Abrading inventions 03/07

20070072517 - Devices for altering the position of the scanning element unit on inclined installation of a segmented grinding platen and controller for control thereof: On inclined installation of the segmented grinding platen (11, 12, 13) of a through belt grinding machine, the problem arises of the altered arrangement of the scanning element series (15) relative to a position for the segment series (11) which is different thereto, for example, at right angles. According to... Agent: Adams Evans P.A.

20070072518 - Grinding machine: A grinding machine, which includes a grinding wheel rotatable by a motor, a first slide movable in X-axis direction, a second slide supported on the first slide and movable in Y-direction, a bracket supported on the second slide and turnable about Y-axis, a tool holder supported on the bracket for... Agent: Rosenberg, Klein & Lee

20070072519 - Viscoelastic polisher and polishing method using the same: A viscoelastic polisher to be used for polishing. The viscoelastic polisher includes a viscoelastic layer provided on a major surface of a base disk and having a hole of a predetermined radius formed in a center portion thereof, and the base disk has a plurality of grooves equiangularly provided in... Agent: Steptoe & Johnson LLP

20070072520 - Dry ice feeding apparatus and method: A dry ice feeding apparatus comprises a hopper (10) adapted to store a supply of dry ice pieces. The hopper (10) has a substantially cylindrical upper portion (12), a frusto-conical lower portion (14) depending downwardly from the upper portion, and a head portion (18) disposed atop the upper portion. The... Agent: Fay Sharpe LLP

20070072521 - Cutting-tool holder used for grinding: A cutting-tool holder (1) used for grinding includes a holder body (10) including a pair of pinching pieces (11, 11) biased to each other; and a pair of handgrips (30, 30) provided on the holder body (10) which sets the pair of pinching pieces (11, 11) apart from each other... Agent: Banner & Witcoff

20070072522 - Driver for abrasive disks: A driver for abrasive disks, that includes a housing assembly, a motor assembly, a driven pulley assembly, and, a belt. The motor assembly is supported by the housing assembly and connectable to a power source. The motor assembly has a motor output shaft with a motor output shaft axis. The... Agent: Lawrence N. Ginsberg

20070072523 - Optical disk restoration apparatus: The present invention intends to provide an optical disk restoration apparatus that is simple structured and small sized to reduce the production cost, and that can evenly apply a substantially uniform pressing force. This object can be achieved by an optical disk restoration apparatus, including a turntable 41 on which... Agent: Oliff & Berridge, PLC

20070072524 - Sanding block: A sanding block for sanding high and extended surfaces configured for use in combination with an attached pole. The sanding block is round in shape and is rotationally mounted on a pole mount that interfaces between the sanding block and the pole, which attaches to a rotatable hub of the... Agent: Merchant & Gould PC

20070072525 - Polishing machine with a brake device: A polishing machine includes a body. A driving motor is installed in the body. The driving motor has an eccentric shaft mounted at a bottom of the motor, and a polishing wheel connector mounted under the eccentric shaft. A dust shield is mounted on the body and outside the driving... Agent: Cooper & Dunham, LLP

20070072526 - Polishing system: The disclosed invention is directed to an improved polishing system that can attain improved values in surface topography, and in particular, improved surface planarity of a polished substrate. The system can prevent the formation of deformities at the polishing surface of the system. The system includes openings that are adjacent... Agent: Dority & Manning, P.A.

20070072527 - Shape controlled abrasive article and method: Provided are an abrasive tool comprising abrasive particles having an average shape controlled to within a small range, and methods of providing such tools. Thus, a large number of abrasive tools will have very similar operating characteristics, and abrasive tools made at different times or through different methods also can... Agent: 3m Innovative Properties Company

