Abrading inventions 10/06

20060240747 - Eyeglass lens processing apparatus: An eyeglass lens processing apparatus for processing a periphery of an eyeglass lens, the apparatus includes: a lens chuck shaft that holds and rotates the lens; an end mill that processes the periphery of the lens; an end mill tilting unit that varies a tilt of the end mill with...

20060240745 - Method for analyzing effective polishing frequency and effective polishing times for chemical mechanical planarization polishing wafers with different polishing pad profiles: A method for analyzing polishing frequency and number of polishing times for chemical planarization polishing wafer with different polishing pad profiles is disclosed. First, drawings of a wafer and a polishing pad are provided and then are converted into pixel arrays. Pixel arrays are processed to be black/white images. The...

20060240744 - Method for calibrating a grinding machine: The invention relates to a method for calibrating a grinding machine for sharpening bar blades by grinding at least two flanks and a top surface (K) of the bar blades, involving the following steps: producing a calibrating blade by sharpening a bar blade according to predetermined dimensions; measuring the dimensions...

20060240746 - System and method for precision machining of high hardness gear teeth and splines: A gear shaper machine system drives and maneuvers a hone tool to generate teeth geometry in a manner the teeth were machined prior to a hardening process. After heat treatment, the hone tool is indexed to the teeth geometry spacing of the workpiece so as to divide the stock removal...

20060240749 - Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity: A chemical mechanical polishing apparatus includes a platen, a polishing pad affixed to a surface of the platen, and a polishing head configured to retain and rotate a wafer while pressing a surface of the rotating wafer against the polishing pad. A first portion of the polishing pad that engages...

20060240748 - Method of manufacturing abrasive composition: A process for producing a polishing composition excelling in dispersion stability wherein the amount of agglomerated particles is reduced. In step 1-1 thereof, ultrapure water is adjusted so as to have a pH value of 1.0 to 2.7. Under shearing force given by a high shear disperser, fumed silica powder...

20060240750 - Composite retaining ring: A two part retaining ring is described that has a lower ring and an upper ring. The lower ring contacts a polishing surface during chemical mechanical polishing. The upper surface and the lower surface of the lower ring have matching grooves formed therein to increase the flexibility of the lower...

20060240751 - Power grinder with safety guard and spindle arresting means: A portable power grinder has a housing, a rotating output shaft with a grinding wheel mounting device, a grinding wheel safety guard adjustable between angular positions defined by apertures in the safety guard, and a manually operable safety guard arresting device engageable with an aperture. The arresting device has a...

20060240752 - Coupling structure for grinding members: A coupling structure for grinding members adopts a removable structure to fasten a grinding member to a pneumatic tool. One or more grinding member may be mounted on the coupling structure according to requirements. The coupling structure may be used repeatedly to reduce costs....

20060240753 - Abrasive cutting device: In order to provide a power tool, especially a cutting device (10) comprising at least one wet cutting device (11) having a nozzle element (23), wherein the nozzle element (23) is provided for supplying a binding liquid for dust particles formed during the grinding process and can especially be detachably...

20060234603 - Attitude control device and precision machining apparatus: An attitude control device and a precision machining apparatus capable of accurately controlling the attitude of an object mounted on the attitude control device according to grinding stages. The attitude control device is constituted by a first flat-plate member 21 and a second flat-plate member 22 disposed in parallel with...

20060234604 - Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate: A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, the method can include engaging a microelectronic substrate with a polishing surface of a polishing pad, electrically coupling a conductive material of the microelectronic substrate to a source of electrical potential, and oxidizing at least...

20060234605 - Multi-diamond cutting tool assembly for creating microreplication tools: In one embodiment, a cutting tool assembly used for creating grooves in a microreplication tool is described. The cutting tool assembly includes a mounting structure and multiple diamonds mounted in the mounting structure. For example, first and second tool shanks having first and second diamond tips can be positioned in...

20060234606 - Device and method for surface machining a workpiece: The invention relates to an apparatus and a method for surface machining. The apparatus for surface machining a workpiece, i.e., for abrasive flow machining, has at least two opposite pressure devices, such that the workpiece to be machined is arranged between the opposite pressure devices and an abrasive can be...

20060234607 - Method of manufacturing optical element having annular zones and method of manufacturing mold for forming the same: There is provided a method of manufacturing an optical element having a circular portion and at least one annular zone formed thereon, the circular portion having a circular profile and centered about an optical axis as viewed from a direction of an optical axis, the annular zone having an annular...

20060234608 - Method of processing antifriction bearing unit for wheel: A method of processing an antifriction bearing unit for a wheel, the antifriction bearing unit including an outer race, an inner race, a plurality of rolling elements and a flange portion for directly or indirectly mounting a brake disk provided to one of the outer and inner races, the method...

