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Abrading December patents and inventions 12/08Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 12/25/2008 > patent applications in patent subcategories. patents and inventions
20080318492 - Substrate holding apparatus, polishing apparatus, and polishing method: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being... Agent: Wenderoth, Lind & Ponack, L.L.P.
20080318493 - Method of manufacturing polishing carrier and silicon substrate for magnetic recording medium, and silicon substrate for magnetic recording medium: An object is to provide a polishing carrier that can prevent scratches from occurring on the edge face of a substrate, and prevent debris from being produced from the edge face, while a single crystal silicon substrate, which is fragile, and has a high cleavage strength, is polished, and to... Agent: Sughrue Mion, PLLC
20080318494 - Chemical mechanical planarization methods and apparatus: A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.... Agent: Duane Morris LLP (tsmc)IPDepartment
20080318495 - Cmp apparatuses with polishing assemblies that provide for the passive removal of slurry: Chemical mechanical planarization apparatuses with polishing assemblies that provide for the passive removal of slurry are provided. In accordance with an embodiment, a work piece polishing assembly comprises a polishing pad comprising a polishing surface and an exhaust aperture that extends through the polishing pad from the polishing surface and... Agent: Ingrassia Fisher & Lorenz, P.C.
20080318496 - Methods of crystallographically reorienting single crystal bodies: A method of changing the crystallographic orientation of a single crystal body is disclosed that includes the steps of characterizing a crystallographic orientation of the single crystal body and calculating a misorientation angle between a select crystallographic direction of the single crystal body and a projection of the crystallographic direction... Agent: Larson Newman Abel Polansky & White, LLP
20080318497 - Method of machining substrate: A method of machining a wafer is disclosed, in which the wafer is held by sucking its back-side surface directly onto a suction surface of a chuck table, and the tips of protruding electrodes and a resist layer are cut to make them flush with each other (appendant part cutting... Agent: Greer, Burns & Crain
20080318498 - Vibration device for a super finishing apparatus and an attachment tool comprising the vibration device: A vibration device for a super finishing apparatus for super finishing a mechanical object is disclosed. It comprises at least two sliding means (1, 3), each comprising a guide (5, 7) and an element (9, 11) provided with a through hole (13) for receiving the guide (5, 7), allowing a... Agent: Buchanan, Ingersoll & Rooney PC
20080318499 - Substrate holding apparatus, polishing apparatus, and polishing method: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being... Agent: Wenderoth, Lind & Ponack, L.L.P.
20080318500 - Electric sanding machine: An electric sanding machine has a housing with a drive device disposed therein, a base plate disposed under the housing, and a driven shaft for driving the base plate. A sanding device is attached to the base plate. The housing has a drive device housing part substantially perpendicular to the... Agent: Greenberg Traurig, LLP
20080318501 - Vibrating device: The object of the present invention is to enable efficient vibration processing by applying a sufficient displacement amount and response speed to an object to be vibrated. In grinding of an outer surface of a workpiece W, first and second supporting members are provided for supporting two opposed points of... Agent: Rankin, Hill & Clark LLP
20080318502 - Grinding-disk shield: The invention relates to an internally cooled grinding disc shielding (16), wherein a cooling liquid (14) outwardly flows thorough a recess embodied in the peripheral surface of a grinding disk, the shielding is provided with a collecting groove (17) for the cooling liquid (14) which surrounds the grinding disc (1)... Agent: K.f. Ross P.C.
20080318503 - Substrate holding mechanism, substrate polishing apparatus and substrate polishing method: A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing... Agent: Wenderoth, Lind & Ponack, L.L.P.
20080318504 - Abrasive sander for sanding device: An abrasive sander includes a net member having a number of cords secured together for forming a number of eyelets between the cords, and a number of abrading particles applied onto the net member for engaging with a work piece and for abrading the work piece and for abrading cut... Agent: Charles E. Baxley, Esquire
20080318505 - Chemical mechanical planarization pad and method of use thereof: A web-style polishing pad includes a guide layer through which individual polishing elements protrude on one side and a flexible under-layer attached to the other side. The polishing elements may be affixed at their base to the compressible under-layer and pass through corresponding holes in the guide layer so as... Agent: Sonnenschein Nath & Rosenthal LLP
20080318506 - Abrasive article and method of making: An abrasive sheet material comprising a first sheet having a first major suface and a second major surface and second sheets having first major surfaces and second major surfaces wherein the second major surfaces of the second sheets are affixed to the first major surface of the first sheet and... Agent: John E. Brown12/18/2008 > patent applications in patent subcategories. patents and inventions
20080311823 - Apparatus for heating or cooling a polishing surface of a polishing appratus: The present invention provides an apparatus for heating or cooling a polishing surface. This apparatus includes a heat exchanger arranged so as to face the polishing surface when the workpiece is polished. The heat exchanger includes a medium passage through which a heat-exchanging medium flows, and a bottom surface facing... Agent: Wenderoth, Lind & Ponack, L.L.P.
