Abrading inventions 11/08

20080293329 - Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile: Methods, apparatus and systems are provided for processing a selected substrate having an edge profile. The invention includes receiving substrate information at a substrate processing system wherein the substrate information is associated with at least one substrate; determining an identification code of a substrate selected for processing using the received... Agent: Dugan & Dugan, PC

20080293328 - O.d. centerless grinding machine: In one aspect of the present invention, an outer diameter (O.D.) centerless grinding machine for use in grinding a diamond workpiece has a grinding wheel positioned parallel to a regulating wheel which is adapted to press a cylindrical workpiece into the grinding wheel as the regulating wheel rotates. Electronic equipment... Agent: Tyson J. Wilde Novatek International, Inc.

20080293330 - Alumina-film-polishing composition and chemical mechanical polishing method using the same: An alumina-film-polishing composition is for use in chemical mechanical polishing of an object to be polished that includes an alumina film with an irregular surface, so as to planarize the irregular surface. The polishing composition contains an alumina abrasive grain, and a protection-film-forming agent for forming a protection film on... Agent: Oliff & Berridge, PLC

20080293331 - Methods and apparatus for low cost and high performance polishing tape for substrate bevel and edge polishing in seminconductor manufacturing: Apparatus and methods are provided relating to polishing a substrate using a polishing device, such as a polishing tape. The polishing device may be formed to include a base, a resin layer adhering to the base, and a plurality of embossed abrasive particles and/or abrasive beads affixed to the base... Agent: Dugan & Dugan, PC

20080293332 - Polishing pad and method of polishing: A circular polishing pad has grooves formed on the surface in a spiral pattern with its center point offset from the center of the pad. The spiral pattern is an Archimedean spiral pattern or a parabolic spiral pattern. A target object is polished by using such a polishing pad without... Agent: Beyer Weaver LLP

20080293333 - Methods and apparatus for controlling the size of an edge exclusion zone of a substrate: In some embodiments, a method of controlling a width of an edge exclusion zone of a substrate is provided. The method includes determining a range of angles over which to rotate a polishing head; rotating the polishing head over the determined range of angles to achieve a preset width for... Agent: Dugan & Dugan, PC

20080293335 - Methods and apparatus for substrate edge polishing using a polishing arm: Apparatus and methods adapted to polish an edge of a substrate include (1) a polishing tape having a polishing surface and a second surface and (2) a polishing arm having a longitudinal axis and adapted to force the polishing surface of the polishing tape into contact with an edge of... Agent: Dugan & Dugan, PC

20080293334 - Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement: Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head, adapted to contact an edge of a substrate, wherein the polishing head includes one pair of front guide rollers and two pairs of back clamping rollers. Numerous other aspects are provided.... Agent: Dugan & Dugan, PC

20080293337 - Methods and apparatus for polishing a notch of a substrate by substrate vibration: Apparatus and methods are provided for polishing a notch on an edge of a substrate. An exemplary apparatus may include a substrate support adapted to support a substrate; a polishing head adapted to contact a notch in an edge of the substrate; and a controller adapted to oscillate the substrate... Agent: Dugan & Dugan, PC

20080293336 - Methods and apparatus to control substrate bevel and edge polishing profiles of films: Methods and apparatus are provided for polishing a film on an edge of a substrate. In some embodiments, a polishing head is provided having a backing plate adapted to press polishing material against a film on an edge of a substrate. The backing plate has a profiled portion adapted to... Agent: Dugan & Dugan, PC

20080293338 - Portable grinder with a wheel-guard support and auxiliary handle: A straight type power grinder includes an elongate housing having a handle with a power controller at its rear end, and a neck portion at its forward end supporting an output shaft connected to a rotation motor. The neck portion is formed with an integrated mounting flange for a grinding... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080293340 - Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads: Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.... Agent: Dugan & Dugan, PC

20080293341 - Methods and apparatus for using a rolling backing pad for substrate polishing: An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous other aspects... Agent: Dugan & Dugan, PC

20080293339 - Retainer ring: A retainer ring and a method of using the retainer ring are provided. The retainer ring has openings along a bottom surface. Grooves encompass the openings and extend to an interior portion of the retainer ring wherein a semiconductor wafer may be held. In operation, a semiconductor wafer is placed... Agent: Slater & Matsil, L.L.P.

