Abrading inventions 06/08

20080153390 - Water jet stripping and recontouring of gas turbine buckets and blades: A method for water jet stripping and recontouring of a coated article of manufacture is provided. The method includes dimensionally scanning the coated article and establishing a three-dimensional model for the coated article. The method further includes establishing a set of reduced dimensional profiles for recontouring and then analyzing whether... Agent: Ge Energy General Electric C/o Ernest G. Cusick

20080153391 - Method of polishing a semiconductor wafer: Semiconductor wafers have a front surface, a back surface, a notch, and an edge. A method of polishing a wafer includes polishing at least one of the surfaces and the notch of the wafer using a polishing pad and slurry. At least one surface of the wafer is cleaned of... Agent: Senniger Powers LLP

20080153392 - Chemical mechanical planarization composition, system, and method of use: The disclosure relates to chemical mechanical planarization (CMP) polishing compositions including proline and a fluorochemical surfactant. The wafer polishing composition may be used as a solution substantially free of abrasive particles, the composition of which can be adjusted to control Oxide Removal Rate and oxide over nitride Selectivity Ratio in... Agent: 3m Innovative Properties Company

20080153393 - Cmp related scratch and defect improvement: A method for serially polishing a plurality of semiconductor wafers, wherein a CMP apparatus having a first polishing pad and a second polishing pad is provided. A first slurry composition is disposed between the first polishing pad and a first wafer when the first wafer is in a first state,... Agent: Texas Instruments Incorporated

20080153394 - Method for fabricating highly reliable interconnects: A method of fabricating highly reliable tungsten interconnects takes into consideration the effects of charging that can occur within a CMP apparatus due to unrestricted DI water flow, limited only by house supply. Such effects are addressed with the use of a variable pressure input constant flow output in-line controller... Agent: Freescale Semiconductor, Inc. Law Department

20080153395 - Chemical mechanical polishing pad: A chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad has a high modulus component forming a continuous polymeric matrix and an impact modifier within the continuous polymeric matrix. The high modulus component has a modulus of at least... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

20080153396 - Methods for machine ceramics: A method for machining a ceramic substrate containing Al, including providing a solution containing a phosphorus compound on the ceramic substrate; and machining the substrate with an abrasive.... Agent: Larson Newman Abel Polansky & White, LLP

20080153397 - Methods for machining inorganic, non-metallic workpieces: A method of machining a workpiece includes applying a fluid between a fixed abrasive component and a workpiece, followed by translation of the fixed abrasive component and the workpiece relative to each other. The fluid contains an anti-clogging agent containing a phosphorus-containing organic chemistry.... Agent: Larson Newman Abel Polansky & White, LLP

20080153398 - Cmp pad conditioners and associated methods: A method of reducing a degree of compression of a CMP pad during conditioning of the CMP pad comprises engaging the CMP pad with at least one superhard cutting element, the cutting element including a cutting face, the cutting face being angled at 90 degrees or less relative to a... Agent: Thorpe North & Western, LLP.

20080153399 - Stone cutting system and method: A stone cutting system and method for cutting a stone sheet having a substantially planar surface utilizes a frame upon which a stone sheet to be cut can be positioned, a motor for supporting a cutting tool adjacent the stone sheet and for rotating the cutting tool, and an articulated... Agent: Michael E. Mckee Attorney At Law

20080153400 - Chemical mechanical polishing apparatus: An edge section of a wafer can be polished, and at same time, a polishing surface of a polishing member can be dressed by a dresser mechanism. A polishing member has annular concave trenches, which are coaxially formed in the front surface thereof, and at least an inner surface of... Agent: Mcginn Intellectual Property Law Group, Pllc

20080153401 - Hand-held power tool: The invention relates to a hand machine tool comprising a first housing shell (12, 150, 162), a second housing shell (16, 156, 168) different from the first housing shell (12, 150, 162) and being connected to the first housing shell (12, 150, 162) via a damping element (58, 60, 122,... Agent: Michael J. Striker

20080153402 - Roadway grinding/cutting apparatus and monitoring system: An apparatus and method is provided for monitoring operation of a roadway grinding/cutting machine of the type configured to travel along a roadway while engaging and grinding the roadway with a grinding/cutting head. A first displacement sensor generates, during the travel, first distance data associated with a distance between a... Agent: Richard L. Sampson Sampson & Associates

20080153403 - Aircraft transparency polisher and/or surface refinisher: A machine for polishing aircraft windows including a window positioner device securable to the side of an aircraft, a frame for holding a polishing system attachable to the window positioner device, a robot seat frame system attachable to the frame, and a robot secured to the robot seat including a... Agent: Scott R. Cox Lynch, Cox, Gilman & Mahan, P.s.c.

