Abrading inventions 05/06

20060111018 - Method and apparatus for lapping gears: A method for lapping the gears of a gear set as well as a gear lapping system. The gear set generally includes a first gear in meshed engagement with a second gear, each of the first and second gears having a plurality of gear teeth each with drive and coast...

20060111019 - Toolholder: A toolholder (50) with a controllable critical angle, such as a lead, trailing, rake or clearance angles, includes a tool spindle (42a) for retaining the toolholder in a tool rest (42) of a machine tool. The machine tool (10) includes at least one linear axis, for example, three mutually perpendicular...

20060111020 - Crankshaft and camshaft grinder: An apparatus for grinding a surface of a nonstraight elongated workpiece has a frame, drives on the frame for rotating the workpiece about a longitudinal workpiece axis, and a guide defining a pivot axis offset from the workpiece axis on the frame. A hanging arm has an inner end juxtaposable...

20060111021 - Semiconductor wafer grinder: A grinder designed to provide an automatic grinding operation for the manufacture of a semiconductor device wafer. The grinder includes a base, a rotatable index table mounted to the base, and a grinding wheel assembly including a grinding wheel for grinding a flat surface on the wafer. The index table...

20060111022 - Apparatus and method for spraying maintenance enhancing material onto the periphery of a tubular member: Apparatus for spraying maintenance enhancing material onto the periphery of a tubular member positioned above a ground surface, that comprises means for generating spray onto the periphery of the tubular member; means for delivering maintenance enhancing material to the spray generating means; and means for positioning the spray generating means...

20060111023 - Method of polishing a large part and abrasive for use in the method: A surface to be polished of a large part is polished by projecting and colliding an abrasive comprising abrasive grains and an elastic petrochemical high polymer material having the specific gravity of 0.5 to 1.8 g/cm3 and elasticity of 10 to 200 ckg/cm2 or an elastic natural material, to the...

20060111024 - Cellulose-containing polishing compositions and methods relating thereto: An aqueous composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0.001 to 15 weight percent of a water soluble modified cellulose, non-saccaride water soluble polymer, 0 to 15 weight percent phosphorus...

20060111025 - Large part polishing apparatus and polishing method: The present invention comprises a turntable which holds a turbine part at a predetermined position, the turn table being rotatably supported by a support member, and rotated and driven by a driving motor, an abrasive feeding unit which feeds an abrasive particle having an elastic material as a core to...

20060111027 - Scissor sharpening machine: The scissor sharpening machine includes a honing disc with a curved blade guide and a blade clamp assembly which slides axially along the blade guide. The curvature of the blade guide corresponds to the conventional curvature along the lengths of the blades of a pair of high quality scissors or...

20060111026 - Tool sharpening apparatus: The invention relates to apparatus for use in the sharpening of tools and in particular to apparatus for the sharpening of selected ones of a plurality of different tools, said apparatus including a grinding wheel and a plurality of tool holders. At least one of the tool holders is connected...

20060111028 - Parallel surfae jig: A device for orienting a work surface of a workpiece. The device has a holding means having a receiving surface generally parallel to a plane of reference. The device also has a pulling means for orienting the work surface of the workpiece to the receiving surface of the holding means....

20060111029 - Bowling ball resurfacing apparatus: A bowling ball resurfacing apparatus comprises a housing, first and second vertical support rollers mounted to the housing for rotation about parallel vertical axes, each of the vertical support rollers adapted to make contact with the surface of the bowling ball at one lateral bottom side of the bowling ball,...

20060111030 - Quad rod jr knife sharpener: The apparatus is an improvement in utility from an old apparatus. This apparatus provides operator two different angles, one angle to be used for large knifes or honing the blade. The additional angle is used for thin blades and realignment of blade edges. An additional improvement is the addition of...

20060111031 - Abrasive grain and grindstone: An abrasive grain 1 includes a crystal defect CD in its crystal structure CS. The crystal defect CD is formed by a laser irradiation....

20060111032 - Finishing tool: A device for finishing a surface includes a body member with a contoured exterior surface and adapted to couple with a shaft. At least two surface portions, positioned at different radial distances from an axis of the body member, define the contoured exterior surface. Each surface portion includes an abrasive...

20060105675 - Grinding apparatus for buttons on rock drill bit: The present invention relates to grinding apparatus for grinding the hard metal inserts of rock drill bits, said grinding apparatus having a grinding machine carried on an support system that provides a feed pressure for said grinding machine during grinding, said grinding machine equipped with a grinding pin driven by...

