Abrading patents - Monitor Patents
FreshPatents.com Logo    FreshPatents.com icons
Monitor Keywords Patent Organizer File a Provisional Patent Browse Inventors Browse Industry Browse Agents

USPTO Class 451  |  Browse by Industry: Previous - Next | All     monitor keywords
03/2008 | Recent  |  08: Dec | Nov | Oct | Sp | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan |  | 07: D | N | O | S | A | J | J | M | A | M | F | J |  | 06: 12 | 11 | 10 | 09 | 8 | 7 | 6 | 5 | 4 | Dec | Nov |  | 2010 | 2009 |

Abrading March list of patents 03/08

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
03/27/2008 > patent applications in patent subcategories.
03/20/2008 > patent applications in patent subcategories.

20080070483 - Method for polishing a semiconductor wafer and polished semiconductor wafer producible according to the method: Semiconductor wafers are polished between upper and lower polishing plates, the semiconductor wafer being polished on both sides while in a recess of a carrier by supplying a polishing agent. The wafer is double-side polished in a first polishing step, which is concluded with a negative overhang, defined as the... Agent: Brooks Kushman P.C.

20080070484 - Method of finishing bevel gears to produce a diffuse surface structure: A method for providing a surface structure wherein conventional grinding micro scratches are broken up to provide a diffuse structure of micro scratches and micro flats resulting from grinding wheel motion comprising an eccentric revolving of the grinding wheel and/or grinding wheel pulsing.... Agent: The Gleason Works

20080070485 - Chemical mechanical polishing process: A chemical mechanical polishing (CMP) process at least includes a polishing step and an ex-situ conditioning step, and the ex-situ conditioning step must be immediately performed after the polishing step. Therefore, it can save the process time. Furthermore, when applying to a CMP apparatus with several polishing regions, it can... Agent: Jianq Chyun Intellectual Property Office

20080070486 - Blasting device: The present invention provides a blasting device, comprising: a container in which a blast medium is stored; a suction pipe which is inserted in the container to be rotatably supported, and is formed substantially in an L-shape with a lower suction port bent at a right angle; a rotary drive... Agent: Roberts, Mlotkowski & Hobbes

20080070479 - Polishing apparatus: A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20)... Agent: Wenderoth, Lind & Ponack, L.L.P.

20080070480 - Thickness-measuring method during grinding process: In a thickness-measuring method during a grinding process, which suppresses wear of a probe coming into contact with a chuck table subjected to self-grind and accurately grinds a workpiece, measurement of wafer thickness is performed only at the commencement and termination of grinding, and a reference probe of a reference... Agent: Greer, Burns & Crain

20080070481 - Probe cleaner and cleaning method: A probe cleaner for removing foreign objects from the tip part of a probe is formed with a cleaner sheet having a surface part with microfibers and abrading particles affixed to the surface of the microfibers at this surface part. The average fiber diameter of the microfibers is in the... Agent: Beyer Weaver LLP

20080070482 - Composition for texturing process: To provide a composition capable of minimizing the average surface roughness (Ra) after texturing of the ground layer of an aluminum magnetic disc or the surface of a glass magnetic disc, forming fine texturing streaks, removing “polishing marks” or “polishing scratches” ascribable to the substrate polishing step and which are... Agent: Sughrue Mion, PLLC

20080070487 - Hand-held power tool:

20080070488 - Polishing method and polishing apparatus: In order to achieve the above object, the present invention provides a polishing method where a mechanism that suspends a member 15a on a pad 19 surface to bring the member in contact with or cause the member to approach the pad 19 surface and supplies the slurry along the... Agent: Paul A. Fattibene Fattibene & Fattibene

03/13/2008 > patent applications in patent subcategories.

20080064302 - Polishing apparatus, polishing pad, and polishing method: A polishing pad is placed on a polishing apparatus including a polishing platen which is rotatable and on which the polishing pad is placed, a substrate retaining mechanism, and a supplying mechanism for supplying a polishing agent on an upper surface of the polishing pad, the polishing pad having grooves... Agent: Mcginn Intellectual Property Law Group, PLLC

20080064303 - Method of manufacturing a ceramic surgical instrument: The invention relates to a method of manufacturing a surgical instrument having a rotatable shaft 2 and a working part 1 disposed thereon, the working part having at least one cutting edge, wherein the shaft 2 and the working part 1 are made of oxide ceramics, characterized in that for... Agent: Pearne & Gordon LLP

20080064300 - Polishing system with in-line and in-situ metrology: A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing... Agent: Fish & Richardson P.C.

20080064301 - Method and apparatus of eddy current monitoring for chemical mechanical polishing: A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad... Agent: Fish & Richardson P.C.

