Abrading inventions 12/07

20070298687 - Apparatus and method for modifying an edge: Edge modifying apparatuses that include a disc chuck, a disc edge modifying unit having an abrasive article support, and a uniform velocity linear oscillation driver coupled to at least one of the disc chuck and the abrasive article support are described. The uniform velocity linear oscillation driver provides a substantially... Agent: 3m Innovative Properties Company

20070298690 - Method of eliminating surface stress of silicon wafer: This invention provides a method for eliminating the surface stress of a silicon wafer comprising forming one or more anti-stress groove(s) on the surface of the silicon wafer. These anti-stress grooves can reduce or eliminate the surface stress of silicon wafer effectively to avoid the formation of slip lines and... Agent: Matthias Scholl

20070298691 - Micro-concave portion machining method: A micro-concave portion machining method is provided for forming micro-concave portions on an inner circumferential surface of a cylindrical bore form in a workpiece. The micro-concave portion machining method includes performing mirror surface machining and subsequent plastic working on the inner circumferential surface. The plastic working on the inner circumferential... Agent: GlobalIPCounselors, LLP

20070298692 - Pad cleaning method: A method for cleaning a polishing pad is disclosed. In CMP and ECMP, a polishing pad must be conditioned to obtain good and predictable polishing results. During conditioning, debris is generated that must be removed to prevent processing defects. An effective method to clean a polishing pad is disclosed herein.... Agent: Patterson & Sheridan, LLP

20070298686 - Eyeglass lens processing apparatus: An eyeglass lens processing apparatus includes: an endmill that bevels a periphery of lens by a tip thereof so that an angle made by a bevel and a bevel foot substantially coincides with an angle of the tip; a moving unit that includes an inclining unit that inclines the endmill... Agent: Sughrue-265550

20070298685 - Honing feed system having full control of feed force, rate, and position and method of operation of the same: The feed system (30) for a honing machine (10) provides a capability to dynamically correct in real time errors in bore size inferred arising from variations in feed force, and a method of operation of the same. The system (10) allows a user to select between rate and force controlled... Agent: Haverstock, Garrett & Roberts LLP

20070298688 - Magnetic disk substrate and production method of magnetic disk: When glass substrate is polished by using a polishing carrier, this invention provides a production method of a magnetic disk substrate that can be applied irrespective of shape, material and hardness of a polishing carrier and can prevent the occurrence of scratches on an outer end face of the glass... Agent: Sughrue Mion, PLLC

20070298689 - Polishing pad conditioning process: A method of operating a polishing apparatus in which a substrate is held with a carrier head supported by a movable support of the polishing apparatus, the substrate is brought into contact with a polishing surface at a polishing station of the polishing apparatus and the substrate is polished, the... Agent: Fish & Richardson P.C.

20070298693 - Cmp-apparatus retainer ring and manufacturing method thereof, and cmp apparatus: A retainer ring is provided which is capable of, effectively in practice, restraining the time taken for a break-in polish to the minimum. This retainer ring 8: is disposed inside of a holding head 4 in a CMP apparatus 1 which polishes a wafer W chemically and mechanically; has a... Agent: Arent Fox LLP

20070298694 - Wafer polishing head: A wafer polishing head according to the invention is disclosed. In the wafer polishing head, an automatic control device is additionally installed outside the wafer polishing head for automatically adjusting a pressure applied on a retaining ring. This ensures the bottom of the retaining ring always lower than that of... Agent: J C Patents, Inc.

20070298695 - Ride-on floor machine with dust collection system: A riding floor sander for large hardwood floor surfaces, such as gymnasiums and dance floors, has a powered cart with one or more sanding machines connected to it. A blower picks up the process waste in a stream of air and and moves it to a cyclone separator that is... Agent: Bernhard P. Molldrem, Jr.

20070298696 - Hand-held power tool with protection hood: A hand-held power tool for rotating a working tool disc (30) includes a removable protection hood (6) for partially covering the working tool disc (30) during operation, and a clamping device (8) for securing the protection hood (6) relative to a power tool head (2) and having a clamping member... Agent: Abelman, Frayne & Schwab

20070298697 - Floor cleaning pads and preparation thereof: An abrasive article (1) for use on a rotary cleaning machine having, on one side, a first abrasive face (2) having a first abrasive nature and, on the other side, a second abrasive face having a second abrasive nature abrasive face comprising a lofty, three-dimensional, non-woven web of fibres bound... Agent: 3m Innovative Properties Company

20070298698 - Sanding block and method of making same: A sanding block includes a compressible core having at least one pair of sides characterized such that an abrasive material is adhered to said sides substantially along the surface thereof and having a juncture area defined between said two sides which does not have said abrasive material adhered thereto such... Agent: R. William Graham

20070293128 - Grinding and polishing machine for grinding and/or polishing workpieces to an optical quality: A grinding and polishing machine, in particular for lenses, has at least one tool spindle and at least one workpiece. The tool spindle is constructed to hold a respective tool on the same axis at both ends and is mounted in a spindle housing which can be pivoted about a... Agent: Reising, Ethington, Barnes, Kisselle, P.C.

