Abrading inventions 09/06

20060211337 - Machining apparatus and method to machine surfaces in recesses of workpieces: In a machining apparatus to machine surfaces in recesses of workpieces, especially tools with flutes and cutting edges, such as twist drills, milling heads, reamers, and similar, the machining apparatus has a circular disk-shaped or frustum-shaped machining body with a symmetrical and rotational axis which is seated in a bearing...

20060211338 - Method for removing material from a semiconductor wafer: The invention relates to a method for removing material from a semiconductor wafer by machining, in which a semiconductor wafer held on a wafer holder and a grinding wheel lying opposite it are rotated independently of one another, the grinding wheel being arranged laterally offset with respect to the semiconductor...

20060211339 - Aerosol sandblast: A pressurized gas or liquid mixture of particulates, or an aggregate of particulates, to be delivered in an aerosol spray through a self-contained container to remove paint, stains and the like from various surfaces, such as wood or metal. The aerosol aggregate mixture can additionally include paint removers or cleaners...

20060211340 - Method and tool for maintenance of hard surfaces, and a method for manufacturing such a tool: A method is disclosed for maintaining a hard surface, the method comprising treating the surface with a flexible pad (1), in the presence of abrasive particles, bonded to the pad, on a contact surface between the pad (1) and the hard surface. The abrasive particles comprise diamond particles, and the...

20060211341 - Apparatus and method for edging stone or stone tiles: A stone machine and a process for working the edge of a stone or a set of stone tiles is provided. The stone machine has a stone receiving area, where stones are placed and their back edges aligned. A lift bar moves a pressure plate so that the pressure plate...

20060211342 - Abrasive articles with novel structures and methods for grinding: Bonded abrasive tools, having novel porous structures that are permeable to fluid flow, comprise a relatively low volume percentage of abrasive grain and bond, and a relatively low hardness grade, but are characterized by excellent mechanical strength and grinding performance. Methods for making the abrasive tools utilizing agglomerated abrasive grain...

20060211343 - Method and device for polishing endless belt metal rings for continuously variable transmission: There are disclosed a method and device for polishing a metal ring, which is capable of polishing a side edge of the metal ring without performing barrel polishing or polishing by grinding stones. Subsequently to a projecting step of projecting a metal ring W by clearing means 6, a first...

20060211344 - Chemical dilution system for semiconductor device processing system: A dilution stage is adapted to supply a dilute chemistry to a semiconductor device processing apparatus. The dilution stage includes a first vessel adapted to store the chemistry after dilution and a second vessel adapted to store the chemistry prior to dilution. The dilution stage may also include a control...

20060211345 - Knife blade dressing apparatus: A dressing device (10,90) for sharpening or conditioning of a blade (18) or the like includes one or more disk pairs (36-40,108), each having a pair of disks (52,54,110,112) respectively presenting a series of circumferentially spaced, projecting teeth (64) with openings (66) therebetween. The disks (52,54,110,112) are oriented in face-to-face...

20060211346 - Multi-bladed razor cartridge sharpener with aloe vera gel lubricant: Apparatus for sharpening and or honing a multi-bladed razor cartridge including a sharpening member, a housing to secure the sharpening member. An aloe vera or soap solution dispenser provides a lubricant to the sharpening member to lubricate the razor and a housing to limit the travel of the razor on...

20060211347 - Belt sander: A belt sander is disclosed that may include a sanding assembly having a first roller and a second roller, the sanding assembly being configured to receive a sanding belt around the first roller and the second roller to define a sanding surface therebetweeen. The belt sander may include a motor...

20060211348 - Honing guide assembly: A honing guide and bevel setting jig for removable attachment to the honing guide to properly position the angle and projection of a tool to be sharpened in the jig to enable the tool to be honed at the proper angle and position. An adjustable roller that contacts an abrasive...

20060211349 - Wafer polishing template for polishing semiconductor wafers in a wax free polishing process: A template for polishing semiconductor wafers is provided. In the present invention, the edge profile of semiconductor wafers polished in a wax-free process is enhanced by the addition of an edge enhancement ring on the back of the polishing template. The edge enhancement ring may be formed directly as part...

20060211350 - Truing tool advancer jig: A truing tool advancer jig is a unit comprising three parts: a jig body; a feed screw; and a clamping screw. The jig body is mounted on the universal support of a grinder and securely positioned thereon by adjustment of the clamping screw. A truing tool is mounted on the...

20060211351 - Power tool with dust collection function: A power tool with a dust collection function has a motor, a dust collection fan, and a cover member. The dust collection fan is driven by the motor for collecting a dust. The cover member covers the dust collection fan. The cover member provides an air passage surrounding the dust...

20060211352 - Sanding gloves: When working in crafts such as a gord project for the senior citizens center it was virtually impossible to find and easy way to clean the surface. What I really needed was something abrasive that would fit the shape of the palm of my hand. Sanding gloves but there wasn't...

20060211353 - Abrasive disc: An abrasive disc which has plural abrasive chips having an abrasive layer on a metal piece and being arranged in a peripheral portion of a disc substrate with a predetermined space comprises a suspension plate placed between the disc substrate and abrasive chips and an elastic sheet placed between the...

20060205322 - Chemical-mechanical planarization tool force calibration method and system: The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and force equations. The control computer can test a variety of pressures in the inflatable seal or the inflatable membrane, depending...

20060205321 - Super-abrasive machining tool and method of use: The super-abrasive machining tool utilizes both a means for grinding a workpiece and a means for revolving the workpiece in order to efficiently and cost effectively remove material from a workpiece comprising superalloy materials or even ceramic material. The means for grinding revolves at a much greater velocity than the...

20060205323 - Substrate holding mechanism, substrate polishing apparatus and substrate polishing method: A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing the amount of heat generated during polishing of a substrate to be polished and of effectively cooling the substrate holding part of the substrate holding mechanism and also capable of effectively preventing...

20060205324 - Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces: Systems and methods for activating end effectors used to condition microfeature workpiece polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a rotatable end effector having a conditioning surface configured to condition a microfeature workpiece polishing medium, and a driver coupled to the end...

20060205325 - Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry: A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively as possible but also achieve recycling of a polishing slurry without any problem; a...

20060205326 - Particle blast system with synchronized feeder and particle generator: A particle blast apparatus has a particle generator the speed of which is synchronized with the speed of the feeder which introduces particles into the flow of transport gas....

20060205327 - Polishing apparatus and method: The present invention provides a polishing apparatus and a polishing method, which are particular for the non-spherical lens. The polishing apparatus includes a base for carrying an object; and a polishing head, wherein the polishing head has a polishing layer made of a resin, a diamond and a graphite for...

20060205328 - Dual-head grinding drill machine and grinding method: A dual-head grinding drill machine and a grinding method that include two grinding bases on both ends of a motive power source and each having a grinding wheel. A fixing device separately aligns a left or a right drill or a mill, such that the knives into blade directions can...

20060205329 - Method and apparatus for abrading the region of intersection between a branch outlet and a passageway in a body: A method and apparatus are disclosed for abrading the inner surface at the intersection region of a branch outlet with the wall of a body having a passageway. Using abrasive flow machining, it is possible to abrade the intersection region to provide a smooth transition between the wall and the...

20060205330 - Perturbation control method for air abrasive instruments: The present invention is a micro-abrasive blasting device (55) with superior perturbation control via a plurality of delivery conduits (25) of various lengths and apertures. The user is able to individually open and close bypass conduit pinch valve (99) external to micro-abrasive blasting device (55) to affect the perturbation intensity...

20060205331 - Sanding apparatus with molded elastomeric pad: A sander comprises a body member molded of polypropylene to which a soft pad member is integrally molded or directly bonded thereto. Preferably, the material comprising the pad member is of a thermoplastic elastomer material, such as Santoprene®. Significantly, when the pad member is molded directly to the body member,...

20060199472 - Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization: Conditioning apparatuses and methods for conditioning polishing pads used for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for conditioning a polishing pad used for polishing a micro-device workpiece includes monitoring surface condition in a first region of the polishing pad and adjusting...

20060199471 - Pad conditioner design and method of use: A polishing pad conditioning apparatus includes a laser beam generating unit along with a system to transmit or focus the beam. The unit is mounted on a conditioning arm, such that the laser beam may be directed perpendicular to the plane of the polishing pad, which is next to the...

20060199473 - Polishing pad, process for producing the same and method of polishing therewith: Provided is a polishing pad comprising a fiber including organic fiber and a matrix resin holding the fiber, wherein at least the organic fiber is exposed on the work material-side surface thereof at least after dressing. The polishing pad suppresses generation of minute polishing scratches on the work material and...

20060199474 - Systems including differential pressure application apparatus: A differential pressure application apparatus is configured to apply different amounts of pressure to different locations of a substrate, such as a semiconductor device structure. The apparatus may be used during polishing or planarization processes. The apparatus includes physically discrete pressurization structures that may be moved independently from one another....

20060199475 - Apparatus and method for forming vias: A method and apparatus for forming vias in one or more layers, comprising providing a vacuum chamber, one or more beams in the vacuum chamber. The array of directed beams located in alignment with a layer for ablating one or more areas of the layer for forming vias. A cold...

20060199476 - Apparatus and method for forming vias: An apparatus and method for forming vias in one or more layers, comprising one or more beams located in alignment with the layers for forming one or more vias in one or more areas of the layers. A vacuum mechanism is provided for collecting ablated material caused by the directed...

20060199477 - Multi-port sandblasting manifold and method: A method and apparatus is provided to simplify sandblasting processes while increasing applied coverage areas in sandblasting operations. The method and apparatus provide a manifold assembly having a plurality of nozzles and that is rigidly attached to an air supply. The manifold is supplied with abrasive material via a plurality...

20060199478 - Substrate delivery mechanism: A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide...

20060199479 - Substrate holding apparatus and polishing apparatus: The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus comprises a vertically movable member (6), and an elastic member (7) for defining a chamber...

20060199480 - Apparatus and method for feeding slurry: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by...

20060199482 - Pad conditioner for chemical mechanical polishing apparatus: A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relatively regular shaped and tough polishing particles may be provided on the...

20060199481 - Polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular: A polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular is disclosed, which comprises a support body, to which a foam layer is attached, wherein a polishing film bears against the foam layer. The polishing film is provided with at least...

20060199483 - Grinding head: The aim of the invention is to provide a simply structured grinding head which is characterized in that the speed of the individual grinding wheels (36) substantially exceeds that of the discoid base (3) carrying them and which can be combined with grinding attachments of a different type, even with...

20060199484 - Sanding apparatus and method of manufacture: An improved resilient sanding block of the type comprising a core having a plurality of exterior surfaces, including a first major surface and a second major surface and side surfaces, and having a layer of abrasive material disposed thereon. The resilient sanding block may have one or more apertures or...

20060199472 - Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization: Conditioning apparatuses and methods for conditioning polishing pads used for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for conditioning a polishing pad used for polishing a micro-device workpiece includes monitoring surface condition in a first region of the polishing pad and adjusting...

20060199471 - Pad conditioner design and method of use: A polishing pad conditioning apparatus includes a laser beam generating unit along with a system to transmit or focus the beam. The unit is mounted on a conditioning arm, such that the laser beam may be directed perpendicular to the plane of the polishing pad, which is next to the...

20060199473 - Polishing pad, process for producing the same and method of polishing therewith: Provided is a polishing pad comprising a fiber including organic fiber and a matrix resin holding the fiber, wherein at least the organic fiber is exposed on the work material-side surface thereof at least after dressing. The polishing pad suppresses generation of minute polishing scratches on the work material and...

20060199474 - Systems including differential pressure application apparatus: A differential pressure application apparatus is configured to apply different amounts of pressure to different locations of a substrate, such as a semiconductor device structure. The apparatus may be used during polishing or planarization processes. The apparatus includes physically discrete pressurization structures that may be moved independently from one another....

20060199475 - Apparatus and method for forming vias: A method and apparatus for forming vias in one or more layers, comprising providing a vacuum chamber, one or more beams in the vacuum chamber. The array of directed beams located in alignment with a layer for ablating one or more areas of the layer for forming vias. A cold...

20060199476 - Apparatus and method for forming vias: An apparatus and method for forming vias in one or more layers, comprising one or more beams located in alignment with the layers for forming one or more vias in one or more areas of the layers. A vacuum mechanism is provided for collecting ablated material caused by the directed...

20060199477 - Multi-port sandblasting manifold and method: A method and apparatus is provided to simplify sandblasting processes while increasing applied coverage areas in sandblasting operations. The method and apparatus provide a manifold assembly having a plurality of nozzles and that is rigidly attached to an air supply. The manifold is supplied with abrasive material via a plurality...

20060199478 - Substrate delivery mechanism: A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide...

20060199479 - Substrate holding apparatus and polishing apparatus: The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus comprises a vertically movable member (6), and an elastic member (7) for defining a chamber...

20060199480 - Apparatus and method for feeding slurry: A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by...

20060199482 - Pad conditioner for chemical mechanical polishing apparatus: A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relatively regular shaped and tough polishing particles may be provided on the...

20060199481 - Polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular: A polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular is disclosed, which comprises a support body, to which a foam layer is attached, wherein a polishing film bears against the foam layer. The polishing film is provided with at least...

20060199483 - Grinding head: The aim of the invention is to provide a simply structured grinding head which is characterized in that the speed of the individual grinding wheels (36) substantially exceeds that of the discoid base (3) carrying them and which can be combined with grinding attachments of a different type, even with...

20060199484 - Sanding apparatus and method of manufacture: An improved resilient sanding block of the type comprising a core having a plurality of exterior surfaces, including a first major surface and a second major surface and side surfaces, and having a layer of abrasive material disposed thereon. The resilient sanding block may have one or more apertures or...