Abrading inventions 09/08

20080233835 - Pin adapter for air bearing surface (abs) lapping and method for using the same: A system for lapping a head on a wafer including at least one head each having an electrical lapping guide (ELG), a plurality of wafer contacts in electrical communication with the ELG, and a closure formed thereon defining a slot in which the wafer contacts are positioned, the system comprising... Agent: Zilka-kotab, PC- Ibm

20080233836 - Polishing composition and polishing method: A polishing composition includes more than 0.1% by mass of colloidal silica, and water, and has a pH of 6 or less. The polishing composition has the ability to polish a titanium material at a high stock removal rate. Thus, the polishing composition is suitable for use in applications for... Agent: Vidas, Arrett & Steinkraus, P.A.

20080233837 - Methods of removing defects in surfaces: Methods of abrading surfaces by rotationally reciprocating abrasive surfaces in contact with the surfaces, abrasive articles for use in rotationally reciprocating tools, and methods of removing defects in a surface, where the methods include sanding using a rotationally reciprocating abrasive surface followed by one or more polishing operations are disclosed.... Agent: 3m Innovative Properties Company

20080233838 - Substrate treatment method for portion to be coated: A portion to be coated of a workpiece is subjected to substrate treatment by blasting to provide an anchor effect without leaving abrasive grains thereon. A substrate treatment method for a portion to be coated includes ejecting an elastic abrasive onto a portion to be coated of a workpiece to... Agent: Merchant & Gould PC

20080233840 - Method for the simultaneous grinding of a plurality of semiconductor wafers: Simultaneous double-side grinding of a plurality of semiconductor wafers involves positioning each wafer freely in a cutout of one of plural carriers which rotate on a cycloidal trajectory, wherein the wafers are machined between two rotating ring-shaped working disks, each disk having a working layer of bonded abrasive, wherein the... Agent: Brooks Kushman P.C.

20080233839 - Polisher for chemical mechanical planarization: Embodiments of a polisher for chemical mechanical planarization. The polisher includes a polishing pad structure containing a first reactant therein, and a second reactant in a polishing environment over the polishing pad structure. The first reactant and the second reactant react endothermically upon contact when polishing a wafer surface between... Agent: Birch, Stewart, Kolasch & Birch, LLP

20080233841 - Disk-shaped substrate manufacturing method: The disk-shaped substrate manufacturing method is provided with: generating an air stream downward from an upper area during grinding a disk-shaped substrate in a grinding apparatus; arranging the grinding apparatus on an upper floor face of a floor and arranging water on a lower floor face of the floor, the... Agent: Sughrue Mion, PLLC

20080233842 - Dresser and apparatus for chemical mechanical polishing and method of dressing polishing pad: A dresser adapted to a chemical mechanical polishing apparatus is used to perform dressing on a polishing pad for polishing a semiconductor wafer such that a circular-shaped support surface thereof is positioned opposite to and in contact with the polishing surface of the polishing pad. In the dresser, at least... Agent: Young & Thompson

20080233843 - Two-sided surface grinding method and apparatus: In effecting two-sided surface grinding for surface-grinding the opposite surfaces of a workpiece simultaneously by a pair of oppositely disposed grinding wheels, infeed grinding is performed by oscillating the workpiece within the range where the surfaces to be ground of the workpiece do not protrude from the inner and outer... Agent: Jordan And Hamburg LLP

20080233844 - Retainer ring and polishing machine: To provide a retainer ring by which an object to be polished can be uniformly polished, and deterioration thereof can be suppressed, and it does not take time to recycle, and a polishing machine having the retainer ring. The retainer ring 1 includes: a first annular portion 11 for surrounding... Agent: Young & Thompson

20080233845 - Abrasive articles, rotationally reciprocating tools, and methods: Methods of abrading surfaces by rotationally reciprocating abrasive surfaces in contact with the surfaces, abrasive articles for use in rotationally reciprocating tools, and methods of removing defects in a surface, where the methods include sanding using a rotationally reciprocating abrasive surface followed by one or more polishing operations are disclosed.... Agent: 3m Innovative Properties Company

20080233847 - Guide cart and power tool with guide a cart: A guide cart for a hand-held power tool with a driven tool has a pivot device that is pivotable between an open position and a fixation position. A fixation elements is provided that releasably secures the power tool on the guide cart. The fixation element is secured on the pivot... Agent: Gudrun E. Huckett Draudt

20080233846 - Hand-held power tool, in particular a sander: g

20080233848 - Compact electric sanding machine: The present invention particularly relates to a hand-held sanding machine with an outer housing (1), a tool shaft (2) and a brushless electric drive motor. In the present invention, the rotor of the drive motor is fastened to the tool shaft (2) of the sanding machine, and the stator (6)... Agent: Altera Law Group, LLC

20080233849 - Composite support structure for use in sanding and sanders formed therefrom: A composite support structure for use in sanding and sander includes a rigid plate having a front surface which includes a wall defining a contained surface and a back surface for connection to a handle and a polyfoam layer having a front surface and a back surface, wherein the back... Agent: R. William Graham

