Abrading inventions 10/08

20080261493 - Apparatus for removing material, use of gas inclusions in an abrasive liquid and process for grinding and/or polishing surfaces: The invention relates to an apparatus for removing material from a surface of a workpiece during grinding and/or polishing of the surface by means of abrasive particles which are delivered by a liquid. The apparatus comprises a device for setting the gas content in the liquid, in particular for adding... Agent: Shoemaker And Mattare, Ltd

20080261494 - Precision sharpener for hunting and asian knives: A knife sharpener is provided which is capable of precision sharpening of hunting and similar knives that have a first and second blade face, each of which terminates at a facet that meets the corresponding facet to create the knife edge. At least the first of the blade faces has... Agent: Connolly Bove Lodge & Hutz LLP

20080261495 - Alighment apparatus and alignment method thereof: An exemplary alignment apparatus (20) includes a supporting member (24), a conveyor (25), and a high-pressure fluid generator (21). The supporting member is configured for supporting a substrate (23) having an alignment layer (26). The conveyor is configured for conveying the supporting member along a predetermined direction. The high-pressure fluid... Agent: Wei Te Chung Foxconn International, Inc.

20080261496 - Apparatus for supplying constant quantity of abrasive: A rotating disk 20 that rotates in the horizontal direction is provided inside an abrasive tank 10, with a gap 3 being capable to rotate the rotating disk 20, being formed at one end 11a of a mixed fluid flow path 11 arranged on one surface of the rotating disk... Agent: Shlesinger, Arkwright & Garvey LLP

20080261497 - Retainer ring for cmp device: A two-layer structure retainer ring is capable of giving a uniform pressing force while uniting a first ring and a second ring more securely. A first ring 11 is formed with a pressed-and-fitted portion 11d over the full circumference of a lower surface 11c thereof and a second ring 12... Agent: Arent Fox LLP

20080261498 - Abrasive belt for sanding device: An abrasive belt includes a net member having a number of cords secured together for forming a number of eyelets between the cords, and a number of abrading particles applied onto the net member for engaging with a work piece and for abrading the work piece and for abrading cut... Agent: Charles E. Baxley, Esquire

20080261499 - Fixed abrasive wire: There is provided a fixed abrasive wire having abrasives fixed thereon with a superior fixing strength. The abrasives are fixed on the wire by electroplating in which the wire is subjected to a degreasing step, an acid cleaning step, a rinsing step and an electroplating step sequentially. A plating liquid... Agent: Marshall, Gerstein & Borun LLP

20080261493 - Apparatus for removing material, use of gas inclusions in an abrasive liquid and process for grinding and/or polishing surfaces: The invention relates to an apparatus for removing material from a surface of a workpiece during grinding and/or polishing of the surface by means of abrasive particles which are delivered by a liquid. The apparatus comprises a device for setting the gas content in the liquid, in particular for adding... Agent: Shoemaker And Mattare, Ltd

20080261494 - Precision sharpener for hunting and asian knives: A knife sharpener is provided which is capable of precision sharpening of hunting and similar knives that have a first and second blade face, each of which terminates at a facet that meets the corresponding facet to create the knife edge. At least the first of the blade faces has... Agent: Connolly Bove Lodge & Hutz LLP

20080261495 - Alighment apparatus and alignment method thereof: An exemplary alignment apparatus (20) includes a supporting member (24), a conveyor (25), and a high-pressure fluid generator (21). The supporting member is configured for supporting a substrate (23) having an alignment layer (26). The conveyor is configured for conveying the supporting member along a predetermined direction. The high-pressure fluid... Agent: Wei Te Chung Foxconn International, Inc.

20080261496 - Apparatus for supplying constant quantity of abrasive: A rotating disk 20 that rotates in the horizontal direction is provided inside an abrasive tank 10, with a gap 3 being capable to rotate the rotating disk 20, being formed at one end 11a of a mixed fluid flow path 11 arranged on one surface of the rotating disk... Agent: Shlesinger, Arkwright & Garvey LLP

20080261497 - Retainer ring for cmp device: A two-layer structure retainer ring is capable of giving a uniform pressing force while uniting a first ring and a second ring more securely. A first ring 11 is formed with a pressed-and-fitted portion 11d over the full circumference of a lower surface 11c thereof and a second ring 12... Agent: Arent Fox LLP

20080261498 - Abrasive belt for sanding device: An abrasive belt includes a net member having a number of cords secured together for forming a number of eyelets between the cords, and a number of abrading particles applied onto the net member for engaging with a work piece and for abrading the work piece and for abrading cut... Agent: Charles E. Baxley, Esquire

