Abrading inventions 07/06

20060166605 - Apparatus for processing chamfering of eyeglass lens: An apparatus for processing a chamfering of an eyeglass lens, including means for inputting a width of the chamfering and a range of the chamfering from a periphery of a lens shape at at least one position adjacent to a nose or far away from the nose, arithmetic control means...

20060166604 - Process and apparatus for grinding work for non-circular rotor, as well as camshaft: To grind an outer peripheral surface of a work (10) for a non-circular rotor by a rotary grindstone (22) advanced and retreated by an NC control depending on the profile of the work (10), while rotating the work (10) about its axis, the following steps are carried out: a first...

20060166607 - Detection of diamond contamination in polishing pad and reconditioning system therefor: Methods for reconditioning a polishing pad and detecting diamond contamination of the polishing pad, are disclosed. In particular, the methods include the step of exposing the reconditioned polishing pad to an energy source to induce the diamond contamination to fluoresce. Detection of the diamond contamination is then made by detecting...

20060166606 - Polishing state monitoring apparatus and polishing apparatus and method: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a...

20060166608 - Spectral imaging of substrates: Spectral imaging systems and methods are provided for monitoring a substrate during a chemical-mechanical planarization process. An example system includes a carrier configured to receive a substrate, and a platen configured to receive a polishing pad. The platen includes an aperture configured to pass light. The system also includes a...

20060166609 - System and method for ophthalmic lens manufacture: A method and system for the manufacture of ophthalmic lenses comprising a computer (102) and a CNC machining platform (104) in operative connection with the computer. The CNC machining platform includes a mounting stage (110), a block (106) in releasable connection with the mounting stage, and a machining tool (112)....

20060166611 - Back pressure control system for cmp and wafer polishing: A wafer carrier with a back pressure applicator system adapted to provide high resolution back pressure control. A plurality of millimeter scale distensible elements are disposed between the wafer carrier pressure plate and a process wafer, and selectively distended to provide excess backpressure to select small areas of a wafer...

20060166610 - Optical disk polishing device: An apparatus for polishing an optical disk according to the present invention includes a flange 24 holding a polishing body 20 such as sandpaper, a backup member 21 interposed between the polishing body 20 and the flange 24, a rotation table 12 holding an optical disk 10 as a polished...

20060166612 - Device for generating pulsating movements: A device generating pulsed motions comprises: (A) two parallel shafts (3; 4) each having a longitudinal axis (5; 6), a rear end (7; 8) and a front end (9; 10), (B) a gear unit (2) comprising at least two gears (20; 21) where at least two gears (20) are oval...

20060166613 - Hand-operated machine-tool comprising a vibration-damping rotary handle: A handheld power tool, in particular a handheld right-angle grinder (10), has an electric motor drive for a motor housing (11) that accommodates a tool and also has a handle (15), which is retained on the motor housing (11) by means of a handle mounting device (30) located between them,...

20060166614 - Clamping device for the exact manual resharpening of knife blades on a whetstone: A clamping device is provided for the exact manual resharpening of knife blades (6) on a whetstone (5). The knife blade (6) is mounted in the clamping device (9) and at least one support contour (2, 14, 14a) of the clamping device (9) is designed such that it is congruent...

20060166615 - Composite abrasive compact: A composite abrasive compact comprises an abrasive compact layer, generally a diamond abrasive compact layer, bonded to a substrate. The abrasive compact layer is characterised by: (i) an inner region, in contact with a surface of the substrate, (ii) a first intermediate region in contact with the inner region, (iii)...

20060160469 - Blade sharpening machines: The invention concerns a blade (5) sharpening machine (1) comprising a support, operation means, manual and/or automatic control and driving means, said machine (1) being characterised in that it provides a rotating grinding wheel (2) and at least a support (3) for the blade (5) to be sharpened, said support...

20060160470 - Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates: Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table, a carrier assembly, and an array of force sensors embedded in at least one of the...

20060160471 - Surface finishing apparatus and method, dimple die, and head suspension: A surface finishing apparatus mirror-finishes a three-dimensional surface of a workpiece. The surface finishing apparatus has an ejector to eject a water jet to a concave surface of a dimple die and a feeder to feed microscopic grains so that the microscopic grains are propelled by the water jet to...

20060160472 - Surface treated product, surface treatment method, and surface treatment apparatus: There is provided a surface treated product that moves relatively in a fluid, wherein a surface of the surface treated product has continuous dimples, each dimple having a diameter of 10 to 2500 μm and a depth of 50 μm or less. The surface treated product significantly reduces resistance of...

20060160475 - Chemical mechanical polishing compositions for metal and associated materials and method of using same: A chemical mechanical polishing slurry composition and method for using the slurry composition for polishing copper, barrier material and dielectric material that comprises first and second-step slurries. The first-step slurry has a high removal rate on copper and a low removal rate on barrier material. The second-step slurry has a...