20070066183 - Control structure of grinding machine: A grinding machine includes a sensor for detecting the variation of the current of a motor thereof to determine the timing that a grinding assembly thereof touches a workpiece. An automated control system computes the grinding path of the grinding assembly according to the timing. Thus, all of the workpieces... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20070066182 - Machine for grinding internal diameter and end surface of workpiece: A grinding machine includes an automated control system, a machine base, a chuck device, and two grinding devices for grinding both of an internal diameter and an end surface of a workpiece automatedly. The machine base is provided with rails thereon. A chuck device has an independent power source and... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20070066187 - Chemical mechanical polishing device including a polishing pad and cleaning method thereof and method for planarization: A chemical mechanical polishing device used to polish a wafer according to the present invention includes a polishing table, a polishing pad, a slurry supply device, a wafer carrier and a high-pressure liquid cleaning device. The polishing pad is disposed on the polishing table to polish the wafer. The slurry... Agent: J C Patents, Inc.

20070066185 - Conformable abrasive articles and methods of making and using the same: Conformable abrasive article comprising: a backing having a first major surface; a deformable material contacting a central portion of the first major surface; an elastic member affixed to the first major surface of the backing and together with the backing enclosing the deformable material; and an abrasive member affixed to... Agent: 3m Innovative Properties Company

20070066188 - Cutting method and cutting apparatus: The invention provides a cutting method and a cutting apparatus that cuts without chipping a composite material consisting of laminated layers of crystal material and amorphous material, in which the amorphous material is cut with an ultrasonically vibrated cutting blade and the crystal material is cut with a cutting blade... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070066186 - Flexible abrasive article and methods of making and using the same: Flexible abrasive article comprising a compressible backing having first and second opposed major surfaces; an elastic polyurethane film affixed to at least a portion of the first major surface of the compressible backing; an optional extensible tie layer affixed to at least a portion of the elastic polyurethane film; and... Agent: 3m Innovative Properties Company

20070066184 - Surface-protecting sheet and semiconductor wafer lapping method: It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and fouling of a wafer even when a wafer having high bumps which are highly... Agent: The Webb Law Firm, P.C.

20070066189 - Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system: An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system. The off-line tool comprises a platen having a first surface for -holding a polishing pad and a motor for rotating the polishing pad. The motor is coupled to the platen via a first... Agent: Docket Clerk

20070066190 - Cutting apparatus: A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided... Agent: Birch Stewart Kolasch & Birch

20070066191 - Cutting or grinding machine: A ultrasonic cutting or grinding machine is composed of an exchangeable cutting or grinding rod, a chuck holding the cutting or grinding rod at a middle portion or rear end thereof, a motor having a rotatable rod, and a transmission rod connecting the chuck and the rotatable rod of the... Agent: Nixon Peabody, LLP

20070066192 - Wafer-edge polishing system: A wafer-edge polishing device includes a buff member for polishing a semiconductor wafer, and a dresser for dressing the buff member, wherein the dresser opposes the buff member with an intervention of the semiconductor wafer. A wafer mount mounting thereon the semiconductor wafer and the dresser are respectively movable toward... Agent: Young & Thompson

20070066193 - Reprofiling device for the rails of railroads that captures waste: A device for the continuous reprofiling of the rails of railroads includes at least one abrasive rail reprofiling unit (2) guided along the railroad tracks and comprising at least one abrasive disk (3) that can be pressed against a rail (1). This device notably includes at least one abrasive-waste pickup... Agent: Young & Thompson

20070066194 - Cmp diamond conditioning disk: A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A bonding system employing finely powdered aluminum oxide particles mixed with a... Agent: Kremblas, Foster, Phillips & Pollick

20070066196 - Method of forming a stacked polishing pad using laser ablation: The present invention provides a method of manufacturing a polishing pad for chemical mechanical polishing, comprising laminating a top polishing pad to a sub-polishing pad to form a stacked pad and transferring the stacked pad to a laser-ablation station containing a laser. Further the invention provides modulating a laser beam... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

20070066195 - Water-based polishing pads having improved adhesion properties and methods of manufacture: The present invention provides a chemical mechanical polishing pad comprising, a polymeric matrix having microspheres dispersed therein, the polymeric matrix being formed of a water-based polymer or blends thereof, and wherein the polymeric matrix is applied on a permeable substrate. The present invention provides a water-based polishing pad with reduced... Agent: Rohm And Haas Electronic Materials Cmp Holdings, Inc.