20080261499 - Fixed abrasive wire: There is provided a fixed abrasive wire having abrasives fixed thereon with a superior fixing strength. The abrasives are fixed on the wire by electroplating in which the wire is subjected to a degreasing step, an acid cleaning step, a rinsing step and an electroplating step sequentially. A plating liquid... Agent: Marshall, Gerstein & Borun LLP

20080254713 - Pad assemblies for electrochemically assisted planarization: In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer, wherein the intermediate layer contains a plurality of perforations, channels, or... Agent: Patterson & Sheridan, LLP - - Appm/tx

20080254714 - Polishing method and polishing apparatus: A polishing method enables to initiate a second polishing step of a workpiece with an optimal thickness of an uppermost-layer film to be polished. The polishing method comprises: measuring a thickness of an uppermost-layer film, and then carrying out a first polishing step to polish the uppermost-layer film partway and... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080254715 - Device grinding method: A device grinding method comprising the steps of holding the undersurface of a protective member which supports a plurality of devices by affixing their front surfaces onto the top surface of the protective member, on the chuck table of a grinding machine and grinding the rear surfaces of the plurality... Agent: Smith, Gambrell & Russell

20080254716 - Variable rate method of machining gears: A method of machining gears or other toothed articles wherein the workpiece feed rate and/or the tool shifting is varied so as to produce an irregular surface pattern on tooth surfaces with a resulting reduction in mesh noise. The method is particularly applicable to grinding spur and/or helical gears with... Agent: The Gleason Works

20080254717 - Cmp polishing slurry and method of polishing substrate: A CMP polishing slurry of the present invention contains cerium oxide particles, water, and a polymer of at least one of a methacrylic acid and the salt thereof, and/or a polymer of at least one of a methacrylic acid and the salt thereof and a monomer having an unsaturated double... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080254718 - Production method of polishing composition: [Means to Solve the Problems] The present invention relates to a production method of a polishing composition containing zirconia oxide sol including: baking at a temperature ranging from 400 to 1000° C., a zirconium compound having d50 (where d50 represents a particle diameter meaning that the number of particles having... Agent: Oliff & Berridge, PLC

20080254719 - Substrate processing method: In a substrate processing method of polishing a periphery of a substrate, in a state where a first polishing surface to which abrasive grains that include particles having a chemical effect on an oxide-silicon-series or nitride-silicon-series film as a main component have been fixed is brought into contact with the... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080254720 - Polishing head, polishing apparatus and polishing method for semiconductor wafer: The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2... Agent: Oliff & Berridge, PLC

20080254721 - Hand-guided sander, sander cradle, and sander housing: e

20080254722 - Pad conditioner: A pad conditioner is provided for conditioning a polishing pad in chemical mechanical planarization (CMP). The pad conditioner comprises a plastic abrasive portion having a first hardness and optionally a brush portion having a second hardness less than the first hardness. The plastic abrasive portion comprises a base plate and... Agent: Patterson & Sheridan, LLP - - Appm/tx

20080254723 - Expansible sanding block exhibiting oblique extending surfaces: A sanding block for supporting an exteriorly mounted looped sanding belt having an elongated and planar shaped base. A planar shaped cover exhibits first and second oblique extending surfaces and, upon engaging with the base by a plurality of mating tabs and slots, collectively defines a three-dimensional article for supporting... Agent: Gifford, Krass, Sprinkle,anderson & Citkowski, P.c

20080254724 - Expandable unitary quick mount abrasive discs and support pad therefor: The combination of an abrasive finishing device and a support pad therefor. The support pad includes circular plastic plates formed to define a depressed center. A fastening member permanently affixed to the abrasive finishing article is attached in such a manner as to form a depressed center section for the... Agent: Fulbright And Jaworski LLP

20080254725 - Quick mount adapter and backing plate surface care system and apparatus: A quick mount adapter and backing plate is provided for use with a surface care tool of conventional manufacture, the tool including a male or female drive spindle with or without an adapter interface. A surface care media is attached directly to the backing plate. The quick mount adapter is... Agent: Joseph S. Heino, Esq. Davis & Kuelthau, S.c.