20080064304 - Grinding apparatus and grinding system: A grinding apparatus and a grinding system capable of efficient and superior grinding performance prevent the falling of a belt during the grinding of an edge surface thereof. The apparatus includes two rotating bodies 31 and 32 each having segment brushes 4, 4, . . . attached in the circumferential... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP

20080064305 - Method and apparatus for reconditioning digital discs: An automated method for reconditioning a plurality of digital discs within a reconditioning apparatus is disclosed. The method comprises holding the digital discs in a load area, and then transferring each of the digital discs from the load area to at least one workstation with a disc transfer mechanism. The... Agent: Stinson Morrison Hecker LLP Attn: Patent Group

20080064306 - Method and apparatus for removing material from microfeature workpieces: Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface. The subpad in this embodiment further includes a hydro-control agent... Agent: Perkins Coie LLP Patent-sea

20080064307 - Stone edge grinding machine: The present utility model relates to a stone edge grinding machine, including a bearing frame, a rocker arm system and a grinding wheel system, wherein: the said bearing frame comprises a base plate, a shaft fixed on the center of the base plate, a workbench connected fixedly to the top... Agent: Baker & Hostetler LLP

20080064308 - Polishing apparatus and manufacturing method of an electronic apparatus: A polishing apparatus that polishes a substrate to be processed includes a rotary polishing table carrying a polishing pad on a surface thereof, and a polishing head that urges the substrate to be processed against the polishing pad while rotating the substrate to be processed, wherein the polishing head holds... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080064309 - Blade sharpening holder: A sharpening holder for manually-sharpening a cutting edge to be honed over a honing surface includes a body, an adjustable clamping component, and a plurality of roller members. The body has a first end, a second end and a tool support surface between the first end and the second end.... Agent: Mesmer & Deleault, PLLC

20080064310 - Polishing pad having hollow fibers and the method for making the same: The invention relates to a polishing pad having hollow fibers and a method for making the same. The polishing pad comprises a body and a plurality of hollow fibers. The body has a polishing surface. The hollow fibers are located within the body and have an opening on the polishing... Agent: Volentine & Whitt PLLC

20080064311 - Polishing pad: A polishing pad having a novel structure, which is applicable to highly accurate various polishing process, such as a CMP process, is provided. An annular rear plane groove (22) extending in a circumferential direction is formed on a rear plane (20) of the polishing pad.... Agent: Rossi, Kimms & Mcdowell LLP.

20080064312 - Abrasive wheels and production thereof: An abrasive device for a grinding tool. The abrasive device includes abrasive grains material-lockingly connected with one another by a bonding agent. The abrasive grains have an approximately spherical contour. The abrasive device further includes a porosity of at least 35 percent. The present disclosure also relates to a method... Agent: Barnes & Thornburg LLP

03/06/2008 > patent applications in patent subcategories.

20080057831 - Double face polishing apparatus: The double face polishing apparatus is capable of controlling an amount of supplying slurry to a lower polishing plate. The double face polishing apparatus comprises: a lower polishing plate and an upper polishing plate; a carrier provided between the polishing plates, the carrier having a through-hole for holding a workpiece;... Agent: Birch Stewart Kolasch & Birch

20080057832 - Chemical-mechanical polishing composition and method for using the same: The invention provides a chemical-mechanical polishing composition comprising: (a) silica particles, (b) about 5×10−3 to about 10 millimoles per kilogram of at least one alkaline earth metal selected from the group consisting of calcium, strontium, barium, and mixtures thereof, based on the total weight of the polishing composition, (c)... Agent: Steven Weseman Associate General Counsel, I.p.

20080057835 - Process and apparatus for grinding with electrolytic dressing: A process for grinding workpieces is obtained which includes attaching honing stones to a tool, each of the honing stones including grinding particles and an electroconductive connection for fixing the grinding particles to each other; grinding the workpieces with the honing stones by applying a honing liquid having substantially no... Agent: Smith, Gambrell & Russell

20080057837 - Method and appratus of manufacturing semiconductor device: A method of manufacturing a semiconductor device, includes: (a) obtaining a surface of a polishing target, wherein an insulating film and a metal film are exposed; and (b) polishing the surface having the exposed insulating film and the exposed metal film. The step (b) includes; (b1) polishing the surface in... Agent: Sughrue Mion, PLLC

20080057838 - Photoresist stripping apparatus and internal air circulating system thereof: An apparatus for stripping photoresists from a substrate includes a reaction chamber, a plurality of air guiding means provided inside the reaction chamber, a pump for extracting air inside the reaction chamber, and a pipe for circulating and feeding the extracted air back into the reaction chamber. The upper and... Agent: Wei Te Chung Foxconn International, Inc.

