Abrading inventions 07/07

20070173184 - Apparatus for cylindrically grinding workpieces: An exemplary apparatus for cylindrically grinding workpieces (60) includes a first holding tool (20), a second holding tool (30), and a first grinding wheel (10). The first holding tool is configured for positioning pre-grinding workpieces, and the first holding tool defines a first groove (24) for containing the pre-grinding workpieces... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang Jeffrey T. Knapp

20070173176 - Method for polishing: A method is disclosed, whereby a reduced wear of the polishing tool and a reduced duration for the polishing process may be achieved and also free form surfaces and non-rotating workpieces may be polished. The above may be achieved whereby the surface of the tool actually in contact with the... Agent: Mcgrath, Geissler, Olds & Richardson, PLLC

20070173177 - Substrate polishing apparatus: A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070173178 - Machine tool for machining workpieces: The invention relates to a machine tool for machining workpieces, comprising a workpiece holder. Said workpiece holder comprises a support, a workpiece spindle head mounted on a first side of the support, and a tailstock. Said tailstock is mounted on a second side of the support which is different from... Agent: Robert C. Faber Ostrolenk Faber Gerb & Soffen

20070173180 - Antiloading compositions and methods of selecting same: An antiloading composition includes a first organic compound. The compound has a water contact angle criterion that is less than a water contact angle for zinc stearate. The first compound also satisfies at least one condition selected from the group consisting of a melting point Tmelt greater than about 40°... Agent: Hamilton, Brook, Smith & Reynolds, P.C.

20070173179 - Method of changing the surface wettability of polymer materials: The present invention belongs to the field of surface modification of solid materials, specifically relates to a method of changing the surface wettability of polymer materials. The method of the present invention comprises of rubbing the surface of the polymer materials various times by using sand paper of different grades... Agent: Blakely Sokoloff Taylor & Zafman

20070173181 - Shot material and method of blasting: It is an object of the present invention to provide a blasting method and a shot material, which are very practical both in the cost and the treatment performance. (a) A shot material containing a styrene ion-exchange resin or a waste material caused therefrom, or/and a dried sludge-derived material, (b)... Agent: Sonnenschein Nath & Rosenthal LLP

20070173182 - Jig for cnc machine: A jig for mounting one or more lenses on a two axes coordinate movement bed of a CNC machine for machining the one or more lenses. The jig comprises a carriage (29) having one or more lens holders (36) for holding one or more lenses (13, 14), each lens having... Agent: Heslin Rothenberg Farley & Mesiti PC

20070173183 - Cutting tool with integrated abrasive trimming elements: An integrated cutting and trimming tool including a cutter tool body having, in one embodiment, a plurality of spaced-apart cutting elements on its cutting face, channel extensions extending between the spaced-apart cutting elements and abrasive coated radially projecting trimming elements. The abrasive coated radially projecting trimming elements are sized and... Agent: Gallop, Johnson & Neuman, L.c.

20070173185 - Wafer holder for semiconductor manufacturing device and semiconductor manufacturing device equipped with the same: A wafer holder uniformly heats a wafer at high temperatures without being damaged. A semiconductor manufacturing apparatus is provided with this wafer holder. The contact surface area where the wafer and the wafer mounting surface of the wafer-holding part are in contact includes a contact surface area A in an... Agent: GlobalIPCounselors, LLP

20070173186 - Grinder for windshield wipers: A grinder includes a first side, a second side, a first piece of sandpaper attached to the first side and a second piece of sandpaper attached to the second side. The second piece of sandpaper is finer than the first piece of sandpaper. The first piece of sandpaper is used... Agent: Kamrath & Associates P.A.

20070173187 - Chemical mechanical polishing pad with micro-holes: Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with micro-holes each having a desired cross-sectional area while having a desired depth. The shape, size, and density of the micro-holes can be optionally adjusted. The chemical mechanical polishing pad provides an effect of maintaining a desired... Agent: Abelman, Frayne & Schwab

20070167117 - Conditioner device for conditioning polishing pad and chemical mechanical polishing apparatus including the same: The present invention relates to a conditioner device for polishing pad and a chemical mechanical polishing (CMP) apparatus having the same. The conditioner device of the present invention comprises a rotable support plate including a support plate surface comprising a center area located about the rotational axis of the support... Agent: Marger Johnson & Mccollom, P.C.

