Abrading inventions 08/08

20080207089 - Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool: Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to... Agent: Baker & Mckenzie LLP

20080207090 - Method for grinding journal section of workpiece: For grinding one of axially spaced journal sections of a workpiece each having a cylindrical surface and a pair of shoulder surfaces extending radially outward from the opposite end portions of the cylindrical surface, a rotating grinding wheel is advanced to grind the shoulder surfaces of one journal section and... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080207091 - Slurry composition for color filter polishing: The invention provides a slurry composition for polishing color filters. The slurry composition at least includes an abrasive, a buffer solution and an additive. The abrasive is selected from the group consisting of alumina, ceria, magnesia, silica, titania, zirconia, cupric oxide, ferric oxide, zinc oxide and the mixture thereof. The... Agent: J C Patents, Inc.

20080207092 - Method of centering a non-edged ophthalmic lens in which the centering point of the lens is offset relative to its geometric center: The invention relates to a method for centering an uncut single vision ophthalmic lens (1) having an initial contour (2) associated with a center point (CO) and provided for being cut according to a final contour (3) associated with a pupil point, comprising the following steps: superimposing the pupil point... Agent: Young & Thompson

20080207093 - Methods and apparatus for cleaning a substrate edge using chemical and mechanical polishing: Methods and apparatus are provided for concurrently chemically and mechanically polishing a substrate edge. The invention includes a substrate support adapted to rotate a substrate; a polishing head adapted to contact an edge of the substrate, the polishing head including a first channel adapted to apply a first fluid to... Agent: Dugan & Dugan, Pc

20080207094 - Method and apparatus for ultra thin wafer backside processing: A method and apparatus for ultra thin wafer backside processing are disclosed. The apparatus includes an outer ring holding a high temperature grinding and/or dicing tape to form a support structure. An ultra thin wafer or diced wafer is adhered to the tape within the ring for wafer backside processing.... Agent: Schein & Cai LLP

20080207095 - Apparatus for processing wafer: An apparatus for processing wafer is provided, in which a re-adhesion of the slurry to the wafer edge, which has been adhered to the elastic abrasion member, can be inhibited, since a stronger contact of the rotating elastic abrasion member with the wafer edge, which is occurred when the rotating... Agent: Young & Thompson

20080207096 - Wide belt sander: A wide belt sander has a base, a driving axle, a driving device, a driven axle bracket, a driven axle, a belt and an automatic adjustment device. The driving axle is rotatably mounted on the base and has a central axis. The driving device is mounted on the base and... Agent: Charles E. Baxley, Esquire

20080207097 - Apparatus for machining a workpiece: An apparatus for machining a strip- or plate-shaped metallic workpiece is proposed, in particular for the deburring of cut edges and/or for the grinding of surfaces of the workpiece, having at least one machining unit which has a revolving drive device which directs a machining element at least approximately linearly... Agent: Burr & Brown

20080207098 - Safety guard with clamping device: The invention relates to a protective hood for a portable tool with a rotary tool, having a clamping device designed as a clamping ring for fastening to a machine neck of the portable tool, and having an anti-rotation locking means for fixing the angular position of the protective hood relative... Agent: Michael J. Striker

20080207099 - Resilient abrasive article and method of manufacture: The present invention provides a resilient hand-held abrasive article comprising a flexible and/or conformable grip comprising a top surface, a bottom surface and individual small high-grip pads attached to each other in a pattern that leaves voids therebetween, the individual small high-grip pads comprising a top and a bottom. The... Agent: Altera Law Group, Llc

20080207100 - Customized polishing pads for cmp and methods of fabrication and use thereof: The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density... Agent: Morrison & Foerster LLP

20080207101 - Abrasive element: An abrasive element has a first surface region which coincides with an enveloping surface of the element, and a second surface region which does not. When the element is pressed against a planar surface, part of the second surface region, which is provided with abrasive material, comes into contact with... Agent: Shoemaker And Mattare, Ltd

20080207102 - Grinding member for buttons on rock drill bit: The present invention provides a grinding member or connection to a drive connection member to form a grinding cup for grinding the hard metal inserts or working tips of drill bits (percussive or rotary), tunnel boring machine cutters (TBM) and raised bore machine cutters (RBM) to restore them to substantially... Agent: Volpe And Koenig, P.c.

