Abrading inventions 01/06

20060019578 - Machining device: According to a machining device for machining a conductive workpiece (W) by a conductive (T), when the tool (T) contacts the workpiece (W) in machining, there is formed a closed-circuit (C) connecting the tool (T), the workpiece (W), a brush (315), a conductor (311), a main spindle housing (12), a...

20060019579 - Non-loading abrasive article: An abrasive article and methods of making and using the same are disclosed. The abrasive article includes a particle impermeable back-up pad attached to an abrasive disc. The abrasive disc includes a plurality of perforations therethrough. When the abrasive article is moved and contacted against a workpiece, debris from the...

20060019580 - Apparatus for removing material, use of gas inclusions in an abrasive liquid and process for grinding and/or polishing surfaces: The invention relates to an apparatus for removing material from a surface of a workpiece during grinding and/or polishing of the surface by means of abrasive particles which are delivered by a liquid. The apparatus comprises a device for setting the gas content in the liquid, in particular for adding...

20060019581 - Polishing solution retainer: A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing...

20060019582 - Substrate removal from polishing tool: Techniques for removing a substrate from a polishing pad are described. A substrate is pulled away from the polishing pad such that the edges of the substrate are pulled away from the polishing pad before the center of the substrate is pulled from the polishing pad....

20060019583 - Method and apparatus for conditioning a polishing pad: A method and apparatus for polishing a thin film on a semiconductor substrate is described. A polishing pad is rotated and a wafer to be polished is placed on the rotating polishing pad. The polishing pad has grooves that channels slurry between the wafer and polishing pad and rids excess...

20060019584 - Method and apparatus for conditioning a polishing pad: A method and apparatus for polishing a thin film on a semiconductor substrate is described. A polishing pad is rotated and a wafer to be polished is placed on the rotating polishing pad. The polishing pad has grooves that channels slurry between the wafer and polishing pad and rids excess...

20060019585 - Device for circular grinding, sanding and stripping tools to attach to any power drive: A mounting arrangement for allowing a variety of circular grinding, sanding or stripping devices to attach to the same power source having a spindle drive shaft. The devices are substantially enclosed by a rigid guard housing and adjustment means are provided to change the angle of the housing with respect...

20060019586 - Carrier head for chemical mechanical polishing: A carrier head for supporting a wafer during a chemical mechanical polishing process is provided. In one exemplary implementation, the carrier head may comprise a wear ring, and a slidably movable pressure plate disposed within the wear ring. The pressure plate may be arranged to provide slidable movement relative to...

20060019587 - Methods for producing in-situ grooves in chemical mechanical planarization (cmp) pads, and novel cmp pad designs: Methods for producing in-situ grooves in CMP pads are provided. In general, the methods for producing in-situ grooves comprise the steps of patterning a silicone lining, placing the silicone lining in, or on, a mold, adding CMP pad material to the silicone lining, and allowing the CMP pad to solidify....

20060019588 - Polishing pad, polishing apparatus having the same, and bonding apparatus: A plurality of projections and grooves are formed on a polishing member. The grooves are formed in grid pattern. A portion on which the grooves and the projections are formed (polishing portion) has a substantially circular shape in a plane view. Around the polishing portion, an outer peripheral portion having...

20060014474 - Gear grinding machine: A gear grinding machine comprises: a moving mechanism rotatably mounted with a threaded grinding wheel, and arranged to move the threaded grinding wheel along directions of X, Z, and Y, and to turn the threaded grinding wheel in a Y-Z plane; an NC device for controlling the position of the...

20060014475 - Grindstone tool: A grindstone tool forperformpredeterminedprocessing on a workpiece, wherein a radio IC tag from, and to, which information can be read, and written, without contact is embedded in the grindstone tool....

20060014473 - Many-headed grinding machine and grinding method using many-headed grinding machine: A control device 40 controls the grinding processing at a processing portion of a work W so as to shift to the last precision grinding step from a rough grinding step through a middle grinding step and a finishing grinding step. When the grinding in each step is carried out,...