20060234609 - Substrate holding apparatus: The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a...

20060234610 - Apparatus for conditioning chemical-mechanical polishing pads: An apparatus for conditioning a polishing pad, or conditioner, includes a supporting substrate and abrasive elements. The abrasive elements of the conditioner are used to condition a polishing pad to be used in abrasive, or at least partially mechanical, semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization...

20060228990 - Method and apparatus for generating complex shapes on cylindrical surfaces: A method and apparatus for shaping the radial surface of a roller or other cylindrically shaped part in a single cycle. The preferred embodiment forms a crown geometry on one roller at a time using a CNC system to control a grinding surface in three axes. The grinding surface is...

20060228991 - Polishing method and apparatus: A chemical mechanical polishing method for polishing an oxide film and a protective film formed on a substrate having recesses comprises four steps. The first step planarizes the oxide film using a polishing pad and a polishing agent containing cerium oxide particles by causing relative rotational motion between the substrate...

20060228992 - Process control in electrochemically assisted planarization: In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface adapted to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer, and a second conductive layer coupled to the intermediate layer....

20060228994 - Hand held electric polisher: A polisher has a polishing disc on a shaft driven by a brushless DC motor driven by a motor controller mounted spaced from the polisher and adjacent a ground fault interrupt circuit and a power plug. Power and control wires form a cord that provides communication between a speed control...

20060228993 - Mechanical grinding apparatus for blending defects on turbine blades and associated method of use: A grinding apparatus for use with an endoscope for viewing and blending defects on a turbine engine blade is provided. In one preferred embodiment a mechanical driver causes a grinding head on the end of a grinding tool to reciprocate at a predetermined speed. The position of the grinding head...

20060228995 - Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces: Systems and methods for monitoring characteristics of a polishing pad used in polishing a micro-device workpiece are disclosed herein. In one embodiment, a method for monitoring a characteristic of a polishing pad includes applying ultrasonic energy to the polishing pad and determining a status of the characteristic based on a...

20060228997 - Apparatus for polishing edge surface of glass substrate for magnetic recording media, and process for producing glass substrate: To provide an apparatus for polishing an edge surface of a glass substrate for magnetic recording media and a process for producing a glass substrate for magnetic recording media, whereby with respect to a glass substrate to be used as a substrate for a hard disk, the quality and productivity...

20060228996 - Lapping system with mutually stabilized lapping carriers: A lapping system for eliminating crowning in a surface to be lapped includes a first lapping carrier adapted to carry a first workpiece and a second lapping carrier adapted to carry a second workpiece. A stabilizer assembly interconnects the first and second lapping carriers in a mutually stabilizing arrangement that...

20060228998 - Sensors with modular architecture: A modular sensing system architecture. A sensing system includes multiple planes that are in electrical communication. A power plane provides a power source and a communications module that can be optical and/or electrical in nature. The power source can be upgraded using optical power delivered over an optical fiber. The...

20060229000 - Polishing pad: A polishing pad for planarizing the surface of a wafer has a planar main body of a non-foamed synthetic resin, having Shore D hardness of 66.0-78.5, preferably 70.0-78.5, or more preferably 70.0-78.0, compressibility of 4% or less or preferably 2% or less, and compression recovery rate of 50% or greater...

20060228999 - Slurry composition and method for polishing organic polymer-based ophthalmic substrates: The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and a pyrrolidone compound. The abrasive particles can be alumina, zirconia, silica, titania or combinations of the foregoing. Slurry compositions according...

20060229001 - Exposing substance, exposing method, and exposing device: The invention relates to an uncovering compound for uncovering surfaces of materials with pronounced Si crystals, in particular of cylinder bearing surfaces made from aluminum materials with pronounced Si primary crystals. The uncovering compound according to the invention preferably includes very fine uncovering material, particularly preferably comprising silicon carbide grains...

20060229002 - Radial-biased polishing pad: The polishing pad is useful for polishing magnetic, optical and semiconductor substrates. The pad includes a polishing layer having a rotational center and an annular polishing track concentric with the rotational center and has a width. The width of the annular polishing track is free of non-radial grooves. And the...

20060229003 - Orbital polishing apparatus and method: An abrasive flow apparatus for polishing a workpiece wherein a horizontal machine tool is adapted such that a workpiece may be secured to first shaft rotatable about a first longitudinal axis. A conjugate form to the workpiece may be secured to a second shaft which is rotatable about a second...

20060229004 - Cutting or grinding machine: A ultrasonic cutting or grinding machine is composed of an exchangeable cutting or grinding rod, a chuck holding the cutting or grinding rod at a middle portion or rear end thereof, a motor having a rotatable rod, and a transmission rod connecting the chuck and the rotatable rod of the...