20080200097 - Polishing method and polishing apparatus: The polishing method of a disk-shaped substrate for polishing an outer circumference 13 of a disk-shaped substrate using slurry is provided with in this sequence: a first polishing process for polishing the outer circumference 13 using an abrasive-grain inclusion brush 50 made of a resin in which polishing abrasive grains... Agent: Sughrue Mion, PLLC

20080200098 - Polishing slurry for aluminum and aluminum alloys: The invention is directed to a method of polishing a surface of an object that includes aluminum. The method includes the step of contacting the surface of the object with a soft polishing pad and a polishing composition. The polishing composition includes abrasive particles, an agent that oxidizes aluminum, and... Agent: Steven Weseman Associate General Counsel, I.p.

20080200099 - Method for monitoring edge exclusion during chemical mechanical planarization: A method is provided for measuring edge exclusion on a workpiece that includes a wafer having a film disposed thereon. The method is performed by a CMP system employing a platen and a thickness sensor coupled to the platen and positioned to repeatedly travel a path over the edge of... Agent: Ingrassia Fisher & Lorenz, P.C.

20080200100 - Substrate processing apparatus: A substrate processing apparatus (1) includes first and second polishing units (70A, 70B) for polishing a peripheral portion of a substrate (W), a primary cleaning unit (100) for cleaning the substrate (W), a secondary cleaning and drying unit (110) for drying the substrate (W) cleaned in the primary cleaning unit... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080200101 - Polisher shuttle, and a method and a polisher device making use thereof: The polisher shuttle serves to polish the inside walls of cylindrical tubes, in particular tubes for medical use. It comprises radial projections that are flexible along the axial direction, suitable for polishing the inside walls of tubes merely by relative movement between the shuttle and the tube, the shuttle passing... Agent: Kenyon & Kenyon LLP

20080200102 - Polishing pad, use thereof and method for manufacturing the same: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; and a buffer layer formed between the base material and an upper surface of the membrane with low permeability and embedded into the fibers of the base material. A method... Agent: Sughrue Mion, PLLC

20080200103 - Guard for a hand-held power tool and hand-held power tool with a guard: The invention relates to a protective hood for a hand tool, in particular for an electrical hand tool which has a support area for the attachment of a flange of the hand tool, and with a clamping device for fastening the protective hood to the flange as well as an... Agent: Striker, Striker & Stenby

20080200104 - High-efficiency dust collecting device with two gateways: A high-efficiency dust collecting device with two gateways is connected with exits of a cover of a sand grinder and above two sanding belt rollers., composed of a first gateway set and a second gateway set, which are both formed integrally with a metallic panel and provided respectively with a... Agent: Bruce H. Troxell

20080200105 - Carrier film for mounting polishing workpiece and method for making the same: The present invention relates to a carrier film for mounting a polishing workpiece. The carrier film comprises a surface substrate and a buffer substrate. The surface substrate comprises holes, and the material of the surface substrate comprises elastomer. The buffer substrate comprises holes, and the material of the buffer substrate... Agent: Sughrue Mion, PLLC

20080200106 - Composite abrasive bodies: Composite abrasive bodies, which include abrasive product supports, abrasive particles and cured adhesives bonding the abrasive product supports and the abrasive products, are provided. The cured adhesives may be two-component polyurethane or (meth)acrylate adhesives. In addition, methods for preparing the composite abrasive bodies are also provided.... Agent: Oliff & Berridge, PLC

20080194182 - Mechano-chemical polishing method for gaas wafer: A method of performing mechano-chemical polishing serving as a primary polishing operation for a GaAs wafer, by using a mechano-chemical polishing solution containing dichloroisocyanuric acid, sodium tripolyphosphate, sodium sulfate, sodium carbonate, and colloidal silica as components except for water, includes the steps of: mounting the wafer on a mechano-chemical polishing... Agent: Mcdermott Will & Emery LLP

20080194183 - Planarization polishing method and method for manufacturing semiconductor device: Disclosed herein is a planarization polishing method for polishing a polishing-target wafer for a planarized surface, the method including the step of polishing a polishing-target surface into a planarized surface by using polishing slurry that contains an abrasive grain and a surfactant encapsulated through surface coating.... Agent: Rader Fishman & Grauer Pllc

20080194184 - Method for manufacturing treatment device and treatment device: A tapered cutting edge portion and a continuous raise portion from the tapered cutting edge portion are ground in an edge portion of a straight grinding raw material so that an eccentricity is not generated. In a method for grinding a treatment device, one end portion of a tapered grinding... Agent: Townsend & Banta C/o Portfolio Ip