20080057839 - Abrasivejet cutting head with novel entrainment structure and method: An abrasivejet cutting head assembly comprises abrasive inlet means for permitting entry of abrasive material into the head's longitudinally-extending passageway about an inlet axis that is preferably non-intersecting with the passageway's longitudinal axis. The abrasive is then prevented from entrainment into the waterjet by means within the passageway that only... Agent: Seldon & Scillieri

20080057840 - Fluid jet polishing with constant pressure pump: The invention relates to fluid jet polishing machine including a pump that maintains a constant pressure in the polishing fluid during each pass of a nozzle over a component. Fluid actuated diaphragms expand and contract the volume of a pair of pump chambers, thereby eliminating the need for high-speed shafts... Agent: Teitelbaum & Maclean

20080057830 - Advanced workpiece finishing: An apparatus for planarizing is disclosed. A methods of planarizing are disclosed. The methods and apparatus, can help improve yield and lower the cost of manufacture for planarizing of workpieces having extremely close tolerances such as semiconductor wafers. Cost of manufacture information are used for control. Methods to determine preferred... Agent: Charles J. Molnar

20080057833 - Aqueous fluid compositions for abrasive slurries, methods of production, and methods of use thereof: Aqueous slurry compositions for use in loose-abrasive machining processes, particularly aqueous abrasive slurries for use in wire saw processes. These aqueous slurry compositions comprise abrasive particles uniformly and stably dispersed in lubricant, which comprises a combination of a vehicle and water, particularly PEG and water.... Agent: Edwards Angell Palmer & Dodge LLP

20080057834 - Method and device for treating wafers on assembly carriers: A method and a device for treating wafers on assembly carriers is disclosed. A wafer to be treated can be fixed on a liquid film that is located between the front side of the wafer and the assembly carrier by freezing of the film.... Agent: Slater & Matsil LLP

20080057836 - Pad conditioning head for cmp process: In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between the rotatable member and the end effector.... Agent: Dugan & Dugan, PC

20080057841 - Sander: A motor is disposed in a main body and has a rotary shaft. A base is disposed below the main body. The base is coupled to the rotary shaft and adapted to make eccentric motions in accordance with rotations of the rotary shaft. A first receptacle is disposed in the... Agent: Oliff & Berridge, PLC

20080057842 - Locking random orbital dual-action head assembly: A head assembly for a rotary tool, comprising a body arranged for connection to a drive means, the drive means rotatable about a first axis of rotation; a rotatable element arranged for connection to a pad assembly, the rotatable element rotatable about a second axis of rotation disposed substantially parallel... Agent: Simpson & Simpson, PLLC

20080057843 - Holding device for a rotary tool: The present invention discloses a holding device for a rotary tool, which is mainly used to hold a rotary tool, such as a wire brush wheel for removing rough edges, and the user should sleeves the wire brush wheel over the holding device before operation. In the present invention, the... Agent: Birch Stewart Kolasch & Birch

20080057844 - Discontinuous abrasive surfaces having controlled wear properties: Discontinuous abrasive surfaces are disclosed that may be employed in wet and/or dry applications. The discontinuous abrasive surfaces of the present invention may consist of abrasive containing protrusions attached to rigid or flexible surfaces arranged in one or more layers, or alternatively may be comprised of closed cell foam compositions... Agent: Denis Khoo

20080057845 - Method for manufacturing microporous cmp materials having controlled pore size: A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to produce an interpenetrating polymeric network comprising a... Agent: Steven Weseman Associate General Counsel, I.p.

20080057846 - Tool-mounting attachment: The invention discloses a tool having a work plate which has a mounting area with a mounting opening for mounting the plate on a drive shaft of a drive, preferably an oscillatory drive, the mounting opening being suitably configured for being seated on the drive shaft, wherein centering elements, projecting... Agent: St. Onge Steward Johnston & Reens, LLC

Previous industry: Foundation garments
Next industry: Butchering


RSS FEED for 20150611: xml
Integrate FreshPatents.com into your RSS reader/aggregator or website to track weekly updates.
For more info, read this article.


Thank you for viewing Abrading patents on the FreshPatents.com website. These are patent applications which have been filed in the United States. There are a variety ways to browse Abrading patent applications on our website including browsing by date, agent, inventor, and industry. If you are interested in receiving occasional emails regarding Abrading patents we recommend signing up for free keyword monitoring by email.

Advertise on FreshPatents.com - Rates & Info


FreshPatents.com Support - Terms & Conditions

Results in 0.06831 seconds