20080233850 - Abrasive article and method of making and using the same: An abrasive article comprises a porous abrasive member, a nonwoven filter medium, a second nonwoven filter medium, and optionally a porous attachment layer. A plurality of openings in the porous abrasive member cooperates with the first nonwoven filter medium to allow the flow of particles from an outer abrasive surface... Agent: 3m Innovative Properties Company

20080233851 - Grinding apparatus: A grinding wheel having a convex grinding surface is attached to a wheel spindle that is contactlessly supported by a casing through a controlled type axial magnetic bearing and controlled type radial magnetic bearings and that is rotated by an electric motor. A groove of a workpiece is ground by... Agent: Mcginn Intellectual Property Law Group, PLLC

20080227366 - Combined apparatus for machining of articles, in particular in form of slabs: An apparatus for machining an article (L) in the form of a slab or the like comprises—in addition to a rotary tool (24) associated with a spindle (22)—a nozzle (26) ejecting water at very high pressure. Both the rotary tool and the nozzle are supported by a carriage (20) sliding... Agent: Katten Muchin Rosenman LLP

20080227367 - Substrate polishing metrology using interference signals: A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, generating a light beam and directing... Agent: Fish & Richardson P.C.

20080227368 - Document abrading device: The present invention provides a shredding device that has an elongated body that houses a motor. A brush may be rotatably secured to the body, at least partly outside of the body, and driven by the motor and configured to remove by abrasion at least a layer of a substrate... Agent: Pillsbury Winthrop Shaw Pittman, LLP

20080227369 - Apparatus and method for confined area planarization: A proximity head and associated method of use is provided for performing confined area planarization of a semiconductor wafer. The proximity head includes a chamber defined to maintain an electrolyte solution. A cathode is disposed within the chamber in exposure to the electrolyte solution. A cation exchange membrane is disposed... Agent: Martine Penilla & Gencarella, LLP

20080227370 - Substrate for magnetic disk: A method for manufacturing a substrate for a magnetic disk, including the steps of (a) polishing a substrate with a polishing composition A containing alumina abrasives having an average particle size of from 0.05 to 0.5 μm, and an oxidizing agent, and (b) polishing the substrate with a polishing composition... Agent: Birch Stewart Kolasch & Birch

20080227371 - Double-side polishing apparatus: The double-side polishing apparatus for polishing both faces of a wafer is capable of reliably measuring not only a thickness of an outer part of the wafer but also a thickness of a center part thereof. The double-side polishing apparatus comprises: a lower polishing plate; an upper polishing plate held... Agent: Birch Stewart Kolasch & Birch

20080227372 - Tribological surface and lapping method and system therefor: A tribological system including: a tribological workpiece having a working surface adapted for moving relative to a counter-surface in a presence of a lubricant, in a load-bearing environment, the working surface for disposing generally opposite the counter-surface, the working surface having: (i) a metal surface layer; (ii) a plurality of... Agent: Dr. Mark M. Friedman C/o Bill Polkinghorn - Discovery Dispatch

20080227373 - Low vibration sander with a flexible top handle: A power tool includes a tool body, and the tool body is subject to vibration during operation of the power tool. The power tool also includes a handle adapted to be grasped by an operator of the power tool for controlling the motion of the power tool, and at least... Agent: Brake Hughes Bellermann LLP

20080227374 - Polishing head testing with movable pedestal: A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer toward the polishing head. In another aspect of the present description, the test wafer may be... Agent: Konrad Raynes & Victor, LLP Attn: Amat7828

20080227375 - Ultra fine fiber polishing pad: A polishing pad includes a body having a polymer layer and a polishing layer. The polymer layer has opposite first and second faces. The polymer layer includes a plurality of first ultrafine fibers and a polymer bonding the first ultrafine fibers together. The polishing layer is formed on the first... Agent: Kamrath & Associates P.A.

20080220695 - Apparatus on a flat card or roller card for grinding a fibre processing clothing disposed on a rotating cylinder or a card flat: In an apparatus on a carding machine for grinding a fibre processing clothing on a roller or a card flat, grinding equipment includes at least one grinding element and an infeed device serving to position the grinding element against the clothing. To permit reliable detection and monitoring of the contact... Agent: Venable LLP

20080220694 - Centerless feed-through super-finishing device having a lapping system containing a freely-disposed abrasive: A centerless feed-through super-finishing device including: first and second feed-through rollers having first and second longitudinal outer surfaces; a metallic part having a generally cylindrical section, disposed between the outer surfaces, wherein a longitudinal axis of the cylindrical section is generally aligned with the outer surfaces, the cylindrical section having... Agent: Dr. Mark M. Friedman C/o Bill Polkinghorn - Discovery Dispatch

20080220696 - Honing feed system having full control of feed force, rate, and position and method of operation of the same: The feed system for a honing machine provides a capability to dynamically correct in real time errors in bore size inferred arising from variations in feed force, and a method of operation of the same. The system allows a user to select between rate and force controlled honing modes, which... Agent: Haverstock, Garrett & Roberts LLP

20080220697 - Machine including grinding wheel and wheel dresser: Disclosed are a machine with a grinding wheel and a dressing surface and related method. The dressing surface is movable in at least two axes of translation relative to the grinding wheel. The rotational speed of the grinding wheel and dressing surface preferably are under the control of a computer... Agent: Banner & Witcoff, Ltd.

