Abrading inventions 11/07

20070275639 - Workpiece centering apparatus and method of centering workpiece: The workpiece centering apparatus is capable of highly reducing damage of a workpiece. The workpiece centering apparatus comprises: a guide plate being provided in a tray and covering a water inlet so as to horizontally introduce water into the tray; and at least three overflow outlets for overflowing the water... Agent: Birch Stewart Kolasch & Birch

20070275641 - Method for grinding complex shapes: A method of producing a complex shape in a workpiece includes the steps of: i) grinding a workpiece at a maximum specific cutting energy of about 10 Hp/in3·min with at least one bonded abrasive tool, thereby forming a slot in the workpiece; and ii) grinding the slot with at least... Agent: Hamilton, Brook, Smith & Reynolds, P.C.

20070275636 - Coolant delivery system for grinding tools: An abrasive grinding wheel having an annular grinding face depending from a substantially circular body includes a tubular inner wall which defines an axial bore configured to convey coolant in a downstream direction therethrough. The inner wall is coupled to a concave body portion terminating at an inner periphery of... Agent: Sampson, Richard Sampson And Assocs PC

20070275637 - Methods and systems for planarizing workpieces, e.g., microelectronic workpieces: Planarizing workpieces, e.g., microelectronic workpieces, can employ a process indicator which is adapted to change an optical property in response to a planarizing condition. This process indicator may, for example, change color in response to reaching a particular temperature or in response to a particular shear force. In this example,... Agent: Perkins Coie LLP Patent-sea

20070275638 - Method of maintaining a constant grinding process: Method of grinding cylindrical gears with a threaded grinding wheel wherein the amount of grinding wheel material utilized during shifting remains constant as the wheel diameter decreases, for example, due to dressing. The amount of grinding wheel shifting is adjusted as the grinding wheel diameter decreases.... Agent: The Gleason Works

20070275640 - Worm wheel machining method, worm wheel, worm speed reducer and electric power steering apparatus: In a method of machining gear teeth 2 of worm wheel 1 by causing a worm (not shown) on which abrasive or grinding material is added to mesh with the gear teeth 2 of the worm wheel 1, at least the gear teeth of said worm wheel being made of... Agent: Miles & Stockbridge PC

20070275642 - Grinding apparatus having sludge-removing device and method of removing sludge: A work having a portion to be ground, such as a tapered surface, is ground by a grinder driven by a driving device. During grinding operation, coolant is supplied to a grinding surface of the grinder and the portion to be ground. After the grinding operation is completed, the coolant... Agent: Nixon & Vanderhye, PC

20070275643 - Fan-type grinding wheel: A fan-type grinding wheel which can be driven in rotation in a direction of rotation comprises, on an annular rim region of a support plate, grinding blades which are configured in the form of a triangle. The outer edge of each grinding blade defines a portion of an outer rim... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20070275644 - Rotary finishing wheel: A rotary tool for surface machining has a disk having an elastomeric outer periphery, an array of angularly spaced elastomeric teeth projecting radially and each having a formation forming a hinge so that the tooth can flex at the hinge.... Agent: K.f. Ross P.C.

20070270085 - Chemical mechanical polishing slurry, cmp process and electronic device process: Slurry for Chemical Mechanical Polishing characterized in comprising abrasive grains and water, wherein said abrasive grains are composite particles coated with ceria particles consisting of organic host particles and ceria particles, zeta potential of said composite particles being a negative potential, the organic host particles constituting the composite particles coated... Agent: Antonelli, Terry, Stout & Kraus, LLP

20070270087 - Polishing device and method: A polishing device includes a polishing head for pressing and holding a semiconductor wafer, a pair of polishing pads having the same diameter as the polishing head for polishing the semiconductor wafer, and a subordinate polishing pad having a smaller diameter for polishing a peripheral portion of the semiconductor wafer.... Agent: Sughrue Mion, PLLC

20070270088 - Grill and griddle cleaning device: A device for cleaning griddles and grills has a heat resistant pad carried by a carriage, which in turn is manipulated by a motor to move in an oscillating and/or planar agitating motion, analogous to a hand-held motorized sander. A dispensing container with liquid for shocking the grill is mounted... Agent: Bradley N. Ruben, PC

