Abrading inventions 08/06

20060194510 - Precision machining apparatus and precision machining method: A precision machining apparatus and a precision machining method capable of carrying out grinding with accuracy by performing switching control, for example, on a device for rotating a grinding wheel according to grinding stages through the amount of movement and constant pressure changed stepwise. To a second pedestal 3 supporting...

20060194511 - Thickness control method and double side polisher: The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The first polishing operation is finished based...

20060194512 - Thickness control method and double side polisher: The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an upper polishing plate measures...

20060194514 - Jet singulation: Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable for singulating surface mount devices such as chip scale packages, ball...

20060194513 - Workpiece headstock: to align the clamping device (7), the alignment control unit (21) operates the actuating drive (19) as a function of the measurement values provided by the sensor arrangement (20) and thus cooperates with the actuating drive (19) and the sensor arrangement (20) to form a closed-loop control circuit....

20060194515 - Methods and systems for conditioning planarizing pads used in planarizing substrates: Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by...

20060194517 - Method for precision alignment during a blocking process of lens manufacturing: A blocking apparatus and a blocking method allow precise alignment of an axis of a button with an axis of a block for a blocking process of lens manufacturing. According to another aspect, the invention provides a blocking apparatus and a blocking method for automatically compensating variations in button geometry...

20060194518 - Methods for planarization of group viii metal-containing surfaces using a fixed abrasive article: A planarization method includes providing a Group VIII metal-containing surface (preferably, a platinum-containing surface) and positioning it for contact with a fixed abrasive article in the presence of a planarization composition, wherein the fixed abrasive article comprises a plurality of abrasive particles having a hardness of no greater than about...

20060194516 - Processing apparatus and processing method: A processing apparatus according to the present invention, which conditions a substrate placed on a table equipped with a heater by radiating an electron beam onto the substrate while heating the substrate with the heater, includes at least three projecting portions for holding the substrate at a predetermined distance from...

20060194519 - Wafer carrier with pressurized membrane and retaining ring actuator: A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable membrane is disposed across the bottom surface...

20060194520 - Chamfered freestanding nitride semiconductor wafer and method of chamfering nitride semiconductor wafer: Technology of making freestanding gallium nitride (GaN) wafers has been matured at length. Gallium nitride is rigid but fragile. Chamfering of a periphery of a GaN wafer is difficult. At present edges are chamfered by a rotary whetstone of gross granules with weak pressure. Minimum roughness of the chamfered edges...

20060194522 - Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates: Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to the selected energy source. The planarizing pad material is exposed to...

20060194523 - Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates: Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to the selected energy source. The planarizing pad material is exposed to...

20060194521 - Polishing apparatus: The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring...

20060194524 - Method of fabricating pliant workpieces, tools for performing the method and methods for making those tools: An improved method of manufacturing automotive accessory drive belts or other workpieces of pliant material which have a grooved operative face, a tool having an abrasive ramp configuration for performing said improved method and a method of manufacturing said tool with the abrasive ramp configuration....

20060194525 - Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion: A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angular positions about said first axis is described. In one...

20060194526 - Apparatus for smoothing the surface of a gas turbine blade: An abrasive device may include first ring-shaped container filled with a liquid abrasive medium. A second container may be arranged next to the first container and filled with a second liquid abrasive medium. A pivoting arm may be arranged between and above the containers and can be pivoted along a...

20060194527 - Multiple cutting edged sanding wheel: An improved sanding wheel configured to rotate axially for sanding or polishing milled contours that will provide sharp edges and corners in the workpiece. The preferred sanding wheel has a cylindrical body with a plurality of segments extending radially from the body that have vertical, horizontal, angled, convex, or concave...

20060194528 - Rotary work tool with orbiting planetary gears containing eccentric axes for the attachment of polishing or sanding platens: A work tool comprising: a principle drive shaft with a sun gear attached thereto; at least two planetary gears distributed about the circumference of the sun gear at substantially equal angular separations; and a carriage for constraining the planetary gears such that they maintain their angular separation about the axis...

20060194529 - Retractable abrasive sharpener and carrying case: A hand held retractable abrasive sharpener having a rod formed with a tapered end portion and a partially cylindrical opposite end portion. A part of the partially cylindrical opposition end portion is flat. A slot is formed in the rod. Substantially all of the outer surfaces include layers of the...