20070066197 - Abrasive article and methods of making same: An abrasive article with an integral dust collection system. The abrasive article comprises a porous abrasive layer with openings, a first filter media with channels, a second filter media, and an attachment interface layer. The openings of the porous abrasive layer cooperate with the channels to allow the flow of... Agent: 3m Innovative Properties Company

20070066199 - Abrasive article mounting assembly and methods of making same: An abrasive article mounting assembly with an integral dust collection system. The abrasive attachment interface is configured to releasably engage and support an abrasive article, such as, for example, a porous abrasive sheet or disc.... Agent: 3m Innovative Properties Company

20070066198 - Abrasive filter assembly and methods of making same: An abrasive filter assembly with an integral dust collection system. The abrasive filter assembly comprises a porous element, a first filter media with channels, a second filter media, and an attachment interface layer. The openings of the porous element cooperate with the channels to allow the flow of particles from... Agent: 3m Innovative Properties Company

20070066200 - Perforation and grooving for polishing articles: Methods, articles of manufacture, and apparatus are provided for depositing and planarizing one or more layers of material on a substrate, or combinations thereof, are disclosed. In one embodiment, an article of manufacture is provided for polishing a substrate, comprising a polishing article having a polishing surface, a plurality of... Agent: Patterson & Sheridan, LLP

20070066201 - Conductive polishing article for electrochemical mechanical polishing: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be... Agent: Patterson & Sheridan, LLP

20070060023 - Apparatus and method for polishing objects using object cleaners: An apparatus and method for polishing objects, such as semiconductor wafers, uses at least one object cleaner, which may be a movable object cleaner. The movable object cleaner allows access to different parts of the apparatus for maintenance.... Agent: Wilson & Ham Pmb: 348

20070060022 - Gear manufacturing machine and process for the operation of such a gear manufacturing machine: The invention concerns a device for the automatic loading of workpieces into a gear manufacturing machine, in particular a hard state finishing machine, by means of a swivel device arranged on the machine, where simultaneous with the machining process of a work piece blank (2) clamped on the work spindle... Agent: Browdy And Neimark, P.l.l.c. 624 Ninth Street, Nw

20070060024 - Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device: A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the pedestal pad which comes into contact with... Agent: Westerman, Hattori, Daniels & Adrian, LLP

20070060025 - Method for finely processing a cylindrical inner surface: The invention relates to a process for precision-machining a cylindrical inner surface, in particular a cylinder bearing surface, which has material of different hardnesses in the axial direction. The cylindrical inner surface is subjected to a precision-turning step, a preliminary honing step and a precision-honing step. The process is distinguished... Agent: Stephan A. Pendorf, P.A.

20070060026 - Methods of bonding superabrasive particles in an organic matrix: Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The... Agent: Thorpe North & Western, LLP.

20070060027 - Equipment and method for polishing both sides of a rectangular substrate: Double-sided polishing equipment configured to polish a rectangular substrate, comprising a carrier having a pocket configured to accommodate a rectangular substrate, a lateral linear moving mechanism configured to move the carrier, first and second polishing pads with first and second rotational axes, respectively, offset from centers of the pads, the... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070060028 - Cmp slurry delivery system and method of mixing slurry thereof: A CMP slurry delivery system includes a delivery pipe, a first slurry supply reservoir coupled to the delivery pipe for supplying an abrasive, a second slurry supply reservoir coupled to the delivery pipe for supplying a clean chemical, a third slurry supply reservoir coupled to the delivery pipe for supplying... Agent: North America Intellectual Property Corporation

20070060030 - Hand-held power tool with clamping device for a tool: A hand-held power tool (10) is specified, comprising a work spindle (12) for driving a tool (68), said tool (68) being fastenable between a fastening element (38) and a holding portion (36) on a tool end of the work spindle (12), and a displacement device (24) for sliding the fastening... Agent: St. Onge Steward Johnston & Reens, LLC

