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Abrading July cataloged by category listing 07/08Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 07/31/2008 > patent applications in patent subcategories. cataloged by category listing
20080182482 - Grinding device and method of grinding: An elongated work is attached to an elongated holding surface opposed to a flat abrasive surface in a grinding device. The holding member is supported on a spherical receiving body so that the holding member changes its attitude around the spherical receiving body. The change of the attitude of the... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20080182484 - Lapping apparatus and lapping method: A lapping apparatus includes a lapping plate having a lapping surface thereon that moves relative to a work. The lapping apparatus can adjust an inclination of the work in a latitudinal direction, thereby obtained preferable parallelization of both a reading elements and writing element to the lapping surface. As a... Agent: Greer, Burns & Crain
20080182483 - Probe polishing method and probe polishing member: In a probe polishing method, a plurality of probes, which are arranged on a probe card for performing an inspection of electrical characteristics of a target object, are polished by using a polishing member. Further, the probes are polished over plural times, while changing a relative position of the abrasive... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20080182485 - Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization: A method of polishing a substrate with a polishing composition comprising an oxidizing agent and abrasive particles having a surface, said surface of the abrasive particles being at least partially modified with 1) at least one stabilizer compound comprising aluminum, boron, tungsten, or both, said stabilizer compound being bound via... Agent: Air Products And Chemicals, Inc. Patent Department
20080182486 - Slurry blasting apparatus for removing scale from sheet metal: An apparatus and method of removing scale from the surfaces of processed sheet metal and tubular metal employs a scale removing medium propelled by counter-rotating pairs of wheels positioned in close proximity to the metal surfaces.... Agent: Thompson Coburn, LLP
20080182487 - Cooling disc, grinding system and grinding tool: The present invention relates to a cooling disc for cooling grinding tools, having at least one fastening opening, a side which can face a grinding tool, a side which can face away from a grinding tool, a first contact face which is configured in such a way that it can... Agent: Shoemaker And Mattare, Ltd
20080182488 - Spiral brush for cleaning and conveying a substrate: Scrubbing apparatus is configured by methods so that discs are quickly cleaned and conveyed by selecting a total number of spiral brush segments, rates of brush rotation, and a pitch length of a helical junction that receives discs for cleaning and transport. A time period for cleaning and transporting discs... Agent: Martine Penilla & Gencarella, LLP
20080182489 - Polishing pad with grooves to reduce slurry consumption: A chemical mechanical polishing pad having an annular polishing track and a concentric center O. The polishing pad includes a polishing layer having a plurality of pad grooves formed therein. The polishing pad is designed for use with a carrier, e.g., a wafer carrier, that includes a polishing ring having... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.
20080182490 - Method and system for pad conditioning in an ecmp process: A method and system for pad conditioning in an electrochemical mechanical planarization (eCMP) tool is disclosed. A polishing pad having a pad electrode is placed onto a platen of the eCMP tool. A conditioning disk, having a second electrode is placed on the polishing pad, such that the pad electrode... Agent: International Business Machines Corporation Dept. 18g
20080182491 - Device and control unit for belt sanding systems: A belt sanding system comprising a segmented sanding block including a plurality of individually controllable segments and one or more sanding belt deflecting rollers, a plurality of sensing elements corresponding to the plurality of segments, and a device for interconnecting the plurality of sensing elements, interconnecting the plurality of sensing... Agent: Adams Intellectual Property Law, P.A.
20080182492 - Chemical mechanical polishing pad: The polishing pad is suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad has an ultimate tensile strength of at least 3,000 psi (20.7 MPa) and polymeric matrix containing closed cell pores. The closed cell pores have an average diameter of 1 to 50... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.
20080182493 - Polishing pad with grooves to reduce slurry consumption: A chemical mechanical polishing pad having an annular polishing track and a concentric center O. The polishing pad includes a polishing layer having a plurality of pad grooves formed therein. The polishing pad is designed for use with a carrier, e.g., a wafer carrier, that includes a polishing ring having... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.07/24/2008 > patent applications in patent subcategories. cataloged by category listing
20080176486 - Polishing apparatus including separate retainer rings: A polishing apparatus includes a polishing pad for polishing a wafer and a polishing head for holding the wafer. The polishing head includes a retainer ring, a membrane sheet, and a head body. The retainer ring retains the wafer in a horizontal direction. The membrane sheet depresses the wafer to... Agent: Mcginn Intellectual Property Law Group, Pllc
20080176487 - Portable cleaning and blasting system for multiple media types, including dry ice and grit: Blast-cleaning systems are disclosed, which enable a single system to handle different classes of particulate blasting media, such as grit, powder, and dry ice, and to deliver controllable mixtures of different media types during a blasting operation. This “multi-media” system includes a hopper having two chambers or other supply assemblies... Agent: Patrick D. Kelly
20080176488 - Grinding method of a disk-shaped substrate and grinding apparatus: The grinding method of a disk-shaped substrate that grinds a disk-shaped substrate including a portion having a hole at the center thereof while rotating the disk-shaped substrate is provided with: grinding an inner circumference of the disk-shaped substrate while an inner circumference grinding device is fed in a radial direction... Agent: Sughrue Mion, Pllc
20080176489 - Disk-shaped substrate inner circumference polishing method: The disk-shaped substrate inner circumference polishing method for polishing an inner circumference of a disk-shaped substrate including a portion having an opening hole at the center thereof includes inserting a brush having a shaft core into the portion having the opening hole of the disk-shaped substrate; fixing one end and... Agent: Sughrue Mion, Pllc
20080176490 - Capillary, capillary polishing method, and capillary polishing apparatus: A tip of a capillary used for microinjection is polished on a plurality of sides by using a polishing plate having a surface roughened by dry etching. A first side of the tip is placed on the polishing plate at a predetermined angle and with a predetermined amount of pressing.... Agent: Staas & Halsey LLP
20080176491 - Wafer grinding method: A method of grinding the rear surface of a wafer having a plurality of dividing lines which are formed in a lattice pattern on the front surface and devices which are formed in a plurality of areas sectioned by the plurality of dividing lines, comprising a protective film forming step... Agent: Greenblum & Bernstein, P.L.C
20080176492 - Units for collecting particles, apparatus including the same and methods for collecting particles using the same: A collection unit includes an exhaust conduit providing a path through which a process gas flows, a trap installed in the exhaust conduit, and a collection line connected to the trap. The trap has an inlet through which particles in the process are introduced into the trap, and the collection... Agent: Mills & Onello LLP
20080176493 - Grinding assembly: A grinding assembly includes a motor with a transmission pipe connected thereto and a male connector is connected to the transmission pipe. A spiral pipe is received in the transmission pipe and a steel cable extends through the spiral pipe. A distal end of the steel cable is connected to... Agent: Chao, Chia-chun
20080176494 - Abrasive preparation device with an improved abrasion element assembly: An abrasive abrading a grinding device (10) having a housing (12) for moving over a concrete surface. The housing has depending abrasion elements (14) with a substrate layer (30) and a backing layer (32) mounted to a support bracket (34) that in turn is affixed to the housing. The substrate... Agent: Reising, Ethington, Barnes, Kisselle, P.c.
20080176495 - Sanding apparatus and method of manufacture: An improved resilient sanding block of the type comprising a core having a plurality of exterior surfaces, including a first major surface and a second major surface and side surfaces, and having a layer of abrasive material disposed thereon. The resilient sanding block may have one or more apertures or... Agent: Altera Law Group, Llc
20080176496 - Knife sharpener: A knife sharpener comprises a base, a motor, a grinding wheel assembly, a rotary shaft and a spring. The working channel between the edge of the grinding disc and the grinding awl is automatically adjustable to accommodate different blade of different thickness. When the knife sharpener performs grinding operation, the... Agent: Dr. Banger Shia
20080176497 - Quick-change grinding pad and mounting system: A quick change mounting system for grinding and other surface preparation pads provides a simple and effective way for the pads to be mounted and changed on the mounting plate of a large surface preparation machine without removing the mounting plate from the machine. (This method also allows that existing... Agent: Law Office Of Polly L. Oliver
20080176498 - Grinding tools and apparatus for securing grinding tools to grinding machines: According to one example, a grinding plate for releasably mounting at least one grinding tool to a grinding machine, each grinding tool having a tool base with at least one grinding element mounted thereto, the grinding plate having least one pocket located proximate a periphery of the grinding plate, each... Agent: Bereskin And Parr07/17/2008 > patent applications in patent subcategories. cataloged by category listing
20080171492 - Method and device for grinding ceramic spheres: A method and apparatus for grinding spheres of ceramic material, including the spheres with at least one grinding wheel containing abrasive grains bound in a synthetic resin. The abrasive grains comprise more than 50% diamond and less than 5%, Cr2O3.... Agent: Robert W. Becker & Associates
20080171493 - Polishing pad and method of producing the same: The present invention mainly relates to a polishing pad and method of producing the same. The polishing pad comprises a base material having a surface for polishing a substrate, wherein the surface comprises a non-woven fabric and an elastomer. The non-woven fabric is made of a long fiber and the... Agent: Sughrue Mion, PLLC
20080171494 - Apparatus and method for slurry distribution: A assembly for a chemical mechanical polishing apparatus includes a carrier head and a polishing liquid delivery ring. The carrier head has a substrate receiving surface and a retaining ring surrounding the substrate receiving surface. The polishing liquid delivery ring is coupled to the carrier head and surrounds the retaining... Agent: Fish & Richardson P.C.
20080171495 - Micro-sanding machine with a sanding effect by air disc-abrasive: A pneumatic sanding machine for cleaning and scraping replaces a sanding disc with a high pressure compressed air disc swirling powder abrasive. Acceleration and ejection functions of the sanding nozzle are dissociated in two portions, allowing very thin ejection ports, even smaller than 400 micrometres in diameter, without clogging. The... Agent: Young & Thompson
20080171496 - Device for smoothing the surfaces of hard or soft materials: The present invention is a finishing plate and method of fabricating a finishing plate. The finishing plate can be fabricated to various shapes, and can be used with various surfacing machines. In a preferred mode, the present invention is a disc cutting plate which can be used with a random... Agent: Kenneth W. Bower
20080171497 - Portable belt sander: A portable belt sander having a drive pulley capable of being produced at a limited period. The sander includes a main body accommodating therein a motor, a drive shaft rotationally driven by the motor, a drive pulley coupled to the drive shaft, a driven shaft, and an endless polishing belt... Agent: Antonelli, Terry, Stout & Kraus, LLP
20080171498 - Grinding assemblies for use with handheld power tools: Grinding assemblies for use with handheld power tools are disclosed herein. More specifically, the assemblies disclosed herein can include a hub, disc, grinding surface and locking nut and can be used with most available handheld grinders for grinding flat surfaces.... Agent: Baumgartner Patent Law
20080171499 - Stand-up grinder caddy with adjustable height and low profile floating head: An apparatus for a stand-up grinder caddy includes a handle assembly and an upper sheath. A lower caddy includes a wheel assembly and a lower sheath for insertion into the upper sheath. A bracket supports a grinder with the bracket attached to a support frame with a joint and to... Agent: David Stoll
20080171500 - Retainer ring for polishing head: In order to achieve the above object, the invention provides a retainer ring for polishing head includes: a base unit made of a highly rigid material, formed to have a ring-like shape, and supported on the polishing head side; and a resin unit in which a plurality of resin blocks... Agent: Paul A. Fattibene Fattibene & Fattibene
20080171501 - Hood plates for handheld grinding tools: Hood plates for use with hood covers designed for handheld power tools including angle grinders are disclosed herein. More specifically, the hood plates disclosed herein include means for easily attaching to a wide variety of available angle grinders and are easily configured to work with a soft hood cover to... Agent: Baumgartner Patent Law
20080171502 - Tool for surfacing an optical surface: o
20080171504 - Abrasive sharpener: A pocket abrasive sharpener having a housing formed with a pair of upper slots and a lower open compartment. A pair of abrasive ceramic stones is mounted in one of the slots to form a V-shaped sharpening slot. Each ceramic stone has at least one flat face to abut an... Agent: Edward D. Gilhooly
20080171503 - Methods of bonding superabrasive particles in an organic matrix: Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The... Agent: Thorpe North & Western, LLP.
20080171505 - Cutting segment for diamond tool and diamond tool having the segment: The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from wear during cutting. In the... Agent: Mcdermott Will & Emery LLP07/10/2008 > patent applications in patent subcategories. cataloged by category listing
20080166948 - Nanotopography control and optimization using feedback from warp data: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based... Agent: Senniger Powers LLP
20080166949 - Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing... Agent: Wenderoth, Lind & Ponack, L.L.P.