20070167112 - Dual ophthalmic lens machining platform and simultaneous ophthalmic lens manufacturing method: A dual ophthalmic lens machining platform comprises a blocked lens mounting structure constructed to simultaneously receive a first and a second blocked lens blank, and configured to rotationally and linearly move each lens blank, wherein the first and second lens blank have at least one common axis of movement on... Agent: Blynn L. Shideler The Blk Law Group

20070167110 - Multi-zone carrier head for chemical mechanical polishing and cmp method thereof: A multi-zone carrier head includes a housing; a retaining ring secured to a lower edge of the housing; a backing plate having a plurality of non-concentric pressure zones defined by a plurality of isolated apertures on the backing plate; wherein the backing plate has a wafer side and a non-wafer... Agent: North America Intellectual Property Corporation

20070167111 - Precision machine tool: A precision machine tool, comprising a table which is suspended so that it is substantially a swivelable table; a driving element for driving a tool during machining of a part; and a device for orienting said table, said orienting device including at least three orienting elements, each including a plurality... Agent: Ilya Zborovsky

20070167113 - Light beam targeting and positioning system for a paint or coating removal blasting system: A blasting system for the removal of coatings or paint from an underlying surface uses an optical device to position the blasting nozzle an appropriate stand-off distance from the surface. The blasting media can use a variety of blasting media including abrasives, water, and various specialty blasting media. The preferred... Agent: Andrus, Sceales, Starke & Sawall, LLP

20070167114 - Brushing system: System for processing technical surfaces, in particular surfaces of essentially rotationally symmetrical work pieces (3), comprising at least one processing unit (4) and one motor-driven work-piece carrier (1) and, mounted thereon in rotatable fashion, at least two or more holders (5) that feed work pieces (3) to the processing unit... Agent: Pearne & Gordon LLP

20070167115 - Chemical mechanical polishing system and process: Chemical mechanical polishing (CMP) systems and methods are provided herein. One aspect of the present subject matter is a polishing system. One polishing system embodiment includes a platen adapted to receive a wafer, and a polishing pad drum that has a cylindrical, or generally cylindrical, shape with a length and... Agent: Schwegman, Lundberg, Woessner & Kluth, P.A. Attn: Marvin L. Beckman

20070167116 - Polishing composition: The present invention relates to a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from −15 to 40 mV; a method for manufacturing a substrate including the step of polishing a substrate to be polished with... Agent: Birch Stewart Kolasch & Birch

20070167118 - Automatic edge tuner: The present invention comprises a tuning device for providing a desired operative edge of a tool or any item wherein a certain operative edge surface is desired. Whether for a new snowboard or ski, or for situations where these items no longer possess the operative edge surface desired, the present... Agent: Archibald LLC

20070167120 - Clamping fixture for detachably fastening a disk-shaped tool: A clamping fixture for detachably fastening a disk-shaped tool on a rotatably driven working spindle with a driven gear includes a fastening element a supporting flange arranged so that the tool is accommodated between the fastening element and the supporting flange and rotatably displaceable relative to the working spindle in... Agent: Striker, Striker & Stenby

20070167119 - Mounting system for grinding wheels and the like: A mounting system for rotating tools such as grinding wheels in a hand-held power tool, includes a hub mountable to the tool drive shaft and a rotating tool element removably affixable to the hub. The tool has at least one flange that engages a corresponding circumferential groove in a hub... Agent: Schweitzer Cornman Gross & Bondell LLP

20070167121 - Device for sharpening chain saw teeth: A device for sharpening chain saw teeth, in particular a chain saw which is portable and applicable in the field, and where the chain is not to be taken off the chain saw blade when sharpened enables swinging of a grinding wheel (16) transversally to each tooth (8) of a... Agent: Beem Patent Law Firm

20070167122 - Knife sharpener: A knife sharpener comprising a sharpening device preferably of the type involving upwardly extending pairs of overlapping, resiliently flexible fingers or strips forming opposed abrasive sharpening faces, provided with a pair of shields respectively operative between closed positions in which they cover and protecting the sharpening device and open positions... Agent: Epstein Drangel Bazerman & James, LLP

20070161336 - Apparatus and process for cylindrically grinding workpieces: An apparatus for cylindrically grinding workpieces includes a first holding tool (100) for positioning pre-grinding workpieces (40) and a second holding tool (200) for positioning partially ground workpieces (i.e. workpieces which have been ground on one side only). The first holding tool (100) defines a first groove (226) for containing... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang Jeffrey T. Knapp

20070161335 - Fixture for grinding machines: A fixture for grinding machines includes a first base (10), a second base (20) and a driving component (40). The first base defines a first working groove (11) therein. The second base defines a second working groove (12) corresponding to the first working groove therein. The driving component is able... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang Jeffrey T. Knapp

20070161333 - In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging: Chemical-mechanical planarization (CMP) apparatus and methods for detecting polishing pad properties using ultrasonic imaging is presented. An ultrasonic probe assembly transmits ultrasonic signals onto the surface of a polishing pad during a CMP process. Reflected ultrasonic signals are collected and analyzed to monitor polishing pad properties in real-time. This allows... Agent: Fish & NeaveIPGroup Ropes & Gray LLP

20070161331 - Stone fabrication positioning system: A stone cutting system effective for mechanically delineating defined datum points in a Cartesian coordinate system by positioning at least one datum point defining means per coordinate comprising a combination blocking and clamping device, a table of a computer numerically controlled (CNC) stoneworking machine, a locating means positioned on the... Agent: Mchale & Slavin, P.A.

