Abrading inventions 09/07

20070224918 - Planarization apparatus: The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge brought into contact with a front surface of the coating film on the substrate; and a contact body... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070224923 - Polishing pad, chemical mechanical polishing apparatus and method for manufacturing polishing pad: A polishing pad with reduced cost and easy manufacturability without waste is provided. A disc-shaped polishing layer 31 having a plurality of through holes 34 formed therein, an adhesive layer 33 provided only in a position in a back surface of the polishing layer 31 where no through hole 34... Agent: Young & Thompson

20070224916 - Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus: A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070224915 - Substrate thickness measuring during polishing: A method for determining a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matching the spectra with indexes in a library and using the indexes to determining a polishing rate for each of the different zones from the indexes. An... Agent: Fish & Richardson P.C.

20070224917 - Polishing pad, a polishing apparatus, and a process for using the polishing pad: A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second opening substantially contiguous with the first opening. The polishing pad can further include, a... Agent: Larson Newman Abel Polansky & White, LLP

20070224919 - Iodate-containing chemical-mechanical polishing compositions and methods: The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive, iodate ion, a nitrogen-containing compound selected from the group consisting of a nitrogen-containing C4-20 heterocycle and a C1-20 alkylamine, and a liquid carrier comprising water.... Agent: Steven Weseman Associate General Counsel, I.p.

20070224920 - Polishing pad, method of polishing and polishing apparatus: A polishing pad according to the invention comprises a pad body having a polishing surface and a support surface and a plurality of hole apertures extending from the polishing surface to the support surface, each of the plurality of apertures having a noncircular shaped opening oriented at a predetermined angle... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070224921 - Method of grooving or counter-bevelling the periphery of an ophthalmic lens: The method is implemented in a grinding machine comprising a lens support provided with means for driving the lens (15) in rotation about the first axis (A-A′), and a grooving or counter-beveling wheel (51, 53) that is tiltable relative to the first axis (A-A′). The method comprises steps of determining... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070224922 - Knife sharpening apparatus: The invention relates to a pocket-sized knife sharpening device comprising two sharpening bars (11, 12) which are arranged in a housing (1) and which are rotationally mounted. The sharpening bars (11, 12) are guided with the other ends thereof into arc-shaped recesses (15, 16; 17, 18) in the front wall... Agent: Flynn Thiel Boutell & Tanis, P.C.

20070224924 - Oscillating grinding machine: The present invention relates particularly to an oscillating grinding machine. The grinding machine comprises a driving motor (3) surrounded by a body (3), and a drive shaft (4) cooperating with the driving motor. The drive shaft comprises a grinding head (5) that constitutes a support for a grinding product (8).... Agent: Altera Law Group, LLC

20070224925 - Chemical mechanical polishing pad: A polishing pad has polishing elements of at least two different types of materials, each having a different coefficient of friction, and arranged over a surface of the pad so as to provide a non-planar material removal profile for the pad. The polishing elements may be arranged to provide different... Agent: Sonnenschein Nath & Rosenthal LLP

20070218809 - Recovery device of blasting medium and method therefor: The present invention provides a recovery device of a blasting medium for recovering a blasting medium after use, which has been injected to a work and has fallen therefrom, into a solid-gas separating tank by suctioning with a suction blower, wherein the solid-gas separating tank comprising: a sucking unit of... Agent: Roberts, Mlotkowski & Hobbes

20070218808 - Sponge blasting apparatus and sponge blasting method: The present invention provides a sponge blasting apparatus comprising: a recovering unit which sucks and recovers a blasting medium jetted out of a nozzle; a sorting unit which sorts the blasting medium sucked and recovered by the recovering unit into a reusable blasting medium and an unreusable blasting medium; a... Agent: Roberts, Mlotkowski & Hobbes

20070218813 - Method for manufacturing cell structure: There is provided a method for manufacturing cell structures having a plurality of cells divided by porous partition walls and extending from one end face to the other end face to function as fluid passages. Dry mass of each of a plurality of honeycomb-shaped cell structure precursors is measured, and... Agent: Oliff & Berridge, PLC

20070218816 - Blasting medium picking-apart device: The present invention provides a blasting medium picking-apart device comprising: a hopper-shaped container having an upper opening through which a blasting medium is put in; a blade attached to a rotary shaft which is mounted along the central axis of the container, for applying a shear force to the blasting... Agent: Roberts, Mlotkowski & Hobbes

20070218806 - Embedded fiber acoustic sensor for cmp process endpoint: Devices, systems and methods for monitoring characteristics of semiconductor substrates and workpieces during planarization and for endpointing planarization processes are provided. The invention utilizes a fiber optic contact sensor incorporated into a planarizing pad or pad-subpad assembly for process monitoring of mechanical energy (e.g., mechanical vibration) and acoustical energy (e.g.,... Agent: Whyte Hirschboeck Dudek S.c.