20080194185 - Pipe and shaft sander: The present invention relates to a hand-held motorized device that is designed for sanding cylindrical objects. The invention comprises a left side and right side within which are a plurality of rollers, a motor, an on/off button, power supply, and sanding belt. A plurality of diameter knobs located on the... Agent: Office Of Kyle Fletcher

20080194186 - Clamping device comprising a centring device on a grinding spindle rotor, and rotary part comprising one such centring device: A grinding disk base body is fixable to the centering section of a grinding spindle rotor in a centering manner by the base body which includes an inner recess from which two fixed projections project inwardly. The base body also includes a mobile supporting element in the form of a... Agent: Jordan And Hamburg LLP

20080194187 - Elastic drive belt assembly: The elastic drive belt system connects the belt directly to a drive shaft and driven pulley. The elastic drive belt has a plurality of longitudinal ribs on the traction side of the belt. The drive shaft has a plurality of grooves sized and arranged to receive and engage the longitudinal... Agent: Husch Blackwell Sanders LLP

20080194188 - Fingernail sander: A fingernail grinder uses a bench grinder-like configuration wherein a motor has dual output shafts with a wheel with an abrasive outer circumference attached to one of the shafts. The wheel is contained within a protective housing that has a longitudinal slit through which a fingernail passes to be ground... Agent: Peter Loffler

20080194189 - Multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system: The present invention related to a multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system which comprises a rotary union at a driving side and a rotary union at a following side. The rotary union at a driving side comprises a central rotation axle; a fluid supplying tube... Agent: Intellectual Property / Technology Law

20080194190 - Universal bushing for abrasive wheels: Embodiments of the present invention resolve the safety and product management issues associated with conventional abrasive wheel bushings by, for example, reducing the opportunity for improperly mounting an abrasive wheel without the appropriate reducing bushing, simplifying the purchasing process, and/or reserving valuable SKU space for primary products. The abrasive wheel... Agent: Houston Eliseeva

20080188161 - Method and system for forming a workpiece: A method for shaping a workpiece having a base portion using a tool is provided. The method includes rotating the tool at a fixed rotational speed in a first direction and rotating the workpiece in the first direction. The tool is positioned in contact with the workpiece at a first... Agent: General Motors Corporation Legal Staff

20080188162 - Electrochemical mechanical polishing apparatus conditioning method, and conditioning solution: An electrochemical mechanical polishing apparatus is for use in polishing of a conductive material (e.g., metal) on a surface of a substrate by combination of electrochemical action and mechanical action. This apparatus includes a polishing table having divided electrodes and adapted to hold a polishing pad having a polishing surface,... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080188163 - Method of polishing a substrate: A method for polishing a substrate using a pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, wherein the polymeric matrix is applied on a permeable substrate, and wherein the polishing pad exhibits reduced defectivity and improved polishing... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

20080188164 - Method and device, for grinding a cutting tool, especiallay a knife: The invention relates to a method for grinding a cutting tool, especially a knife. The aim of the invention is to provide a method which allows configuration of individual leaf or blade geometries at comparatively low costs. For this purpose, the cutting tool is contacted with the effective surface of... Agent: Harness, Dickey & Pierce, P.L.C

20080188165 - Method for manufacturing disk-substrates for magnetic recording media, disk-substrates for magnetic recording media, method for manufacturing magnetic recording media, magnetic recording media, and magnetic recording device: A method for manufacturing a magnetic recording medium disk substrate is provided for achieving a magnetic disk having a suitable surface roughness, a high in-plane magnetic anisotropy and a high S/N. The manufacturing method has a texturing process wherein the magnetic recording medium disk substrate is rotated in the circumferential... Agent: Venable LLP

20080188166 - Lapping machine: A lapping machine includes upper and lower lapping wheels and a sprocket having a common centered rotational axis. A rotational drive source for at least one of the upper and lower lapping wheels provides rotational movement about the axis. At least two independently locatable gears or sprockets disposed radially exterior... Agent: Mcnees Wallace & Nurick LLC

20080188167 - Substrate processing apparatus: A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080188168 - Polishing material having polishing particles and method for making the same: The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a high polymer elastic body. The base material has a plurality of fibers for defining a... Agent: Sughrue Mion, PLLC