20080311824 - Apparatus for smoothing a product, in particular a semi-finished ceramic product: An apparatus (1) for smoothing a product (2), in particular a semi-finished ceramic product, comprises: an abrasive tool (3) in the form of an endless belt (4) which is trained around at least one pair of pulleys (5, 6), at least one of which is power-driven; the belt (4) has... Agent: Pearne & Gordon LLP
20080311825 - Incorporation of particulate additives into metal working surfaces: A mechanical device and method for lapping a metal working surface, the device including: (a) a workpiece having the metal working surface; (b) a contact surface, disposed generally opposite the working surface, for moving in a relative motion to the working surface; (c) a plurality of abrasive particles, disposed between... Agent: Dr. Mark M. Friedman C/o Bill Polkinghorn - Discovery Dispatch
20080311826 - Griding and/or polishing tool, and use and manufacturing thereof: A grinding and/or polishing tool comprises a thin, substantially flat substrate, which has a grinding side to which grinding particles are applied, the substrate being substantially incompressible in a direction perpendicular to the grinding side, the grinding particles comprising diamond particles, and the grinding particles being fixed to the substrate... Agent: Merchant & Gould PC
20080311827 - Chamfering apparatus, a grinding wheel, and a chamfering method: A chamfering apparatus for chamfering an outer periphery of a disk-shaped substrate includes a grinding member having a circular hole inside thereof, wherein the hole has a diameter larger than an outer diameter of the substrate. An inner periphery of the grinding member forming the hole is a grinding surface... Agent: Kanesaka Berner And Partners LLP
20080311828 - Grinding method: It is provided that a grinding method of a rotating workpiece W having a cylindrical part and at least one end face beside the cylindrical part. The grinding wheel 30 has a rotational axis parallel to a rotational axis of the workpiece W and has an external surface 30FM, at... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20080311829 - Emery wheel grinding machine with adjustable drill bit chuck: The emery wheel grinding machine with adjustable drill bit chuck disclosed herein has an adjustable chuck in which is provided with a T-bushing having an outer flange formed at one end thereof. The outer flange is provided with several pairs of stop traps along its circumference, whereas the number of... Agent: Lowe Hauptman Ham & Berner, LLP
20080311830 - Sander: A sander can include housing, and a motor assembly in the housing. The motor assembly can include an output member. A platen can be driven by the output member. A user feedback assembly can be coupled to the housing and have a sensor assembly, a controller and an indicator. The... Agent: Harness, Dickey & Pierce, P.L.C
20080311831 - Sander: A sander can include a housing and a motor assembly in the housing. The motor assembly can include an output member. A platen can be driven by the output member. An indicator can be disposed on the housing and include a light source. A semi-transparent lens can be disposed generally... Agent: Harness, Dickey & Pierce, P.L.C
20080311832 - Sander: A sander can include a housing, an indicator disposed on the housing, and a motor assembly in the housing. The motor assembly can include an output member. A platen can be driven by the output member. A sensor assembly can be configured to sense a condition in which a pressing... Agent: Harness, Dickey & Pierce, P.L.C
20080311833 - Sander: A sander can include a housing, an indicator coupled to the housing, and a motor assembly in the housing. The motor assembly can include an output member. A platen can be driven by the output member. A DC generator can be driven by the output member. The DC generator can... Agent: Harness, Dickey & Pierce, P.L.C
20080311834 - System and method for cleaning a conditioning device: A system for cleaning a conditioning device to improve the efficiency of the conditioning of a polishing pad using the conditioning device as part of a chemical-mechanical polishing process, the system comprising a conditioning device; a fluid dispenser arranged to dispense a fluid on the conditioning device; and an acoustic... Agent: Freescale Semiconductor, Inc. Law Department12/11/2008 > patent applications in patent subcategories. patents and inventions
20080305716 - Honing method and honing control device: A honing method and honing control device suitable for the honing having a large processing area is provided. The honing control device includes a grinder and an expansion member for disposition in a processing hole of a workpiece. The amount of an expanding movement when the grinder contacts the inner... Agent: Young & Basile, P.C.
