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Abrading April category listing, related patent applications 04/06

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
04/27/2006 > 10 patent applications in 9 patent subcategories. category listing, related patent applications

20060089086 - Working device and method for working a stack of plate-shaped elements: A working station for working vertical edges of a stack (9) of plate-shaped elements (10). The working station comprises a support (11) for supporting the stack (9) and a number of working devices (1, 2, 3, 4) that are each configured for being able to slide towards and away from...

20060089088 - Holding apparatus for an optical element: Holding apparatus for an optical element In a holding apparatus (1) for an optical element (2) that holds the optical element during an abrasive processing of the latter, the optical element (2) is in contact with a pressure piece (9) that is adapted to a force distribution to be expected...

20060089087 - Honing installation with several work stations: A honing installation for honing workpieces comprises a plurality of work stations, each work station being configured for performing at least one working step on a workpiece and at least part of the work station is set up as a honing station for performing at least one honing operation on...

20060089089 - Rotary table apparatus: A small-sized, lightweight rotary table apparatus is provided. The rotary table apparatus has: a support rest for rotatably supporting a rotary table; and a base for turnably supporting, in a cantilever fashion, the support rest by a shaft element, which is protrudingly formed on the support rest, being inserted into...

20060089090 - High pressure cleaning and decontamination system: Abrasive cleaning and decontamination methods and systems are disclosed. The methods and systems use a high pressure liquefied gas, such as carbon dioxide, which produces insignificant quantities of secondary waste. These principles of the invention exploit the properties of the relatively high triple point of CO2 in order to first...

20060089091 - Rotational processor with drive rollers: A rotational processor comprises an outer vessel and a plurality of inner vessels having an outer traction surface adapted for rolling contact with an inner surface of the outer vessel. A plurality of drive rollers drive the inner vessels about a center line of the outer vessel in rolling contact...

20060089092 - Retaining ring deflection control: A carrier head for chemical mechanical polishing of a substrate. The carrier head includes a carrier base, a retaining ring, and a junction connecting the carrier base to the retaining ring. The junction is configured such that vertical movement of the retaining ring is substantially restrained relative to the carrier...

20060089093 - Polyurethane urea polishing pad: The present invention relates to an article for altering a surface of a workpiece, or a polishing pad. In particular, the polishing pad includes a polyurethane urea material wherein at least a portion of the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane...

20060089094 - Polyurethane urea polishing pad: The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material...

20060089095 - Polyurethane urea polishing pad: The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material...

  
04/20/2006 > 10 patent applications in 9 patent subcategories. category listing, related patent applications

20060084364 - Combined apparatus for machining of articles, in particular in form of slabs: An apparatus for machining an article (L) in the form of a slab or the like comprises—in addition to a rotary tool (24) associated with a spindle (22)—a nozzle (26) ejecting water at very high pressure. Both the rotary tool and the nozzle are supported by a carriage (20) sliding...

20060084363 - Direct clamp tooling for robotic applications: A direct clamp robotic finishing system is provided including a robot, a gripper secured to the robot, and a pair of fingers secured to the gripper. A tray assembly is also provided for supporting a plurality of implants for picking up by the fingers. An implant reorientation station is provided...

20060084365 - Polishing pad: A polishing pad having a polishing layer which has specific composition and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 60° C. of 2 to 15 and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus...

20060084366 - Combination router-end mill cutter tool, edger with combination tool, and method of edging eyeglass lenses: The present invention relates to a tool for shaping and polishing an edge of an eyeglass lens. The tool includes a longitudinally extending body rotatable on the axis thereof, with a proximal portion and a distal portion. A first cutter extends axially and radially from the distal portion, and includes...

20060084367 - Method of sharpening cutting edges: The invention is directed to a method for polishing a cutting edge on a cutting instrument, comprising contacting a cutting edge of a cutting instrument with a polishing pad and a chemical-mechanical polishing composition comprising particles of an abrasive, and a liquid carrier, wherein the abrasive is suspended in the...

20060084368 - Burr removal apparatus: Apparatus for removing a burr from an aperture in a workpiece, using a rotating deburring tool having a flexible or partly flexible shaft, an abrasive mechanism that rotates on the shaft and a collar that protects the workpiece from abrasion when the abrasive mechanism is being positioned for deburring. Optionally,...

