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Abrading January USPTO class listing 01/08Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 01/31/2008 > patent applications in patent subcategories. USPTO class listing
20080026677 - Lapping machine and head device manufacturing method: A lapping machine that polishes a head block in which plural head devices are connected in a row includes a jig that has a bottom surface that opposes to a grinding plane, and fixes the head block onto the bottom surface, a pressure mechanism that applies a pressure to the... Agent: Kratz, Quintos & Hanson, LLP
20080026678 - Diamond tool blade with circular cutting edge: An apparatus for turning a hard and/or brittle material includes a precision workpiece spindle, a workpiece support, a hard and/or brittle workpiece rigidly coupled to the workpiece support, and a diamond tool blade rigidly coupled to a spin-turner mechanism. The diamond tool blade is formed to include a cutting edge... Agent: Barnes & Thornburg LLP
20080026679 - Method of local manufacture of ophthalmic lens using remotely assembled pre-blocked lens blanks: A method of manufacturing ophthalmic lenses comprises the steps of: a) mounting lens blanks on lens blocks at a blocking location; b) transporting the blocked lens blanks to at least one manufacturing site that is remote from the blocking location; and c) selectively machining ophthalmic lens from the blocked lens... Agent: Blynn L. Shideler The Blk Law Group
20080026681 - Conductive polishing article for electrochemical mechanical polishing: Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the... Agent: Patterson & Sheridan, LLP
20080026682 - Knife maintenance apparatus: A knife maintenance apparatus has a substantially rectangular hone body, a length with an open end and a base end, a width, a top surface covered with an abrasive material, and a bottom surface. There is a first hone edge extending along the length of the hone body and has... Agent: Teri G. Andrews Attorney At Law01/24/2008 > patent applications in patent subcategories. USPTO class listing
20080020679 - Glass substrate for magnetic disk, its production method and magnetic disk: A method for producing a glass substrate for a magnetic disk by polishing a circular glass plate, which comprises a step of polishing the principal plane of the circular glass plate by using a slurry containing at least one water-soluble polymer selected from the group consisting of a water-soluble organic... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.
20080020680 - Rate-enhanced cmp compositions for dielectric films: The invention provides a chemical-mechanical polishing composition consisting essentially of silica, an oxidizing agent, a quaternary ammonium compound, and water. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. The polishing composition provides for enhanced polishing rates when used to polish dielectric films.... Agent: Steven Weseman Associate General Counsel, I.p.
20080020676 - Run-to-run control of backside pressure for cmp radial uniformity optimization based on center-to-edge model: During planarization of wafers, the thickness of a layer of a wafer is measured at a number of locations, after the wafer has been planarized by chemical mechanical polishing. The thickness measurements are used to automatically determine, from a center to edge profile model to which the measurements are fit,... Agent: Silicon Valley Patent Group LLP
20080020677 - Sanding machine having malfunction indicating device: A sanding machine includes a number of machine elements, a number of sensors attached to the machine elements respectively, a malfunction indicating device having a graph disposed on a front panel for showing the machine elements, and a number of indicating members disposed on the front panel and coupled to... Agent: Charles E. Baxley, Esq.
20080020678 - Discontinuous abrasive particle releasing surfaces: Discontinuous abrasive particle releasing surfaces are disclosed that may be employed in low speed wet grinding, sanding, and polishing operations. The discontinuous abrasive surfaces of the present invention may consist of abrasive containing protrusions attached to rigid or flexible surfaces or alternatively may be comprised of closed cell foam compositions... Agent: Denis Khoo
20080020681 - Knife sharpening method and system: A method and system are disclosed. The system may include a device for sharpening a convex edge on the blade of a knife. The device may include a resilient material and a plurality of abrasive sheets of varying grit values. Each abrasive sheet may be removably attachable to a top... Agent: Duckor Spradling Metzger & Wynne A Law Corporation
20080020682 - Method for conditioning a polishing pad: A method of conditioning processing pads increases the removal rate of conductive material from a substrate surface during polishing. In this method, the direction of rotation of the processing pad relative to the conditioning disc during conditioning is opposite the direction of rotation of the processing pad relative to the... Agent: Patterson & Sheridan, LLP
20080020683 - Polishing method and polishing pad: A polishing method includes polishing a surface to be polished of a target object by using a polishing pad in which a cutout part been formed by cutting out a polishing surface from an outer circumferential end toward an inner part, and after polishing, separating the target object from the... Agent: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
20080020684 - Wafer clamping device for a double side grinder: A hydrostatic pad for use in holding a semiconductor wafer during grinding of the wafer by grinding wheels. The pad includes hydrostatic pockets formed in a face of the body directly opposed to the wafer The pockets are adapted for receiving fluid through the body and into the pockets to... Agent: Senniger Powers
20080020685 - Truing tool for a grindstone: A truing tool for a grindstone (1) is intended for attachment to a universal support (3) in the form of a cylindrical rod of a grinding machine in parallel with the rotation axis of the grindstone. It has—in a holder (12) therefore—a cutting tip (13) for truing engagement with the... Agent: Breiner & Breiner, L.L.C.
