Abrading inventions 06/06

20060141906 - Hydrodynamic radial flux polishing and grinding tool for optical and semiconductor surfaces: A polishing tool useful for grinding and high precision, fine polishing of flat or curved optical surfaces, as well as for the optical flattening of semiconductor and metallic surfaces. The tool does not make contact with the surface to be polished and lacks moving parts; but produces a high velocity...

20060141908 - Method and apparatus for using a coolant fluid: A metal machining apparatus for removal of metal from a workpiece, that employs a laser-targeted coolant nozzle to apply coolant fluid to a machining tool, such as a grinding wheel, to remove metal from a workpiece. The laser-targeted coolant nozzle has a coolant nozzle body having a flow passage for...

20060141907 - Method for monitoring a cmp polishing method and arrangement for a cmp polishing method: The invention relates to a method for monitoring a CMP polishing method, a substrate being fixed in a mount, a polishing pad being fixed on a plate, a surface of the polishing pad being operatively connected to a surface of the substrate, the polishing pad and the substrate being moved...

20060141909 - Chemical mechanical polishing apparatus: A “black belt” phenomenon that may be caused by an eddy of a slurry may be prevented when a wafer is polished by a chemical mechanical polishing (CMP) apparatus that includes a polishing pad to be supplied with the slurry, a polishing head including a top ring adapted to hold...

20060141910 - Methods and systems for conditioning polishing pads: Methods for conditioning polishing pads that are to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes, include abrading at least a portion of a polishing surface with a conditioner including abrasive elements formed from a material that is etchable selectively with respect...

20060141911 - Device for the abrasive machining of surfaces of elements and in particular optical elements or workpieces: A device for abrasive machining of surfaces of components, comprising a tool (1) having an inlet (11) and an outlet (12); a supply unit for conveying to the inlet (11) a liquid in which abrasive agents are dissolved and which emerges from the outlet (12); and a positioning means which...

20060141912 - Magnetic flow switch, for aspirators in particular: A magnetic flow switch (1) is described that includes a body (2) defining a chamber (20) destined to have a fluid flow pass through it, an excitation magnet (4) placed in a shuttle (3) mounted such that it can slide within the chamber (20) of the body to pass from...

20060141913 - Wafer planarization composition and method of use: A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process....

20060141914 - Electric hand power tool: An electric hand power tool has a housing, an air-cooled electric motor which is accommodated in the housing, a tool which is driven by the electric motor a protective hood which at least partially covers the tool, the housing having a handle and an auxiliary handle for a two-hand guidance...

20060141915 - Modular sander-casing architecture: A sander-casing may include: a field housing to contain at least a motor, the field housing having an interface connectable to a random orbital sander (ROS) shroud and a quarter sheet sander (QSS) shroud. The ROS shroud can contain an ROS-type power transmission. The QSS shroud can contain a QSS-type...

20060141916 - Knife sharpener: The present disclosure concerns embodiments of an improved knife sharpener. In particular embodiments, the knife sharpener has an elongated sharpening member, which can be, for example, an abrasive sharpening rod. The sharpening rod can be made of any of various suitable materials, such as ceramic, porcelain, stone, diamond. The sharpening...

20060141917 - Method for removing trip hazards in concrete sidewalks: An apparatus for cutting a chamfer on an upper edge of a concrete slab includes a hub designed for installation on the threaded output spindle of an angle grinder, and a specially-modified diamond-grit-edged rotary blade which mounts on the hub. For a preferred embodiment of the hub, an attachment collar...

20060141918 - Endless abrasive belt and method of making the same: Endless abrasive belt useful for polishing or otherwise abrading surfaces....

20060135040 - Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates: The aim the invention is to machine the surface of objects using a universal device as economically as possible and in a significantly reduced amount of time, even in the event of process variations, material non-homogeneities etc., with high reproducible precision. The this end, the pressure distribution on the surface...

20060135042 - Multi-station disk finishing apparatus and method: Multi-disk processing system and method of continuous finishing of memory media disks for digital data storage systems in preparation for magnetic memory coating, comprising four main sub-systems: 1) multiple driven spindles mounted on a chassis, at 3, 6, 9 and 12 o'clock positions; 2) finishing tape head units mounted on...

20060135041 - Stonecutting apparatus and method using saw and water jet: An apparatus for cutting stone which utilizes both a circular saw and a water jet. Both the saw and the water jet are mounted on a gantry, which moves along tracks. All the parts are under the control of the CNC device. The saw is used for straight cuts and...

20060135044 - Grinding machine: In a cylindrical grinding machine for grinding a rotating cylindrical workpiece with a rotating grinding wheel, a wheel spindle for supporting the grinding wheel is divided at its axial mid portion into first and second spindle components, and respective ends on the sides opposite to the axial mid portion of...

20060135043 - Grinding method and grinding machine: In a grinding machine, a generally cylindrical workpiece having at least first and second grinding areas is ground by use of a grinding wheel supported by a wheel head. The first grinding area is first ground such that power consumed by the grinding machine is maintained at a first level....