20070218810 - Eyeglass lens processing apparatus: An eyeglass lens processing apparatus for processing an eyeglass lens includes: a lens chuck that holds the lens; a regular-grooving tool; a first moving unit that moves the lens held by the lens chuck; a grooving data input unit that inputs grooving data including a width and depth of the... Agent: Sughrue-265550

20070218807 - Method and apparatus for producing micro-texture on a slider substrate using chemical & mechanical polishing techniques: A system and method for producing micro-texture on a slider substrate using chemical & mechanical polishing techniques is described. In certain embodiments of the present invention, this is accomplished by a method comprising formulating an abrasive slurry solution of predetermined acidity (or pH value), treating a chemical mechanical polishing pad... Agent: Kenyon & Kenyon LLP

20070218811 - Cmp polishing slurry and method of polishing substrate: A CMP polishing slurry of the present invention, contains cerium oxide particles, a dispersant, a polycarboxylic acid, a strong acid having a pKa of its first dissociable acidic group at 3.2 or less, and water, the pH of the polishing slurry is 4.0 or more and 7.5 or less, wherein... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20070218812 - Spectrum based endpointing for chemical mechanical polishing: Methods and apparatus for providing a flushing system for flushing a top surface of an optical head. The flushing system includes a source of gas configured to provide a flow of gas, a delivery nozzle, a delivery line that connects the source of gas to the delivery nozzle, a vacuum... Agent: Fish & Richardson P.C.

20070218814 - Variable speed wet sharpener and methods relating to same: A variable speed wet sharpener having a support, at least one grinding stone rotatably mounted on the support and having a contacting surface, a container of coolant disposed in a vicinity of the grinding stone for cooling the contacting surface of the grinding stone, a motor having a rotatable drive... Agent: Fitch Even Tabin And Flannery

20070218815 - Machine for producing web material, in particular paper or paperboard, and method for treating a surface of a transport belt in a machine for producing web material: Machine and method for producing web material. The machine includes at least one transport belt structured and arranged for transporting the web material, a plurality of rolls over which the at least one transport belt is guided, and a treatment apparatus, assigned to the at least one transport belt, composed... Agent: Greenblum & Bernstein, P.L.C

20070218817 - Loading device for chemical mechanical polisher of semiconductor wafer: The present invention related to a loading device for a chemical mechanical polisher of semiconductor wafers comprising: a loading cup on wherein a cup plate is installed in a cup-shaped bath, a loading plate for receiving wafers sits on the cup plate, and a plurality of vertical damping devices lie... Agent: Leydig Voit & Mayer, Ltd

20070218818 - Wet sharpener and accessories therefor: A tool sharpener having a housing including an interior and an exterior, and at least one rotatable grinding stone disposed adjacent the housing. At least one storage space is disposed within the interior of the housing that is accessible from the exterior of the housing. In another form, a sharpener... Agent: Fitch Even Tabin And Flannery

20070218819 - Sharpener accessory and methods relating to same: A tool sharpener accessory having a base mounted on a support, a pivoting member pivotally mounted on the base and pivoting in at least a seesaw motion relative to the base, the pivoting ember having an axis of rotation adaptable for extending transverse to the axis of rotation of the... Agent: Fitch Even Tabin And Flannery

20070218820 - Valve gasket sealing surface refurbishing methods and systems: In one embodiment, a device to resurface a sealing surface of a fluid connector in a fluid delivery component is provided. The device may include a housing adapted to be reversibly coupled to the fluid connector. Included may be an arbor which is at least partially disposed in the housing,... Agent: Townsend And Townsend And Crew, LLP

20070218821 - Cmp pad conditioner: A CMP pad conditioner is provided with a grinding part formed by fixing abrasive grains on a metal base by soldering, wherein the grinding part has a flat part near an inner periphery and an inclined part near an outer periphery, wherein abrasive grains having regular shapes are fixed to... Agent: Oliff & Berridge, PLC

20070212977 - Machine tool: A machine tool for machining workpieces (22), comprising three NC-controlled linear axes orthogonal to each other, namely a horizontal X-axis, a horizontal Y-axis and a vertical Z-axis, with a machine base (10), which comprises two vertically upwardly directed side beds (12) that are spaced from each other in the X-axis,... Agent: The Nath Law Group