20080166950 - Tribological surface and lapping method and system therefor: A method of operating a tribological system including the steps of: (a) providing a workpiece having a tribological working surface, the working surface including: (i) a metal surface layer; (ii) a plurality of organic particles intimately incorporated in the metal surface layer, and (iii) a plurality of inorganic particles incorporated... Agent: Dr. Mark Friedman Ltd. C/o Bill Polkinghorn
20080166951 - Sapphire substrates and methods of making same: A sapphire substrate includes a generally planar surface having a crystallographic orientation selected from the group consisting of a-plane, r-plane, m-plane, and c-plane orientations, and having a nTTV of not greater than about 0.037 μm/cm2, wherein nTTV is total thickness variation normalized for surface area of the generally planar surface,... Agent: Larson Newman Abel Polansky & White, LLP
20080166952 - Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same: The present invention is a carrier for a double-side polishing apparatus in which, in a double-side polishing apparatus, the carrier is set between upper and lower turn tables to which polishing pads are attached, and a holding hole to hold a wafer sandwiched between the upper and lower turn tables... Agent: Oliff & Berridge, PLC
20080166953 - Adhesive tape for fixing lens and method for processing lens using the same: An adhesive tape, interposed between a lens to be processed and a holding jig when the lens is mounted in a lens processing machine, which has a plastic foam with holes opening in an adhering surface and an adhesive layer formed on the adhering surface of the plastic foam, and... Agent: Rabin & Berdo, PC
20080166954 - Fluid barrel-polishing device and polishing method: A fluid barrel-polishing device comprises a cylindrical fixed tank (1) and a turntable (2) that is located at the bottom of the tank (1) with a gap (3) that allows it to rotate horizontally, and wherein when workpieces and media are thrown in the fixed tank (1) and the turntable... Agent: Bromberg & Sunstein LLP
20080166955 - Tribological surface and lapping method and system therefor: A mechanical system for lapping a metal working surface, including: (a) a workpiece having the metal working surface; (b) a lapping tool having a contact surface, the contact surface for disposing generally opposite the working surface, the contact surface including an organic, polymeric material; (c) a plurality of particles, including... Agent: Dr. Mark Friedman Ltd. C/o Bill Polkinghorn
20080166956 - Method for correcting semi-conductive belt: The present invention provides a method for correcting a semi-conductive belt, the semi-conductive belt including a resin and a conductive substance, the method having grinding a geometrically defective part of the semi-conductive belt to flatten the geometrically defective part.... Agent: Sughrue-265550
20080166957 - Substrate holding apparatus and polishing apparatus: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion... Agent: Wenderoth, Lind & Ponack, L.L.P.
20080166958 - Method and system for point of use recycling of ecmp fluids: The present invention generally comprises a method and an apparatus for recycling electrochemical mechanical polishing (ECMP) fluid. A selected portion of used ECMP fluid may be delivered to a recycling unit where the fluid may be refurbished. The concentration of the components that are present in the selected portion of... Agent: Patterson & Sheridan, LLP - - Appm/tx
20080166959 - Scraper sharpening apparatus: A kit for sharpening scrapers includes a burnisher, a block, a file and a clamp. The block has a plurality of bores for receiving the burnisher that are aligned at different angles relative to each other. The block is held in place by the clamp with the block below an... Agent: Law Office Of John C. Mcmahon07/03/2008 > patent applications in patent subcategories. cataloged by category listing
20080160878 - Failure alarm device and failure alarm method: A failure alarm device includes: an operation instruction capturing unit; an operation status signal capturing unit; and a timing and alarming unit for starting timing when the operation instruction capturing unit captures a start-operation instruction and the operation status signal capturing unit captures an operation status signal indicative of that... Agent: Squire, Sanders & Dempsey L.l.p.