20060160473 - Fixture for slider lapping, lapping device and lapping method: A fixture for slider lapping includes a holding portion for holding the object with its surface to be lapped toward the lapping surface of the lapping device; a main body for mounting the lapping fixture to the lapping device; a plurality of load-applied portions which are arranged along said longitudinal...

20060160474 - Magnetically secured retaining ring: A retaining ring having a bottom portion that is removable from the ring's upper portion is described. The upper and lower portions of the retaining ring include one or more magnetic bodies and/or one or more bodies formed of a material that is attracted to magnets....

20060160477 - Cmp conditioner, method for arranging hard abrasive grains for use in cmp conditioner, and process for producing cmp conditioner: Disclosed are CMP conditioners which can suppress microscratching of the surface of a semiconductor substrate and can realize stable CMP conditioner properties. The CMP conditioner according to the first aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on a surface of...

20060160476 - Porous abrasive articles with agglomerated abrasives and method for making the agglomerated abrasives: A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being characterized by a melting temperature between 500 and 1400° C, and the sintered agglomerates having a loose packing density of ≦1.6 g/cc...

20060160478 - Chemical mechanical polishing pad for controlling polishing slurry distribution: A polishing pad for a chemical mechanical polishing apparatus has a body with a polishing surface having a radius, a central region, and a peripheral region. The polishing surface has a plurality of main radial-line channels extending radially outwardly from the central region to the peripheral region, each main radial-line...

20060160479 - Carrier head for thermal drift compensation: Systems and apparatus providing a carrier head for chemical mechanical polishing are described. The carrier head includes a base, a support structure attached to the base, a retaining structure attached to the base, and a connector attached to the base and the retaining structure. The support structure includes a receiving...

20060160480 - Flapped grinding disk: A flapped grinding disk having a disk- or plate-shaped support including an outer periphery, and a plurality of spaced-apart, discrete groups of grinding flaps forming a plurality of apertures, wherein the flaps overlap each other on the support in the manner of shingles, are secured in an adhesive bed, and...

20060160481 - Diamond disk: A novel diamond disc is disclosed. The diamond disc comprises a plurality of diamond grains 2 bound on a disc. The diamond grains 2 are arranged in such a manner that a distance m1 between diamond grains 2 which are located on a common rotational track of the diamond disc...

20060154568 - Multilayer polishing pad and method of making: A polishing pad has a polishing layer with a polishing surface and a first registration mark, and a backing layer connected to the polishing layer and having a second registration mark aligned with the first registration mark. The polishing pad may have a window that includes an aperture in the...

20060154570 - Monitoring a metal layer during chemical mechanical polishing: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around...

20060154569 - Platen assembly utilizing magnetic slip ring: Embodiments of the present invention generally relate to an apparatus for processing a substrate and more specifically to a device that will transfer electrical power and/or control signals between a stationary base and a rotating platen without involving mechanical contact. The device does not suffer the drawbacks of conventional slip...

20060154571 - Grinding machines for depression patterns along roads: In certain preferred embodiments, the present invention provides a grinding machine for creating depression patterns in a surface such as asphalt or concrete. The depression pattern may be a rumble strip for alerting drivers who drift off a driving lane, or may be for other uses. Use of a depression...

20060154574 - Cmp pad having a radially alternating groove segment configuration: A polishing pad (104) having an annular polishing track (122) and including a plurality of grooves (148) that each traverse the polishing track. Each groove includes a plurality of flow control segments (CS1-CS3) and at least two discontinuities in slope (D1, D2) located within the polishing track....

20060154573 - Gentle chemical mechanical polishing (cmp) liftoff process: A method for chemical mechanical polishing (CMP) wafers having high aspect ratio surface topography. A wafer is positioned on a plate. A polishing pad is coupled to a platen. A polishing solution (e.g., slurry) is added between the polishing pad and the wafer. CMP is performed on the wafer by...

20060154572 - High-pressure polishing apparatus and method: A high-pressure polishing apparatus and method comprising a condenser having high-pressure nozzles for ejecting a solution on the polishing pad to perform a conditioning, thereby preventing damage to the wafer and destruction of the diamond condenser due to a larger force applied on the diamond condenser in order to obtain...

20060154575 - Method of making solar cell: A method of manufacturing a solar cell including a silicon wafer is provided. In certain example instances, the method may include flattening fine roughness existing on a side face of a silicon block or a silicon stack used for manufacturing the silicon wafer for use in the solar cell....

20060154576 - Sharpening apparatus: A sharpening apparatus (16) for a blade-like cutting implement. The sharpening apparatus has an elongate body (18) and a cutting edge extending widthwise across one end of the body (11) at a predetermined angle relative to the longitudinal axis of the body (11). The cutting edge is formed by an...

20060154577 - Method of producing polishing pad: A method of manufacturing a grooved polishing pad wherein a large number of grooves, extending parallel to each other, are fabricated at specific intervals on at least one of a front surface and a back surface of a polishing pad substrate through a groove cutting process on the polishing pad...