20080020686 - Electric hand-held power tool: An electric hand-held power tool is disclosed that includes a machine housing (11) that has at least one dust-ejection opening (12), and a dust-collection container (13) attached to dust-ejection opening (12), the dust-collection container (13) including a dust-collection box (15) and a cover (16) that closes the dust-collection box (15).... Agent: Michael J. Striker
20080020687 - Hand-held sanding block dust catcher: A dust collection device for a hand-held sanding block is disclosed. The dust collection device has an outer shell. The device also has a series of ribs and blocks to hold the sanding block in place along with a seal and baffles to contain the dust generated during the sanding... Agent: Arthur M. Peslak, Esq. Mandel & Peslak, LLC
20080020688 - Tool for working on a surface: An embodiment of a tool for working on a surface includes a tool support, a pad replaceably attached to a lower surface of the tool support, a working material replaceably attached to a lower surface of the pad, and a vacuum attachment member connected to the tool support.... Agent: Brooks, Cameron & Huebsch , PLLC
20080020689 - Hand tool quick release mechanism: A hand tool quick release mechanism for releasably connecting a frame to a base, the quick release mechanism comprising a frame connecting mechanism and a base connecting mechanism each for respectively coupling releasably the frame and base together, wherein the frame and base are placed into an attached position by... Agent: Mark A Koch
20080020691 - Polishing head for a polishing machine: A polishing head for polishing machines, in particular for polishing optical surfaces, has a polishing plate that is connected to a rotationally drivable drive shaft. The polishing plate is articulated to, and rotates with, the drive shaft. A ball hexagonal socket joint provides the articulated connection. Rotating by means of... Agent: Fish & Richardson PC
20080020690 - Reducing polishing pad deformation: A polishing system can have a polishing pad with a polishing surface and a bottom surface that includes a recess with a thickness less than the thickness of the polishing pad. An in-situ monitoring module can be positioned in a cavity formed in part by the recess. A vent path... Agent: Fish & Richardson P.C.01/17/2008 > patent applications in patent subcategories. USPTO class listing
20080014836 - Device for production of a pre-formed shape on a workpiece by grinding and corresponding method: The invention relates to a device and method for production of a pre-formed shape on a workpiece having a blank piece shape, by means of grinding in several working steps, preferably on cams of a camshaft, comprising a grinding machine and a controller, for controlling the grinding machine. A measuring... Agent: Jordan And Hamburg LLP
20080014837 - Method of forming partitions of plasma display panel and device for forming partitions: In a method of forming partitions of a plasma display panel, the partitions of the plasma display panel are formed by using a sandblasting method, and abrasive material and partition cutting powder are dispersed in liquid after the completion of sandblasting. Further, in a device for forming partitions of a... Agent: Mcdermott Will & Emery LLP
20080014839 - Method for the simultaneous double-side grinding of a plurality of semiconductor wafers, and semiconductor wafer having outstanding flatness: A method for the simultaneous double-side grinding of a plurality of semiconductor wafers, involves a process wherein each semiconductor wafer lies such that it is freely moveable in a cutout of one of a plurality of carriers caused to rotate by means of a rolling apparatus and is thereby moved... Agent: Brooks Kushman P.C.