20080305715 - Manufacturing method of semiconductor integrated circuit device: A polishing pad used in a CMP step in the manufacture of a semiconductor integrated circuit device is relatively expensive; thus, it is necessary to avoid a wasteful exchange of the pad. Accordingly, it is important to measure the abrasion amount of this pad precisely. However, in ordinary measurement thereof... Agent: Miles & Stockbridge PC
20080305717 - Platen assembly and work piece carrier head employing flexible circuit sensor: A platen assembly is provided for supporting a polish pad of the type utilized to planarize a wafer. The platen assembly comprises a sensor system and a polish platen having a first surface for supporting the polish pad. The sensor system comprises a flexible sensor and a flexible circuit operatively... Agent: Ingrassia Fisher & Lorenz, P.C.
20080305718 - Polishing composition and polishing method: A first polishing composition includes abrasive grains and an iodine compound and has a pH of 6 or more. The first polishing composition can suitably polish the Si  plane of a single crystal silicon carbide substrate. A second polishing composition includes an iodine compound and has a pH of... Agent: Vidas, Arrett & Steinkraus, P.A.
20080305719 - Scratch removal device and method: A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a central passage to an outer edge. A... Agent: Merchant & Gould PC
20080305720 - Method for production of a laminate polishing pad: Disclosed is a method for production of a laminate polishing pad which comprises a reduced number of steps and is excellent in productivity rate, and which causes no detachment between a polishing layer and a cushion layer and can prevent the groove clogging caused by a slurry or the like.... Agent: Morrison & Foerster LLP
20080305722 - Method for the single-sided polishing of bare semiconductor wafers: Single-sided polishing of bare semiconductor wafers is accomplished by using a polishing head with a membrane made of a resilient material by which polishing pressure is transmitted onto the backside of the semiconductor wafer to be polished, wherein the semiconductor wafer is pressed against a polishing cloth with a smooth... Agent: Brooks Kushman P.C.
20080305721 - Treating method for brittle member: A treating method for brittle member comprising: a step of removably fixing a brittle member on a flexible glass base plate, a step of treating said brittle member, a step of fixing said brittle member side by holding means, and a step of separating said flexible glass base plate from... Agent: Hahn & Voight PLLC
20080305723 - Polishing disc for a tool for the fine machining of optically active surfaces particularly on spectacle lenses and method for its production: A polishing disc for a tool for the fine machining of optically active surfaces, particularly on spectacle lenses as workpieces, comprises a main body which has a center axis and on which there is fixed an intermediate layer which is softer than the main body and on which a polishing... Agent: Reising, Ethington, Barnes, Kisselle, P.C.
20080305724 - Surface grinding machine, spindle device and surface grinding method: In through-feed grinding workpieces by grinding stones rotating around the axes of spindles, the spindles are tiltably held by elastic holding means around tilt axes substantially orthogonal to the direction of exit and entrance of the workpieces with respect to the grinding stones. When a grinding loads are imposed on... Agent: Jordan And Hamburg LLP
20080305725 - Chemical mechanical polish system having multiple slurry-dispensing systems: A chemical mechanical polish system includes a polishing pad, a platen supporting and rotating the polishing pad, a top slurry dispenser placed over a polishing pad, a bottom slurry dispenser placed through an opening in the polishing pad, and a duct connected to the bottom slurry dispenser, the duct extending... Agent: Slater & Matsil, L.L.P.
20080305726 - Wheel spindle device for grinding machine: In a wheel spindle device wherein a plurality of grinding wheels are attached in a juxtaposed relation to a wheel spindle rotatably carried on a wheel head of a grinding machine, a reference position for specifying a position in the circumferential direction of the grinding wheel is provided on a... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20080305728 - Power tools: A power tool includes an air introduction device that can introduce an external air into the casing and can produce a spiral flow of the air within the casing. A motor is disposed within the casing.... Agent: Oliff & Berridge, PLC
20080305727 - Rapid locking device: A rapid locking device axially secures a disc-type tool (16), in particular a grinding disc on the flange (24) of a driven spindle (14), the spindle (14) having an axial bore containing at least one locking element in the form of a plate spring (28), which co-operates with a locking... Agent: Dreiss, Fuhlendorf, Steimle & Becker
20080305729 - Thin polishing pad with window and molding process: A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the... Agent: Fish & Richardson P.C.