20070212981 - Ballbar equipment: m

20070212983 - Apparatus and methods for conditioning a polishing pad: Apparatus and methods for conditioning a polishing pad include a base, an arm pivotally coupled to the base and adapted to support a conditioning disk, and an actuator coupled to the base and the arm. The actuator is adapted to cause the arm to press the conditioning disk against the... Agent: Dugan & Dugan, PC

20070212986 - Method for concave grinding of wafer and unevenness-absorbing pad: To facilitate handling of a wafer with its thickness reduced by grinding its rear surface, and prevent any protrusions and depressions matching those of the front surface from being formed on its rear surface, the method including the steps of disposing an unevenness absorbing pad between a chuck table and... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070212978 - Polisher, polishing processing apparatus, polishing processing method, control program to make computer execute polishing, and the record medium: At least one polisher is provided that has a rotation axis that is parallel to a normal to a surface of material to be polished, which is mounted on a table. The polisher moves relative to the material to polish and process the surface of the material. The polisher has... Agent: Frishauf, Holtz, Goodman & Chick, PC

20070212976 - Smart polishing media assembly for planarizing substrates: A smart polishing media assembly is provided, along with a polishing system and a method for using the same. In one embodiment, the smart polishing media assembly includes a memory device coupled to a polishing material. The polishing material may be in pad, web or belt form. The memory device... Agent: Patterson & Sheridan, LLP

20070212979 - Composite polishing pad: A polishing pad having an optically clear bottom layer and a closed cell top layer where the interface between the top and bottom layers is only a urethane to urethane interface. Grooves may be machined into the top layer or through the top layer and into the bottom layer.... Agent: Snell & Wilmer L.L.P. (main)

20070212980 - Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting: A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.... Agent: Harness, Dickey & Pierce, P.L.C

20070212982 - Automated floor sander: The automated floor sander includes numerous devices and mechanisms to facilitate the task of the operator of the machine. The machine includes a variable speed drive mechanism, enabling the operator to select the desired travel speed over the surface in order to optimize results. Another feature is the automated sanding... Agent: Litman Law Offices, Ltd.

20070212984 - Grinding machine and method of grinding: A grinding machine and a method for grinding buttons of a rock drill bit are disclosed. The grinding machine has a frame and a grinding head. The grinding head has a rotatable grinding spindle. The free end of the grinding spindle is intended to drive, and to replaceably carry, a... Agent: Drinker Biddle & Reath (dc)

20070212985 - Wet sanding sponge; system and method for storing and using same: A wet sanding sponge comprises a portion of sponge or foam having sandpaper sewn thereto. Sponge or foam used in the invention may be natural or man-made. Applicant's wet sanding sponges may be selected to float in water or another lubricant by selecting a form or sponge of appropriate density.... Agent: Schnader Harrison Segal & Lewis, LLP

20070212987 - Monitoring a metal layer during chemical mechanical polishing: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around... Agent: Fish & Richardson P.C.

20070212988 - Polishing apparatus: A polishing apparatus has a polishing surface, a top ring for holding a semiconductor wafer, and a top ring shaft for pressing the top ring against the polishing surface. The top ring has a retainer ring for holding a peripheral portion of the semiconductor wafer, a housing substantially in a... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070212989 - Sander tool with pivoting handle and attachable pole: Disclosed is a sander tool suited for sanding planar surfaces, and mechanisms enabling the pivoting of an ergonomic handle. Also disclosed is a sander tool having a detachable pole for use in reaching areas located outside the user's normal reach.... Agent: Hamre, Schumann, Mueller & Larson, P.C.

20070212991 - Adjustable handheld tool: An adjustable handle is attached to a power tool having a tool head and a motor housing. When the handle is loosened, the tool head can rotate relative to the motor housing and the handle can be rotated relative to the power tool. When the handle is tightened, the tool... Agent: Dergosits & Noah LLP

20070212990 - Power tool: A power tool has a handle holder portion having a semispherically bulging outer circumference, and an arm portion enclosing the handle holder portion and having a semispherically recessed inner circumference. The bulging outer circumference of the handle holder portion is fitted in the recessed inner circumference of the arm portion.... Agent: Mattingly, Stanger, Malur & Brundidge, P.C.