20080153404 - Electric hand tool - in particular an angle sander/grinder: The invention relates to an electrical hand tool device, in particular an angle grinder with a machine housing for holding a motor for the rotating drive of a drive shaft and a driven shaft connected with it via an angular gear for attaching a grinding tool at its free end,... Agent: Central Coast Patent Agency, Inc

20080153405 - Contact planarization apparatus: A contact planarization apparatus includes a lower membrane assembly, an upper membrane assembly, a differential pressure assembly, and a curing or reflowing assembly. The lower membrane assembly supports a substrate to be planarized and biases it toward the upper membrane assembly under the influence of the pressure differential assembly. The... Agent: Hovey Williams LLP

20080153406 - Dust collection system for a belt sander: An electrically powered belt sander comprising a housing, a dust flow path defined by the housing, a motor mounted in the housing at a first location and having an output shaft, a fan connectable to the motor output shaft and rotateably mounted in the housing at a second location a... Agent: The Black & Decker Corporation

20080153407 - Abrasive article and methods of making same: An abrasive article with an integral dust collection system. The abrasive article comprises a porous abrasive layer with openings, a first filter media with channels, a second filter media, a third filter media with channels, a fourth filter media, and an optional attachment layer. The openings of the porous abrasive... Agent: 3m Innovative Properties Company

20080146119 - Substrate polishing method and apparatus: A polishing apparatus is provided for optimizing a polishing profile in consideration of even such parameters as the temperature on the surface of an object to be polished, and the thickness of a polishing pad, in addition to a polished amount. The polishing apparatus for polishing the object to be... Agent: Wenderoth, Lind & Ponack, L.l.p.

20080146120 - Determining physical property of substrate: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded... Agent: Fish & Richardson P.c.

20080146121 - Platen assembly for electrochemical mechanical processing: A processing pad and platen assembly for processing a substrate is provided. The platen assembly includes a spacer having an upper surface adapted to contact a lower surface of a pad assembly, an upper plate having a recessed area coupled to and disposed below the spacer, and a lower plate... Agent: Patterson & Sheridan, LLP - - Appm/tx

20080146122 - Polishing compositions and use thereof: Slurry compositions comprising abrasive particles and solid lubricant particles are useful for planarizing surfaces, and preventing delamination and scratches.... Agent: Connolly Bove Lodge & Hutz LLP (for Ibm Yorktown)

20080146123 - Semiconductor device manufacturing apparatus and method: A semiconductor device manufacturing apparatus according to the present invention comprises a head for holding a semiconductor wafer, a retainer ring for surrounding the outer periphery of the semiconductor wafer held by the head, and a polishing pad for polishing a polished surface of the semiconductor wafer. This apparatus presses... Agent: Sughrue Mion, Pllc

20080146124 - Semiconductor manufacturing apparatus and semiconductor manufacturing method: A semiconductor manufacturing apparatus includes a supporting unit for supporting a semiconductor wafer received from a CMP apparatus and a vacuuming system for holding the wafer on the supporting unit. The vacuuming is applied only in a peripheral area of the wafer. In the peripheral area of the wafer, any... Agent: Young & Thompson

20080146125 - Turbine for vacuum driven tools: An improved turbine for vacuum driven tools provides higher speed and power output while reducing problems such as the clogging and stopping of the turbine due to dust and debris. The turbine has a closed bottom and open sides and top, and draws air in through the sides and out... Agent: Randall B. Bateman Bateman Ip Law Group

20080146126 - Angle grinder: An angle grinder is provided including a trigger assembly for selectively actuating the angle grinder. A particle separation assembly is provided for the removal of any dust, particle, or artifacts that may have entered into the housing of the angle grinder. A brush biasing system is also provided to ensure... Agent: The Black & Decker Corporation