20070270081 - Automated chemical polishing system adapted for soft semiconductor materials: At least one wafer is suspended on a respective jig shaft above a polishing platen. The degree of parallelism between the wafer and the polishing platen is controlled using a three-point suspension, which allows for planar pitch adjustments using vertical actuation algorithms. As the wafer is lowered into contact against... Agent: Momkus Mccluskey Monroe Marsh & Spyratos, LLC

20070270080 - Non-contact chemical mechanical polishing wafer edge control apparatus and method: Methods and apparatus for controlling a material removal rate at an edge of a wafer during a chemical mechanical polishing (CMP) process are disclosed. According to one aspect of the present invention, a CMP apparatus includes a wafer, a polishing pad to polish a surface of the wafer, a polishing... Agent: Aka Chan LLP

20070270082 - Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field: The lapping of a slider is controlled based on an amplitude of a readback signal which is produced from an externally applied magnetic field. A lapping plate is used to lap a slider which includes at least one magnetic head having a read sensor. During the lapping, a coil produces... Agent: John J. Oskorep, Esq. One Magnificent Mile Center

20070270083 - Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field: The lapping of a slider is controlled based on an amplitude of a readback signal which is produced from an externally applied magnetic field. A lapping plate is used to lap a slider which includes at least one magnetic head having a read sensor. During the lapping, a coil produces... Agent: John J. Oskorep, Esq. One Magnificent Mile Center

20070270084 - Method of manufacturing silicon substrates for magnetic recording medium, silicon substrate for magnetic recording medium, magnetic recording medium, and magnetic recording apparatus: A manufacturing method for silicon substrates for a magnetic recording medium has the steps of forming a stack body of a number of silicon substrates which are stacked via spacers therebetween, wherein each silicon substrate has a circular hole at a center of the substrate; immersing the stack body of... Agent: Sughrue Mion, PLLC

20070270086 - Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device: A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mixes the mist of abrasive slurry,... Agent: Mcdermott Will & Emery LLP

20070270089 - Polishing device: A polishing device includes a polishing pad for polishing a wafer and a polishing head for holding the wafer. The polishing head has a retainer ring for retaining the wafer in the in-plane direction of the wafer, a membrane sheet for pressing the wafer against the polishing pad, and a... Agent: Foley And Lardner LLP Suite 500

20070270090 - Composite support structure for use in sanding and sanders formed therefom: A composite support structure for use in sanding includes a rigid member having a front surface and a back surface for connection to a handle, and a polyfoam layer having a front surface and a back surface, wherein the back surface of the polyfoam is bonded to the front surface... Agent: A Patent Lawyer Corp, PLC R William Graham

20070264906 - Facetting area setting device and eyeglass lens processing apparatus: A facetting area setting device for setting a facetting area so as to perform a facetting on an edge corner of an eyeglass lens which has been finished, includes: an input unit that inputs a target lens shape; a display unit that displays a front outline graphic based on the... Agent: Sughrue-265550

20070264911 - Method for producing a semiconductor wafer with profiled edge: Semiconductor wafers with profiled edges, are produced with decreased losses due to edge or other damage by separating a semiconductor wafer from a crystal; profiling the edge in a profile producing step wherein the edge is mechanically machined to a profile that is true to scale with respect to a... Agent: Brooks Kushman P.C.

20070264912 - Wafer processing method: A method of processing a wafer having a device area in which a plurality of devise are formed and a peripheral excess area surrounding the device area on the front surface, comprising an annular groove forming step for forming an annular groove having a predetermined depth and a predetermined width... Agent: Smith, Gambrell & Russell

20070264913 - Method for grinding of cam profiles: The present invention relates to a method for grinding of cam profiles on a camshaft (1), having an inner shaft (5) and an outer shaft (4) arranged coaxially one inside the other and mounted to rotate with respect to one another. The camshaft (1) additionally has first and second cams... Agent: William Collard Collard & Roe, P.C.