20070293129 - Substrate holding device and polishing apparatus: A substrate holding device according to the present invention includes an elastic membrane to be brought into contact with a rear surface of a substrate, an attachment member for securing at least a portion of the elastic membrane, and a retainer ring for holding a peripheral portion of the substrate... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070293130 - Wearable abrasive surfaces for dry applications: Abrasive articles are disclosed that may be used in low speed dry sanding applications. The abrasive articles disclosed may be made entirely from abrasive materials or alternatively may be made by fastening abrasive surfaces to handles or tools. The abrasive articles of the present invention have abrasive surfaces with controlled... Agent: Denis Khoo

20070293131 - Die-cutting method, flexible abrasive product and apparatus for manufacturing thereof: The present invention relates to a method for manufacturing a flexible abrasive product, to such an abrasive product as well as to an apparatus for manufacturing the same. Hereby, the abrasive product is formed to be of the shape of a substantially regular polygon by die cutting it off a... Agent: Altera Law Group, LLC

20070287360 - Polishing tape and polishing device using same: A polishing device has a reel core around which a polishing tape is wound and a reel plate with flanges that engage with the polishing tape and sandwich it from both sides. A memory element with data on the polishing tape is provided to the reel core such that errors... Agent: Beyer Weaver LLP

20070287363 - Apparatus for grinding a wafer: An apparatus for grinding a wafer comprises a grinding member. The grinding member has a grinding element for grinding a first section of a wafer surface and a wafer contact element planar with and adjacent the grinding element. The wafer contact element is configured to contact a second section of... Agent: Texas Instruments Incorporated

20070287361 - Method of polishing a layer using a polishing pad: A tool for forming a desired pattern on a polishing pad establishes a vibration that is coupled to the polishing pad. The vibration removes small portions of the polishing pad according to the desired pattern. The polishing pad is then used in a chemical mechanical polishing (CMP) step to polish... Agent: Freescale Semiconductor, Inc. Law Department

20070287362 - Polishing composition and method of polishing with the same: A polishing composition comprises: at least one compound selected from tetrazole compounds and derivatives thereof and anthranilic acid compounds and derivatives thereof; abrasive particles comprising associative abrasive particles; and an oxidizing agent.... Agent: Sughrue Mion, PLLC

20070287364 - Substrate processing method and substrate processing apparatus: A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070287365 - Power tool with dynamic and mechanical brake: A power tool in accordance with an embodiment of the invention has a motor driving a member, a switch coupled across windings of the motor that dynamically brakes the motor, and a mechanical brake that brakes speed of the member. In an aspect, the combined dynamic and mechanical braking brakes... Agent: Harness, Dickey & Pierce, P.L.C

20070287366 - Abrasive article and methods of making and using the same: An abrasive article having an apertured coated abrasive member, filter media, and an attachment interface member is formed by an ultrasonic welding process. The abrasive article is useful for abrading a workpiece.... Agent: 3m Innovative Properties Company

20070287367 - Extended life conditioning disk: The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists... Agent: International Business Machines Corporation Dept. 18g

20070281588 - Profile grinding machine: The profile grinding machine includes: a base; a work unit disposed on one side on the base and including a work table for gripping a work; and a stone unit disposed on the other side on the base and including a stone rotating mechanism for holding and rotating a grinding... Agent: Greenblum & Bernstein, P.L.C

20070281589 - Rotational alignment mechanism for load cups: The present invention generally relates to a substrate transferring system having an alignment mechanism of a surface and to two points. One embodiment of the present invention provides a load cup for transferring a substrate. The load cup comprises a cup having a substrate supporting surface configured to support the... Agent: Patterson & Sheridan, LLP

20070281587 - Method of making and apparatus having polishing pad with window: A polishing layer of a polishing has a window member with a top surface positioned a predetermined distance below the polishing surface. A transparent layer can be positioned below the polishing layer arid supporting the window member.... Agent: Fish & Richardson P.C.

20070281590 - Apparatus for precision steeling/conditioning of knife edges: A multi-stage sharpener includes at least one motor driven abrasive sharpening stage and one non-motor driven conditioning stage. The conditioning stage has a non-abrasive hardened surface and at least one precision knife guide which has a planar guide surface for creating a microscopic serration along the edge of a blade... Agent: Connolly Bove Lodge & Hutz LLP

20070281591 - Grinder and method for controlled edge break production: A robust grinding assembly is provided for grinding cooling holes in a dovetail groove by offsetting the drive shaft of the cutting assembly with respect to the center axis of the bar in which it is housed, whereby a larger sized collet can be accommodated.... Agent: Nixon & Vanderhye P.C.

20070281592 - Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk: A method and apparatus for conditioning polishing pads that utilize an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilize a vacuum capability to pull waste material out of the conditioning pad and through the apertured conditioning... Agent: Wendy W. Koba

20070281593 - Grinding apparatus having pressing portion: The grinding apparatus (10) includes a base (100) for receiving at least one workpiece, a pressing portion (106), and a blocking portion (102) opposite to the pressing portion. The pressing portion is movable relative to the blocking portion. The pressing portion is configured for applying a pressing force against the... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang Jeffrey T. Knapp

20070281594 - Honing guide assembly with camber roller: A tool honing guide and an adjustable roller that contacts an abrasive surface during use of the guide facilitates formation of micro bevels, and the roller is barrel-shaped to facilitate honing a curved cutting arris.... Agent: John S. Pratt Kilpatrick Stockton LLP (l3440)

20070281595 - Wheel assembly for a pneumatic sander: A wheel having an inflatable tyre (1) for releasable pressure engagement with an abrasive belt. The wheel includes a first hub assembly (2) sealingly engageable with a first axial opening (3) in one side of the tyre. A second hub assembly (4) is sealingly engageable with a second axial opening... Agent: Sheridan Ross PC