20060154578 - Baseball de-slicking apparatus and method: A baseball is desirably blasted with an abrasive material to attain a sufficient level of de-slicking. Baseballs are desirably delivered one at a time to a support and rotated while being sprayed with abrasive material from plural directions. Used abrasive material may be collected and recycled for reuse. Baseballs in...

20060154579 - Thermoplastic chemical mechanical polishing pad and method of manufacture: The present invention is directed, in general, to a chemical mechanical polishing pad comprising a closed-cell thermoplastic foam polishing body. The polishing body comprises an ethylene vinyl acetate block copolymer. The ethylene vinyl acetate block copolymer comprises a vinyl acetate content ranging from about 1 to about 18 wt %....

20060154580 - Flexible membrane for multi-chamber carrier head: A flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus has a central portion with an outer surface providing a substrate receiving surface, a perimeter portion for connecting the central portion to a base of the carrier head, and at least one flap extending...

20060154581 - Optical surface-finishing tool: An optical surface-finishing tool includes a rigid support (4) having a transverse end surface (13); an elastically-compressible interface (5) which is applied against the end surface (13) such as to cover same; and a flexible buffer (6) which can be applied against the optical surface (2), which is applied against...

20060154582 - Abrasive holder: An abrasive tool comprising of a base portion (2), having a foam layer (3) affixed to the abrasive tool base portion, and a plastic film layer (4) affixed, bonded or glued to the foam layer. This tool is adapted to receive an abrasive material layer (5) or sand paper or...

20060154583 - Grinding wheel: Grinding wheel for a floor grinding machine, comprising a metal wheel (1) with a first and a second flat surface. Diamond-containing grinding elements (11, 12) are arranged on the first flat surface. Grinding elements (11, 12), preferably diamond-containing, are also arranged on the second flat surface of the wheel (1)....

20060148381 - Pad assembly for electrochemical mechanical processing: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer...

20060148382 - Polishing apparatus: A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for...

20060148383 - Methods and systems for detecting a presence of blobs on a specimen during a polishing process: Systems and methods for detecting a presence of blobs on a specimen are provided. One method may include scanning measurement spots across a specimen during polishing of the specimen. The method may also include determining if the blobs are present on the specimen at the measurement spots. Each of the...

20060148384 - Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method: The present invention provides a polishing apparatus for a semiconductor wafer in which a slide member and a swing holding member are provided in a polishing member that is provided so as to block an opening in a head housing, a slide guide member and a ring member are provided...

20060148385 - Retaining structure for edge control during chemical-mechanical polishing: An improved design for a retaining ring for a chemical mechanical poling machine is described which provides superior flexibility and instantaneous in-situ control of the polishing rate in the edge region of a wafer. The design has a plurality of straight slurry delivery groves, angled in the direction of rotation...

20060148386 - Method and device for manufacturing substrate for magnetic disk, and method of manufacturing magnetic disk: A magnetic polishing method capable of easily and satisfactorily polishing the inner peripheral end face of a circular hole (1) at the center part of a disk substrate (2) even if the diameter of the circular hole is reduced. By this method, a large quantity of disk substrates with stable...

20060148387 - Vibration damping in chemical mechanical polishing system: A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity...

20060148388 - Belt grinder and attachment for grinding pipe ends: A belt grinder includes a motor, a driving disc, a contact disc, a grinding belt, and a housing, where the motor and the driving disc are moveable with respect to the contact disc in order to vary the distance between the axis of the contact disc and the axis of...

20060148389 - Adjustable abrading tool: An abrading tool, abrasive star and abrading kit, in which the abrading kit includes the abrasive star and the abrading tool. The abrading tool includes a threaded drive rod, a means for retaining an abrasive material about the threaded drive rod, an expandable support disposed about the threaded drive rod...

20060148390 - Abrasive article and methods of making same: A porous abrasive article that allows air and dust particles to pass through. The abrasive article has a screen abrasive and a porous attachment interface. The screen abrasive has an abrasive layer comprising a plurality of erectly oriented abrasive particles and at least one binder. The porous attachment interface cooperates...

20060148392 - Method of producing polishing pad: A method of producing a polishing pad having a polishing layer is characterized in that the polishing layer is produced by a photolithographic method including: forming a sheet molding from a curing composition containing at least an initiator and an energy ray-reactive compound to be cured with energy rays; exposing...

20060148391 - Polishing pad and cushion layer for polishing pad: A polishing pad includes at least a polishing layer and a cushion layer and is characterized in that the difference in hardness in Shore D hardness between the polishing layer and the cushion layer is 3 or more....

20060148393 - Polishing pad and cushion layer for polishing pad: A polishing pad includes a polishing layer having abrasive grains dispersed in a resin and is characterized in that the resin is a resin containing ionic groups in the range of 20 to 1500 eq/ton....