of the stools,... Agent: Staas & Halsey LLP
20090042486 - Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method: A polishing method configured to simultaneously polish both surfaces of a work includes the steps of inserting the work into a hole in a carrier and fixing the work with a fixing member, attaching the carrier to a polishing apparatus, polishing both surfaces of the work simultaneously, and detaching the... Agent: Staas & Halsey LLP
20090042490 - Three-dimensional network for chemical mechanical polishing: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a three-dimensional network of interconnected unit cells (225). The interconnected unit cells (225) are reticulated for allowing fluid flow... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.
20090042489 - Wafer polishing apparatus and wafer polishing method: A wafer polishing in which a polishing liquid is supplied to a polishing pad for polishing a wafer carried on a carrier head; and the polishing liquid is supplied from one or more polishing liquid supplying devices onto the polishing pad, by a polishing liquid supplying member of the polishing... Agent: Roberts Mlotkowski Safran & Cole, P.C. Intellectual Property Department
20090042491 - Method and apparatus for circumferential interior treatment of pipe elbows: A method for the circumferential interior treatment of pipe elbows, including a step of positioning a working member within a pipe elbow and moving the working member along a portion of a length of the pipe elbow between selected working positions, while concurrently manipulating the pitch and rotational positioning of... Agent: Christensen, O'connor, Johnson, Kindness, PLLC
20090042492 - Fluid system and method for thin kerf cutting and in-situ recycling: A fluid jet system for achieving a kerf width less than 0.015 inches is provided. In one embodiment, the system includes an orifice mount having a high-pressure fluid bore and an abrasive bore configured to communicate an abrasive mixture in form of a paste or foam to at least a... Agent: Seed Intellectual Property Law Group PLLC
20090042493 - Chamfering apparatus for chamfering glass substrates: A chamfering apparatus is used to chamfer a peripheral edge of a glass substrate. The chamfering apparatus includes a grindstone having a cylindrical hollow end portion; a grindstone driving unit that rotates the grindstone around an axis of the cylindrical hollow end portion; a substrate rotation-driving unit that rotates the... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20090042494 - Pad conditioner of semiconductor wafer polishing apparatus and manufacturing method thereof: A pad conditioner of semiconductor wafer polishing apparatus and a pad conditioner manufacturing method thereof are provided with a uniform conditioning for a polishing pad of a polishing apparatus, the polishing apparatus being for evenly planarizing a metal layer formed on the surface of wafer in a semiconductor device manufacturing... Agent: Myers Bigel Sibley & Sajovec
20090042495 - Rotary-type polishing device having protrusion members: Disclosed herein is a rotary-type polishing device having protrusion members. The rotary-type polishing device includes a rotary shaft, a disc-type body, an elastic rubber, and a plurality of protrusion members. The disc-type body is coupled with the rotary shaft and is configured to integrally rotate together with the rotary shaft.... Agent: Greenlee Winner And Sullivan P C02/05/2009 > patent applications in patent subcategories.
20090036027 - Automated detection of characteristics of abrasive products during use: A method of processing an article with a coated abrasive product, including a repeat of a single marking, comprises detecting at least two characteristics of the repeat of a single marking. The repeat is placed along the length of the abrasive product at a first major surface, wherein each of... Agent: Hamilton, Brook, Smith & Reynolds, P.C.
20090036024 - Cmp apparatus and method of polishing wafer using cmp: A CMP apparatus is provided with a polishing pad, a film thickness sensor for measuring a thickness of a film being polished on a wafer via the polishing pad, a polishing pad thickness measuring unit for measuring the thickness of the polishing pad, a dresser for dressing the polishing pad,... Agent: Young & Thompson
20090036025 - Eyeglass lens processing apparatus: a calculation control unit which includes a counter for multiplying a processing refuse amount of the lens on the basis of a control signal of the apparatus and a memory for storing a processing refuse extraction reference provided to maintain filtering efficiency of the dewatering bin, the processing refuse extraction... Agent: Sughrue-265550
20090036026 - Substrate thickness measuring during polishing: A computer program product that determines a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matches the spectra with indexes in a library and uses the indexes to determining a polishing rate for each of the different zones from the... Agent: Fish & Richardson P.C.
20090036028 - Chemical mechanical polishing apparatus and chemical mechanical polishing method thereof: A chemical mechanical polishing apparatus and a chemical mechanical polishing method thereof are provided. The chemical mechanical polishing method at least includes the following steps. In step a, a positive pressure is formed between a polishing pad and a wafer. In step b, the wafer is driven to revolve around... Agent: Bacon & Thomas, PLLC
20090036029 - Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback: The present disclosure relates to automatic deposition profile targeting with a combined deposition/polishing apparatus which obtains matching deposition and subsequent polishing profiles by use of feedback data from an advanced polish endpoint system in an advanced process control system.... Agent: Williams, Morgan & Amerson
20090036030 - Polishing head and chemical mechanical polishing process using the same: A polishing head for a chemical mechanical polishing process is provided. The polishing head includes an inner circle part and an outer circle part. The outer circle part is a ring-like structure that is connected to the inner circle part. The inner circle part and the outer circle part are... Agent: J C Patents, Inc.