20080160879 - Method of abrading a zirconium-based alloy workpiece: A method of abrading a zirconium-based alloy workpiece including the steps of contacting a zirconium-based alloy workpiece with an abrasive article, wherein the abrasive article includes a flexible waterproof backing having a first surface bearing a cured primer coating; and a plurality of shaped structures, each structure having a distal... Agent: 3m Innovative Properties Company
20080160880 - Chemical mechanical polishing slurry and chemical mechanical polishing apparatus and method: A chemical mechanical polishing (CMP) slurry and a chemical mechanical polishing (CMP) apparatus and method reduce defects, such as scratches, while maintaining a high polishing rate of a target film to be polished through a CMP process. The CMP slurry includes a ceria-based abrasive having a concentration of 0.001-10 percent... Agent: Townsend And Townsend And Crew, LLP
20080160881 - Polishing composition: A polishing composition comprising an abrasive and water, wherein the polishing composition has an index of degree of sedimentation of 80 or more and 100 or less; a process for producing a substrate comprising polishing a substrate to be polished using the above-mentioned composition; a process for preventing clogging of... Agent: Birch Stewart Kolasch & Birch
20080160882 - Method for achieving stripe height control at bow compensated lapping: A lapping device comprises a mounting surface for coupling at least one non-parted slider row. At least one lever arm is coupled to at least one distal end of the mounting surface. The lever arm comprises a coupling feature at an end of the lever arm for receiving a force-vectoring... Agent: Hitachi C/o Wagner Blecher LLP
20080160883 - Abrasive configuration for fluid dynamic removal of abraded material and the like: An abrasive tool utilized to remove material from a workpiece is formed to comprise fluid-dynamically-designed features (apertures, airfoils) configured to efficiently remove abraded material and waste from the surface of the workpiece. An abrasive component (and/or backing plate) is formed to include fluid-dynamically-designed features that create an air flow stream/pressure... Agent: Wendy W. Koba
20080160884 - Rotating polishing tool: The present invention has an object to provide a rotating polishing tool with high durability that can finish a polished surface with desired surface roughness. As means thereof, a substantially cylindrical polishing member 3 is constituted by a pair of polishing units 9 at opposite ends, and an intermediate portion... Agent: Wenderoth, Lind & Ponack, L.l.p.
20080160885 - Retaining ring for a chemical mechanical polishing tool: A retaining ring for a chemical mechanical polishing tool comprises a pad side surface. The pad side surface has an edge portion adjacent its outer circumference. A surface normal of the edge portion and a surface normal of the pad side surface include an acute angle. Additionally, or alternatively, the... Agent: Williams, Morgan & Amerson
20080160886 - Abrasive cleaning device: A cleaning element (36) for a cement floor surface mounted to a housing (32). Each cleaning element has a flat flexible abrasive surface (39) that is transversely positioned to the direction of motion to provide flex during cleaning of a cement floor surface.... Agent: Simon Palushaj
20080160887 - Abrasive finishing tool having a rotary pneumatic motor: A pneumatic abrading or polishing tool is provided that includes a motor having a rotor, a motor housing, a carrier part having a shaft and a key extending from the shaft, and an abrading or polishing head attached to the carrier part. The motor housing contains a progressive exhaust passage... Agent: Christie, Parker & Hale, LLP
20080160888 - Rotor and rotor housing for pneumatic abrading or polishing tool: A power driven abrading or polishing tool is provided that includes a motor having a rotor; a carrier part having a shaft and a key extending from the shaft; and an abrading or polishing head attached to the carrier part. The rotor includes an outer body of a first material... Agent: Christie, Parker & Hale, LLP
20080160889 - Automatic lens blocking apparatus: An automatic lens blocking apparatus having a tracer and a lensmeter therein, for adhering a block to a lens by using a robot arm, is disclosed. The automatic lens blocking apparatus comprises: a tracer for obtaining data on a shape of a glass frame and data on a center of... Agent: Blakely Sokoloff Taylor & Zafman
20080160890 - Chemical mechanical polishing pad having improved groove pattern: A chemical mechanical polishing pad and method for chemical-mechanical polishing is provided, wherein the polishing pad has a plurality of first mesas and one or more second mesas defined on a surface thereof. The plurality of first mesas are generally distributed about the surface of the polishing pad, wherein each... Agent: Texas Instruments Incorporated
20080160891 - Method for determining initial burnishing parameters: A method of determining parameters for a burnishing operation includes: using a rolling burnishing element to burnish at least two segments on a selected surface of a material sample, the segments having a common width and overlapping each other by a preselected overlap value; measuring the resulting hardness of the... Agent: Adams Intellectual Property Law, P.a.Previous industry: Foundation garments
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