20060105678 - Polishing apparatus and polishing method: A polishing apparatus can supply a polishing liquid uniformly and efficiently to a surface to be polished of a workpiece. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding a semiconductor wafer and pressing the semiconductor wafer against the polishing surface. The...

20060105676 - Robust signal processing algorithm for end-pointing chemical-mechanical polishing processes: A signal processing system has the detected mechanical, chemical, optical, electrical, or thermal signals generated during chemical-mechanical polishing (CMP) process collected, analyzed and differentiated with respect to time in-situ, in order to reveal the different stages during CMP for process control and end-pointing purposes. This control and/or end-pointing scheme may...

20060105677 - System and method for manufacturing magnetic heads: Systems and methods for the manufacture of a magnetic head. A first embodiment provides an apparatus for the manufacture of a magnetic head comprising a feedback control loop to terminate lapping of the magnetic head responsive to achieving a target signal to noise ratio for the magnetic head....

20060105679 - Substrate polishing apparatus: A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a...

20060105680 - Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers: A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wafer is being loaded onto or unloaded from one of the wafer carriers. The...

20060105681 - Grinding apparatus for grinding an out-of-round trunnion or tire for a rotary kiln: The present invention relates to a grinding apparatus for grinding an out-of-round trunnion tire for a rotating kiln. The present invention is mounted on a trunnion roller such that a tracking wheel and a grinder are in tangent with the out-of-round trunnion tire. The mounting bracket supports a means for...

20060105682 - System and method for monitoring and/or controlling a flow of a media: Some embodiments of the invention relate to a system and method for enhanced monitoring and/or controlling a flow of a media. For example, the flow of the media may be controlled and/or monitored over an enhanced range of flow rates; control over the flow of the media may be highly...

20060105683 - Nozzle design for generating fluid streams useful in the manufacture of microelectronic devices: Improved nozzle design that discharges fluid streams through a series of nozzle orifices distributed along a length of the nozzle. The present invention may be incorporated into a wide range of microelectronic device manufacturing processes and equipment types for which an array of process streams are desired for treating microelectronic...

20060105684 - Fiber polishing apparatus and method for field terminable optical connectors: A polishing apparatus for an optical fiber connector that includes an optical fiber ferrule and a connector housing, comprises a polishing puck having an aperture to permit passage of the ferrule therethrough and a mount to hold the connector housing at a predetermined angle. The polishing apparatus further includes a...

20060105685 - System and method for cmp having multi-pressure zone loading for improved edge and annular zone material removal control: In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the...

20060105686 - Platen structure of polishing apparatus for processing semiconductor wafer and method for exchanging polishing pad affixed to the same: A platen structure of a polishing apparatus for semiconductor wafer and a method for exchanging a polishing pad affixed to the same are provided in which the polishing pad supported by the platen is exchanged with convenience within a short time. The platen structure of the polishing apparatus in which...

20060105687 - Tool holder for power tool: A holder for holding a tool implement for use with a power tool having a drive output member. The holder includes a pair of first and second supports for connection to the output member, a clamp member located between the supports, and a cam supported between the first support and...

20060105688 - Workpiece support method and workpiece support device: There is provided a workpiece support device for use in machining a workpiece including: a securing support unit; and a following support unit. The securing support unit has a securing abutment member releasably positioned and secured at a desired position, and the securing abutment member abuts against the workpiece at...

20060099885 - Wear indication apparatus and method: Apparatus and method for monitoring the wear of a downhole tool, and providing indication of the degree of wear to an operator at the well surface. A pressurized fluid path within the cutting element matrix can exhibit a pressure drop when wear of the matrix progresses into the fluid path,...

20060099886 - Electronic die positioning device and method: An autocollimator is relied upon to orient an electronic die such that its frontside is parallel to a polishing surface. The polishing device is configured such that a beam of light that is projected by the autocollimator is able to reflect off of the backside surface of the die. Measurement...

20060099887 - Grinding jig set and grinding method: A grinding jig set comprising a combination of several jig units and a method for grinding a number of objects are provided. The method comprises a series of steps from arranging the objects to be ground on a grinding jig (a master plate) through removing the ground objects from the...

20060099888 - Abrasive, a method for manufacturing the abrasive, and a method for blast processng with the use of the abrasive: An abrasive, which makes it possible to polish a surface to be processed of a workpiece with a blast processing, and together therewith, can bear using for a long period of time or a plurality of times, and a method for blast processing with the abrasive are provided. The abrasive...