20060229005 - Water driven rotary tool: The present invention provides an assembly of machined or precision cast components which combine to form a high pressure water powered rotary tool. The rotary tool includes a rigid metal housing, a high pressure water inlet, an impeller rotatably mounted within the housing, an output drive shaft, a backing disk...

20060229006 - Ferrule holder assembly for optical-fiber-end-face grinding apparatus: A ferrule holder assembly for an optical-fiber-end-face grinding apparatus comprises a ferrule holder board supported to be moved upward and downward in parallel with a grinding board of the optical-fiber-end-face grinding apparatus, a ferrule sleeve provided at the ferrule holder board for receiving and supporting an optical fiber ferrule while...

20060229007 - Conductive pad: A method and apparatus for a processing pad assembly for polishing a substrate is disclosed. The processing pad assembly has a conductive processing pad having a plurality of raised features made of a conductive composite disposed on a conductive carrier. The raised features are adapted to polish the feature surface...

20060229008 - Chemical mechanical polishing pads: The present invention provides a deformable pad useful for chemical mechanical polishing (“CMP”), a CMP apparatus incorporating the deformable pad of the present invention, and methods for using the deformable pad and CMP apparatus of the present invention. The deformable pad of the present invention includes a plurality of solid...

20060223416 - Device and nethod for abrading a wooden barrel: A device for abrading a wooden barrel (13) includes a robot having elements (11, 17, 23) for loading a barrel (13), elements (29a, 29b, 33a, 33b) for gripping and rotating the barrel (13) around the axis thereof, elements (43a, 43b) for extracting and re-positioning the two bilge hoops of the...

20060223417 - Manufacturing cell for the treatment of grinding and wheel set testing and procedures for the operation of the manufacturing cell: A manufacturing cell for the treatment of grinding of gear wheel flanks, in particular by bevel pinions, and suggested for the wheel set testing, which includes a grinding machine (1), an unreeling test equipment (2), a laser inscription unit (3) with a time band (5) and a robot-supported load system...

20060223418 - Method and apparatus for treating the surface of a media, such as a magnetic hard disk, while operating, such as during dynamic electrical testing: A system and method for treating (e.g. polishing to remove defects) the surface of a media, such as a magnetic hard disk, while in operation, such as during dynamic electrical testing is disclosed. Further, a method for manufacturing a head for treating the surface of a media is disclosed....

20060223419 - Height comparator: A device is provided for measuring the centre of a grinding wheel for use in setting the height of a skate blade. The device has a base, a support extending from the base, a slider block slidable along the neck between the base and a head block secured to an...

20060223421 - Polishing apparatus: The polishing apparatus is capable of transferring a work piece to a top ring without moving the work piece from the center and capable of precisely polishing the work piece. The polishing apparatus has a transfer unit for transferring the work piece to the top ring. The transfer unit comprises:...

20060223420 - Shaping apparatus: A shaping apparatus for shaping a flotation core includes a worktable. At least one support is adjustably mounted on the worktable to be adjustable at least along a z-axis and configured to support the core. At least one engagement mechanism is mounted on the worktable and is displaceable relative to...

20060223423 - High pressure abrasive-liquid jet: An abrasive-liquid jet cutting head comprising at least one mixing stage; a first mixing chamber arranged to accept a coherent high pressure liquid from an orifice and flow of accelerated abrasive particles from an abrasive feed tube and produce a pressurized slurry-like flow that enters a nozzle; wherein a nozzle...

20060223422 - Multi-stage abrasive-liquid jet cutting head: A multistage abrasive-liquid jet cutting head comprising at least a first and a second mixing stage. Within the first mixing stage is a first mixing chamber arranged to accept a first flow of accelerated abrasive particles from a first abrasive feed tube and a pressurized liquid flow from an orifice...

20060223424 - Polishing pad: An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component....

20060223425 - Semiconductor processing methods of removing conductive material: The invention includes a semiconductive processing method of electrochemical-mechanical removing at least some of a conductive material from over a surface of a semiconductor substrate. A cathode is provided at a first location of the wafer, and an anode is provided at a second location of the wafer. The conductive...

20060223426 - System, method, and apparatus for wetting slurry delivery tubes in a chemical mechanical polishing process to prevent clogging thereof: A moisturizing process for slurry delivery tubes in chemical mechanical polishing is disclosed. A mist of deionized water is dispensed directly into the tubes each time a high pressure spray bar automatically cycles. The tips of the tubes are kept wet enough to prevent the slurry from drying in and...

20060223427 - Polishing method for inner surface of tubular brittle material and tubular brittle material obtained by polishing method: An object of the present invention is to provide a polishing method for producing, in a relatively short period of time, a tubular brittle material having an inner surface of high surface precision with a maximum roughness Rmax of 0.1 μm or smaller and a center line average roughness Ra...