20070161332 - Systems and methods for removing microfeature workpiece surface defects: Systems and methods for removing microfeature workpiece surface defects are disclosed. A method for processing a microfeature workpiece in accordance with one embodiment includes removing surface defects from a surface of a microfeature workpiece by engaging the surface with a buffing medium having a first hardness, and moving at least... Agent: Perkins Coie LLP Patent-sea

20070161334 - Two-sided surface grinding apparatus: A two-sided surface grinding apparatus capable of eliminating undulations of concentric circles produced in the work surfaces by grinding, thereby further improving the degree of flatness of the work surfaces after grinding includes a pair of support pads which hold work outwardly of grinding whetstones and noncontactly support the work... Agent: Jordan And Hamburg LLP

20070161337 - Methods and systems for marring fiber optic substrates: Methods and systems for marring fiber optic substrates may include rollers with abrasive surfaces that press lengths of the substrates against elongated supports, which may be tapered, during relative lengthwise movement between the rollers and supports; abrasive sheets that are vibrated against the substrates; abrasive flap wheels that are rotated... Agent: Renner Otto Boisselle & Sklar, LLP

20070161338 - Wafer polishing apparatus and wafer polishing method: The present invention provides a wafer polishing apparatus, comprising: a polishing pad to which a polishing liquid is supplied for polishing a wafer; a carrier head to carry the wafer; and one or more polishing liquid supplying device which supplies the polishing liquid onto the polishing pad, wherein the polishing... Agent: Roberts, Mlotkowski & Hobbes

20070161339 - Method and apparatus for removing a pipe lining: An apparatus for removing a lining from a pipe includes a collapsible stripping tool having a plurality of extensible arms with an abrading tool mounted on each arm that is deployed by inserting the apparatus into the pipeline, supplying pressurized fluid to a cylinder to extend the arms and force... Agent: Pgm Philip G. Meyers Law Office

20070161341 - Focusing nozzle: A focusing nozzle for abrasive water jet cutting has a nozzle body of carbide metal formed with a bore. At least the bore wall is formed with a single-layer or multi-layer coating of hard material. The hard material coating has a coat with titanium nitride content at least at the... Agent: Lerner Greenberg Stemer LLP

20070161340 - Water jet milled ribbed silicon carbide mirrors: Water jet milled ribbed silicon carbide mirrors and a method of making the mirrors. In a preferred embodiment the component is a light weight silicon carbide mirror fabricated with water jet milling from a solid silicon carbide work piece. A prior art water jet cutting process has typically cuts edges,... Agent: Trex Enterprises Corp.

20070161342 - Polishing pad, polishing apparatus and method for polishing wafer: A polishing apparatus includes a belt-type surface plate stretched between two rollers each having a rotation shaft arranged in parallel to that of the other roller, a plurality of sheet-type polishing pads stuck on the surface plate, and a dresser for activating the polishing pads. Part of an upper end... Agent: Mcdermott Will & Emery LLP

20070161343 - Belt sander: A belt sander is disclosed that may include a sanding assembly having a first roller and a second roller, the sanding assembly being configured to receive a sanding belt around the first roller and the second roller to define a sanding surface therebetween. The belt sander may include a motor... Agent: Brake Hughes Bellermann LLP

20070161344 - Tool independent dust protection apparatus and associated dust protection methods: Methods and apparatus are described that provide an alternative to dust protection shrouds that must be clamped or be otherwise affixed to the body of a tool. The shroud captures and facilitates the removal of dust from an area being worked upon by a tool bit while being attached to... Agent: Kaliko & Yeager, L.L.C.