20080014838 - Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition: An additive composition for a slurry contains a first salt of polymeric acid including a first polymeric acid having a first weight average molecular weight and a first base material, and a second salt of polymeric acid including a second polymeric acid having a second weight average molecular weight and... Agent: Volentine & Whitt PLLC
20080014840 - Backingless abrasive article: An abrasive article includes an abrasive layer having an array of protrusions. The abrasive layer has a thickness not greater than about 500 mils. The abrasive article is free of a backing layer.... Agent: Larson Newman Abel Polansky & White, LLP
20080014841 - Low friction planarizing/polishing pads and use thereof: A polishing pad comprising a polymeric matrix and solid lubricant particles is useful for planarizing surfaces, and preventing delamination and scratches.... Agent: Connolly Bove Lodge & Hutz LLP
20080014842 - Polishing head for polishing semiconductor wafers: A polishing head and method for chucking a semiconductor wafer onto the polishing head uses a base structure and an outer flexible membrane with at least a first annular chamber and a second annular chamber positioned between the base structure and the outer flexible membrane. The polishing head includes a... Agent: Wilson & Ham
20080014843 - Method and apparatus for refinishing wooden floors: A portable machine is used to abrade the surface of a factory finished wooden floor so the abraded surface may be recoated with a fresh coat of wooden floor finish. Abrasion of the surface provides anchor sites to achieve a strong bond between the pre-existing abraded finish and the fresh... Agent: Blackwell Sanders LLP
20080014844 - Power tool with spindle lock: A spindle lock equipped hand-held power tool, such as a grinder or circular saw, includes a housing assembly, a motor including a rotating armature shaft, a spindle carried externally of the housing adapted for selectively affixing and releasing a rotating cutting tool and a drive train which drivingly interconnects the... Agent: J. Gordon Lewis
20080014845 - Conditioning disk having uniform structures: A method and apparatus for conditioning a conductive polishing material is described. In one embodiment, the pad dresser comprises a backing plate adapted to coupled to a conditioning head assembly, the backing plate comprising a rigid disk having a first side and an opposing second side, the second side having... Agent: Patterson & Sheridan, LLP
20080014846 - Tools for polishing and associated methods: Methods for making polishing tools and associated tools are disclosed. In one aspect, a method of making a polishing tool is provided. Such a method may include truing a working surface of a nano-diamond impregnated substrate. The method may further include forming asperities on the working surface with a polycrystalline... Agent: Thorpe North & Western, LLP.01/10/2008 > patent applications in patent subcategories. USPTO class listing
20080009227 - Optical head for chemical mechanical polishing: A polishing system includes a platen, a carrier head to hold a surface of a substrate against a polishing pad on the platen, a monitoring module including a light source and a detector, an optical fiber having a proximate end coupled to the monitoring module and a distal end, and... Agent: Fish & Richardson P.C.
20080009228 - Polishing pad, method for manufacturing the polishing pad, and method for polishing an object: A polishing pad with first plural concave portions regularly allocated with prescribed spacing or/and a groove formed on the surface of the polishing pad; and a second concave portion randomly allocated without corresponding to the first plural concave portions or/and the groove formed on the surface of the polishing pad.... Agent: Westerman, Hattori, Daniels & Adrian, LLP
20080009229 - Bilateral machine for processing glass panes shaped like a parallelogram with non-right angles: A bilateral machine for processing panes shaped like a parallelogram with non-right angles, comprising an input station downstream of which there is a first bilateral unit which leads to an angle transfer assembly which is arranged upstream of a second bilateral unit, the angle transfer assembly comprising elements for rotation... Agent: Modiano & Associati
20080009230 - Impact resistant lens, frame and tools and method for making same: A corrective/ophthalmic lens comprising an impact lip extending from an anterior lens edge and a radial groove adjacent and parallel to the lens lip posterior surface, an eyewear system containing a corrective/ophthalmic lens and a method of making a lens is provided. The lens impact lip size is variable, determined... Agent: Kaplan Gilman Gibson & Dernier L.L.P.
20080009231 - Dressing a wafer polishing pad: A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for... Agent: Senniger Powers
20080009232 - Machining plate with machining element: A machining plate carries at least one machining element for the grinding, polishing and/or cutting of a floor surface. The machining element is arranged in a recess in the machining plate. The recess is at least partially provided with an elastic lining, so that the machining element is resiliently secured... Agent: Merchant & Gould PCPrevious industry: Foundation garments
Next industry: Butchering
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