Abrading inventions 06/07

20070149094 - Monitoring device of chemical mechanical polishing apparatus: A monitoring device and method of a chemical mechanical polishing apparatus are provided. Embodiments may form a uniform surface of a polishing pad and monitor a CMP process by incorporating piezoelectric sensors capable of monitoring a pressure applied to a pad on a rear surface of a polishing pad. The... Agent: Saliwanchik Lloyd & Saliwanchik A Professional Association

20070149095 - Welding robot comprising an electrode grinder secured on a moving assembly of said welding robot: A welding robot (1) comprising a stand (2) pivotally receiving a trunk-forming portion (3) having one end (5) of an articulated arm (6) pivotally mounted thereon, the arm having an opposite end (7) provided with a clamp (8) fitted with welding electrodes, the robot including an electrode grinder (9) mounted... Agent: Young & Thompson

20070149096 - Chemical mechanical polishing pad and chemical mechanical polishing method: (P is the distance between adjacent intersections between the virtual straight line and the first grooves, and W is the width of the first grooves); and (ii) a group of second grooves extend from the center portion toward the peripheral portion of the polishing surface and consist of second grooves... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070149097 - Polishing composition for hard disk substrate: The present invention preferably provides a polishing composition for a hard disk substrate, containing aluminum oxide particles and water, wherein secondary particles of the aluminum oxide particles have a volume-median particle size of from 0.1 to 0.7 μm, and particles having particle sizes of 1 μm or more of the... Agent: Birch Stewart Kolasch & Birch

20070149098 - Robot system and method for ball loading for loading into sag and/or ball mills in ore concentration processes: The robotic system is composed mainly of a robotic manipulator (1) of at least 5 degrees of freedom, and a grip mechanism (2) which allows, in a sequential and programmed way, to take, manipulate and release, from a ball holder rack (3) located at one of its sides, a certain... Agent: Hugo Salamanca P.

20070149099 - Tool-less quick locking screw nut: A tool-less quick locking screw nut is secured onto a connecting object having a male thread and includes a pull-ring tab and an axle portion secured to an axle portion of the connecting object. The axle portion has a passage with a female thread, such that the pull-ring tab rotates... Agent: Birch Stewart Kolasch & Birch

20070141961 - Apparatus and method for edge processing of a glass sheet: An apparatus for edge processing of a glass sheet, the apparatus including a shroud, a finishing member and a wiping device. The finishing member is substantially enclosed by the shroud. The apparatus uses pressurized air emitted by at least one slot in the wiping device to prevent contaminants resulting from... Agent: Corning Incorporated

20070141952 - Fluid abrasive machining method and apparatus thereof: In a fluid abrasive machining method for abrasively machining a fine pore on a work (5) to be machined by supplying a slurry (7) which is an abrasive machining fluid from a supplying device (2) to the work to be machined comprising steps of: supplying the slurry to the work... Agent: Harness, Dickey & Pierce, P.L.C

20070141950 - Lens stocking apparatus and lens processing system having the same: A lens stocking apparatus capable of stocking a plurality of lenses, which has a first stage, on which a plurality of trays respectively accommodating lenses are mountable, for transferring a tray, a vertically movable second stage, on which a plurality of trays respectively accommodating lenses are mountable by being vertically... Agent: Sughrue Mion, PLLC

20070141951 - Substrate processing method and substrate processing apparatus: A holding mode is selectively switched, in accordance with the content of processing of a substrate, among three holding modes: (a) a first holding mode in which while first support pins F1 through F12 abut on the back surface of a substrate W and support the substrate W, the substrate... Agent: Ostrolenk Faber Gerb & Soffen

20070141953 - Grinding apparatus: The present invention concerns a grinding apparatus (1) including a number of grinding units (3), a number of drive units (11) and a number of screen units (2), where a number of the grinding units (3) are enclosed by at least one of the screen units (2), and where at... Agent: James C Wray

20070141954 - Paired pivot arm: The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one pivot point. Each of the pivoting arms enable the corresponding polishing head direct access to two polishing stations. The polishing system... Agent: Patterson & Sheridan, LLP

20070141955 - Processing method for wafer and processing apparatus therefor: A processing method for wafers includes: a preparing step for preparing a wafer having an active device region and a reinforcing rib region. The active device region having plural devices is formed on a surface of the wafer, and the reinforcing rib region is at an outer circumferential edge of... Agent: Brinks Hofer Gilson & Lione