20080146127 - Angle grinder: An angle grinder is provided including a trigger assembly for selectively actuating the angle grinder. A particle separation assembly is provided for the removal of any dust, particle, or artifacts that may have entered into the housing of the angle grinder. A brush biasing system is also provided to ensure... Agent: Mehul R. Jani Black & Decker Corporation

20080146128 - Fabrication process of semiconductor device and polishing method: A method of fabricating a semiconductor device includes a polishing process of a substrate, wherein the polishing process includes the steps of applying a chemical mechanical polishing process to the substrate on a polishing pad while using slurry, and conditions a surface of the polishing pad, the conditioning step including... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080146129 - Fast break-in polishing pad and a method of making the same: The present invention is directed to a fast break-in polishing pad, which chemically and/or physically allows for a high rate of absorption of water and/or chemical slurry by decreasing the maximum absorption distance into the pad. In a preferred embodiment, this decrease in distance is achieved by forming a plurality... Agent: Snell & Wilmer L.l.p. (main)

20080146130 - Mating systems and methods for joining coated abrasives: Mating systems and methods for joining coated abrasives. The mating system comprises mating portions positioned at coated abrasive end portions. Complimentary mating portions may be used to join coated abrasives without glue or mechanical attachment. The mating system of the present invention may be used to join a coated abrasive... Agent: Larson Newman Abel Polansky & White, LLP

20080146131 - Polishing pad: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.... Agent: Goodwin Procter LLP Patent Administrator

20080139087 - Substrate polishing apparatus and substrate polishing method: The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a... Agent: Wenderoth, Lind & Ponack, L.l.p.

20080139088 - Method to remove circuit patterns from a wafer: A method holds wafers that contain patterned structures using a particle blasting tool. Next, the method directs particles at the patterned structures, such that the particles contact the patterned structures with a predetermined velocity and remove the patterned structures. This process of directing the particles at the wafer is controlled... Agent: Frederick W. Gibb, Iii Gibb & Rahman, Llc

20080139089 - Method of polishing hard crystal substrate and polishing oil slurry therefor: A hard crystal substrate such as a GaN substrate or a SiC substrate is polished by using polishing oil slurry having abrading particles of artificial diamond clusters dispersed in a dispersant. The artificial diamond clusters include approximately spherical agglomerate particles with average particle size D50 of 20 nm or more... Agent: Beyer Weaver LLP

20080139090 - Grinding machine having grinder head and method of manufacturing semiconductor device by using the grinding machine: A grinding machine for grinding a workpiece, including a chucking table having a chucking area and a grinder head. The grinder head includes a spinning disk rotating about a rotation axis and a plurality of grindstones, which are circularly arranged on a surface of the spinning disk, whereby a slit... Agent: Junichi Mimura Oki America Inc.

20080139091 - Cylindrical grinding method for producing hard metal tools and cylindrical grinding machine for grinding cylindrical starting bodies during the production of hard metal tools: A grinding method and to a cylindrical grinding machine grinds metal rod that is pushed through a chuck of a workpiece spindle head. Two backrest seats are ground on and two backrests are then seated. The support of an end area enables a front cone to be ground. A grinding... Agent: Jordan And Hamburg LLP

20080139092 - Steady rest for rotating shaft: An improved steady rest assembly having a pair of opposed gripper arms that selectively open and close around a rotating cylindrical workpiece. One end of the gripper arms includes a workpiece-engaging member while the opposite end is pivotally coupled to a stationary base portion. Each gripper arm has a precision... Agent: Steve M Clemmons

20080139093 - Reinforced means: This invention relates to reinforcement of various items by the use of a fibre substrate such as filament tape. The reinforced items may be used for strengthening abrasive paper, packaging and cabling.... Agent: Young & Thompson

20080139094 - Polishing pad, method for processing polishing pad and method for producing substrate using it: The present invention is a polishing pad used for polishing a semiconductor substrate, wherein, at least, grooves having a radial pattern are formed on a surface of the polishing pad, and so that a groove depth of the groove parts located nearer to the center than the substrate is shallower... Agent: Oliff & Berridge, Plc

20080132147 - Eyeglass lens processing system: An eyeglass lens processing system for processing an eyeglass lens includes: a data inputting device that inputs a left and right target lens shape data and a layout data; a cup attaching device that attaches a lens fixing cup used for processing the eyeglass lens, the cup including an IC... Agent: Sughrue-265550

