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USPTO Class 451 | Browse by Industry: Previous - Next | All 02/2006 | Recent | 08: Jun | May | Apr | Mar | Feb | Jan | | 07: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | | 06: Dec | Nov | Oct | Sep | Aug | Jul | Jun | May | Apr | Mar | Feb | Jan | Abrading inventions 02/06Recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.Listing format for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 02/23/2006 > 18 patent applications in 11 patent subcategories. 20060040587 - Automatic sharpening system for ice-skates: A method is for using a skate-grinding device. The method provides an automatic sharpening system (10) that has grip members (14, 16) and a grinding wheel (28). A blade (18) of a skate (20) is inserted into a groove (19). The system is turned on. A motor (44) rotates the... 20060040585 - Method and apparatus for abrasive circular machining: For the machining of a workpiece (18) rotating about a workpiece axis, a first abrasive tool (20), which rotates about a first tool axis, and the workpiece (18) are advanced towards one another, in order to machine a first workpiece face in a first abrasive operation. Further, a second abrasive... 20060040584 - Method and apparatus for grinding: Apparatus for high speed grinding includes a diamond-bonded abrasive wheel, a drive mechanism for mounting and rotating the grinding wheel at peripheral speeds up to approximately 200 m/s, and a liquid coolant supply system including a delivery system for directing liquid coolant to the point of grinding contact.... 20060040586 - Method and apparatus for polishing a semiconductor device: A method and an apparatus for polishing a semiconductor wafer are provided. An initial thickness of the semiconductor wafer is actually measured to obtain a measured initial thickness value. First and second inter-positions are then set or determined with reference to the measured initial thickness value. The first and second... 20060040588 - Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same: Polishing pads, planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies. The polishing pads, for example, can be web-format pads, and the planarizing machines can be web-format machines. In a typical application, the web-format machines have a pad advancing mechanism and stationary table with a first... 20060040589 - Double sided polishing machine: Double-sided polishing machine with an upper and a lower working disc, each comprising a polishing disc and a carrier disc. The working disc are co-axially arranged and rotatable relative to each other, a polishing gap being formed between the polishing discs. Said workpieces are machined in the polishing gap. A... 20060040590 - Contour follower: A contour follower includes a plurality of sensors spaced around a waterjet nozzle, each of the sensors being configured to measure a distance between a working surface and a first plane, perpendicular to a longitudinal axis of the nozzle. The sensors may include hall-effect sensors lying in the first plane... 20060040594 - Apparatus and method for fabricating liquid crystal display panel: An apparatus and method for fabricating a liquid crystal display panel are disclosed. In case of the single mode that liquid crystal display panels are fabricated with the same size on a large glass substrate, defective unit liquid crystal display panels are kept and discarded not to proceed with a... 20060040593 - Method for polishing silicon carbide crystal substrate: A method for polishing a silicon carbide crystal substrate according to the present invention includes a polishing process of polishing a silicon carbide crystal substrate having a surface roughness Rz of at most 50 μm, using an abrasive solution containing abrasive particles made of boron carbide. Accordingly, it is possible,... 20060040591 - Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods: Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods are disclosed. A method in accordance with one embodiment of the invention includes disposing a polishing liquid on a polishing surface of a microfeature workpiece polishing pad. The polishing pad can include a matrix material... 20060040592 - Tool and process for chrome plating a vehicle wheel surface: A cutting tool having a crystalline tip is pressed with a uniform pressure against the outboard surface of a vehicle wheel as the wheel is rotated. The smoothed wheel surface is then chrome plated to provide a cosmetic finish to the wheel face.... 20060040595 - Method and system for chemical mechanical polishing pad cleaning: In one embodiment, a method for cleaning a chemical mechanical polishing (CMP) pad is provided. The CMP pad surface has a residue thereon. Chemicals are applied onto the surface of the CMP pad and the pad surface is rinsed so as to substantially remove by-product produced by the chemicals. A... 20060040596 - Abrasive and dust separator: Provided is a centrifuge media separator for separating blast particulate from fine particulate carried by air flowing from a blast cabinet and through the media separator. The centrifuge media separator comprises an upper panel, a lower panel, and an outer wall. The upper panel has a central opening formed therein.... 20060040597 - Grinding or polishing arrangement: A grinding or polishing machine or device having a grinding or polishing disc for grinding or polishing a work piece for the condition of the work piece placed against the lower surface of the grinding or polishing disc. The grinding or polishing disc has a plurality of slots extending therethrough... 20060040598 - Precision sharpener tool: A precision sharpening tool is disclosed, having an opposing sharpening elements arranged to form a generally “V” shaped sharpening slot and first and second elongate guide members arranged on opposite sides of the sharpening slot which comprise mating toothed spur gears arranged so that turning the guide pin element of... 20060040599 - Intermediate and assembly assistance components for fluid driven tools and tools incorporating the same: A flow guide configured for insertion in a cavity defined between an outer housing and a nested inner motor housing of a fluid driven tool and a tool incorporating the same. The flow guide has a longitudinal axis and includes at least two longitudinal portions disposed parallel to the longitudinal... 20060040600 - Precision sharpener tool: A precision sharpening tool is disclosed, having opposing sharpening elements arranged to form a generally “V” shaped sharpening slot and first and second guide members arranged on opposite sides of the sharpening slot which comprise tensioned spring means arranged to urge a guiding surface against a side of a blade... 20060040601 - Drum grinding wheel: A drum grinding wheel includes an elongated drum configured for coaxial engagement with a spindle of a grinding machine. An exterior surface of the drum extends parallel to a central axis, and a plurality of removable cutters are removably fastened to the exterior surface. Each of the cutters has a... 02/16/2006 > 12 patent applications in 10 patent subcategories.20060035564 - Fine force actuator assembly for chemical mechanical polishing apparatuses: A polishing apparatus (10) for polishing a device (12) with a polishing pad (48) includes a pad holder (50) and an actuator assembly (432). The pad holder (50) retains the polishing pad (48). The actuator assembly (432) includes a plurality of spaced apart actuators (438F) (438S) (438T) that are coupled... 20060035563 - Method, apparatus and system for use in processing wafers: The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end... 20060035562 - System and a method for polishing optical connectors: A polishing system for polishing optical connectors includes at least one polishing station having a region of polishing film overlying a substrate block, and a polishing fixture (200). The polishing fixture has connector mounting holes (204) for receiving optical connectors and a working liquid supply arrangement including working liquid release... 20060035565 - Grinding wheel monitoring: A method of monitoring the wear of a grinding wheel comprises the steps of measuring the force exerted between the wheel and a workpiece, measured normal to the grinding face of the wheel at the point of contact between the wheel and workpiece, and generating a warning signal when the... 20060035566 - Superabrasive tool: A tool for use in an abrasive machining process has a body extending along a central longitudinal axis from a first end to a tip end. An abrasive material is located on the tip end. A central recess is formed in the tip end.... 20060035567 - Process for removing inclusions present in a welding seam and device for executing said process: A process for removing inclusions (6), in particular silicates, present in the surface region of a welding seam (3), which is manufactured using shielding gas and which joins metallic components (4) to one another is designed in such a manner that the welding seam (3) is impinged by several jets... 20060035568 - Polishing pad conditioners having abrasives and brush elements, and associated systems and methods: Systems and methods for conditioning polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a polishing support configured to carry a microfeature workpiece polishing pad, and a conditioner positioned at least proximate to the support to condition a polishing pad carried by the support.... 20060035569 - Integrated system for processing semiconductor wafers: An integrated system for processing a plurality of wafers, having a conductive front surface, is provided. The system includes a plurality of processing subsystems for depositing on or removing metal from the front surfaces of the wafers. Each processing subsystem includes a process chamber and a cleaning chamber. The system... 20060035570 - Abrasivejet cutting head with back-flow prevention valve: An abrasivejet cutting head is disclosed that includes a valve assembly for presenting back-flow to the abrasive hopper of abrasive-laden fluid from the cutting head when the discharge path for the abrasivejet becomes clogged or otherwise blocked. The valve assembly is positioned within the abrasive line to conduct abrasive from... 20060035571 - Polishing apparatus: An upper polishing plate is moved downward until facing a lower polishing plate to polish a work piece. The upper polishing plate is rotated in a horizontal plane together with a first elastic member, a second elastic member, an outer member and a connecting member. A pressure difference between a... 20060035572 - Configuration for knife sharpeners that rotationally stabilizes them and knife sharpeners that conform to it: My invention is a configuration or layout for the pull-through type of knife sharpener that rotationally-stabilizes them during use as well as the sharpeners that incorporate this improvement. The improvement applies to the portable counter-top sharpeners that were primarily designed for sharpening knives. These sharpeners consist of a base with... 20060035573 - Polishing pad and method of making same: An article or polishing pad for altering a surface of a work piece includes a polymer matrix created by reaction injection molding of size controlled gas bubbles within a polyurethane matrix. The proposed liquid urethane precursor is first injected into an actuated mold and cured. The molded product is then... 02/09/2006 > 10 patent applications in 5 patent subcategories.20060030240 - Method and apparatus for planarizing microelectronic workpieces: Planarizing machines and methods for accurately planarizing microelectronic workpieces. Several embodiments of the planarizing machines produce a planar surface at a desired endpoint in the microelectronic workpieces by (a) quickly reducing variances on the surface of the workpiece using a planarizing medium that removes topographical features but has a low... 20060030246 - Buffing head and method for reconditioning an optical disc: A buffing head (34) includes a rotary element (36) for retaining an optical disc (20) and causing the disc (20) to rotate at a first speed. A buffing element (38) contacts a work surface (30) of the optical disc (20), and rotation of the disc (20) enables corresponding movement of... 20060030245 - Grindstone and method for producing optical element: A grindstone 1 has a pedestal 2 and an abrasive-grain layer 9 provided on the pedestal 2. The abrasive-grain layer 9 is a plating film which contains abrasive grains. An intermediate layer 7 which has physical properties different from those of the abrasive-grain layer 9 is provided between the abrasive-grain... 20060030241 - Pad backer and cmp process using the same: A pad backer is described, comprising a backing plate, an elastomer layer and a pad backing ring. The elastomer layer has a bottom surface bonded to the backing plate and an upper surface with a protrudent part at the edge portion thereof. The pad backing ring has an inner bottom... 20060030243 - Polishing composition: A polishing composition containing an abrasive and water, wherein the polishing composition has a pH of from 0.1 to 7, and satisfies the following conditions: (1) that the number of polishing particles having sizes of 0.56 μm or more and less than 1 μm is 500,000 or less per 1... 20060030242 - Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods: Systems and methods for beveling microfeature workpiece edges are disclosed. A system in accordance with one embodiment is configured to remove material from a microfeature workpiece having a first face, a second face facing opposite from the first face, an edge surface between the first and second faces, and an... 20060030244 - Substrate polishing apparatus: A chemical mechanical polishing apparatus includes a rotating plate on which a substrate received, and a polishing pad which moves across the substrate as it rotates on the plate to polish the substrate. The load of the pad against the substrate, and the rotary speed of the plate, may be... 20060030247 - Cleaning sheet and method for a probe: A cleaning sheet has a base sheet, a foamed layer of a porous material on the base sheet and a polishing layer formed on the foamed layer. The foamed layer includes non-fibrous abrading particles and air bubbles. Such a cleaning sheet may be produced by preparing a paint having air... 20060030248 - Handheld skate sharpener: The invention provides for a powered hand held apparatus for sharpening ice skate blades having an elongated frame with a drive pulley located at one and, and a driven pulley located at the other end. An abrasive grinding belt loops over the pulleys and passes over a convex grinding surface... 20060030249 - Grinding tool for a grinder with rotary oscillating drive: Disclosed is a grinding tool for a grinder comprising a rotary oscillating drive, the output shaft of which is driven so as to oscillate back and forth about its longitudinal axis and is configured for securing the grinding tool thereon. The grinding tool comprises a grinding pad which is made... 02/02/2006 > 10 patent applications in 5 patent subcategories.20060025048 - Abrasive article detection system and method: Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading... 