20070264907 - Control system and method for processing jewelry and the like: A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a gripper for holding a piece of jewelry. Drive motors are associated with each translational and rotational degree... Agent: Gordon & Rees LLP

20070264908 - Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor device: A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mixes the mist of abrasive slurry,... Agent: Mcdermott Will & Emery LLP

20070264909 - Method and apparatus for fluid polishing: In a fluid polishing method for processing a fine aperture by slurry 7, the slurry is supplied from a cylinder 2a in a slurry flow rate target process until the flow rate increases to a target value of a slurry feed flow rate. When the flow rate reaches the target... Agent: Harness, Dickey & Pierce, P.L.C

20070264910 - Method and apparatus for fluid polishing: In a fluid polishing method for processing a fine aperture by slurry 7, the slurry is supplied from a cylinder 2a in a slurry flow rate target process until the flow rate increases to a target value of a slurry feed flow rate. When the flow rate reaches the target... Agent: Harness, Dickey & Pierce, P.L.C

20070264914 - Substrate delivery mechanism: A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070264915 - Device for automatically preparing ophthalmic lenses for mounting, enabling a plurality of lenses to be taken in charge simultaneously: A device includes a measurement element for automatically measuring optical locating or identification characteristics of an ophthalmic lens, a cutting-out element for cutting out an ophthalmic lens and including an element for lens clamping, and a receiver/transfer element that receives an ophthalmic lens and transfers it in at least three... Agent: Young & Thompson

20070264916 - Grinding apparatus for a pin for use in power transmission chain and manufacture of a pin for use in power transmission chain: A disc-like grinding wheel 5 is formed with a circumferential groove 5a, the opposite walls of which define grinding surfaces 5b. A rotated carrier 3 brings a load pin 55 into rotary movement relative to the grinding wheel 5 rotated about an axis 5z, so as to pass the load... Agent: Birch Stewart Kolasch & Birch

20070264917 - Riding floor polishing and grinding machine for treating concrete, terrazzo, stone and similar surfaces: The invention is a riding floor polishing and grinding machine that uses one or more gangs of polishing heads (242) to treat concrete and similar surface flooring (208). A compact vehicle (210) equipped with a front loader arm (235) is fitted with a module (240) containing the gang(s) of polishing... Agent: Hemingway & Hansen, LLP

20070264918 - Methods of bonding superabrasive particles in an organic matrix: Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The... Agent: Thorpe North & Western, LLP.

20070264919 - Polishing pad: A polishing pad includes a main body having a polishing surface and a backing that is affixed to the back surface of the main body. The elasticity of the main body is within the range of 600 psi-16000 psi and preferably within the range of 1600 psi-16000 psi when a... Agent: Beyer Weaver LLP

20070259604 - Eyeglass lens processing apparatus: An eyeglass lens processing apparatus for processing an eyeglass lens, includes: a facetting tool that facets an edge corner of the lens which has been finished; a lens chuck that holds the lens; an input unit that inputs a target lens shape; a lens measuring unit that obtains front and... Agent: Sughrue-265550

20070259607 - Method and cutting and lapping a workpiece: Cutting and lapping of a workpiece such that the workpiece is divided into thin wafers with the aid of a lapping compound and a circulating wire tool bringing the lapping compound into engagement is improved by employing a wire cable as the wire tool.... Agent: Brooks Kushman P.C.

20070259605 - Process for polishing glass substrate: A process for polishing a glass substrate, which enables to polish a glass substrate having a large waviness formed by mechanical polishing, to have a surface excellent in flatness, is provided. A process for polishing a glass substrate, comprising a step of measuring the surface profile of a mechanically polished... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070259606 - Method of masking and a hot melt adhesive for use therewith: A method of masking includes adhering a removable pressure sensitive adhesive to a masking surface to cover the masking surface and blasting the adhesive and an adjacent target surface with abrasive blast media to remove material forming the target surface wherein the adhesive protects against removal of material forming the... Agent: Sand & Sebolt

20070259608 - Method and apparatus for precision polishing of optical components: A polishing apparatus comprising a base for affixing structures thereto, a drive wheel, a polishing wheel assembly, a polishing belt, and at least one routing wheel engaged with the polishing belt. The polishing wheel assembly includes an elongated arm including a distal end, and a rotatable polishing wheel supported at... Agent: John M. Hammond Patent Innovations LLC

20070259609 - Cmp conditioner: In a CMP conditioner in which abrasive grains are fixed to a protrusion protruded from an upper surface of a base, the abrasive grains are stably fixed to prevent a scratch from being generated due to detachment of the abrasive grains and a space for holding a polishing fluid is... Agent: Darby & Darby P.C.

20070259610 - Ring system for guiding a medium in an abrasive disk: The invention relates to a ring system for accommodating a medium, to a method for compressing and guiding a medium for use in any known grinding methods for abrasive disks that consist of a support (1) and an abrasive lining (2) disposed on the circumference or face thereof for use... Agent: K.f. Ross P.C.