20060099889 - Elastic polishing tool and lens polishing method: An elastic polishing tool that comes into contact with a surface to be polished of a lens and rotates to polish the surface, includes: an elastic polishing body which has a cylindrical shape and whose shape can be changed according to the surface to be polished; and a polishing pad...

20060099890 - Simultaneous planarization of pole piece and coil materials for write head applications: A method for simultaneously planarizing to relatively equal smoothness a thin film magnetic head hardbaked resist structure having relatively low surface energy and one or more additional thin film magnetic head structures containing other materials having comparatively higher surface energy, such as copper, hardbaked resist, alumina and NiFe. The method...

20060099891 - Method of chemical mechanical polishing, and a pad provided therefore: In a chemical mechanical polishing for removing a barrier and subsequent buffing a polyurethane polishing pad is used which is composed of for removal a barrier and buffing after a bulk copper removal to the barrier in a chemical mechanical polishing of a copper film deposited on a surface of...

20060099892 - Substrate holding apparatus and polishing apparatus: The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and...

20060099893 - Retainer and wafer polishing apparatus: When a wafer is pressed on a rotating polishing pad and its surface is polished, a retainer retains the periphery of the wafer to prevent the wafer from being detached from the polishing pad. The retainer includes a first ring which surrounds the wafer and contacts the polishing pad and...

20060099894 - Multi-bladed razor cartridge sharpener: Apparatus for sharpening and or honing a multi-bladed razor cartridge including a sharpening member, a housing to secure the sharpening member. A soap solution dispenser provides a lubricant to the sharpening member to lubricate the razor and a housing to limit the travel of the razor on the sharpening member....

20060099895 - Composite tool insert: A tool insert comprises a substrate (10) having a support surface and a support ring extending laterally from the support surface. The support ring is sized to define a recess (14) within the confines thereof and a shelf about the periphery thereof. A layer (12) of ultra-hard abrasive material is...

20060094337 - Pad conditioner test apparatus and method: A test apparatus and method tests a pad conditioner of a chemical mechanical polishing apparatus. The pad conditioner test apparatus includes a main body having a conditioner mounting section that supports the pad conditioner, a conditioner head raising/lowering system that raises and lowers the head of the pad conditioner while...

20060094338 - Chemical mechanical polishing apparatus and chemical mechanical polishing method using the same: Polishing uniformity in a CMP process may be improved due to an improvement in the temperature uniformity of a polishing surface, when a wafer is polished by a CMP apparatus including a polishing head for holding the wafer, a platen, a polishing pad at a top of the platen so...

20060094339 - Handler for semiconductor singulation and method therefor: A water jet handler (200) has a loading location (205), a cutting location (210), and an unloading location (215); and two movable mounts (240 and a 245). As a first movable mount (240) receives a molded substrate at the loading location (205), and transport it to the cutting location (210),...

20060094341 - Polishing tool with several pressure zones: The invention refers to a polishing tool 1 for optical lenses 10 with at least one polishing pad 7 adaptable at least partially to the shape of a lens surface 10.1 of said lenses 10 and drivable by means of a drive shaft 3, said polishing pad 7 having a...

20060094340 - Process for manufacturing optical and semiconductor elements: A method for fabricating an array of precisely shaped and located shaped elements utilizes a precisely shaped patterned abrasive to form channels in a workpiece. One or more patterned abrasives contact and abrade along one or more intersecting axes to define the shaped elements. The shaped elements may include optical...

20060094342 - Monolithic rotating tool: A solution is presented for high speed rotating devices, in particular cutting tools, whereby the said rotating device (1) is made monolithic with its shaft and the bearing system, needed to support it during rotation, uses the surfaces of the rotating device (1) as bearing surfaces. In the preferred embodiment,...

20060094343 - Polishing machine: A polishing machine uses a polishing head having a movable pad to press a polishing tape for polishing beveled and edge parts of a disk-shaped object. A rotary shaft is connected to the polishing head in a direction of contact surface between the polishing tape and the object. A rotary-and-reciprocating...

20060094344 - Mist supply mechanism for rotary tool: A mist supply mechanism for supplying mist under pressure to a rotary tool 18 provided at a rotating shaft 10, and implementing cooling and/or lubricating of the rotary tool 18 during workpiece-machining is configured so that the rotary tool 10 is provided at a sleeve 16 of a necessary length...

20060094345 - Polishing pad, polishing apparatus having the same, and bonding apparatus: A plurality of projections and grooves are formed on a polishing member. The grooves are formed in grid pattern. A portion on which the grooves and the projections are formed (polishing portion) has a substantially circular shape in a plane view. Around the polishing portion, an outer peripheral portion having...