20080254726 - Abrasive body: It is disclosed an abrasive body having a work surface (2) that under operating conditions is designed to face a surface of an article of manufacture to be worked; this surface is provided with abrasive means to enable an abrading or finishing working; also present is a predetermined number of... Agent: Pearne & Gordon LLP

20080248719 - Apparatus, method and computer program product for modifying a surface of a component: An apparatus, method and computer program product for modifying a surface of a component is provided. In use, a surface of a component is translated relative to at least one jet for a period of time to form a plurality of features thereon.... Agent: Zilka-kotab, PC

20080248721 - Eyeglass lens processing apparatus: a speed controller that calculates radius vector moving data for the moving unit with respect a rotating angle of the lens chuck shaft based on target lens shape data, and calculates a rotating speed of the lens chuck shaft rotating unit based on a change of the moving data with... Agent: Sughrue-265550

20080248722 - Eyeglass lens processing apparatus: In an eyeglass lens processing apparatus for beveling a peripheral edge of an eyeglass lens, if the high curve lens processing mode is selected by a mode selector, a computing unit acquires a high curve bevel path for locating the bevel apex on a front surface curve of the eyeglass... Agent: Sughrue-265550

20080248720 - Eyeglass lens processing apparatus and lens fixing cup: In a two-step processing mode in which a cup for attaching a lens to a chuck axis is changed from a large diameter cup to a small diameter cup on the way of processing, a roughing path data computing unit for computing first roughing path data larger than the target... Agent: Sughrue-265550

20080248723 - Polishing condition control apparatus and polishing condition control method of cmp apparatus: To eliminate the unevenness of the film thickness of the wafers, and increase the polishing efficiency, reduce the running cost and enhance the production yield. A CMP apparatus 1 includes a film thickness measuring means 6 that measures the film thickness of the wafers before polishing, a polishing recipe preparing... Agent: Paul A. Fattibene Fattibene & Fattibene

20080248724 - Grinding machine for grinding work pieces between centers and for centerless grinding, as well as grinding method: A grinding machine for grinding work pieces (3) between centers, as well as for centerless grinding, features a drive for a grinding wheel (1) and a drive for a regulating wheel (2). The work piece (3) can be supported between the grinding wheel (1) and the regulating wheel (2) either... Agent: Townsend And Townsend And Crew, LLP

20080248725 - Floor grinding machine: The present invention is a floor grinder assembly for grinding a floor. The assembly includes first and second rails configured for being mounted spaced apart from and parallel to one another. A plurality of stands is configured for mounting the first and second rails above the floor. The stands have... Agent: Lerner Greenberg Stemer LLP

20080248728 - Method for manufacturing polishing pad, polishing pad, and method for polishing wafer: There is disclosed a method for manufacturing a polishing pad that is formed of a urethane foam pad and attached to a turn table to polish a wafer, the method comprising at least steps of: slicing a urethane foam cake to provide the urethane foam pad; and performing press processing... Agent: Oliff & Berridge, PLC

20080248726 - Polishing method and polishing film used in such polishing method: Disclosed is a polishing method which is effective to prevent lowering of the polishing efficiency in the later stage of polishing. The polishing method is characterized in that polishing is performed while so adjusting a polishing liquid as to have a pH of not less than 2 and less than... Agent: The Webb Law Firm, P.C.

20080248727 - Polishing slurry: The present invention provides a polishing slurry which remarkably inhibits the occurrence of scratch, dishing or erosion. According to the present invention, provided is a polishing slurry comprising organic particles (A), an oxidizing agent and a complexing agent, wherein said organic particles (A) are those obtained by coating a part... Agent: Buchanan, Ingersoll & Rooney PC

20080248729 - Method and apparatus for manufacturing optical elements: In a method for producing optical elements, material on a blank (20) is removed with an abrasive liquid jet (32). The liquid jet (32) has a jet thickness (d) which is greater than the dimension (D) of the blank (20) in a plane (E) perpendicular to the direction (R) of... Agent: Shoemaker And Mattare, Ltd

20080248730 - Wafer processing method: A wafer processing method including the step of removing a ringlike reinforcing portion formed along the outer circumference of a wafer on the back side thereof. The ringlike reinforcing portion is ground by a grinding stone in such a manner that the locus of the grinding stone rotating intersects the... Agent: Greer, Burns & Crain

20080248731 - Sonic razor blade sharpener: An apparatus for sharpening one or more razor blades secured within a holder is disclosed. The holder includes a head for retaining the one or more razor blades in a cutting position and a handle affixed to the head. A housing includes a razor slot adapted to receive the head.... Agent: David M. Morse Connoly Bove Lodge & Hutz LLP