20070141956 - Probe polishing method and probe polishing member: In a probe polishing method, a plurality of probes, which are arranged on a probe card for performing an inspection of electrical characteristics of a target object, are polished by using a polishing member. Further, the probes are polished over plural times, while changing a relative position of the abrasive... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070141957 - Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the same: A polishing slurry for polishing an aluminum film used for LSI or the like and a method for polishing an aluminum film using the same are provided. A polishing slurry for polishing an aluminum film comprising a polyvalent carboxylic acid having a first stage acid dissociation exponent at 25° C.... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20070141959 - Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces: Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece during mechanical or chemical-mechanical polishing. In this embodiment, the carrier head can include a... Agent: Perkins Coie LLP Patent-sea

20070141960 - Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces: Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece during mechanical or chemical-mechanical polishing. In this embodiment, the carrier head can include a... Agent: Perkins Coie LLP Patent-sea

20070141958 - Silicon wafer grinding apparatus, retaining assembly used for the same and silicon wafer flatness correcting method: A silicon wafer grinding apparatus, a retaining assembly used for the same, and a silicon wafer flatness correcting method are provided More particularly, a silicon wafer grinding apparatus, a retaining assembly used for the same, and a silicon wafer flatness correcting method for correcting a wafer flatness in a final... Agent: Miller, Matthias & Hull

20070141962 - Method for grinding a workpiece: A method of modifying a workpiece such as a geared member includes grinding the workpiece with a rotating grinding wheel, and superimposing a primary motion of the axis of rotation of the grinding wheel with a secondary, oscillatory motion of the axis of rotation. The primary motion is oriented perpendicular... Agent: Caterpillar C/o Liell & Mcneil Attorneys PC

20070141963 - Automated drill bit re-sharpening and verification system: A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a... Agent: Stetina Brunda Garred & Brucker

20070141964 - Work rolls surface textured by media blasting and controlled surface modification: Apparatus and methods of texturing the surfaces of work rolls and the rolls produced thereby which are used in the manufacture of sheet metals and other sheet materials. The working surface of each roll is textured in a series of process steps which include the steps of media blasting and... Agent: Norris Mclaughlin & Marcus, P.A.

20070141965 - Oxidation protected blade and method of manufacturing: The surface of a gas turbine blade is machined with a material-removing tool and simultaneously, an anti-oxidation coating is deposited on the surface using eletrospark deposition.... Agent: Ogilvy Renault LLP (pwc)

20070141966 - Burr removal apparatus: Apparatus for removing a burr from an aperture in a workpiece, using a rotating deburring tool having a flexible or partly flexible shaft, an abrasive mechanism that rotates on the shaft and a collar that protects the workpiece from abrasion when the abrasive mechanism is being positioned for deburring. Optionally,... Agent: Knobbe Martens Olson & Bear LLP

20070141967 - Die grinder with rotatable head: A die grinder including a body having a longitudinal axis, and a grinding head portion with an output shaft capable of powered rotation. A motor is disposed in the body for rotating the output member. A locking interconnect portion attaches the grinding head portion to the body and is adapted... Agent: Senniger Powers

20070141968 - Sanding device, and sanding assembly including the same: A sanding device including a base plate, an evacuating tube, an articulated joint, and a sealing member. The base plate has a sanding surface and an opposite supporting surface, with an orifice extending therethrough for allowing the passage of particles sanded by the sanding surface. The evacuating tube has an... Agent: Darby & Darby P.C.

20070141969 - Sanding tool with molding interface pad: A hand-held, manually-operated, sanding tool for use with a replaceable sheet-like abrasive material, such as sandpaper, includes a base member, a molded interface pad provided on the base member to define a working face against which the sheet-like abrasive material is arranged, and a retaining mechanism arranged to maintain the... Agent: 3m Innovative Properties Company

20070141970 - Arbors and fasteners to afford two forms of easy/quick change mounting for abrasive discs: An attachment structure for a coated abrasive finishing article such as a disc having a central aperture formed therein. The attachment structure may be in a form to be reused indefinitely and in such form includes a nut having a flange engaging the abrasive particles on the disc and a... Agent: Fulbright And Jaworski LLP

20070135018 - Apparatus and method for processing magnetic head slider: An apparatus for processing a magnetic head slider used for a magnetic disk apparatus for performing a magnetic recording/reproducing process in a discoid recording medium comprises a discoid recording medium used as an abrasive material, a holding unit configured to hold a suspension arm on which a magnetic head slider... Agent: Armstrong, Kratz, Quintos, Hanson & Brooks, LLP

