Abrading inventions 04/08

20080096466 - Method and apparatus for cooling lens edge during dry processing: A method and apparatus for processing a periphery of a lens includes holding the lens to be processed, providing at least one edge processing system, disposing the at least one edge processing system and the periphery of the lens proximal one another in a processing position, dry edging the periphery... Agent: Buchanan, Ingersoll & Rooney PC

20080096467 - Stepped retaining ring: A two part retaining ring is described. An rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion... Agent: Fish & Richardson P.C.

20080096470 - Chemical mechanical polishing slurry, its preparation method, and use for the same: A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have... Agent: Davidson Berquist Jackson & Gowdey LLP

20080096471 - Concrete block splitting and pitching apparatus and method: An apparatus for splitting a concrete block and pitching at least one edge of the split concrete block is provided. The apparatus includes a splitting blade have a blade edge, such as a sharpened edge or a dull edge. The splitting blade is configured to move in a first direction... Agent: Mr. Christopher John Rourk Jackson Walker LLP

20080096473 - Grinding machine and coolant supplying method therefor: In a rough grinding step the large quantity of coolant supplied to cool the grinding point enables the flow to pass through a wheel-following air layer and reach the grinding point while the supply of an air jet is stopped during this step. At a fine grinding step, the grinding... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080096475 - Polishing composition and polishing method:

20080096476 - Portable, flexible abrasive blasting container: A portable, flexible abrasive blasting container that is easily transportable and accommodates larger work pieces has a frameless, flexible containment assembly, and a support member to support the assembly and work piece. The blasting container is under positive pressure relative to the outside atmosphere. The containment assembly may be located... Agent: Michael L. Leetzow, Esq. Michael L. Leetzow, P.A.

20080096468 - Single-step fiber grinding process and apparatus: A fiber grinding process includes: contacting an end of the optical fiber with a grinding surface in such a manner that a central axis of the optical fiber at the end is inclined to the grinding surface; rotating the optical fiber about the central axis; and changing a contact pressure... Agent: Darby & Darby P.C.

20080096469 - Method and device for strip and flat-shaping machining surfaces of glass panes: The removal of partial areas of a coating (11, 12) on at least one surface (37, 38) of a glass pane (2) takes place by means of a plasma jet (14, 15) which emerges from a plasma nozzle (5, 6). The plasma nozzle (5, 6) is part of a plasma... Agent: Notaro And Michalos

20080096472 - Elastic roller and method of grinding the same: An elastic roller comprises an elastic layer 1 carried on the outer circumference of a shaft 2 via adhesive agent, and an unapplied area of adhesive agent at one end of the elastic layer in the longitudinal direction of the roller. The surface of the elastic layer is ground by... Agent: Sughrue Mion, PLLC

20080096474 - Method for producing semiconductor wafer and semiconductor wafer: The present invention is a method for producing a semiconductor wafer, comprising: at least a double-side polishing step; and a chamfered-portion polishing step; wherein as a first chamfered-portion polishing step, at least, a chamfered portion of the wafer is polished so that a chamfered surface of each of main surface... Agent: Oliff & Berridge, PLC

20080096477 - Blade sharpening device with blade contour copying device: The present invention provides a blade sharpening device designed for sharpening a blade for a uniform sharpening of the edge thereof. The blade sharpening device contains a base having a guide slidably movable relative to the base. The guide includes a material that receives an impression of a blade defining... Agent: Barlow, Josephs & Holmes, Ltd.

20080096478 - Polishing tool comprising a drive plate and a removable pad for finishing an ophthalmic lens: A polishing tool (1) for finishing an ophthalmic lens includes a drive plate (4) which is equipped with elements (2) for mounting same to the spindle of a polishing machine; a removable polishing pad (5) designed to be rotated by the drive plate (4); positioning elements to block the radial... Agent: Young & Thompson

20080096479 - Low-melting point superabrasive tools and associated methods: Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method for making a low-melting point superabrasive tool having a plurality of superabrasive particles is provided. Such a method may include coating each of the plurality of superabrasive particles with a reactive element that chemically bonds to... Agent: Thorpe North & Western, LLP.