20080248732 - Disc blade sharpener: A disc blade sharpener. A wheel carriage includes a rotatable abrasive wheel contactable against the side surface of the cutting edge of the disc blade. A rotatable driver wheel mounted on the carriage rotates the disc blade while the abrasive wheel contacts and sharpens the cutting edge of the disc... Agent: Woodard, Emhardt, Moriarty, Mcnett & Henry LLP

20080248733 - Holding fixture for a grinding tool, grinding tool and supporting body for a grinding tool: A holding fixture (1) for a grinding tool (30) is comprised, in essence, of a first tension plate (10) and a second tension plate (20). The first tension plate (10) can rotate relative to the second tension plate (20) about an axis (A). The first tension plate (10) comprises a... Agent: Shoemaker And Mattare, Ltd

20080248734 - Method and apparatus for improved chemical mechanical planarization and cmp pad: A polishing pad includes a guide plate, a porous slurry distribution layer and a flexible under-layer. Polishing elements are interdigitated with one another through the slurry distribution layer and the guide plate. The polishing elements may be affixed to the compressible under-layer and pass through corresponding holes in the guide... Agent: Sonnenschein Nath & Rosenthal LLP

20080242195 - Cmp system having an eddy current sensor of reduced height: By providing an eddy current sensor element in a polishing tool at a reduced height level in combination with a corresponding optical endpoint detection system, standard polishing pads may be used, thereby enhancing the lifetime of the polishing pad and increasing tool utilization.... Agent: J. Mike Amerson Williams, Morgan & Amerson, P.C.

20080242196 - Method and system for controlling chemical mechanical polishing by taking zone specific substrate data into account: A system for chemical mechanical polishing (CMP) is disclosed which includes a polishing apparatus for polishing a surface of a substrate and a sensor for determining zone-specific substrate data respectively related to at least two zones of the substrate. A controller is provided for generating, in response to the zone-specific... Agent: Williams, Morgan & Amerson

20080242197 - Wafer polish monitoring method and device: The present invention aims to provide a wafer polish monitoring method and device for detecting the end point of the polishing of a conductive film with high precision and accuracy by monitoring the variation of the film thickness of the conductive film without adverse influence of slurry or the like... Agent: Paul A. Fattibene Fattibene & Fattibene

20080242198 - Multi-step planarizing and polishing method: A multi-step planarizing and polishing method includes performing a first and a second polishing steps, wherein one of the two polishing steps is performed using a silica abrasive based slurry, while the other one of the two polishing steps is performed using a CeO2 abrasive based slurry. A third polishing... Agent: J C Patents, Inc.

20080242199 - Polishing apparatus and method of reconditioning polishing pad: This polishing apparatus includes a head that holds a semiconductor wafer, a polishing pad that polishes a surface to be polished of the semiconductor wafer held by the head, and a dresser that reconditions the polishing pad by cutting the polishing pad. The polishing apparatus polishes a surface to be... Agent: Young & Thompson

20080242200 - Method for manufacturing surface-coated cutting insert: This method for manufacturing a surface-coated cutting insert includes clamping and holding a surface-coated cutting insert with a pair of rotary shafts which are rotatable around an axis, and jetting an abrasive fluid to the surface of the surface-coated cutting insert using at least one blasting gun while rotating the... Agent: Darby & Darby P.C.

20080242201 - Apparatus for reworking a steel edge of a ski: An apparatus is described for reworking a steel edge of a ski (1), comprising at least one grinding apparatus (16) made of a cup-like grinding wheel (18) which is driven by a motor (17) and comprises a rotational axis extending transversally to the direction of feed (10), a bearing block... Agent: Collard & Roe, P.C.

20080242202 - Extended pad life for ecmp and barrier removal: A method and apparatus for extending a polishing article lifetime on a polishing tool with multiple platens is described. The apparatus includes an advanceable roll to roll platen with multiple embodiments of a polishing article to be used thereon. The polishing article is adapted to perform a polishing process by... Agent: Patterson & Sheridan, LLP - - Appm/tx

20080242203 - Apparatus and method for lapping slider using floating lapping head: An apparatus for lapping a slider comprises a lapping head for supporting elements while pressing the elements against a rotating lapping plate, the elements that are to be formed into sliders, a holding mechanism for supporting the lapping head, the holding mechanism having a first engaging member that extends in... Agent: Nixon & Vanderhye, PC

20080242204 - metal sanding devices: A multi-tasking disk which in one form is used primarily with a powered hand tool to remove measured amounts of material from the surface of a work piece, and, in another form, serving as a buffing tool for removing minute amounts of skin from feet, elbows and the like on... Agent: Ladas & Parry LLP