20070135019 - Eyeglass lens processing apparatus: An eyeglass lens processing apparatus includes: a controller that controls a second driver for rotating lens chucks for chucking an eyeglass lens and a third driver for changing an axis-to-axis distance between an axis of a processing tool and an axis of the lens chucks so that a processing load... Agent: Sughrue Mion, PLLC

20070135020 - Polishing apparatus and polishing method: A polishing apparatus polish a surface of a substrate, such as a semiconductor substrate. The polishing apparatus according to the present invention includes a substrate holding mechanism, a polishing table having a polishing surface, and a polishing surface temperature controller for controlling a temperature distribution of the polishing surface. The... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070135022 - Apparatus for reduction of defects in wet procssed layers: The present invention provides an apparatus for wet processing of a conductive layer using a degassed process solution such as a degassed electrochemical deposition solution, a degassed electrochemical polishing solution, a degassed deposition solution, and a degassed cleaning solution. The technique includes degassing the process solution before delivering the degassed... Agent: Knobbe Martens Olson & Bear LLP

20070135021 - Mounting structure for measuring device and grinding machine with the structure: In a grinding machine, a bed 10 has secured thereon a work head 11 which rotatably supports a work spindle 12 for supporting a workpiece W and mounts thereon a slide base 15 reciprocatively movable in a Z-direction parallel to the axis of the work spindle, and a wheel head... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070135023 - Lapping system having a polymeric lapping tool: A lapping system including: (a) a workpiece having a metal working surface; (b) a lapping tool having a contact surface for disposing generally opposite the working surface, the contact surface including an organic, polymeric material; (c) a plurality of abrasive particles for disposing between the contact surface and the working... Agent: Dr. Mark M. Friedman C/o Bill Polkinghorn - Discovery Dispatch

20070135024 - Polishing pad and polishing apparatus: A polishing pad enables efficient removal of a polishing product and an “old polishing liquid” remaining on a surface (polishing surface) or in through-holes of a polishing pad. The polishing pad has a polishing surface and a plurality of through-holes extending in the thickness direction, which communicate with each other... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070135025 - Surface treating method for golf club head: A surface treating method for a golf club head includes applying polishing pretreatment on a golf club head and grinding at least one surface of the golf club head with a resilient grinding rod. The resilient grinding rod includes at least one resilient matrix and at least one kind of... Agent: Birch Stewart Kolasch & Birch

20070135026 - Orbiting polishing tool: An orbiting polishing tool for at least one of polishing and material removal. The orbiting polishing tool may include a housing of a housing assembly rotatable about a first axis. The orbiting polishing tool may also include at least one abrasive wheel rotatable about a second axis, the at least... Agent: Harness, Dickey & Pierce, P.L.C

20070135027 - Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces: Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece during mechanical or chemical-mechanical polishing. In this embodiment, the carrier head can include a... Agent: Perkins Coie LLP Patent-sea

20070135029 - Drywall sander: A drywall sander includes a replaceable sanding pad having a layer of resilient material, and an abrasive surface. The sanding pad includes one or more edge portions that project beyond the edges of a sander head. The edges of the sanding pad can be deformed during use when the sander... Agent: Price Heneveld Cooper Dewitt & Litton, LLP

20070135028 - Polishing device for stone and other hard materials: The present invention is directed to a portable polishing device for stone or other hard materials. The polishing device includes a motorized sander and a polishing block attached to the sander. The polishing block comprises an abrasive surface which is shaped to fit the profile of an edge or surface... Agent: John D. Pemberton

20070135030 - Inlaid polishing pad: A surface treatment or a two-step injection molding is used to make an inlaid polishing pad. A surface of the inlaid polishing pad has areas of different rigidity to control the rigidity and compressibility of the inlaid polishing pad. Furthermore, methods of making such an inlaid polishing pads are also... Agent: Ditthavong Mori & Steiner, P.C.