20080090492 - Adjustment device for adjusting a level difference between rollers of a roller belt sander: An adjustment device for adjusting a level difference between rollers of a roller belt sander includes a base, an eccentric shaft and a restricting knob. The base is fixed on an interior wall edge of a main body corresponding to two ends of a roller. The eccentric shaft inserted pivotally... Agent: Sinorica, LLC

20080090493 - Grinding machine having universal joint bearing with constant-speed inner wheel: A grinding machine having a universal joint bearing comprises a movable-mount module, a universal-joint module, a mount control module, a grinding-wheel module and a milling-stone module. The movable-mount module further comprises a plurality of movable mounts. The universal-joint module consists of a plurality of servo-motors, each being provided with a... Agent: Min-fang Yu

20080090494 - Abrading tool and method for refurbishing electrical connector pin contacts: An abrading tool for refurbishing pin contacts in situ in an electrical connector is provided. The abrading tool includes a bore defined in a first end for receiving the pin contacts therein and a transverse slot which intersects the bore. A removable abrading element is received within the slot and... Agent: Ogilvy Renault LLP (pwc)

20080090496 - Mirror image pair sanding blocks: A right handed or left handed sanding block can be provided individually or as a mirror image pair. Each block includes a grasp handle and a fastening surface engaging a replaceable sanding pad. Each handle includes a pair of cove box channels to fit the fingers of the user. These... Agent: Alfred M. Walker

20080090495 - Trimming composite skin stiffener ends: A tool for trimming the ends of stiffeners on aircraft composite skin panels accurately, rapidly and without damaging the underlying skins includes an expandable guide frame adapted to straddle and clamp to the stiffener at a selected longitudinal position thereon. The frame includes a pair of planar guide faces disposed... Agent: Macpherson Kwok Chen & Heid, LLP

20080090497 - Substrate retaining ring for cmp: The edge effect or variation in polishing edge profile on a substrate undergoing CMP is reduced by structuring a retaining ring, housed in a carrier head for retaining the substrate, such that the polishing edge profile shifts back and forth with respect to the center of the substrate. Embodiments include... Agent: Ditthavong Mori & Steiner, P.C.

20080090498 - Customized polish pads for chemical mechanical planarization: A polishing pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconductor wafer, the one or more characteristics of the structure can include... Agent: Morrison & Foerster LLP

20080090499 - Pad conditioner, pad conditioning method, and polishing apparatus: A pad conditioning apparatus and method for conditioning a surface of a polishing pad which is used in a polishing apparatus for polishing works, having a bending or deflecting or elastic member and a supporting section to support a base end of the bending or deflecting or elastic member, wherein... Agent: Roberts, Mlotkowski & Hobbes

20080090501 - Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080090500 - Process for reducing dishing and erosion during chemical mechanical planarization: This invention is directed to a slurry system and process of metal removal from a substrate. This invention is useful for polishing a microelectronic device. This invention is especially useful for chemical mechanical planarization of a semiconductor wafer for removal of an overburden thereof. The slurry system of the present... Agent: Deborah M. Altman Ppg Industries, Inc.

20080090502 - Machine for removing the sharp edge in plates in general and in particular in glass plates: A machine for removing sharp edge in plates in general and in glass plates in particular, comprising a frame for the support and advancement of a plate on which there is at least one station for arrissing an edge of the plate, the arrissing station comprising an upper tangential grinding... Agent: Modiano & Associati

20080090503 - Polishing pad and chemical mechanical polishing apparatus comprising the same: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper... Agent: Volentine & Whitt PLLC

20080090504 - Large angle grinder: An angle grinder is provided including a radial fan assembly. The radial fan assembly is configured to direct exhaust radially outwardly and axially away from a user of the angle grinder. Brush card assemblies for an angle grinder are also provided. The brush card assemblies provide for the securing of... Agent: Harness, Dickey & Pierce, P.L.C

20080090505 - Wafer grinding method: A recessed portion is formed in an area, of a rear surface of a wafer, corresponding to a device formation area is formed by a rough grinding wheel of a rough grinding unit and an annular protruding portion is concurrently formed around the recessed portion. The inner circumferential lateral surface... Agent: Greer, Burns & Crain

20080090506 - Sanding system: An abrasive sanding work glove (12) has a fabric (13) with an inner first elastomeric cushion coat (18) and an harder cured coat (21) cured on the palm and finger fronts. Abrasive particles (22) are bonded to the cured coat (21) to provide for a sanding or gripping work tool.... Agent: Reising, Ethington, Barnes, Kisselle, P.C.

20080085658 - Substrate polishing apparatus and method: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to... Agent: Wenderoth, Lind & Ponack, L.l.p.

20080085659 - Drive for a cutting or grinding machine: The present invention provides a drive for a grinding or cutting machine. The drive comprises a body having a drive coupling for receiving at least one drive shaft in a manner so that the or each drive shaft is drivable by the drive. The drive also comprises a mount for... Agent: Weingarten, Schurgin, Gagnebin & Lebovici LLP

20080085660 - Abrasive articles with novel structures and methods for grinding: Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade, but are characterized by excellent mechanical strength and grinding performance. Methods for making the abrasive tools utilizing agglomerated abrasive grain... Agent: Larson Newman Abel Polansky & White, LLP

20080085661 - Polishing pad having micro-grooves on the pad surface: A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the... Agent: Grossman, Tucker, Perreault & Pfleger, Pllc

20080085662 - Polishing tool and polishing method and apparatus using same: A polishing tool comprising a support member, and polishing means fixed to the support member. The polishing means is composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt. A polishing method and apparatus involving... Agent: Smith, Gambrell & Russell, LLP Suite 800

20080085663 - Polishing compound for semiconductor integrated circuit device, polishing method and method for producing semiconductor integrated circuit device: To provide a technique employed when a plane to be polished of a silicon dioxide type material layer is polished in production of a semiconductor integrated circuit device, which is capable of polishing protruded portions by priority while suppressing polishing at recessed portions and planarizing the plane to be polished... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.c.

