Abrading inventions 02/08

20080051006 - Tangential grinding resistance measuring method and apparatus, and applications thereof to grinding condition decision and wheel life judgment: A tangential grinding resistance measuring method comprises a section area obtaining step of obtaining an abrasive grain section area which is at a predetermined infeed depth from the highest top surface of abrasive grains on a grinding wheel; a tangent calculation step of calculating the tangent of a half vertex... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20080051007 - Methods and tools for controlling the removal of material from microfeature workpieces: Methods and apparatus for controlling the removal of material from microfeature workpieces in abrasive removal processes. An embodiment of such a method comprises irradiating a periodic structure of the workpiece and obtaining an intensity distribution of radiation returning from the periodic structure. The workpiece can be irradiated with a wide... Agent: Perkins Coie LLP Patent-sea

20080051008 - Apparatus and method for chemical mechanical polishing with improved uniformity: A chemical mechanical polishing (CMP) apparatus includes a workpiece carrier configured for retaining a workpiece thereupon, a polishing platen configured for retaining a polishing pad thereupon, and an electromagnetic coil surrounding a periphery of the workpiece carrier. The electromagnetic coil is configured to provide a magnetic field of alternating polarity... Agent: Cantor Colburn LLP - IBM Fishkill

20080051010 - Polishing composition and polishing method: A polishing composition contains at least one water soluble polymer selected from the group consisting of polyvinylpyrrolidone and poly(N-vinylformamide), and an alkali, and preferably further contains at least one of a chelating agent and an abrasive grain. The water soluble polymer preferably has a weight average molecular weight of 6,000... Agent: Vidas, Arrett & Steinkraus, P.A.

20080051011 - Ethylene terephthalate polymer retaining ring for a chemical mechanical polishing head: Embodiments of a retaining ring for use with a chemical mechanical polishing process with a body including a polyethylene terephthalate polymer or polymer including ethylene terephthalate monomers are disclosed.... Agent: Squire, Sanders & Dempsey L.L.P.

20080051014 - Configurable polishing apparatus: A polishing apparatus for polishing semiconductor wafers comprises a main polishing structure, which includes a plurality of polishing tables, a plurality of polishing heads and a plurality of load-and-unload stations, and an add-on polishing structure, which includes an additional polishing table and an additional polishing head. The add-on polishing structure... Agent: Thomas H. Ham Wilson & Ham

20080051015 - Lens machining machine: The invention relates to a machining machine for lenses, which comprises a first workpiece drive, configured as the transport receptacle and having a workpiece spindle, a workpiece changer for exchanging workpieces between the workpiece drive and a workpiece stock, and a machining station for machining a workpiece. The workpiece spindle... Agent: Hudak, Shunk & Farine, Co., L.p.a.

20080051009 - Endpoint for electroprocessing: Method for process control of electro-processes is provided. In one embodiment, the method includes processing a conductive layer formed on a wafer using a target endpoint, detecting breakthrough of the conductive layer to expose portions of an underlying layer, and adjusting the target endpoint in response to the detected breakthrough.... Agent: Patterson & Sheridan, LLP

20080051012 - Spectacle lens manufacturing method: The manufacturing method of the spectacle lens in which necessary information for a frame machining of a spectacle lens (progressive-power lens 20) including spectacle rim related information is obtained, and both surfaces of a convex surface and a concave surface are edge/polish machined from a spectacle lens blanks. When the... Agent: Oliff & Berridge, PLC

20080051013 - Methods and apparatus for machining a coupling: A method facilitates fabricating a coupling including a first annular coupling member and a second annular coupling member. The method comprises coupling the first coupling member to a machine assembly that includes a plurality of grinding wheels coupled to a tool storage member, machining a plurality of troughs in the... Agent: John S. Beulick Armstrong Teasdale LLP

20080051016 - Sintered rare earth magnetic alloy wafer surface grinding machine: A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary... Agent: Clark & Brody

20080051017 - Process for holding an optical lens on a holder of a lens machining equipment: m

20080051018 - Semiconductor wafer handler: A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitrogen can be applied to the surface of the semiconductor wafer... Agent: Texas Instruments Incorporated

20080045123 - Sanding system with water based dust collection: A sanding system includes a wood sander that produces dust, a portable vacuum system, and a vacuum hose extending therebetween. The vacuum system includes a canister having a chamber configured to hold a liquid, a transfer conduit coupled to the canister and defining an inlet port into the chamber, means... Agent: Workman Nydegger

20080045124 - Sawing method for a wafer: The present invention relates to a sawing method for a wafer. The sawing method of the invention comprises: (a) providing a wafer, the wafer having an active surface and a back surface, the active surface having a plurality of sawing lines; (b) coating a protection layer on the active surface... Agent: Volentine & Whitt PLLC

20080045125 - Polishing pad and chemical mechanical polishing apparatus: A polishing pad and a CMP apparatus are provided. The polishing pad includes a plurality of patterns formed of trenches having a predetermined size and may include a groove for slurry flow. The plurality of patterns can include herringbone shaped trenches in concentric rows, where the rows of herringbone shaped... Agent: Saliwanchik Lloyd & Saliwanchik A Professional Association