20070128984 - Apparatus at a flat card or roller card for grinding a clothing drawn onto a rotating roller, having a carrying device: In an apparatus at a carding machine for grinding a clothing drawn onto a rotating roller, having a carrying device with at least one grinding element, the carrying device is attached to the carding machine. In order to make it possible, by means that are simple in terms of construction... Agent: Venable LLP

20070128982 - Bubble suppressing flow controller with ultrasonic flow meter: A method and apparatus for the delivery of slurry solution comprising an ultrasonic flow meter positioned between a fluid preparation manifold and a slurry delivery arm, and a shutoff valve positioned between a proportional valve and the slurry delivery arm. Also, a method and apparatus for the delivery of slurry... Agent: Patterson & Sheridan, LLP

20070128983 - Grinding apparatus and method: The present embodiments provide methods, systems and apparatuses for use in grinding work pieces, such as wafers. Some embodiments provide methods that position a grind spindle to contact a first grinding spindle to a face of a work piece, remove a portion of the face, and control the removing of... Agent: Sinsheimer Juhnke Lebens & Mcivor, LLP

20070128985 - Method of polishing work: In the method of precisely polishing a work, torque of a sun gear and an internal gear are kept constant and a load applied to a carrier is reduced and maintained. The method comprises the steps of: changing a rotational speed of at least one of the sun gear, the... Agent: Birch Stewart Kolasch & Birch

20070128986 - Double end face truing device, double end face truing tool, and double end face truing method: First and second end surface truing sections are formed by protruding cylindrical first and second base bodies from opposite end surfaces of a disc-like base of an opposite end surface truing tool in the axial direction thereof and by providing on the external surface of the first base body and... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070128987 - Method for manufacturing surface-coated cutting insert: This method for manufacturing a surface-coated cutting insert includes clamping and holding a surface-coated cutting insert with a pair of rotary shafts which are rotatable around an axis, and jetting an abrasive fluid to the surface of the surface-coated cutting insert using at least one blasting gun while rotating the... Agent: Darby & Darby P.C.

20070128988 - Feeder assembly for particle blast system: A particle blast system includes a feeder assembly having a rotor with a plurality of pockets formed in the peripheral surface. The transport gas flowpath includes the pockets, such that substantially all transport gas flows through the pockets. The seal adjacent the peripheral surface is actuated by the transport gas... Agent: Frost Brown Todd, LLC

20070128989 - Novel grinding tool: The present invention relates to a novel grinding tool, comprising a substrate with a first water-permeable, flexible textile layer, which comprises multifilaments and to which the abrasive material has been applied, and at least one second layer, which is connected to the surface of the first layer that is free... Agent: Shoemaker And Mattare, Ltd

20070128990 - Semiconductor wafer polishing apparatus, and method of polishing semiconductor wafer: Aimed at thoroughly preventing abrasive and dusts from adhering onto the circuit-forming region of a wafer, improving yield ratio of semiconductor devices, and thereby improving operation rates of the individual manufacturing apparatuses in the succeeding stage, a semiconductor wafer polishing apparatus of the present invention has a polishing unit polishing... Agent: Young & Thompson

20070128991 - Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same: A fixed abrasive polishing pad includes a base and a plurality of polishing layers on the base, wherein each polishing layer includes abrasive particles and apertures in a polishing surface of the polishing layer.... Agent: Lee & Morse, P.C.

20070128992 - Method for conditioning processing pads: Embodiments of a flexible pad conditioner for conditioning a processing pad are provided. The pad conditioner includes an arc-shaped member having an abrasive bottom surface configured for conditioning the processing pad. Means are provided to apply a downward force as well as to oscillate the pad conditioner. Further means may... Agent: Patterson & Sheridan, LLP

20070128993 - Apparatus for cylindrically grinding workpieces: An apparatus for cylindrically grinding workpieces includes a first holding tool (10) and a second holding tool (12). The first holding tool is configured for positioning pre-grinding workpieces (18). The first holding tool defines a first groove (103) for containing the pre-grinding workpieces. A first stopping board (106) is detachably... Agent: PCe Industry, Inc. Att. Cheng-ju Chiang Jeffrey T. Knapp

20070128994 - Electroplated abrasive tools, methods, and molds: The present invention provides for a mold that can position and hold abrasive particles, which are to be electrolytically attached to an electrically conductive substrate during an electrolytic process. The mold can include an insulating material with a molding surface suitable for holding the abrasive particles in place during this... Agent: Thorpe North & Western, LLP.

20070128995 - Polishing grindstone and method for producing same: A polishing grindstone according to the present invention comprises abrasive grains dispersed in, bound to and held by a particulate matrix composed of rubber particles. With the polishing grindstone, the abrasive grains decreased in polishing properties owing to wear associated with polishing become easily detached from the surface of the... Agent: Smith, Gambrell & Russell

20070128996 - Grinding wheel: The present invention refers to an improved grinding wheel, comprising an abrasive and/or cutting disk-shaped member that can be associated substantially coaxially with the free end of the rotating shaft of a grinding machine and equipped with at least one substantially central through-hole, with a first face that can be... Agent: Young & Thompson