20080305730 - Grinding tool for natural stone floors, artificial stone floors and industrial soils: A grinding tool for natural stone floors, artificial stone floors and industrial floors allows a greatest possible adaptation to the unevennesses of worn natural and artificial stone floors to be restored by using diamond tools that are flexibly attached. The diamond tools are fixed on a mat so that each... Agent: Lerner Greenberg Stemer LLP12/04/2008 > patent applications in patent subcategories. patents and inventions
20080299871 - Methods and apparatus for polishing a semiconductor wafer: Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and a plurality of actuators, at least two... Agent: Corning Incorporated
20080299872 - Independent measuring apparatus for grinding machines: Measuring apparatus (50) of geometrical parameters of cylinders, rolls and similar elements (11), used for the rolling of flat products operating on a machine for the grinding of said cylinders with an autonomous movement, i.e. with a movement independent of the translation movement of the grinding wheel or other parts,... Agent: Hedman & Costigan P.C.
20080299873 - Cmp apparatus: The present invention provides a CMP apparatus less susceptible to slurry adhesion, easy to cleaning off the adhering slurry therefrom and excellent in chemical resistance. The present invention is a CMP apparatus, at least one covered surface selected from the group consisting of a head portion surface and an arm... Agent: Sughrue Mion, PLLC
20080299874 - Method for restoring acid etched glass: A method for restoring acid etched glass includes grinding the glass and then applying an acid resistant polyester film over the glass. Grinding may be performed in steps going from course to fine grinding pads, and stopping with a 400 grit pad, leaving a somewhat cloudy appearing surface. The polyester... Agent: Averill & Varn
20080299875 - Equal sized spherical beads: A method of producing equal-sized spherical shaped beads of a wide range of materials is described. These beads are produced by forming the parent bead material into a liquid solution and by filling equal volume cells in a sheet with the liquid solution. The sheet cells establish the volumes of... Agent: Mark A. Litman & Associates , P.A.
20080299876 - Blasting device for premixed abrasive slurry jet: The present invention relates to a blasting device for premixed abrasive slurry jet. The device comprise a cylinder, in which defines a hydraulic oil side and a slurry side separated from each other hermetically, and the hydraulic oil side and the slurry side have ports for oil or slurry entry... Agent: Ohlandt, Greeley, Ruggiero & Perle, LLP
20080299877 - Compact disk buffer system: This invention comprises methods, devices, and systems for buffing, to repair and restore all types of compact discs. The restoration is essentially accomplished by interaction of rotating buffers with a compact disc on a rotating platform. For added effectiveness certain chemicals are added to the rotating buffers. The portable system... Agent: Our Pal Asija Asija House
20080299878 - Systems and methods for reducing electrostatic charge of semiconductor wafers: A chemical-mechanical polishing machine and associated methods are disclosed. One embodiment of the machine includes a polishing pad, a wafer carrier corresponding to the polishing pad and configured to carry a semiconductor wafer, and a transfer station proximate to the polishing pad for holding the wafer during loading and/or unloading.... Agent: Perkins Coie LLP Patent-sea
20080299879 - Polishing pad, the use thereof and the method for manufacturing the same: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane with low permeability; and a polyurethane paste formed... Agent: Volentine & Whitt PLLC
20080299880 - Substrate holding apparatus and substrate polishing apparatus: A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the... Agent: Wenderoth, Lind & Ponack, L.L.P.
20080299881 - Device for blocking optical elements: The invention concerns a locking device comprising a rigid base (2) and a deformable pocket (3) containing a granular material (13). Discharging means (4) are provided for gas exchange between the inside and the outside the deformable pocket (3).... Agent: Young & Thompson
20080299882 - Retainer-ring of cmp (chemical mechanical polishing) machine: A retainer ring is provided which may restrain the time taken for a break-in polish to a minimum. This retainer ring may be disposed inside of a holding head in a CMP apparatus which polishes a wafer chemically and mechanically; may have a ring shape so as to surround the... Agent: Arent Fox LLP
20080299883 - Wall scrubber for blown insulation: An insulation system comprising: a supply of material having discrete elements; an applicator assembly for installation of the material having discrete elements to a surface; and a scrubber for finishing the face of the material, the scrubber including: (a) a vacuum conduit; (b) a blade assembly attached to the vacuum... Agent: Maccord Mason PLLC
20080299884 - Grinding wheel: In a grinding wheel in which abrasive tips for rough grinding and abrasive tips for finish grinding are alternately bonded to a periphery of a disk type base rotating about a rotation axis, each abrasive tip includes the abrasive layer for ed by bonding abrasive grains and a lower layer... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.Previous industry: Foundation garments
Next industry: Butchering
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