20080293342 - Cmp head and method of making the same: A CMP head includes a membrane support and a membrane. The membrane support is disk-shaped, having an origin and a radius R. The membrane support has at least a ventilator disposed in a central region within the range between origin and (2/3) R, and at least a diversion opening disposed... Agent: North America Intellectual Property Corporation

20080293343 - Pad with shallow cells for electrochemical mechanical processing: The present invention generally provides a polishing article that is easy to clean, reduces debris and by product accumulation and reduces amount of polishing solution needed.... Agent: Patterson & Sheridan, LLP - - Appm/tx

20080293344 - Methods and apparatus for polishing a notch of a substrate using a polishing pad: Methods and apparatus are provided for polishing a notch of a substrate using a polishing tape. In some embodiments, a polishing head may be provided that is adapted to apply the polishing tape against the notch of the substrate, including: a polishing pad having a cavity adapted to be filled... Agent: Dugan & Dugan, PC

20080293345 - Porous abrasive articles with agglomerated abrasives and method for making the agglomerated abrasives: A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being characterized by a melting temperature between 500 and 1400° C., and the sintered agglomerates having a loose packing density of ≦1.6 g/cc... Agent: Saint-gobain Corporation

20080287038 - Polishing composition for semiconductor wafer, method for production thereof and polishing method: The present invention relates to a polishing composition for a substrate including a metal such as wiring, etc., formed on a semiconductor wafer, which can provide a high polishing rate without causing scratches on the wiring metal, a method of producing the polishing composition, and a polishing method. The polishing... Agent: Edwards Angell Palmer & Dodge LLP

20080287039 - Abrasive blasting system with remote flow control and method: A particulate blasting apparatus includes a blast vessel having an interior for storing abrasive particulate. The blast vessel has an inlet for introducing a pressurized gas into the interior of the blast vessel and an outlet for allowing the passage of the pressurized gas and particulate. A flexible blast hose... Agent: Grady K. Bergen

20080287040 - Method and device for generating dry ice particles: A method for generating a jet of dry ice particles, in which liquid carbon dioxide is expanded in an expansion space (12) in order to form dry ice particles which are then introduced into a flow of a carrier gas, and the discharge of the dry ice particles from the... Agent: Richard M. Goldberg

20080287041 - System and method for removing particles from a polishing pad: A system for removing particles from a polishing pad to improve the efficiency of the removal of material by the polishing pad as part of a chemical-mechanical polishing process, the system comprising a polishing pad; a fluid dispenser arranged to dispense a fluid on the polishing pad; and removal means,... Agent: Freescale Semiconductor, Inc. Law Department

20080287042 - Manufacture of lapping board: A method for manufacturing a lapping board having abrasive grains fixed on its surface, which is performed by the steps of: preparing a rotatable metal board having a surface of soft metal, an abrasive slurry-supplying tool arranged over the surface of the metal board, an abrasive-pressing tool which is placed... Agent: Nixon Peabody, LLP

20080287043 - Polishing apparatus: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring configured to hold and press the substrate against the polishing surface, a top ring shaft configured to... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080287044 - Method of transferring a wafer: A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the... Agent: North America Intellectual Property Corporation

20080287045 - Low-stress polishing device: A low-stress polishing device includes a base; a plurality of actuators mounted to the base and spaced from each other in a predetermined interval, each of the actuators having a drive shaft and a buffer spring connected with the drive shaft for providing the drive shaft with a predetermined impulsive... Agent: Bacon & Thomas, PLLC

20080287046 - Device for clamping a tool insert in a grinding machine: The insert (2) is placed on the reception surface (10) of the interchangeable support (9). A simple movement of the piston (35) towards the right in the barrel (7) of the headstock (1) drives the cam (32) so that the lever (13) pivots and moves, introducing its nose (15) into... Agent: Krieg Devault LLP

20080287047 - Polishing pad, use thereof and method for making the same: The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer. A method of polishing... Agent: Volentine & Whitt PLLC

20080287048 - Device for modifying the position of the segments in the event of the inclination of a segmented grinding pad: When a segmented grinding pad (11, 12, 13) of a continuous belt grinding machine is inclined, the modified position of the row (15) of key elements in relation to the original, for example, right-angled position of the row (11) of segments presents a problem. The aim of the invention is... Agent: Adams Intellectual Property Law, P.A.