20080045126 - Manual grinding tool: The invention relates to a manual grinding tool comprising a rotating grinding head (7). The inventive grinding device is characterised by a guiding device that is connected to the grinding tool (8) and can be applied to a workpiece (19) in a sliding and/or rolling manner. The grinding head (7)... Agent: Friedrich Kueffner

20080045127 - Comfort grip for an orbital abrasive hand tool: The present invention is an abrasive or abrading tool assembly comprising an abrasive or abrading tool having a housing, an air inlet port, and an exhaust outlet with a support for a wrist and forearm attached to the tool. In one embodiment including a pneumatically powered tool, the support extends... Agent: Simpson & Simpson, PLLC

20080045128 - Door skin cutter: A cutter apparatus is configured for cutting into an edge of a metal sheet and for adjusting a precise depth of cut. A motor drives a cutting tool, preferably a rotary file, in axial rotation. A guide plate supports the motor with the cutting tool extending through a hole in... Agent: Patent Law & Venture Group

20080038989 - Two-side working machine: A two-side working machine, comprising an upper and a lower working disc which hold on, and are fixed to, an upper and a lower carrier disc, and which are disposed coaxially with each other and are adapted to be rotationally driven relative to each other by a working motor via... Agent: Vidas, Arrett & Steinkraus, P.A.

20080038991 - Submerged fluid jet polishing: Fluid jet polishing (FJP) is a method of contouring and polishing a surface of a component by aiming a jet of a slurry of working fluid from a nozzle at the component and eroding the surface to create a desired shape. During erosion, the end of the nozzle and the... Agent: Teitelbaum & Maclean

20080038993 - Apparatus and method for polishing semiconductor wafers: An apparatus and method for polishing semiconductor wafers uses multiple polishing surfaces, multiple polishing heads and multiple wafer stations to sequentially polish the semiconductor wafers. The wafer stations includes at least one wafer load-unload station to transfer the semiconductor wafers between the wafer load-unload station and the polishing heads.... Agent: Wilson & Ham Pmb: 348

20080038995 - Periodic acid compositions for polishing ruthenium/low k substrates: A method of polishing a semiconductor substrate surface having at least one ruthenium feature thereon and at least one dielectric material, wherein the substrate is contacted with an aqueous composition containing from about 0.0005 to about 1 moles/kilogram of periodic acid, from about 0.2% to about 6% % by weight... Agent: Morgan Lewis & Bockius LLP

20080038996 - Polishing composition for semiconductor wafer, production method thereof, and polishing method: A polishing composition for semiconductor wafers containing colloidal silica is disclosed, wherein the colloidal silica is prepared from an active silicic acid aqueous solution obtained by removing alkali from an alkali silicate aqueous solution and a quaternary ammonium base, and is stabilized with a quaternary ammonium base. The polishing composition... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20080038990 - Blasting apparatus for outer surface of pipe: The present invention provides a blasting apparatus for an outer surface of a pipe which ejects a blast material to an outer side of a pipe and grinds the outer surface, comprising: a blast head containing a nozzle which ejects the blast material and a suction port which sucks a... Agent: Roberts, Mlotkowski & Hobbes

20080038992 - Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers: A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wafer is being loaded onto or unloaded from one of the wafer carriers. The... Agent: Mckenna Long & Aldridge LLP

20080038994 - Method to passivate conductive surfaces during semiconductor processing: A method for processing semiconductor wafers is disclosed. A solution is applied to a semiconductor wafer to prevent dendrites and electrolytic reactions at the surface of metal interconnects. The solution can be applied during a CMP process or during a post CMP cleaning process. The solution may include a surfactant... Agent: Freescale Semiconductor, Inc. Law Department

20080038997 - Method of working gemstones: The invention provides a method of gemstones working enabling rapid gemstone working member exchange and gemstone processing sequence continuation without the need to level the gemstone or the working member. The invention also provides a rotatable support having an axis of rotation and a registering feature. The registering feature precisely... Agent: Pearl Cohen Zedek Latzer, LLP

20080038998 - Method for processing a substrate using multiple fluid distribtuions on a polishing surface: A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, a polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has an outlet of the delivery tube coupled... Agent: Patent Counsel Applied Materials, Inc.

20080038999 - Retaining ring with conductive portion: A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that... Agent: Fish & Richardson P.C.

20080039000 - Reataining ring and articles for carrier head: A carrier head for chemical mechanical polishing that has a base, a mounting assembly connected to the base having a surface for contacting a substrate, and a retaining ring secured to the base. The retaining ring can include perfluoroalkoxy, polyetherketoneketone, polybenzimidazole, a semi-crystalline thermoplastic polyester, or a long molecular chain... Agent: Fish & Richardson P.C.