20090036031 - Coating assisted surface finishing process: A method of polishing a first component by a second component of a tribological pair is disclosed. The method includes mating the first component to the second component in a tribological configuration. The first component and the second component are moved such that a first surface of the first component... Agent: Caterpillar/finnegan, Henderson, L.L.P.
20090036032 - Temperature control for ecmp process: Methods for polishing a substrate are provided. In one embodiment, the method includes pressing a substrate against a pad assembly disposed on rotating platen assembly, the pad assembly comprising an electrode coupled to a power source, flowing an electrolyte fluid onto the pad assembly, wherein the electrolyte fluid is in... Agent: Patterson & Sheridan, LLP - - Appm/tx
20090036033 - Methods and apparatus for processing a substrate: A method of cleaning an edge of a substrate is provided. The method comprises tensioning a first polishing film in a frame; contacting the first polishing film against an edge of a substrate; conforming the first polishing film to the edge of the substrate, the edge including an outer edge... Agent: Dugan & Dugan, PC
20090036034 - Semiconductor wafer and processing method for same: A semiconductor wafer which is generally circular, and which has on its face an annular surplus region present in an outer peripheral edge portion of the face, and a circular device region surrounded by the surplus region, the device region having many semiconductor devices disposed therein. A circular concavity is... Agent: Smith, Gambrell & Russell
20090036035 - Apparatus and methods for conditioning a polishing pad: Apparatus and methods for conditioning a polishing pad include a base, an arm pivotally coupled to the base and adapted to support a conditioning disk, and an actuator coupled to the base and the arm. The actuator is adapted to cause the arm to press the conditioning disk against the... Agent: Dugan & Dugan, PC
20090036036 - Apparatus and methods for conditioning a polishing pad: Apparatus and methods for conditioning a polishing pad are provided. An apparatus includes a base, an arm adapted to support a conditioning disk; and a drive mechanism coupled between the arm and the conditioning disk, wherein the drive mechanism is adapted to directly rotate the conditioning disk relative to the... Agent: Dugan & Dugan, PC
20090036037 - Apparatus for conditioning processing pads: Embodiments of an apparatus for conditioning a processing pad are provided. In one embodiment, an apparatus for conditioning a processing pad includes a member having a bottom surface selectively maintained in a non-planar orientation and an abrasive disposed on the bottom surface of the member. The abrasive is configured for... Agent: Patterson & Sheridan, LLP - - Appm/tx
20090036039 - Methods and apparatus for polishing an edge of a substrate: Methods of and systems for polishing an edge of a substrate are provided. The invention includes a substrate rotation driver adapted to rotate the edge of a substrate against a polishing film; and a first sensor coupled to the rotation driver adapted to detect one of an energy and torque... Agent: Dugan & Dugan, PC
20090036040 - Eyeglass lens processing apparatus: An eyeglass lens processing apparatus includes: a processing chamber for processing the lens; a grinding water supply unit which includes a first switch unit for turning on/off a supply of grinding water to a first nozzle for ejecting grinding water toward a processing point of the lens; a cleaning water... Agent: Sughrue-265550
20090036041 - Cmp pad dresser and cmp apparatus using the same: A CMP pad dresser for dressing a polishing pad of a CMP apparatus is provided with a dressing pad having abrasive grains, a purified water supply unit provided to an external periphery of the dressing pad, and a drive mechanism for sliding the dressing pad in a radial direction of... Agent: Young & Thompson
20090036042 - Methods and apparatus for polishing an edge of a substrate: Methods, systems and apparatus are provided for polishing an edge of a substrate. The invention includes an apparatus adapted to apply a preset pressure to a polishing film in contact with an edge of a substrate. The apparatus includes an actuator adapted to apply a preset pressure to the polishing... Agent: Dugan & Dugan, PC
20090036043 - Cover device for a power tool: A cover device for a power tool with at least one disc-shaped working tool (6), includes first and second cover parts (12, 22) and a locking mechanism (41) for releasably pivotally positioning the second cover part (22) relative to the first cover part (12) and having a locking element (46)... Agent: Abelman, Frayne & Schwab
20090036044 - Guard lock: The invention relates to a protective hood securing device for a portable power tool (12), especially an angle grinder. Said protective hood securing device comprises a protective hood unit (14), having a protective hood (16), and a securing unit (18) having at least one securing element (20) which is provided... Agent: Michael J. Striker
20090036045 - Chemical mechanical polishing pad: The chemical mechanical polishing pad has a surface resistivity of its polishing layer of 1.0×107 to 9.9×1013Ω. The polishing layer is made of a composition containing (A) a polymer matrix component having a volume resistivity of 1.0×1013 to 9.9×1017 Ω·cm and (B) a component having a volume resistivity of 1.0×106... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.Previous industry: Foundation garments
Next industry: Butchering
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