20060135045 - Polishing compositions for reducing erosion in semiconductor wafers: The aqueous polishing composition is useful for polishing semiconductor substrates. The polishing solution comprises 0.001 to 2 wt % of a polyvinylalcohol copolymer, the polyvinylalcohol copolymer having a first component, a second component and a weight average molecular weight of 1,000 to 1,000,000 grams/mole, and the first component being 50...

20060135047 - Method and apparatus for clamping a substrate in a high pressure processing system: Pressure biased wafer holding of a semiconductor wafer is provided for use in high pressure processing. The use of vacuum chucking for holding a semiconductor wafer during processing is applied to high pressure systems. Adverse effects of high pressure biases are prevented by a valve arrangement that reduces or limits...

20060135046 - Multi-platen multi-slurry chemical mechanical polishing process: A multi-platen, multi-slurry chemical mechanical polishing method comprises providing a substrate having a surface that includes at least one nitride structure and an oxide layer atop the nitride structure, performing a first CMP process on the substrate using a first platen with a silica based slurry to remove a bulk...

20060135048 - Abrasive cleaning plant with single-block plastic booth and intergrated feeding and filtering device: An abrasive cleaning plant comprising a single-block plastic blasting booth (C) having a front wall, a rear wall, a top wall, a bottom wall, and side walls, wherein at least a portion of one of the side walls is openable by rotation on a hinge connecting the single-block blasting booth...

20060135049 - Millwork sanding sponge: The present invention relates to a hand-held abrasive article. In one embodiment, the hand-held abrasive article includes an elongated resilient body having a perpendicular cross-sectional surface. The cross-sectional surface of the resilient body includes at least one internal right angle, at least one internal acute angle, at least one internal...

20060135050 - Resilient structured sanding article: A resilient hand-held abrasive article suitable, for example, for woodworking, includes a plurality of separated raised abrasive surfaces to allow the article to more effectively conform to a contoured surface. A method of making such an abrasive article is also disclosed....

20060135051 - Polishing pad with removal features: The invention provides a polishing pad comprising a polishing element and an adhesive layer provided on the bottom surface of the polishing element for attaching the polishing element to a polishing device. To protect the adhesive layer and prevent unintentional adhering of the polishing element, the polishing pad is also...

20060128270 - Apparatus at a spinning room machine, especially a flat card, roller card, cleaner or the like, for processing, especially grinding and/or sharpening, a clothing: In a spinning room machine, especially a flat card, roller card or cleaner, an apparatus for processing, especially grinding and/or sharpening, a clothing on a roller has a processing device which is movable along a track. The spinning room machine has an electronic control and regulation device together with a...

20060128272 - Automated drill bit re-sharpening and verification system: A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a...

20060128271 - Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer: An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoint detection without lowering the polishing performance as well as methods for polishing of a semiconductor...

20060128273 - Methods and systems for conditioning planarizing pads used in planarizing substrates: Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by...

20060128274 - Process and device for grinding a profile of a workpiece: On a device for grinding the profile of a rotating workpiece (5), the rotating workpiece (5), arranged on a swivel table (6) for axial and transverse displacement with reference to the work spindle (4), is according to the invention positioned prior to grinding and relative to a swivel table axis...

20060128275 - Liquid honing machine and liquid honing method: A honing machine 1 is provided with a honing zone 5 for subjecting a work 2 to a liquid honing process and a washing zone 6 for subjecting the work 2 to which the liquid honing process was executed at the honing zone 5 to a washing process in a...

20060128277 - Apparatus and method for chemical-mechanical polishing (cmp) head having direct pneumatic wafer polishing pressure: A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the...

20060128276 - Carrier for double side polishing: In a carrier of the invention, a thick ring-shaped support frame is provided at an outer periphery of a carrier body in which a workpiece housing hole for holding a workpiece is opened. An outer periphery of the support frame is provided with a teeth portion for engaging with driving...

20060128278 - Polishing method, polishing device, glass substrate for magnetic recording medium, and magnetic recording medium: There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is polished with an...

20060128279 - Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces: Conditioning devices, systems and methods for conditioning a contact surface of a processing pad used in processing microelectronic workpieces. One embodiment of a conditioning device comprises an end-effector having a conditioning surface configured to engage the contact surface of the processing pad and a plurality of microstructures on the conditioning...

20060128280 - Grinding method and grinding device: To grind a peripheral surface of a rotated work (10), by a rotary grindstone (22) rotated by a wheel spindle 21, a rotary brush (40) is mounted to one side of the rotary grindstone (22), so that it is rotated along with the rotary grindstone (22). Subsequently to the grinding...

20060128281 - Glass pane machining device: A glass-plate working apparatus (1) includes a grinding means (7) for grinding a peripheral edge (6) of a glass plate (2); and a grinding supporting means (9) for supporting the glass plate (2) whose peripheral edge (6) is to be ground by the grinding means (7), wherein the grinding supporting...

20060128282 - Abrasive blasting device: An abrasive blasting device provides for both “cold” and “hot” processing. It includes a nozzle gun, an abrasive vessel, a batcher, an ejection-type mixer, a fuel tank, and a receiver. The nozzle gun includes a combustion chamber (108), a tubular element (114) for air/abrasive mixture feeding, a nozzle (128), swirlers...