20080287049 - Cutting disc: The invention describes a cutting disc (100) comprising a circular-disc-shaped body (10) with a central hole (11) for accommodating a drive spindle, an annular cutting region (13), containing abrasive, at the circumference (12) of the circular-disc-shaped body (10) and a centred plastic damping element (20) with a central hole (21),... Agent: Michael J. Striker

20080280536 - Surface treatment method: A surface treatment method that enables a surface of an electrostatic chuck to be smoothed, so as to improve the efficiency of heat transfer between the surface of the electrostatic chuck and a substrate. The electrostatic chuck is provided in an upper portion of a susceptor provided in a chamber... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080280538 - Polishing composition: The present invention provides a polishing composition containing an organic nitrogen-containing compound, an organic polybasic acid, an abrasive, and water, wherein the organic nitrogen-containing compound has in the molecule two or more amino groups, two or more imino groups, or one or more amino groups and one or more imino... Agent: Birch Stewart Kolasch & Birch

20080280537 - Sweetening and cleaning system for lapping machines: A sweetening and cleaning system that is used with one or more lapping machines to sweeten a lapping compound in a sweetening mode, and to clean parts of the system itself and parts of the one or more lapping machines with a cleaning compound in a cleaning mode. The system... Agent: James D. Stevens Reising, Ethington, Barnes, Kisselle, P.C.

20080280539 - Optical component fabrication using amorphous oxide coated substrates: A method of fabricating or preparing an optical component, such as a mirror, using an amorphous oxide coated substrate is presented. An amorphous oxide coating is applied to an optical substrate. An assessment of surface roughness of the coated surface is performed. The coated surface is polished based on the... Agent: Sterne, Kessler, Goldstein & Fox P.l.l.c.

20080280540 - Method for biopsy device needle tip: A biopsy device having a cannula with a distal tip is disclosed. The distal tip includes a blade, and can be a unitary metal injection molded component including a base and a blade. The blade can have a hardness of at least 40 HRC. The blade can be hardened, polished,... Agent: Philip S. Johnson Johnson & Johnson

20080280541 - Abrasive filament and brush: An abrasive filament including a matrix of thermoplastic polymer; and a plurality of abrasive particles such as eutectic alumina zirconia particles interspersed throughout at least a portion of the matrix. Abrasive brushes including such abrasive filaments are also disclosed. Methods of deburring a substrate having at least one burr, with... Agent: 3m Innovative Properties Company

20080280542 - Cleaning apparatus for a probe: The present invention provides a cleaning apparatus capable of removing foreign matters attached to a tip of a probe effectively without impairing the durability of the probe. The cleaning apparatus for the probe comprises a base plate having a rough surface and a surface layer formed to conform to and... Agent: Stolowitz Ford Cowger LLP

20080280543 - Hard finishing machine: The invention relates to a hard finishing machine (1). The machine has one tool (4) which is arranged on a tool spindle (3) and a rotary table (5) with an axis of rotation (6) which is aligned vertically, and a workpiece spindle (7) arranged on the rotary table (5) which... Agent: Lucas & Mercanti, LLP

20080280544 - Apparatus for lapping sliders using axially deformable member: An apparatus for lapping sliders comprises a rotatable lapping plate for lapping elements that are to be formed into sliders, a pushing force adjusting member that has an internal space therein and that extends vertically along an lapping plate axis that is perpendicular to the lapping plate, a pusher for... Agent: Nixon & Vanderhye, PC

20080280545 - Machine for dressing the edges and outer surfaces of flat workpieces: In a machine for processing the edges and outer surfaces of flat workpieces, including a machine frame with a workpiece support surface 12 and at least one dressing head 14 with a work tool carrier, which work tool carrier is rotatably supported on the machine frame for rotation about a... Agent: Mccormick, Paulding & Huber LLP

20080280546 - Method and apparatus for grinding the blade tips of a rotor wheel in blisk design: Tip grinding of BLISK blades is performed in a static state of an incrementally rotatable BLISK, with a rotational axis (9) of a grinding wheel (4), which is traversable along an upper edge of the blade, being aligned diagonally to an orientation of the blade upper edge, and hence, in... Agent: Harbin Klima Law Group PLLC