20070060029 - Insertion tool for an angle grinder: h

20070060031 - Polishing head elbow fitting: An improvement is provided for a TITAN HEAD wafer carrier having an annular inflatable tube for exerting pressure on the edge of a perforated plate during wafer dechucking, and a flexible plastic tube for supplying pressure to the annular inflatable tube. The improvement comprises a fixed elbow fitting secured to... Agent: Anthony G. Fussner

20070054598 - Locking mechanism of linear motor travel slider and processing machine: A locking mechanism of a linear motor travel slider, includes: a serration member having a teeth portion and disposed on one of the bed and the travel slider extending in a slider-traveling-direction; a bracket supported by the other of the bed and the travel slider; an actuator supported by the... Agent: Sughrue-265550

20070054599 - Apparatus and method of controlling the temperature of polishing pads used in planarizing micro-device workpieces: Temperature regulation systems and methods for controlling the temperature of polishing pads used in planarizing micro-device workpieces are disclosed herein. In one embodiment, an apparatus for polishing a workpiece includes a platen defining a planarizing zone and a primary duct system. The platen can have a first duct, and the... Agent: Perkins Coie LLP Patent-sea

20070054600 - Polishing pad, method of producing same and method of polishing: A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30MPa or greater and 70 MPa or less and preferably in the range of 40MPa or greater and... Agent: Beyer Weaver & Thomas, LLP

20070054601 - Grooved platen with channels or pathway to ambient air: A polish pad (120) and platen (130) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (130) having a grooved or channeled surface (136) which is sealed from the processing environment by an ungrooved portion (131) at the periphery of the platen (130). In addition, the... Agent: Hamilton & Terrile, LLP

20070054602 - Platen endpoint window with pressure relief: A polish pad (40, 42) and platen (50) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (50) having a vented endpoint window (62, 72, 82) with one or more venting passageways (e.g., 64, 66) and/or a grooved or channeled platen surface (176) to prevent air... Agent: Hamilton & Terrile, LLP

20070054603 - Wafer carrier with pressurized membrane and retaining ring actuator: A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable membrane is disposed across the bottom surface... Agent: Crockett & Crockett

20070054604 - Orbital rotary blade sharpener: An orbital rotary blade sharpener for sharpening rotary cutter blades and other rotary blades includes a bottom blade holding portion having a center and a perimeter edge, a top blade holding portion rotatably connectable to said bottom blade holding portion, having a perimeter and a center, a central shaft portion... Agent: Kurt M. Rylander Rylander & Associates

20070054605 - Method for rough-honing the peripheral surface of a bore: In a method of rough-honing the circumferential surface of a bore, a honing tool is inserted into a bore, wherein before rough-honing the longitudinal axis of the bore has an offset relative to the finished bore. This offset is compensated during the rough-honing operation.... Agent: O'shea, Getz & Kosakowski, P.c.

20070054607 - Lapping plate resurfacing abrasive member and method: A lapping machine includes a lapping plate, and a workpiece carrier with a workpiece-holding hole disposed on the plate, a workpiece being fitted within the hole in the carrier. The workpiece is lapped while the plate and the carrier are individually rotated and loose abrasive grains are fed onto the... Agent: Birch Stewart Kolasch & Birch

20070054606 - Method of adhering polishing pads and jig for adhering the same: The method of adhering polishing pads is capable of easily adhering the polishing pads without damages. The method comprises the steps of: tentatively adhering the polishing pads to polishing plates; attaching a roller unit having a shaft and a roller member, which is capable of rotating about the shaft and... Agent: Birch Stewart Kolasch & Birch

20070054608 - Working platform of tool cabinet: The invention discloses a working platform of a tool cabinet, and the working platform is turned over on the tool cabinet, so that two working sides on different sides of the working platform can be used alternately, so as to maximize the utility of the limited space of the tool... Agent: Birch Stewart Kolasch & Birch

20070054609 - Dual purpose sanding and collecting abrading device: A dual purpose abrading device for smoothing, sanding or finishing a surface of an object while simultaneously surrounding, collecting and containing the particles or debris as they are being generated. The abrading device includes a porous member having a collecting surface with a recess defined therein and a three dimensional... Agent: Cheryl F. Cohen, Llc