20060084369 - Polishing apparatus: A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on...

20060084370 - Overload protection device and machine tool having such overload protection device: A portable device having an overload protection device for motor-operated tools has a drive motor, a drive shaft connected to the drive motor and driven in rotation by the drive motor, and an output shaft for driving a cutting tool, wherein the output shaft is arranged substantially perpendicularly to the...

20060084371 - Wafer chuck: The influence of the slurry generated when polishing an orientation notch and the like is minimized. The holding members 10, 20 for holding the outer periphery of the wafer W and the driving mechanism 30 for driving the holding members 10, 20 all together in the closing direction are integrally...

20060084372 - Grinding wheel replacement fixture: An apparatus to facilitate the replacement of a grinding wheel secured to a mounting plate. The apparatus includes a frame having two spaced-apart uprights. An elongated support bar extends between and is pivotally mounted to the uprights while a mounting plate of a grinding wheel is detachably secured to the...

  
04/13/2006 > 10 patent applications in 7 patent subcategories. category listing, related patent applications

20060079154 - Chemical mechanical polishing process for manufacturing semiconductor devices: A chemical-mechanical polishing (CMP) process for the manufacturing of semiconductor devices is disclosed. The process includes removing a first portion of a first layer of interconnect materials using a first platen and a first slurry, removing a second portion of the first layer using a second platen and a second...

20060079156 - Method for processing a substrate using multiple fluid distributions on a polishing surface: A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, a polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has an outlet of the delivery tube coupled...

20060079155 - Wafer grinding method: A wafer grinding method for grinding the surface to be ground of a wafer having an arcuatedly chamfered outer peripheral surface, comprising an outer peripheral portion removal step for removing the outer peripheral portion of the wafer by applying a laser beam from one surface side of the wafer along...

20060079157 - Apparatus and method for manufacturing or working optical elements and/or optical forming elements, and such element: The invention relates to an apparatus for forming or working optical elements and/or optical forming elements (1) comprising a working apparatus (18) for forming surfaces of form parts by machining or an abrasive technique, wherein at least one measuring device (17) is provided for measuring changes in form and/or surface...

20060079158 - Wall scrubber for blown insulation: An insulation system comprising: a supply of material having discrete elements; an applicator assembly for installation of the material having discrete elements to a surface; and a scrubber for finishing the face of the material. In one embodiment, the scrubber includes: a vacuum conduit; a planer assembly attached to the...

20060079159 - Chemical mechanical polish with multi-zone abrasive-containing matrix: Chemical mechanical polish (CMP) devices, CMP systems, methods of CMP, and methods of manufacturing CMP devices. A CMP device comprises a plurality of zones, with each zone having a matrix of fixed abrasive features disposed therein. The abrasive-containing matrix within each zone has material removal properties that differ from the...

20060079160 - Polishing pad conditioner with shaped abrasive patterns and channels: A polishing pad conditioner comprises a base and a pad conditioning face on the base. The conditioning face comprises central and peripheral regions. Abrasive spokes having a substantially constant width of abrasive particles, extend from the central to the peripheral region. The spokes are symmetric and radially spaced apart from...

20060079161 - Grinding plate for an electric hand grinder, and method of producing the same: A grinding plate for an electric hand grinder has a plate member having an upper plate surface with an upper plate edge, a lower plate surface with a lower plate edge for placement of a grinding means and extending at least partially beyond the upper plate edge, and a side...

20060079162 - Cmp conditioner: A CMP conditioner is provided in which diamond grit that is adhered to a conditioning surface so as to face and be in contact with a polishing pad of a CMP apparatus is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel with the...

20060079163 - Surface-treatment wheel: A surface-treatment wheel has an inner element rotatable about an axis, and an outer ring fixed rotationally on the inner element, centered on the axis, and formed unitarily with an annular array of radially outwardly projecting teeth defining outwardly open notches, and respective angularly extending webs or ridges in the...

  
04/06/2006 > 16 patent applications in 11 patent subcategories. category listing, related patent applications

20060073767 - Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces: Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for polishing a workpiece includes determining an estimated frequency of serial defects in a workpiece, pressing the workpiece against a polishing pad and moving the workpiece relative to the pad....

20060073764 - Device and method for machine control: A data set (D) is provided for machine control of a grinding machine to determine time-efficient, collision-free travel paths whereby said data set has a collision parameter of “0” or “1” in each separate coordination point (X, Y, Z, A) as well as for each combination of the separated tool...

20060073765 - Grinding process and apparatus with arrangement for grinding with constant grinding load: A process of grinding a surface of a workpiece, by a grinding tool rotated about its axis. The process includes a grinding step of grinding the workpiece surface, by pressing at least one of the grinding tool and the workpiece against the other of the grinding tool and the workpiece,...

20060073766 - Magnetic spindle for machine tool: A spindle for a machine tool comprising a outer spindle portion and an inner spindle portion with each of the outer spindle portion and the inner spindle portion being rotatable relative to one another about the same axis. The outer spindle portion and the inner spindle portion each include a...

20060073768 - Conductive pad design modification for better wafer-pad contact: An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface....

20060073769 - Polishing method: A polishing method includes the steps of: (a) polishing a to-be-polished object by moving an abrasive cloth relative to the to-be-polished object while pressing the to-be-polished object against the abrasive cloth; and (b) pressing a dressing member against the abrasive cloth moving relative to the to-be-polished object with the to-be-polished...

20060073770 - Vapor deposition crucible: A polishing apparatus includes a polishing jig. The polishing jig includes an elastic balloon member, a fixture, and a fluid supply portion. The fixture airtightly closes the rear opening portion of the balloon member. The fluid supply portion supplies a fluid into a space formed by the fixture and balloon...

20060073771 - Method and device for producing ophthalmic lenses and other shaped bodies with optically active surfaces: The invention concerns a method for producing ophthalmic lenses that uses plastic blanks in the form of flat, round discs. The outer edge of said plastic blanks is clamped and the desired final surface geometry and surface quality of the front faces of the lens are subsequently produced by a...

20060073772 - Eyeglass lens processing apparatus: An eyeglass lens processing apparatus for processing a lens to fit the lens into a rim, includes: an edge measurement portion that measures a path of an edge position of the chucked lens based on a 2-D outline shape is a projection shape of the rum in its warp direction...

20060073774 - Cmp pad dresser with oriented particles and associated methods: CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear....

20060073773 - High pressure pad conditioning: An apparatus for conditioning a polishing pad. A turntable is mounted to a frame, where the turntable is adapted to receive and rotate the polishing pad. A conditioning head is also mounted to the frame, where the conditioning head is adapted to spray a liquid from the conditioning head against...

20060073775 - Process for artificially ageing blocks: An apparatus for artificially aging blocks such as concrete blocks, vitrified bricks and natural stones, having the following features. An underlying surface, on which the blocks can be placed in such a way that their surface to be worked and the adjoining edges are exposed. Essentially freely movable distressing bodies...

20060073776 - Tool holder for a grinding machine: A tool assembly for a grinding machine that supports a tool and is separately and easily removed from the grinding machine to change tools. The grinding machine includes one or more grinding heads that support a plurality of the tool assemblies. The grinding heads include ring members and the tool...

20060073778 - Drywall sander: The present invention provides an adjustable drywall sander capable of imparting more than one type of motion. In an exemplary embodiment, the sander includes a power unit with a motor and a sanding assembly coupled to the power unit. A telescopic support arm assembly is coupled to the sanding assembly...

20060073777 - Pole and support assembly for an orbital sander: An assembly attachable to an orbital sander of the type having a dust extractor containing an exhaust outlet, the assembly comprising mounting means to allow an extension pole to be attached to the assembly, the extension pole being substantially hollow and defining an internal exhaust passageway, and a conduit extending...

20060073779 - Knife sharpener: A knife sharpener has at least two sharpening strips. The sharpening strips are arranged to adjoin each other in the width direction and intersect with each other. The sharpening strips are elastically deformable and include spread portions, respectively. The spread portions stretch from the intersecting point to one ends of...

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