20080132146 - Machining apparatus: When the grinding wheel 30 cut arc portions 11A, 11C, U having its diameter of which is gradually small according to a position apart from the shoulder, the numerical controller 40 controls a rotation of the workpiece 10 around said C-axis, a motion of a grinding wheel 30 relative to... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080132148 - Precision abrasive machining of work piece surfaces: The spacing between an abrasive type surface polishing tool and the surface of the work piece that is being polished is controlled dynamically so that variations in the area of the abrasive pad in contact with the surface of the work piece compensated, thereby eliminating size variations in this contact... Agent: Corning Incorporated

20080132149 - Grinding method and system with non-contact real-time detection of workpiece thickness: A grinding method includes the steps of: enabling an image-capturing device to capture a set of consecutive images containing a workpiece being ground by a grinding device; enabling an image-processing device to identify the workpiece from the images, to detect a top edge of the identified workpiece from a latest... Agent: Paul D. Greeley, Esq. Ohlandt, Greeley, Ruggiero & Perle, L.l.p.

20080132151 - Micro-machining dust removing device, micro-machining apparatus, and micro-machining dust removing method: There is a micro-machining apparatus for removing the micro-machining dust generated at the time of machining while a workpiece M is machined within a liquid W using a probe tip. The apparatus includes a stage on which the workpiece is to be placed; a probe having the probe tip, a... Agent: Brinks Hofer Gilson & Lione

20080132150 - Polishing method for extreme ultraviolet optical elements and elements produced using the method: The invention is directed to polished glass substrates suitable for extreme ultraviolet lithography. The elements are silica-titania glass elements having a coefficient of thermal expansion of 0±30×10−9/° C. or less, and containing 5-10 wt. % titania. The polished elements have a mid-spatial frequency peak-to-valley roughness of <10 nm and a... Agent: Corning Incorporated

20080132152 - Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet: A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the... Agent: J. Mike Amerson Williams, Morgan & Amerson, P.c.

20080132153 - Cmp conditioner: To provide a CMP conditioner that prevents dissolution of metals in slurry, without the chipping of the abrasive grains and/or decreasing the cutting performance. The CMP apparatus has a polishing pad that faces and contacts conditioning surface of the conditioner body. On this conditioning surface, abrasive grains are distributed and... Agent: Darby & Darby P.c.

20080132154 - Instrument sharpener system: An instrument sharpener system for efficiently sharpening dental tools, such as but not limited to dental explorers. The instrument sharpener system generally includes a body including a motor and a drive member, wherein the drive member is mechanically connected to the motor and the motor rotates the drive member about... Agent: Neustel Law Offices, Ltd.

20080132155 - Abrading device: The invention concerns a device for abrading a wall of stone or concrete material. The invention comprises a shell (2) with which is operationally connected an abrading head (1), and a carriage intended to move at least along the surface and support the shell (2) movably so that the abrading... Agent: Merchant & Gould Pc

20080132156 - Polishing composition and polishing method: A polishing composition contains alumina, a complexing agent, and an oxidizing agent. It is preferable that the complexing agent is at least one compound selected from an α-amino acid, ammonia, and an ammonium salt. The polishing composition is preferably used in applications for polishing an object having a resin section... Agent: Kirton & Mcconkie

20080132157 - Preformed block piece with three points of support: The invention relates to a block piece for holding an optical lens to be machined, with a coupling part for holding in a workpiece chuck and with a holding part for fastening the lens. The holding part has a convex or concave holding surface corresponding to a first side of... Agent: Hudak, Shunk & Farine, Co., L.p.a.

20080132158 - Grinding wheel and wheel hub therefore: A grinding wheel hub is provided for mounting an abrasive grinding wheel on a grinding apparatus. The hub is adapted for use with an abrasive grinding wheel of the type that has a mounting aperture disposed centrally therein, and a grinding face and a backing face disposed on opposite sides... Agent: Cantor Colburn, LLP

20080132159 - Retractable abrasive sharpener and carrying case: A hand held retractable abrasive sharpener having a rod formed with a tapered end portion and a partially cylindrical opposite end portion. A part of the partially cylindrical opposition end portion is flat. A slot is formed in the rod. Substantially all of the outer surfaces include layers of the... Agent: Edward D. Gilhooly