20060128283 - Tool unit for ultrasonically assisted rotary machining: The tool unit for the ultrasonically assisted rotary machining of a workpiece comprises a converter (23) including at least one electroacoustic transducer (22) for generating and transmitting ultrasonic oscillations, a tool (30) that is coupled to the converter, and a holder (21) in which the converter including the transducer is...

20060128284 - Saw-setting machine for saw chain: It is to provide a saw chain sharpener such that while a saw chain is clamped at both ends by a holding plate, which is supported forward of a handy type electric motor, so as to stabilize its sharpening posture, a grinding tool such as a round rod-shaped grinding tool...

20060128285 - Tool for polishing the edge of a knife: A tool for polishing knife's edges, the tool (1) comprising two oppositely positioned and co-rotating rings of elongate honing studs (10), extended at intersecting directions forming an angle (α) wherein the knife's edge is inserted to be straightened by the rotating polishing tool....

20060128286 - Polishing apparatus: A polishing apparatus according to the present invention has a polishing surface (101), a top ring (1) for holding a semiconductor wafer (W), and a top ring shaft (11) for pressing the top ring (1) against the polishing surface (101). The top ring (1) has a retainer ring (3) for...

20060128287 - Support for sanding apparatus: A support stand (2) for a sanding apparatus having a housing, a motor, and a sanding belt of abrasive material adapted to be driven around a plurality of rollers by means of the motor is disclosed. The support stand (2) comprises a body portion (6) having recesses (10, 14, 18,...

20060128288 - Conditioner for chemical mechanical planarization pad: The present invention provides a conditioner for CMP pad required for global planarization of wafer to achieve high integration of a semiconductor element. The conditioner for CMP pad includes a metal substrate having abrasive particles fixed thereto, a plurality of abrasive particles fixed to the metal substrate, and a layer...

20060128289 - Protective cover for a hand-held cut-off machine: A protective cover of a hand-held cut-off machine has a cover member having an interior. At least two injection nozzles for spraying a cooling liquid into the interior are arranged on the cover member. A supply line for supplying the cooling liquid to the at least two injection nozzles is...

20060128290 - Cmp pad having an overlapping stepped groove arrangement: A polishing pad (104, 300) having an annular polishing track (152, 320) and a plurality of groups (160, 308) of grooves (112, 304) repeated circumferentially about the rotational center (128) of the pad. The plurality of grooves in each group are arranged along a trajectory (164, 312) in an offset...

20060128291 - Cmp polishing pad having grooves arranged to improve polishing medium utilization: A polishing pad (104, 304, 404, 504) having an annular polishing track (152, 312, 412, 512) for polishing a wafer (120, 316, 416, 516). A plurality of grooves (112, 320, 420, 520) are arranged within the wafer track so that they are spaced from one another both radially and circumferentially...

20060128292 - Abrasive cutting-off wheel for stationary use: An abrasive cutting-off wheel for stationary use is comprised of two partial abrasive wheels which are joined to each other. Each of these partial abrasive wheels comprises an interior supporting disk and a radially adjoining interior layer of abrasive grain. It further comprises an exterior layer of abrasive grain and...

20060116051 - Polishing pad with built-in optical sensor: An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The...

20060116052 - Workpiece grinding method: In a workpiece grinding method, a grinding allowance of a predetermined width (T) at at least an end surface portion 21 of a workpiece W is removed with a grinding wheel 10 (or 32) by rotating the workpiece W having a cylindrical portion 20 and the end surface portion 21...

20060116053 - Barrel polishing method and barrel polishing apparatus: Barrel polishing is effected while causing a mass (M) consisting of work and media (polishing material) to rotation-flow by rotating a rotary disk installed in the bottom of a polishing tank by a drive motor. A load on the drive motor for the rotary disk is preset as by a...

20060116056 - Apparatus and methods for polishing a semiconductor wafer: An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a...

20060116054 - Polishing body: An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case a large quantity of the...

20060116055 - Resin bond grindstone and method of manufacturing a semiconductor chip using the grindstone: The present invention provides a resin bond grindstone and method of manufacturing a semiconductor chip using the grindstone that provide a semiconductor device with high reliability even when a thickness of the semiconductor chip is thinned, and specifically provides followings: [1] A resin bond grindstone which comprises grains coated with...

20060116057 - Method and apparatus for cleaning a web-based chemical mechanical planarization system: A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid spray bar traverses the length of...

20060116058 - In-line sander: An in-line profile sander is disclosed. The in-line profile sander includes a sander housing configured to be grasped by a user. A plurality of interchangeable profile sanding pads can be mounted at a head of the housing. The sander includes an in-line oscillating mechanism for moving the profile sanding pads...

20060116059 - Fiber embedded polishing pad: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its...

20060116060 - Holder plate supporting grinding elements: A holder plate supporting grinding elements for grinding and/or polishing hard floor surfaces of stone, concrete, terrazzo or similar, has an element for mounting this on a driven grinding plate that rotates flat substantially parallel with the floor surface. The holder plate carries at least two grinding elements where each...