20070049165 - Environmental control system for a centrifugal processor: A centrifugal processor is disclosed with includes an outer frame having an inner surface and an axis. At least one inner vessel positioned within the outer frame and is adapted to receive an object to be processed. A drive system rotate the inner vessel with respect to the outer frame... Agent: Drinker Biddle & Reath Attn: Intellectual Property Group

20070049166 - Polishing method and polishing apparatus: A polishing method make it possible to carry out a multi-step polishing process with improved polishing conditions (polishing recipe) while omitting measurement of the surface conditions of a substrate, as carried out between polishing steps, as much as possible, thereby increasing the throughput. The polishing method for polishing workpieces by... Agent: Wenderoth, Lind & Ponack, L.L.P.

20070049164 - Polishing pad and method for manufacturing polishing pads: A polishing pad comprising particles having an average diameter between 1 nanometer and 100 nanometers, wherein the total weight of the particles is greater than about 3% of the total weight of the pad. Also, a method of manufacturing a polishing pad comprises the steps of: mixing a pre-polymer and... Agent: Snell & Wilmer

20070049169 - Nonwoven polishing pads for chemical mechanical polishing: A polishing article and its use as a polishing article for various substrates, especially for polishing a semiconductor wafer. The article is comprised of a mesh of splittable intermingled fibers and a binder material holding the fibers in the mesh. The fibers and binder material provide the polishing pad with... Agent: Intellectual Property Group Bose Mckinney & Evans LLP

20070049168 - Polishing pad, pad dressing evaluation method, and polishing apparatus: The present invention provides: a polishing apparatus for polishing a workpiece, comprising a polishing pad whose surface or surface layer part is colored with a color different from a color inside the polishing pad, a pad dresser which performs dressing of the polishing pad, and an observing device which observes... Agent: Roberts, Mlotkowski & Hobbes

20070049167 - Sealed polishing pad, system and methods: A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a sealant that penetrates a... Agent: Fish & Richardson P.C.

20070049170 - Retainer ring, polishing head, and chemical mechanical polishing apparatus: A retainer ring configured to reduce heat generated during a polishing process may include a heat absorbing element, a thermoelectric element, and a heat dissipating element. A polishing head configured to polish a wafer may include a wafer carrier, a retainer ring, and a cooling element. A chemical mechanical polishing... Agent: Harness, Dickey & Pierce, P.L.C

20070049172 - Apparatus and method for removing material from microfeature workpieces: Machines and systems for removing materials from microfeature workpieces using fixed-abrasive mediums. One embodiment of a method for removing material from a microfeature workpiece comprises rubbing the workpiece against a surface of a fixed-abrasive medium having a matrix and abrasive particles attached to the matrix, and sensing a parameter indicative... Agent: Perkins Coie LLP Patent-sea

20070049171 - Flexible cnc belt grinding machine: A belt grinding machine is disclosed that includes an automatic pressure and position control systems for robotic grinding and polishing applications. The machine will be combined with off-line programming package, capable of carrying out complicated operations that cannot be performed on traditional types of machines. The multiple contact wheels of... Agent: Kenneth Onyema Cambridge Lawyers Group, LLC

20070049173 - Process, apparatus and slurry for wire sawing: A wire saw (1; 100) for cutting a workpiece includes a device (21, 22, 24, 27) for setting, controlling and/or maintaining a predetermined or desired water content in at least part of the gaseous medium that contacts the slurry. With the wire saw according to the invention and the process... Agent: Foley And Lardner LLP Suite 500

20070049174 - Apparatus for screw-polishing with abrasive and method thereof: The present invention is applied in the fields of precise transmission devices, bio-medical devices and military-used devices to polish a surface of an object by an abrasive carried by the rotating of a screw.... Agent: Troxell Law Office PLLC