20070155288 - Fixture for grinding machines: A fixture for grinding machines includes a first base (10) and a second base (20). The first base defines a first workpiece holding groove (11 ) therein, a first side surface (12) is formed corresponding to the first workpiece holding groove, and the first base defines a plurality of first... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang Jeffrey T. Knapp

20070155291 - Apparatus for holding lenses and method for use thereof: An apparatus for holding a plurality of lenses, including: a block having a mounting surface; a cavity defined in the block at the mounting surface; and a through hole defined in the block, the through hole being in communication with the cavity, wherein the mounting surface is configured for mounting... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang Jeffrey T. Knapp

20070155285 - Riding floor polishing machine: A riding floor polishing machine with dust and exhaust filtering apparatus is disclosed. The riding floor polishing machine provides a vehicle-driven surface processing apparatus capable of performing a large scale surface polishing operation in an indoor setting with reduced dust accumulation and reduced exhaust emission to the working environment. The... Agent: Pitts And Brittian P C

20070155284 - Wafer polishing control: Methods of controlling polishing of wafers are disclosed. In one aspect, a method may include measuring one or more pre-polish thicknesses of one or more layers of a wafer. The one or more layers may then be polished. Then a post-polish thickness of a layer of the wafer may be... Agent: Blakely Sokoloff Taylor & Zafman

20070155286 - Polishing machine comprising a work chamber and a platform: A polishing machine for optical elements, comprising: a spindle arranged to rotationally drive an optical element; a polishing tool mobile relative to the spindle; wherein the polishing machine further comprises a platform mounted on top of a work chamber, the work chamber comprising the spindle, and the platform holding a... Agent: Young & Thompson

20070155287 - Polishing machine comprising sliding means transverse to the front face: A polishing machine for optical elements, includes: a spindle arranged to rotationally drive an optical element; a polishing tool mobile relative to the spindle; a front face provided with a door enabling the access to the spindle and to the polishing tool; wherein the polishing tool is mounted on a... Agent: Young & Thompson

20070155289 - Abrasive entrainment: A method for generating a high-velocity cutting jet comprises forming a high velocity jet of a liquid such as water, forming a suspension of an abrasive such as garnet in a carrier gas containing a condensable vapour such as superheated steam, and entraining the abrasive suspension into the liquid jet... Agent: Heslin Rothenberg Farley & Mesiti PC

20070155290 - Method of manufacturing laminated mold and laminated mold: For manufacturing the laminated mold comprising the laminate (11) being formed of a plurality of thin sheets (11a) laminated on each other, laminate the thin sheets with the excess portions of respective thin sheets exceeding the profile of the tire crown portion on the side of contacting with the tire... Agent: Oliff & Berridge, PLC

20070155292 - Enhanced diamond polishing: A grown single crystal diamond is polished using a non contact polishing technique, which leaves a residue on the diamond surface. In one embodiment, a wet chemical etch is performed to remove the residue, leaving a highly polished single crystal diamond surface. In a further embodiment, a colloidal silica solution... Agent: Schwegman, Lundberg, Woessner & Kluth, P.A.

20070155293 - Composite articles and methods of making the same: Composite articles (e.g., abrasive articles (e.g., abrasive wheels and honing sticks), cutting tools, and cutting tool inserts) comprising a glass-ceramic distributed in a ceramic matrix.... Agent: 3m Innovative Properties Company

20070155294 - Chemical mechanical polishing system: According to one embodiment of the invention, a chemical mechanical polishing system includes a platen having a first surface adapted to couple a polishing pad thereto. The first surface includes a generally circular center portion and an annular portion surrounding the generally circular center portion. The generally circular center portion... Agent: Texas Instruments Incorporated

20070155295 - Lens layout block device: This apparatus includes a unit for adhering an elastic seal to a lens holder, a unit for causing the lens holder, to which the elastic seal is adhered, to hold a lens, a pivotal arm, an arm driving unit for pivoting the pivotal arm, a clamp unit attached to the... Agent: Townsend And Townsend And Crew, LLP

20070155296 - Handheld power tool with a guard hood: A handheld power tool has a housing, a rotating cutting tool having a clamping neck structurally connected to the housing, a guard hood that covers the cutting tool and has a guard hood part and a slip-on ring for receiving the guard hood releasably and adjustably on the clamping neck,... Agent: Michael J. Striker

20070155297 - Sanding tool with rotatable handle: A hand-held, manually-operated sanding tool includes a base body, a handle, and a coupling device. The base body defines an aperture extending from a first surface of the base body to a second surface of the base body. The handle includes a grip and a post. The coupling device is... Agent: 3m Innovative Properties Company

20070155298 - Superhard cutters and associated methods: A cutting device comprises a base having a solidified organic material layer disposed thereon. A plurality of individual polycrystalline cutting elements are secured in the solidified organic material layer. Each of the plurality of individual polycrystalline cutting elements has a substantially matching geometric configuration.... Agent: Thorpe North & Western, LLP.