20080039001 - Knife sharpener: A knife sharpener has a body with a handle. The body provides a knife blade support surface and an abrasive element support surface set at an included angle that is half a sharpening angle from the support surface. A permanent magnet is used to retain an abrasive element against the... Agent: David Kiewit

20080032603 - Sanding tool: A surface treatment apparatus for abrading a workpiece surface includes a motion generating device configured to move an abrasive disc, a stabilizer, and a force control device. The stabilizer and the force control device work cooperatively to prevent a force of contact between the abrasive disc and the workpiece surface... Agent: 3m Innovative Properties Company

20080032605 - Abrasive lubricating wipes: A disposable wipe includes an abrasive disposable fabric. Further, the disposable wipe includes a lubricant which is carried by the wipe. A disposable wipe system is also disclosed. The disposable wipe system includes a container. The disposable wipe system also includes a plurality of abrasive wipes in the container. Further,... Agent: Tracy Chan

20080032609 - Apparatus for reducing contaminants from a chemical mechanical polishing pad: The present invention provides an apparatus for reducing contaminants on an unused chemical mechanical polishing pad. The apparatus comprises a rotating vacuum platen for rotating and holding the polishing pad, a traversing arm that moves between a peripheral edge and a center axis of the polishing pad, and a contaminant... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

20080032601 - System and method for improved hand tool operation: Systems and methods for improved operation of hand tools are disclosed. Sensors may be configured to monitor one or more operational parameters of a hand tool and collected data may be communicated to the hand tool operator. The data may be compared to predetermined limits for an operational parameter to... Agent: Lowrie, Lando & Anastasi, LLP S1432

20080032602 - Devices and methods for optical endpoint detection during semiconductor wafer polishing: A method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an optical sensor disposed within the polishing pad. The intensity of the reflected light is measured by a light... Agent: Crockett & Crockett

20080032604 - Servo stroking apparatus and system: A servo stroking apparatus and system (10) for honing wherein the cam stroking motion follows a cam profile which produces a finite jerk profile for reducing machine vibration and optimizing one or more honing parameters. The cam profile can be selected for example from a simple harmonic cam profile, a... Agent: Haverstock, Garrett & Roberts LLP

20080032606 - Method for controlling the dishing problem associated with chemical-mechanical planarization (cmp) during manufacture of copper multilayer interconnection structures in ultra large-scale integrated circuits (ulsi): Provided is a method of chemical-mechanical planarization of copper multilayer interconnection structures and of controlling the dishing problem associated therewith comprising: (a) preparing a slurry by (i) diluting SiO2 hydrosol with deionized water; (ii) admixing a chelating agent and adjusting the pH to between 9.5 to 11.5; and (iii) admixing... Agent: Matthias Scholl

20080032607 - Aging apparatus for aging an artificial stone: The present invention provides an apparatus and a method for aging a stone, preferably an artificial stone. The aging device comprises a rotary support operatively connected to a rotary shaft, at least one abrasive tool mounted to the rotary support for roughing and/or polishing a surface of the artificial stone... Agent: John S. Pratt, Esq Kilpatrick Stockton, LLP

20080032608 - Process for manufacturing glass substrate for magnetic recording medium and glass substrate for magnetic recording medium obtained by the process: A process for manufacturing a glass substrate for a magnetic recording medium, comprising polishing a glass substrate is polished using abrasive grains and then washing the substrate using a 0.02-0.3% aqueous hydrofluoric acid solution, and a glass substrate for a magnetic recording medium which is manufactured by the process. A... Agent: Sughrue Mion, PLLC

20080032610 - Cutting head for fluid jet machine with indexing focusing device: A cutting head for a water jet cutting machine includes a base with a bore and an orifice member having an inlet, an outlet, and a passage extending between the inlet and outlet which increases velocity of fluid flowing through the passage to form a fluid jet. A wear insert... Agent: Michael Best & Friedrich LLP

20080032611 - System for surface preparation: A system for preparing a surface for painting, staining, or other treatment is provided. This system includes a surface preparation material and an optional dispenser for dispensing the surface preparation material. The surface preparation material includes a single-layer or multi-layer substrate material or fabric; a sanding portion formed on the... Agent: Mcnees Wallace & Nurick LLC

20080032612 - Apparatus for grinding a surface comprising two movably arranged hoods: The present invention concerns an apparatus (1), preferably for grinding a surface, including at least one grinding unit, a screen (2, 3) and a guide member (5), where the grinding unit is a rotatable and preferably horizontally arranged grinding cylinder, which at a cylinder surface is provided with a number... Agent: James C. Wray

20080032613 - Lapping head for machining workpieces of hard stone materials: A lapping head (10) for machining a workpiece of hard stone materials comprises a body (12) rotatable about a vertical axis (Y) and having tools (20a,b,c,d,e,f) mounted thereon in such a way that each tool can swing about an axis arranged radially with respect to said vertical axis (Y). The... Agent: Katten Muchin Rosenman LLP

20080032614 - Conformable sanding pad: A flexible, hand-held sanding pad comprises a conformable, multi layered, semicircle pad having a surface capable of providing temporary adhesive attachment for a sheet of pressure-sensitive adhesive-coated abrasive material.... Agent: Glen Stuhlmacher Ii