20080220698 - Systems and methods for efficient slurry application for chemical mechanical polishing: An embodiment relates generally to a chemical mechanical polishing apparatus. The apparatus includes a platen adapted to receive a wafer to be chemical-mechanically polished and a polishing pad configured to polish the wafer. The apparatus also includes a slurry feed line configured to provide slurry to the polishing pad and... Agent: Texas Instruments Incorporated

20080220699 - Fluid system and method for thin kerf cutting and in-situ recycling: A fluid jet system for achieving a kerf width less than 0.015 inches is provided. In one embodiment, the system includes an orifice mount having a high-pressure fluid bore and an abrasive bore configured to communicate an abrasive mixture in form of a paste or foam to at least a... Agent: Seed Intellectual Property Law Group Pllc

20080220700 - Glass substrate for information recording medium and method for producing the same: A glass substrate for an information recording medium is manufactured by polishing the surface of a raw material glass plate. The polishing of the raw material glass plate is divided into a step for performing a first polishing process to roughly polish the surface of the raw material glass plate... Agent: Sheridan Ross Pc

20080220701 - Polishing pad and method for making the same: A method for making a polishing pad includes providing a non-woven fabric made of a plurality of fibers. The non-woven fabric is submerged with a polymer resin solution. The polymer resin submerged in non-woven fabric is cured to form a porous polymer having an outer face adapted for polishing a... Agent: Kamrath & Associates P.a.

20080220702 - Polishing pad having surface texture: The present invention relates to a polishing pad having a surface texture. The surface texture is disposed on the polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove extends from a... Agent: Volentine & Whitt Pllc

20080220703 - Abrasive backing and abrasive cloth: The present invention relates to an abrasive backing and abrasive cloth and more particularly, to an abrasive backing including an upper weave layer and a lower weave layer which are comprised with warps and wefts, and a binding yarn which connects the upper weave layer and the lower weave layer,... Agent: Perkins Coie LLP

20080214091 - Sanding apparatus: A sanding apparatus for sanding a support surface includes an elongated frame having a handle end and a work end. The handle end is arranged for operator control and the work end is adapted for connection to a working device. The sanding apparatus also includes a stabilizer member adapted to... Agent: Fildes & Outland

20080214093 - Cmp polishing slurry and polishing method: The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080214092 - Method and apparatus for measurement of magnetic permeability of a material: A system for determining the magnetic permeability of a material is provided. Two electrical inductors formed as primary and secondary concentric coils share a common magnetic core space. An AC voltage applied to the primary coil creates a magnetic flux in the core proportional to the magnetic permeability of a... Agent: Steven Weseman, Patent Counsel Qed Technologies International, Inc.

20080214094 - Method for manufacturing silicon wafer: A method for manufacturing a silicon wafer comprises a slicing step of a silicon single crystal ingot to obtain sliced wafers, a single-side grinding step to grind only one side of a wafer, and a smoothing step to smooth the other side of the wafer by controlling application of etchant... Agent: Duane Morris LLP Patent Department

20080214095 - Cutting tool sharpener: A tool sharpening assembly (100) suitable for sharpening cutting tools (140,350,366,546,562). In some embodiments, a wedge-shaped port is formed between a rotational first abrasive surface (160,262) and a stationary second abrasive surface (162,264) to sharpen a distal cutting edge (146) of a cutting tool (140,230,546). In other embodiments, a cooling... Agent: Fellers, Snider, Blankenship, Bailey & Tippens, PC

20080214096 - Machining spindles: A machining spindle includes an inner shaft arranged for carrying a first tool and an outer shaft for carrying a second tool. The shafts are mounted for rotation about a common axis and for axial movement relative to each other. The inner shaft is mounted within the outer shaft, which... Agent: Alston & Bird LLP

20080214097 - Handheld electric grinder: A handheld electric grinder comprises a first shell body and a second shell body. The first shell body contains an electric motor therein, and is connected to the electric motor via a drive shaft. The electric motor is driven to let the drive shaft generate a first rotating speed. A... Agent: Sinorica, LLC

20080214098 - Power sander with novel sanding sheet tension clamping: Portable sander, in particular an orbital sander, having an abrasive sheet carrier (1) and having clamping means (3) for firmly clamping opposite abrasive sheet ends of an abrasive sheet (21) which can be supported on the abrasive sheet carrier (1), wherein first clamping means (3) together with an abrasive sheet... Agent: Michael J. Striker