20070259611 - Fastening system, fastening adapter and fastening method: The invention relates to a fastening system for mounting a roller-shaped tool on a drive shaft of a drive motor with the help of a fastening adapter comprising a hollow-cylindrical basic body which comprises in the interior a fastening apparatus for mounting on a drive shaft. A plurality of lamellae... Agent: Baker & Hostetler LLP

20070259612 - Polishing pad and method thereof: A polishing pad and fabricating method thereof includes a polishing pad body and at least a compressibility-aiding stripe. The compressibility-aiding stripe is buried in the polishing pad body and has a larger compressibility than that of the polishing pad body.... Agent: Thomas, Kayden, Horstemeyer & Risley, LLP

20070254563 - Polishing composition for magnetic disk substrate: A polishing composition for a magnetic disk substrate of the present invention includes water, silica particles, and at least one or more selected from an acid, a salt of the acid, and an oxidizing agent. The silica particles are observed with a transmission electron microscope to measure a maximum diameter... Agent: Birch Stewart Kolasch & Birch

20070254557 - Polishing state monitoring apparatus and polishing apparatus and method: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070254558 - Polishing apparatus and polishing method: A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement mechanism (54) to press the wafer (W)... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070254559 - Reducing agglomeration of particles while manufacturing a lapping plate using oil-based slurry: Embodiments of the present invention pertain to reducing agglomeration of particles while manufacturing a lapping plate using an oil-based slurry. According to one embodiment, an oil-based slurry with particles of a known size is applied to a lapping plate. The oil-based slurry is ultrasonically mixed while applying the oil-based slurry... Agent: Wagner, Murabito & Hao LLP

20070254562 - Magnetic disk substrate and production method of magnetic disk: The invention can provides a production method of a magnetic disk substrate capable of controlling surface roughness and can reduce surface defects using only a polishing step, and a production method of a magnetic disk. When a glass substrate is polished, the glass substrate polished is with abrasive slurry containing... Agent: Sughrue Mion, PLLC

20070254561 - Method of polishing the inner peripheral end surfaces of substrates for a recording medium using a brush: The object of the invention is to provide a method of polishing the inner peripheral end surfaces of substrates while maintaining a sufficiently high working precision at the time of polishing the inner peripheral end surfaces of a plurality of disk-like substrates for a recording medium. According to the invention,... Agent: Sughrue Mion, PLLC

20070254560 - Structured abrasive article and method of making and using the same: A structured abrasive article comprises a backing, a structured abrasive layer affixed to the backing, the structured abrasive layer comprising: a plurality of raised abrasive regions, each raised abrasive region consisting essentially of a close-packed plurality of pyramidal abrasive composites; and a network consisting essentially of close-packed truncated pyramidal abrasive... Agent: 3m Innovative Properties Company

20070254564 - Base pad polishing pad and multi-layer pad comprising the same: Disclosed is a base pad of polishing pad, which is used in conjunction with polishing slurry during a chemical-mechanical polishing or planarizing process, and a multilayer pad using the same. Since the base pad according to the present invention does not have fine pores, it is possible to prevent premeation... Agent: Jay S. Cinamon Abelman, Frayne And Schwab

20070254565 - Substrate polishing apparatus: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070254566 - Contoured cmp pad dresser and associated methods: CMP pad dressers with increased pad dressing work loads on the centrally located abrasive particles during dressing of a CMP pad, and methods associated therewith are disclosed and described. The increase in work load on centralized particles improves pad dressing performance and also extends the service life of the pad... Agent: Thorpe North & Western, LLP.

20070254567 - Foam buffing pad with random or strategically placed collapsed cell structures: Selected surfaces of a cellular polymeric foam surface finishing pad are heated to cause the surface cells to partially collapse or to fully collapse and glaze over. The selected surfaces may be the planar pad faces or may be formed in one or more depressions formed in the planar faces.... Agent: Andrus, Sceales, Starke & Sawall, LLP

20070254568 - Grinding wheel: A grinding wheel has a disc having a connection hole formed at a center thereof, to which a rotation axis of a grinder is connected, and a plurality of abrasive segments detachably connected to a surface of the disc. A plurality of fixing recesses are radially formed on the surface... Agent: Ipla P.A.