20060194530 - Polishing pad for use in polishing work pieces: A polishing/lapping pad for use in CMP and other polishing and lapping operations is presented that comprises multiple channels designed to facilitate in the manipulation of slurry into specific locations on the wafer being planarized....

20060189258 - Controlled wall saw and method for controlling the wall saw: A control wall saw includes a guide rail (2) securable on a to-be-cut wall (7), a saw head (3) displaceable along the guide rail (2), a rotary drive, a pivotally adjustable saw arm (4) on a radially end of which a rotatably driven, disc-shaped saw blade (5) is releasably mountable,...

20060189259 - Polishing apparatus and related polishing methods: Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources....

20060189255 - Spectacle lens manufacturing method and spectacle lens manufacturing system: A spectacle lens design device 201 disposed at a factory 200 on a manufacturing side and a lens processing device connected thereto block an applicable semi-finished lens blank or lens blank so that a reference surface thereof tilts at a predetermined angle using a numerical-control curve generator based on order...

20060189256 - Systems and methods for wafer polishing: An electromagnetic polish head (100) comprises at least one electromagnet. An embodiment may also include the addition of a slurry component or components that can be affected by an electromagnetic field. During polishing or planarization, a field or fields may be generated by the polish head (100) to affect the...

20060189257 - Systems and methods for wafer polishing: An electromagnetic polish head (100) comprises at least one electromagnet. An embodiment may also include the addition of a slurry component or components that can be affected by an electromagnetic field. During polishing or planarization, a field or fields may be generated by the polish head (100) to affect the...

20060189260 - Process via worktable of relative coordinates: A process via a worktable of relative coordinates, which adopts relative coordinates to construct a processing worktable, and includes sliding rails of axes X, Y and Z. A main processing axle head, a cutter or the like is provided at axis Z, such that the axle head/cutter can travel along...

20060189261 - Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods: Systems and methods for beveling microfeature workpiece edges are disclosed. A system in accordance with one embodiment is configured to remove material from a microfeature workpiece having a first face, a second face facing opposite from the first face, an edge surface between the first and second faces, and an...

20060189262 - Shaped polishing pads for beveling microfeature workpiece edges, and associated systems and methods: Systems and methods for beveling microfeature workpiece edges are disclosed. A system in accordance with one embodiment is configured to remove material from a microfeature workpiece having a first face, a second face facing opposite from the first face, an edge surface between the first and second faces, and an...

20060189263 - Apparatus and method for sharpening tool blades: A sharpening device for the blade of a tool such as a chisel or plane is in two parts. The first is a jig into which the blade is inserted with its tapered end projecting some distance beyond the jig. This distance is related to the angle to which the...

20060189264 - Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation: A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is preferably arranged to apply different...

20060189265 - Apparatus for supporting airfoils in a grit blasting process: An apparatus provided for supporting at least one component in a grit blasting process comprises a base and a platform table assembly mounted to the base. The platform table assembly includes a platform table therein which is rotatable and angularly adjustable with respect to the base. The platform table includes...

20060189266 - System for replacement of sheet abrasive: A system for rapid replacement of abrasive in machinery which uses the abrasive to finish the surfaces of workpieces that pass through the machinery on a belt, such as so-called widebelt sanders. One preferred embodiment of the system employs an abrasive material that is frictionally held on each edge to...

20060189267 - Eccentric stroke adjusting mechanism: The present invention relates to an eccentric stroke adjusting mechanism for use in a power tool with a principle drive shaft comprising a first and a second eccentric member mounted on the principle drive shaft respectively and a coupling member for connecting the first and the second eccentric member. The...

20060189268 - Grinding disc for grinding machines: In a grinding disk (100) for the rotary slaving on a driven shaft of a grinding machine, in particular of a hand grinder, which has at least one supporting plate (10) with at least one cut or opening (20) through which the abrasive dust which develops by grinding can be...

20060189269 - Customized polishing pads for cmp and methods of fabrication and use thereof: Various examples of customized polishing pads are given, along with methods of making and using such customized polishing pads. The subject customized pads are designed and fabricated so that there is spatial distribution of chemical and physical properties of the pads that are customized for performance suited to a specific...

20060183407 - Platen and head rotation rates for monitoring chemical mechanical polishing: Methods system and apparatus, including computer program products, for monitoring polishing a substrate. A polishing pad mounted on a platen is rotated at a first rotation rate, and a carrier head is rotated at a second rotation rate that is different from the first rotation rate. The carrier head carries...