20060025046 - Abrasive article splicing system and methods: Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading... 20060025050 - Gear grinding machine: To correct the tooth profile error of a ground gear, the wheel angle of a threaded grinding wheel is modified by dressing the threaded grinding wheel by a dressing device. To correct the helix form deviation of a ground gear, namely, to modify the helix angle of the gear, synchronization... 20060025047 - Grading system and method for abrasive article: Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading... 20060025052 - Method and apparatus of eddy current monitoring for chemical mechanical polishing: A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad... 20060025049 - Spray slurry delivery system for polish performance improvement and cost reduction: Methods and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one aspect, the apparatus comprises a vertical arm having a delivery portion located proximate to a circumference of a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense... 20060025045 - System and method for detecting abrasive article orientation: Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading... 20060025051 - Wire sawing apparatus: A wire sawing apparatus includes a plurality of cutting wires arranged in parallel with one another and caused to travel in their axial directions; a table on which a workpiece is placed and held; a moving device for vertically moving the table; and a machining-liquid feed pipe. While a machining... 20060025053 - Method for fabricating a magnetic transducer using a slurry with spherical particles for cmp-assisted photoresist lift-off: A method is described which uses a CMP slurry with an abrasive of spherical particles to lift-off photoresist used in the patterning of the sensor for a magnetic transducer. The spherical particles are preferably silica, alumina, titania or zirconia with colloidal silica being preferred. The size of the particle is... 20060025054 - Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces: Systems and methods for activating end effectors used to condition microfeature workpiece polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a rotatable end effector having a conditioning surface configured to condition a microfeature workpiece polishing medium, and a driver coupled to the end... 20060025055 - Apparatus for loading wafers and method for loading wafers using the same: The present invention relates to an apparatus for loading wafers, a semiconductor manufacturing apparatus and a method for loading wafers comprising: a disk pad for supporting a wafer, the disk pad having a fixing member mounted on a front surface thereof for fixing the wafer and a hole extending therethrough;... 20060025056 - End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces: End effectors, apparatuses including end effectors for conditioning planarizing pads, and methods for manufacturing end effectors with contact elements to condition planarizing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector includes a member having a first surface and a plurality of generally uniformly... 20060025057 - Method for fabricating a magnetic transducer using a slurry with spherical particles for cmp-assisted photoresist lift-off: A method is described which uses a CMP slurry with an abrasive of spherical particles to lift-off photoresist used in the patterning of the sensor for a magnetic transducer. The spherical particles, preferably less than 0.015 microns, are preferably silica, alumina, titania or zirconia with colloidal silica being preferred. An... 20060025058 - Carrier head with gimbal mechanism: A carrier head includes a housing connectable to a drive shaft to rotate therewith, a lower assembly having a substrate mounting surface, and a gimbal mechanism that connects the housing to the lower assembly to permit the lower assembly to pivot with respect to the housing about an axis substantially... 20060025059 - Concrete polishing system: A grinding machine abrasive unit holder with the use of springs, gases or fluids allows each abrasive unit to be in contact with the floor, independently at all times. This action allows the finishing of the high and low spots of the floor in the same operation.... 20060025060 - Handle for a power tool: A hand-held power tool, in particular an angle grinder, includes a housing (4) having, at its working tool side end, a tool head (6) to which a working tool (10) is secured; a main handle (14) connected to the housing (4) at its handle side end remote from the working... 20060025061 - Polishing pad having grooves configured to promote mixing wakes during polishing: A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) containing a plurality of grooves ((148, 152, 156)(304, 308, 324)(404, 408, 424)(520, 524, 528)) having orientations largely parallel to one or more corresponding respective velocity vectors... 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