20080085664 - Sanding tool with pivotally coupled head assembly: A sanding tool includes a handle assembly and a head assembly having a sanding member. The sanding tool also includes at least one pivot member that pivotably couples the handle assembly and the head assembly such that the head assembly is pivotable about a plurality of different axes relative to... Agent: Harness, Dickey & Pierce, P.L.C

20080085665 - Apparatus for polishing gemstones: Disclosed is an apparatus for working gemstones. The apparatus comprises an abrading article and a rotatable support with a guiding feature for holding and rotating the article. The abrading article has a mounting bore substantially larger than the guiding feature. A balancing arrangement facilitates balancing of the article, and an... Agent: Pearl Cohen Zedek Latzer, LLP

20080085666 - Hand engraving sharpening device: A sharpening device that utilizes templates for sharpening specific shaped points. The templates are easily replaceable for grinding additional facets or for additional styles of points.... Agent: Steve J. Lindsay

20080085667 - Handheld wet grinder: A handheld wet grinder designed with water-discharging mechanism for wetting the powders. The wet grinder includes a main body and a water-discharging switch. A water incoming flow way is disposed in the main body and extends from the rear end of the main body to the front end thereof. A... Agent: Troxell Law Office Pllc

20080081539 - Orthopaedic component manufacturing method and equipment: A method of reducing the surface roughness of articulating surfaces of orthopaedic implants is provided. The method includes the steps of providing an abrasive particle providing a chemical including at least one of an oxidant, a corrosion inhibitor, a complexing agent and a surfactant, combining the chemical with the abrasive... Agent: Maginot, Moore & Beck, LLP Chase Tower

20080081540 - Substrate processing apparatus and substrate processing method: The substrate processing apparatus relating to the present invention comprises a polishing section where wafers are sequentially arranged, and that has multiple polishing platens for polishing a metal film on the wafer surface in stages. The wafers are simultaneously conveyed between the polishing platens by a rotating head mechanism. Further,... Agent: Mcdermott Will & Emery LLP

20080081541 - Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer: A rough-polishing method for conducting a rough polishing before mirror-finish polishing on a semiconductor wafer (W) using a polishing apparatus (1) includes a first polishing step for polishing the semiconductor wafer using slurry containing colloidal silica supplied by a slurry supplying unit (4) and a second polishing step for polishing... Agent: Frishauf, Holtz, Goodman & Chick, PC

20080081542 - Slurry compositions and methods of polishing a layer using the slurry compositions: In a slurry composition and a method of polishing a layer using the slurry composition, the slurry composition includes from about 3 to 20 percent by weight of an abrasive, from about 0.1 to 3 percent by weight of an ionic surfactant, from about 0.01 to 0.1 percent by weight... Agent: Marger Johnson & Mccollom, P.C.

20080081543 - Water-based non-organic coolant for texturing hard disk: A water-based non-organic coolant contains a texturing surfactant, a wetting surfactant, a lubricating surfactant and a bacterial growth inhibitor each of a specified composition and each in an amount within a specified range. As a hard disk is rotated, slurry containing abrading particles and such a coolant is applied to... Agent: Beyer Weaver LLP

20080081544 - Tension/release mechanism for belt sander: A belt sander includes a mechanism to apply and release tension to the roll of sandpaper used in the sander. A release arm is rigidly connected to an rotational member that is engageable with a support member that is operatively connected to the front roller of the sander. The rotational... Agent: Brinks Hofer Gilson & Lione

20080081545 - Guard for a moving tool: Abrading and cutting devices such as saws include waste containment systems and methods to improve removal of slurry or other contaminants from a work area during operations, and separation of slurry from a carrying medium such as air. A blade guard includes fluid channels, and may be removable from a... Agent: Henricks Slavin And Holmes LLP Suite 200

20080081546 - Dust vacuuming abrasive tool: The present disclosure is directed to a dust vacuuming abrasive tool comprising an abrasive sheet material having an abrasive surface, a back surface and 20 or more perforations; and a backup pad having a support surface, a back surface and 20 or more perforations, or a plurality of perforations and... Agent: 3m Innovative Properties Company