20070212992 - Equipment for capturing the contour, markings, bores, millings and etchings of an ophthalmic lens or template lens for glasses: Equipment for capturing the contour, markings, bores, millings and etchings of an ophthalmic lens or a template lens for glasses. Equipment for capturing the contour, markings, bores, millings and etchings of an ophthalmic lens or a template lens for glasses comprising lighting means (11) that produce a beam of parallel... Agent: Mayer, Brown, Rowe & Maw LLP

20070212993 - Tool for working on a surface: An embodiment of a tool includes a tool body. A base is coupled to the tool body and a pad is coupled to the base. The tool includes a working material coupled to the pad.... Agent: Brooks & Cameron, PLLC

20070207706 - Substrate processing apparatus and substrate handling method: A substrate processing apparatus includes: a carrier holding unit for holding a carrier which houses a substrate; a substrate holding mechanism for holding a substrate when a predetermined process is executed on the substrate; and a substrate transfer mechanism for transferring a substrate between the substrate holding mechanism and the... Agent: Ostrolenk Faber Gerb & Soffen

20070207708 - Method of blasting process: Disclosed is a blast processing method for removing a deposit adhered onto a surface of a ceramic heater formed of aluminum nitride by blowing a blasting material onto the surface. Abrasive grains made of silicon carbide or aluminum oxide and having a grain size of #400 to #800 are used... Agent: Burr & Brown

20070207709 - Polishing head for polishing semiconductor wafers: A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer... Agent: Wilson & Ham

20070207711 - Combined grinder and water blaster for stripe removal system: A self-propelled mobile marking removal system which comprises a mobile vehicle assembly including a chassis, a high pressure liquid pump in fluid connection with a liquid reservoir contained within said chassis, said high pressure liquid pump is further in fluid connection with a blast head, said blast head having at... Agent: Mchale & Slavin, P.A.

20070207712 - Sharpener for blades of food slicers: A sharpener to sharpen the edge of a food slicer blade includes a non-planar abrasive surfaced rotatable disk mounted on a supporting structure. The supporting structure includes one or more surfaces designed to align with at least one of a push bar, thickness control plate and the surface of the... Agent: Connolly Bove Lodge & Hutz, LLP

20070207702 - Device for water-jet cutting or abrasive water-jet cutting units: Control device and method for controlling the impingement of the workpiece by a water jet or an abrasive water jet in a cutting unit. Control device includes a feeder composed of at least two flow-through areas positionable between a high-pressure water supply and a jet nozzle of the cutting unit.... Agent: Greenblum & Bernstein, P.L.C

20070207703 - Electric sander and motor control therefor: A hand held orbital sander has a housing having an electronically commutated motor disposed therein and an orbit mechanism disposed beneath the housing. A motor controller is coupled to the motor. The motor controller changes the speed of at which it runs the motor from an idle speed to a... Agent: Harness, Dickey & Pierce, P.L.C

20070207704 - Smart conditioner rinse station: A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse... Agent: Patterson & Sheridan, LLP

20070207705 - Enhanced end effector arm arrangement for cmp pad conditioning: A CMP conditioning apparatus enhanced end effector arm for improving the reliability of the apparatus and the quality of the conditioning and polishing operations includes a conditioner head with features that provide for simplified alignment/attachment of a conditioning disk to the arm, while also providing a “quick release” mechanism for... Agent: Wendy W. Koba, Esq.

20070207707 - Method and apparatus to process substrates with megasonic energy: A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid... Agent: Townsend And Townsend And Crew, LLP

20070207710 - Method and apparatus to process substrates with megasonic energy: A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into intimate contact with one surface of the substrate, while cleaning or processing fluid... Agent: Townsend And Townsend And Crew, LLP

20070207713 - Method for removing surface coatings: A method of removing a coating, such as paint, varnish, biological growth or grime, from a surface, the method comprising selecting a suitable particulate solid having a particular, size of from 150-250 mm and a fluid carrier to form a spray mixture and spraying the mixture as a jet spray... Agent: Factor & Lake, Ltd

20070207714 - Device for tilting stones: A device for tilting split stones, which have a broken structure on at least one surface such that a surface which is orientated laterally before the tilting process, is rotated to form the upper side of the stone after the tilting process. At least one receptacle is provided for a... Agent: Davis & Bujold, P.l.l.c.

20070207715 - Cutting tool insert with molded insert body: A cutting tool comprising may include at least one abrasive tip that includes an abrasive cutting edge, and an insert body. The insert body includes a moldable material, and the moldable material is adhered to a portion of the abrasive tip.... Agent: Pepper Hamilton LLP