20060183408 - Method for sequencing substrates: Methods for transferring substrates in a system with a factory interface robot between at least one FOUP, a buffer coupled to a parasitic device and an inbound and outbound transfer station coupled to a processing tool are provided. In one embodiment, a method for transferring substrates includes transferring a first...

20060183409 - Combination router-end mill cutter tool, edger with combination tool, and method of edging eyeglass lenses: The present invention relates to a tool for shaping and polishing an edge of an eyeglass lens. The tool includes a longitudinally extending body rotatable on the axis thereof, with a proximal portion and a distal portion. A first cutter extends axially and radially from the distal portion, and includes...

20060183410 - Diamond conditioning of soft chemical mechanical planarization/polishing (cmp) polishing pads: Conditioning of chemical mechanical planarization (CMP) using conventional diamond-embedded abrasive strips are well suited to condition conventional “hard” polishing but not soft polishing pads because the diamonds not only remove waste material, but they also damage the polishing surface of the pad. Embodiments of the present invention condition soft polishing...

20060183411 - Portable skate sharpener: A skate sharpening device is provided which allows a grinding device to rotate with respect to a working surface of the device in both a cross grind configuration and a finish grind configuration. The grinding device pivots about a pin and is guided by a threaded stud protruding through an...

20060183412 - Polishing pad: A polishing pad is described as comprising, (a) particulate polymer which can be chosen from particulate thermoplastic polymer (e.g., particulate thermoplastic polyurethane), particulate crosslinked polymer (e.g., particulate crosslinked polyurethane and/or particulate crosslinked polyepoxide) and mixtures thereof; and (b) organic polymer binder (e.g., polyurethane binder and/or polyepoxide binder), which can bind...

20060178086 - Eyeglass lens processing apparatus: An eyeglass lens processing apparatus includes; a drilling tool for forming a hole in an eyeglass lens; a first movement mechanism part that relatively moves the drilling tool relative to the lens; a target lens shape input section that inputs data of a two-dimensional target lens shape of the lens;...

20060178087 - Hand-held electric machine tool comprising a dust collection container and a level indicator: An electric hand-held power tool is described that has a machine housing (11) with an integral dust-ejection connection (15) and a dust collection container (16) attached thereto. To ensure, when working with the electric hand-held power tool, that the dust collection container (16) is emptied in time when full, a...

20060178088 - Stone sawing without acute noise: The invention relates to stone sawing without acute noise. Acute noise, which is produced by the direct friction between the metal bands and the stones, reaches levels greater than 90 db at a distance of 1.5 m between said bands and the measuring apparatus. By increasing the concentration of grit...

20060178089 - Wafer-retaining carrier, double-side grinding device using the same, and double-side grinding method for wafer: The present invention is a wafer-holding carrier 1 wherein the carrier has polishing agent-passing holes 3, 4 for passing the polishing agent through as well as wafer-holding holes 2 for containing and holding wafers, and the total area of the polishing agent-passing holes occupies 15% or more of a main...

20060178090 - Abrasive cleaning article and method of making: The present invention provides an abrasive cleaning article, a method of making an abrasive cleaning article, and a method of cleaning a surface with an abrasive cleaning article. In one aspect, the abrasive cleaning articles comprises a substrate, a water-soluble binder having a weight average molecular weight less than 200,000,...

20060178092 - Particle blast cleaning apparatus with pressurized container: A particle blast cleaning apparatus incorporates a pressurized container which is pressurized by the transport gas upon start up. A feeder introduces the blast media into the transport stream....

20060178091 - Soda blasting apparatus: The Soda Blasting Apparatus (1) disclosed and claimed herein introduces pressure into a pressure vessel (10). The blasting medium (70) is metered from the pressure vessel interior (13) by a pressure differential introduced by a venture (500) positioned at the pressure vessel interior (13) proximal the pressure vessel bottom (12)...

20060178093 - High speed vertical processor: A vertical processor (10) for processing parts by subjecting the parts to rotational and centrifugal motion with abrasive media. The processor includes an outer drum (32), and a plurality of inner containers (34) positioned within the outer drum. The inner containers are driven into engagement with the inner surface of...