20080280547 - Power tool with output shaft: A motorized power tool includes an output shaft (11) including a tool receptacle (13) for receiving a disc-shaped tool (7) and having an outer thread with a constant outer diameter (D) and that forms a first securing element (14) for a locking element (8), a centering section (16) adjoining the... Agent: Abelman, Frayne & Schwab

20080280548 - Ice skate blade sharpening machine: A ice skate blade sharpening machine comprises a skate holder which holds the blade in a releasably fixed position, a rotatable grinding wheel having a periphery and rotatable about a grinding wheel axis, and a contouring tool having a contour surface, moveable between an engaged position and a disengaged position,... Agent: Miller, Canfield, Paddock And Stone P.L.C C/o Robert Kelley Roth

20080280549 - Guard attachment device: The invention is based on a protective hood fastening device having a fastening element (12a-12n) for fastening a protective hood (14a-14n) which is intended for partly enclosing a rotating application tool on a body (16a-16n) of an electric tool (10a-10n). It is proposed that the fastening element (12a-12n) comprise at... Agent: Michael J. Striker

20080274670 - Substrate peripheral portion measuring device, and substrate peripheral portion polishing apparatus: A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing controller (54) processes the electric signal of the reflected light to... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080274671 - Method of doping surfaces: Disclosed herein are methods of treating an article surface. The method comprises removing a metal oxide surface from the metal substrate to expose a metal surface; and delivering particles comprising a dopant from at least one fluid jet to the metal surface to impregnate the surface of the article with... Agent: Rissman Jobse Hendricks & Oliverio, LLP

20080274672 - Ophthalmic blocking pad: An ophthalmic blocking pad includes a foam layer, a film layer disposed over and directly contacting the foam layer, and an adhesive layer disposed over the film layer. The film layer has a tensile strength of at least about 25 ksi (172 MPa).... Agent: Larson Newman Abel Polansky & White, LLP

20080274673 - Wafer polishing apparatus, wafer polishing system and wafer polishing method: It is possible to execute a one-step polishing or a plural-step polishing at a high throughput, and it is possible to achieve a reduction of an occupied area on the basis of a compact structure of a whole apparatus. Two platens are respectively provided with a first wafer retention head... Agent: Paul A. Fattibene Fattibene & Fattibene

20080274674 - Stacked polishing pad for high temperature applications: The invention provides a polishing pad for chemical-mechanical polishing comprising a polishing layer, a bottom layer, and a hot-melt adhesive, the hot-melt adhesive joining together the polishing layer and the bottom layer. The hot-melt adhesive comprises between about 2 and about 18 wt. % EVA and is substantially resistant to... Agent: Steven Weseman Associate General Counsel, I.p.

20080274675 - Multipurpose bench grinder with left and right grinder assemblies: A multipurpose bench grinder (1) is disclosed that includes a body including a base (2) and a housing (3); a motor mounted in the body and having a driving shaft (6) extending out of both sides of the body; a right grinder assembly (4) including a first grind wheel (45)... Agent: G. Link Co., Ltd.

20080274676 - Abrading device: An abrading device features a flexible abrading membrane supported by two supports. The device may be used in either linear or rotary configurations. The device can be used in conjunction with devices that impart continuous or vibratory linear or rotary motion.... Agent: Cherskov & Flaynik

20080274677 - Abrasive slotted disc with controlled axial displacement of a workpiece: Apparatus and method for sharpening a workpiece, such as a cutting tool. An abrasive disc is rotatable about a disc rotational axis and includes a plurality of spaced apart, radially disposed apertures extending therethrough from a first surface to an opposing second surface of the disc. The first surface is... Agent: Fellers, Snider, Blankenship, Bailey & Tippens

20080274678 - Grinding machine and a grinding jig therefore: A grinding jig for use in the grinding of a straight edge woodworking tool on the peripheral surface of a rotating grindstone in a grinding machine. The grinding machine has a cylindrical support bar parallel with the rotation axis of the grindstone. The jig includes a base, which is parallel... Agent: Breiner & Breiner, L.L.C.

20080274679 - Sheet metal finished by continuous hair-line on its plane and curved surface and apparatus and method for finishing by continuous hair-line on the same: A hair-line processing, and more particularly a sheet metal finished by continuous hair-line on its plane and curved surface, and apparatus and method for finishing by continuous hair-line on the same are disclosed, wherein the sandpaper curvaceously advances to form hairlines relative to curved surface of the sheet metal, and... Agent: Fish & Richardson P.C.