20070049175 - Diamond tool blade with circular cutting edge: An apparatus for turning a hard and/or brittle material includes a precision workpiece spindle, a workpiece support, a hard and/or brittle workpiece rigidly coupled to the workpiece support, and a diamond tool blade rigidly coupled to a spin-turner mechanism. The diamond tool blade is formed to include a cutting edge... Agent: Barnes & Thornburg LLP

20070049176 - Powered paint preparation kit and method: A paint preparation tool, kit and method for preparing a previously coated surface by optionally mechanically removing loose coating material separated from the surface, applying a softening chemical to soften margin areas of the previously applied coating, and using a powered tool to rotate an abrasive disk against the surface... Agent: Faegre & Benson LLP Patent Docketing

20070049178 - Method and apparatus for fluid polishing: In a fluid polishing method for processing a fine aperture by slurry 7, the slurry is supplied from a cylinder 2a in a slurry flow rate target process until the flow rate increases to a target value of a slurry feed flow rate. When the flow rate reaches the target... Agent: Harness, Dickey & Pierce, P.L.C

20070049177 - Method and apparatus for removing material from microfeature workpieces: Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface. The subpad in this embodiment further includes a hydro-control agent... Agent: Perkins Coie LLP Patent-sea

20070049180 - Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices: An aqueous dispersion for chemical mechanical polishing contains water, a polyvinylpyrrolidone having a weight-average molecular weight exceeding 200,000, an oxidant, a protective film-forming agent and abrasive grains, the protective film-forming agent containing a first metal compound-forming agent which forms a water-insoluble metal compound, and a second metal compound-forming agent which... Agent: Oblon, Spivak, Mcclelland, Maier & Neustadt, P.C.

20070049179 - Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces: Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece during mechanical or chemical-mechanical polishing. In this embodiment, the carrier head can include a... Agent: Perkins Coie LLP Patent-sea

20070049181 - Sharpener carried by the product table of a food slicer: A food slicer is provided having a support member including a base portion and an upstanding portion integrally formed with the base portion. The upstanding portion includes a rotating cutting blade secured thereto for slicing food product and at least one motor positioned within the upstanding portion for rotating the... Agent: Mark W. Croll Illinois Tool Works Inc.

20070049182 - Methods and apparatus for machining a coupling: A method facilitates fabricating a coupling including a first annular coupling member and a second annular coupling member. The method comprises coupling the first coupling member to a machine assembly that includes a plurality of grinding wheels coupled to a tool storage member, machining a plurality of troughs in the... Agent: John S. Beulick (12729) C/o Armstrong Teasdale LLP

20070049183 - Chemical-mechanical polishing apparatus and method of conditioning polishing pad: A chemical-mechanical polishing apparatus comprising at least a polishing platen, a polishing pad, a slurry supplying piping, a polishing pad conditioner, a chemical reagent supplying piping and a splitting piping is provided. The polishing platen has a plurality of slurry outlets disposed thereon and the polishing pad is disposed on... Agent: Jianq Chyun Intellectual Property Office

20070049184 - Retaining ring structure for enhanced removal rate during fixed abrasive chemical mechanical polishing: A retaining ring structure for a chemical mechanical polishing (CMP) apparatus includes a plurality of protrusions formed on a bottom surface of a retaining ring configured for retaining a workpiece to be polished, the protrusions disposed so as to be in contact with a polishing pad during a polishing operation... Agent: Cantor Colburn LLP - IBM Fishkill

20070049185 - Ceramic polishing pad dresser and method for fabricating the same: A ceramic polishing pad dresser and the method for fabricating the same are provided. Abrasive particles are adhered onto a ceramic substrate by heating a ceramic powder to be vitrified, thus forming a ceramic diamond disk. Meanwhile, a plastic base is mounted on the bottom of the ceramic diamond disk.... Agent: Workman Nydegger (f/k/a Workman Nydegger & Seeley)

20070049186 - Dental grinding tool and method for making the same: The present invention provides a dental grinding tool which is unlikely to damage gums and capable of finely shaping a formation part on which a crown is placed, and further provides a method for making the same. The dental grinding tool is made by forming a chamferred part on the... Agent: Smith Patent Office