20060178094 - Polishing apparatus: In polishing apparatus of the present invention, collars can be easily exchange. The polishing apparatus comprises: an outer pin gear having an inner gear section; an inner pin gear having an outer gear section; and a carrier having outer gear teeth, which are engaged with the inner gear section of...

20060178095 - Polishing media stabilizer: A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between...

20060178096 - Subpad support with a releasable subpad securing element and polishing apparatus including the subpad support: A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for non-adhesively securing the subpad thereto. The subpad support may also include one or more lips protruding therefrom...

20060178097 - Portable rail cutting apparatus: A portable rail cutting apparatus is presented herein. The portable rail cutting apparatus comprises a housing encasing a motor, the motor configured to drive a rotary abrasive blade, a drive pulley coupled to the motor, a driven pulley coupled to the rotary abrasive blade, a loop drive belt engaged by...

20060178098 - Machining apparatus: A machining apparatus, comprising: a mounting member to be rotationally driven; a tool support member mounted on the mounting member; and a fixing member, fixed to the mounting member, for fixing the tool support member to the mounting member. The mounting member has a mounting outer peripheral surface of a...

20060178099 - Polishing pad: A single-layered polishing pad suitable for chemical mechanical polishing (CMP) of semiconductor wafers, etc., which attains excellent step height reduction and in-plane uniformity and is integrally molded by reaction injection molding, is provided. The polishing pad is a polyurethane-based foam 12 having a desired shape, as obtained by molding a...

20060178100 - Hand-held sharpener device: A hand-held sharpener device for sharpening and deburring convergent surface cutting edge implements including an elongated cylindrical body having a central area mounting a plurality of sharpener bit assemblies and opposite end areas providing hand grips for holding and moving the sharpener device across a cutting edge to be sharpened....

20060172661 - Devices with angularly adjustable sanding units: The invention describes devices consisting of a combination of oblique to feed direction aligned belt sanding assemblies, with drives or devices for low sanding belt speeds and/or with conventional, or modified for sanding belt oblique operation, electronic segmented sanding pad. The oblique alignment of the sanding unit can be adjusted...

20060172664 - Methods for reducing delamination during chemical mechanical polishing: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having...

20060172662 - Real time monitoring of cmp pad conditioning process: CMP pad conditioning processes have been monitored and controlled by detecting the vibrational spectrum of a sensor mounted on the conditioner support arm. An accelerometer is used as the detector so that vibrational velocity (which correlates with pad wear) can be measured, rather than displacement or acceleration. After the vibrational...

20060172663 - Surface polishing method and apparatus thereof: A surface polishing method that polishes the surface of a hard brittle material, such as a glass substrate, an oxide film of a silicon wafer, and a ceramic substrate is disclosed. In the surface polishing method, a fixed abrasive grain polishing tool is used, in which the fixed abrasive grains...

20060172666 - Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips: A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an outer contour of a desired semiconductor chip, holding the semiconductor wafer by a wafer holding mechanism, grinding a back surface...

20060172665 - Polishing tool and polishing apparatus: A polishing tool is used for polishing a workpiece (13) such as a semiconductor wafer to a flat mirror finish. The polishing tool has a polishing table (10) and a polishing pad (11) attached to an upper surface of the polishing table (10). The polishing pad (11) has a plurality...

20060172667 - Grinding head for a mobile grinding machine and mobile grinding machine comprising such a grinding head: The invention concerns a grinding head for a mobile grinding machine which is suitable for grinding floor surfaces, and a mobile grinding machine comprising such a grinding head. The grinding machine is driven by a motor and has a rotatable planet disc and grinding heads (5-7) rotatable relative to this....

20060172669 - Hand machine tool with clamping device: A hand power tool has a disk-shaped tool, and a clamping device for clamping the tool, the clamping device including at least one flange and a clamping unit for clamping the tool to the at least one flange and passing through the tool, the clamping unit and the at least...

20060172668 - Insertion tool for a machine tool: h

20060172670 - Hand sanding tool: A hand grinder (10), having a grinding sheet (20) that fits over the grinding disk underside (18) and having clamping means (22, 24, 30) for fixing the grinding sheet (20) to the grinding disk (14), the clamping means (22, 24, 30) having clamping bodies (24) that can be pressed against...

20060172671 - Conductive polishing article for electrochemical mechanical polishing: An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality...