Abrading inventions 03/06

20060068683 - Machining apparatus using a rotary machine tool to machine a workpiece: A machining apparatus includes a rotary machine tool for machining a workpiece. A nozzle jets a coolant for the rotary machine tool. Information which changes based on a position of the nozzle is obtained. The nozzle is moved based on the information obtained....

20060068682 - Method and system of using offset gage for cmp polishing pad alignment and adjustment: A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a...

20060068684 - Polishing method and polishing system: A polishing method includes supplying a slurry onto a pad disposed above a turntable while rotating the turntable, and polishing a workpiece disposed on the pad by pressing the workpiece to the pad, and detecting an ion concentration of a specific ion included in the slurry on the pad by...

20060068681 - Wafer polishing method and apparatus: The present invention provides a wafer polishing method and a polishing apparatus which are capable of preventing peripheral sags of a wafer due to polishing and then manufacturing the wafer, especially an SOI wafer at a high flatness level. There is provided a wafer polishing method using a polishing apparatus...

20060068685 - In-line contiguous resistive lapping guide for magnetic sensors: An in-line lapping guide uses a contiguous resistor in a cavity to separate a lithographically-defined sensor from the in-line lapping guide. As lapping proceeds through the cavity toward the sensor, the resistance across the sensor leads increases to a specific target, thereby indicating proximity to the sensor itself. The contiguous...

20060068686 - Track supported bore finishing device: A bore honing device comprising a support assembly including first and second end support elements connected by a base support which supports an axial guide track. A trolley engaging with the guide track and the trolley being movable along the guide track for guide movement of a bore honing tool...

20060068687 - Apparatus for dry footing and sanding ceramic pieces and method of using same: An apparatus for removing paint and dipping glaze from ceramic pieces before they are fired includes a support having an opening passing through it. Located in the opening is a rigid carrier which air can readily pass through. The carrier supports a porous, abrasive pad. A vacuum device attached to...

20060068688 - Manual power grinder, in particular a battery-powered manual power grinder: A manual power grinder has a housing, a motor received in the housing, a grinding disc driven by the motor and located on an underside of the motor; a drive shaft arranged so that said drive shaft and the motor are located parallel to one another and vertically to the...

20060068689 - Manual power grinder, in particular a battery-powered manual power grinder: A manual power grinder has a housing, a motor received in the housing, a grinding disc driven by the motor and located on an underside of the motor; a drive shaft arranged so that said drive shaft and the motor are located parallel to one another and vertically to the...

20060068690 - Cover device for a power tool: A cover device for partially covering a front, in an axial direction, side of a disc-shaped working tool (10) of a power tool includes a bearing element (22) securable on the shielding member (12), which partially radially covers the working tool (10), and having a bearing surface (28) abutting, at...

20060068691 - Abrading tools with individually controllable grit and method of making the same: A replaceable superabrasive tool insert for use in an abrading tool body includes an attachable shank, having a working end and an attachment end. At least one superabrasive particle is individually attached to the shank at the working end of the shank to provide an abrading interface between the shank...

20060057939 - Grinding method of a workpiece and grinding apparatus: An adaptive work table-reciprocation control system and method that can reduce a grinding time. The system uses a vibration sensor head installed on a chuck surface in the vicinity of the workpiece to detect a vibration signal emitted from the contact zone between the grinding wheel and the workpiece. When...

20060057940 - Polishing apparatus and method for producing semiconductors using the apparatus: The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence...

20060057941 - Machine for machining elongate workpieces provided with cutting teeth, in particular for grinding bandsaw blades: furthermore the workpiece-guiding device guiding the workpiece (14) along a predetermined guide path to bring about the desired position by means of the feed device (38), and the workpiece-fixing device (42) fixing the workpiece on reaching the desired position, there is provided a common central machine block (18), on which...

20060057943 - Ceria-based polish processes, and ceria-based slurries: By adding silica to ceria-based CMP slurries the polish process starts much faster than without silica thereby eliminating dead time in the polish process and eliminating process instability caused by changes in the dead time with operating conditions. A slurry for performing chemical mechanical polishing (CMP) of patterned oxides (e.g.,...

20060057944 - Chemical mechanical polishing process: A high throughput chemical mechanical polishing process is disclosed. A substrate having thereon a top bulk metal layer and a lower barrier layer is prepared. The top bulk metal layer is polished at a substantial constant removal rate to expose the barrier layer by utilizing a first platen and first...

20060057945 - Chemical mechanical polishing process: A first substrate and second substrate both having thereon a top bulk metal layer and a lower barrier layer are prepared. The first substrate is first loaded onto a first platen of a CMP tool, and then an upper portion of the top bulk metal layer of the first substrate...

20060057942 - Polishing apparatus, polishing head and polishing method: A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery...

20060057946 - Apparatus and method for sharpening tool blades: A sharpening device for the blade of a tool such as a chisel or plane is in two parts. The first is a jig into which the blade is inserted with its tapered end projecting some distance beyond the jig. This distance is related to the angle to which the...

20060057947 - Apparatus for chemical mechanical polishing: Apparatus for chemical mechanical polishing are disclosed. A disclosed apparatus includes a polishing station having a polishing pad, a gas supplier to generate pressurized gas to press a wafer toward the polishing pad, and a polishing head assembly including a planar member having a plurality of fine holes in communication...

20060057948 - Pneumatic grinder with easily replacing grinding disc: A pneumatic grinder with easily replacing grinding disc, including: a main body in which a rotary shaft is eccentrically pivotally connected with and is driven by a drive shaft of the pneumatic grinder, a bottom end of the rotary shaft being for mounting a grinding disc; a rotary member fixedly...

20060052036 - System and method detecting malfunction of pad conditioner in polishing apparatus: A system and method adapted to detect a malfunction related to a pad conditioner in a polishing apparatus are disclosed. The pad conditioner includes a conditioning pad seated on a conditioner head and a drive motor rotating the conditioner head. The system also comprises a current sensor connected to the...

20060052037 - Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus: The vacuum suction holding apparatus of the present invention has a vacuum duct which is disposed inside a polishing head, with one end of this vacuum duct being opened in the attachment surface and the other end thereof being connected to a vacuum source. A polishing body is held by...

20060052038 - Machine for superfinishing by honing: A honing machine for super finishing workpieces, e.g. by honing using a tool spindle (7), can be rotatably driven and can receive a tool. A motor rotates the tool spindle, the tool spindle (12) being arranged on a carriage (12), which can be displaced on a machine frame (16), by...

20060052039 - Method of and apparatus for magnetic-abrasive machining of wafers: A method of magnetic-abrasive machining of parts has the steps of supporting a part, generating a magnetic field by magnetic means located at one side of the part, placing a magnetic-abrasive powder on a surface located at another, opposite side of the part, so that the magnetic-abrasive powder is attracted...

20060052040 - Method for manufacturing microporous cmp materials having controlled pore size: A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to produce an interpenetrating polymeric network comprising a...

20060052041 - Electri portable power tool: A manually operated electric machine tool for a disk-shaped rotating tool (18), having a machine housing (11) from which a drive spindle (12) for the tool (18) protrudes and on which a hollow cylindrical collar (15) is embodied coaxial to the drive spindle (12), and having a guard (20) that...

20060046617 - Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups: An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups are located between the object carriers....

20060046618 - Methods and systems for determining physical parameters of features on microfeature workpieces: Methods and systems for determining physical parameters of features on microfeature workpieces. In one embodiment, a method includes directing a substantially coherent probe beam at a selected area of a feature on the microfeature workpiece to produce a reflected probe beam having phase information of different points within the selected...

20060046619 - Polishing pad conditioner and monitoring method therefor: A polishing pad conditioner for a chemical mechanical polishing apparatus and real-time monitoring method thereof. A conditioning head is supported for rotation at one end of a transverse beam. A drive assembly is coupled to the conditioning head to drive downward force to the conditioning head, and at least one...

20060046620 - Process for forming spherical components: A process is disclosed for forming a spherical component using a centrifugal processing machine. The process includes the steps of providing a component having an initial shape with at least a portion that is non-spherical, placing the component into a container in the centrifugal processor, adding a first stage abrasive...

20060046622 - Polishing pad with microporous regions: The invention provides a polishing pad for chemical-mechanical polishing comprising a polymeric material comprising two or more adjacent regions, wherein the regions have the same polymer formulation and the transition between the regions does not include a structurally distinct boundary. In a first embodiment, a first region and a second...

20060046621 - Retaining ring structure for edge control during chemical-mechanical polishing: The retaining ring has a plurality of slurry channels wherein each alternate channel is recessed away from the inner circumference of the pad contacting surface forming a recess which extends upward from the bottom surface sufficient to prevent contact of the retaining ring with the polishing pad. Each recess curves...

20060046623 - Method and apparatus for reduced wear polishing pad conditioning: Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head...

20060046624 - Method for manufacturing grindstone corrector and grindstone, and grindstone corrector, and grindstone: The present invention is to increase the flatness of the correcting surface of a grindstone corrector and the grinding surface of the grindstone, thereby enabling to give excellent sharpness to a cutting tool or the like. The present invention is characterized in that a plate-glass is used as a base...

20060046625 - Debris collecting attachment for machine tool: An apparatus for collecting dust and debris generated by a machine tool includes a base member configured to be removably attachable to the machine tool, a rotatable member configured to rotate within the base member, a debris channel formed in the base member, and a debris-directing structure attached to the...

20060046626 - Optimized grooving structure for a cmp polishing pad: A polishing pad for a chemical mechanical polishing has a body rotatable in a predetermined direction and having a working surface, the working surface being provided with grooves, the grooves being formed so that over the course of a single revolution of the pad said grooves extend in all directions...

20060046629 - Grinding device: Grinding device and process of forming grinding device. Grinding device includes a grinding belt and a flexible substrate body. The grinding belt is mounted on the flexible substrate body in one piece and the flexible substrate body is detachably attachable to a drive device. The instant abstract is neither intended...

20060046627 - Method of improving planarization of urethane polishing pads, and urethane polishing pad produced by the same: For improving planarization of urethane polishing pads, at least one layer of the pad has a base resin and an isocyanate with a concentration within a range of 6.5-11.0 weight percent to obtain a high planarization property....

20060046628 - Stacked polyurethane polishing pad and method of producing the same: A polishing pad has a sublayer; a top layer attached to the sublayer, the sublayer having a modulus of elasticity between 300 and 5000 psi and a compressibility of less than 30% at 73 psi, wherein the top pad has a modulus of elasticity which is greater than the modulus...