20060014476 - Method of fabricating a window in a polishing pad: The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and...

20060014477 - Polishing pad with flow modifying groove network: A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to vary the residence time across the wafer track of the reaction products formed by the interaction of reactants in the polishing medium (46) with structure on the wafer. The...

20060014478 - Apparatus and method for distributing a polishing fluid: An apparatus and method for evenly distributing a polishing fluid onto a polishing pad during a chemical mechanical planarization process, wherein the polishing fluid is dispersed by way of a spray being emitted from a spray nozzle. The pattern of polishing fluid applied to the polishing pad can be modified...

20060014479 - Arrangement of a chemical-mechanical polishing tool and method of chemical-mechanical polishing using such a chemical-mechanical polishing tool: wherein the first dispensing means location (L1) of the first dispensing means (7) is arranged in a downstream direction with respect to the holder location (L0) at a first downstream distance (d1), with the downstream direction being taken in relation to the first direction (ω1); and the second dispensing means...

20060014480 - Method of manufacturing a dental instrument: Method for manufacturing a dental instrument having a desired machined configuration, without twisting the instrument. A blank of superelastic material is brought to an annealed state comprising a phase structure including a rhombohedral phase alone or in combination with austenite and/or martensite, or a combination of martensite and austenite. In...

20060014481 - Drum for drum sander for surface mounting of sandpaper blanks: A powered floor sanding system with a rotating sanding drum having a drum core, to which is adhered a compliant sole and thereto a hook component material, using suitable adhesives; in combination with a sanding sheet having a loop fabric laminated to its backside with a high temperature adhesive so...

20060014482 - Rotary finishing device: A rotary finishing device includes a generally circular hub having a front surface, a back surface, an inner periphery and an outer periphery. The inner periphery of the device defines a throughhole. The front surface of the hub has a plurality of slots formed therein. Each of the plurality of...

20060009125 - Both side grinding method and both side grinder of thin disc-like work: When the feeding operation of grinding wheels (1, 2) is completed, the distances from hydrostatic pads (20, 21) to the surface and back of work (W) are measured at three points, and the deformation amount of work (W) is detected from the results of measurement at the three points by...

20060009128 - Eddy current sensing of metal removal for chemical mechanical polishing: A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around...

20060009129 - Feedforward and feedback control for conditioning of chemical mechanical polishing pad: A method, apparatus and medium of conditioning a planarizing surface includes installing a wafer to be polished in a chemical mechanical polishing (CMP) apparatus having a polishing pad and a conditioning disk, polishing the wafer under a first set of pad conditioning parameters selected to maintain wafer material removal rates...

20060009130 - Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing...

20060009126 - Method and apparatus for producing optical glasses: The invention relates to a method and an apparatus for producing optical glasses. The glasses are polished and marked, following a shaping process. The polishing and marking steps are carried out in a common processing cell which comprises a polishing station, a washing station, and a marking station....

20060009127 - Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus: A polishing method can automatically reset the polishing conditions according to the state of a polishing member based on data on the polishing profile changing with time, thereby extending the life of the polishing member and obtaining flatness of the polished surface with higher accuracy. The polishing method, including the...

20060009131 - Data processing for monitoring chemical mechanical polishing: Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing...

20060009132 - Chemical mechanical polishing apparatus with non-conductive elements: Conductive elements of a chemical mechanical polishing system may generate undesired eddy currents under the influence of a time-dependent magnetic field used in an eddy current monitoring system. To improve the accuracy of an eddy current monitoring system, elements that may contribute an undesired signal to the sensed eddy current...

20060009133 - Light-emitting display device and method for making the same: A method for making a light-emitting display device having a substrate with light-emitting layers on a surface of the substrate and constituting pixels, light emission from the pixels being electrically controlled, and having barriers delimiting at least one side of each respective pixel. A mask pattern is formed on a...

20060009134 - Grinding wheel, grinding apparatus and grinding method: The present invention provides the grinding wheel, the grinding apparatus and the grinding method of the present invention so that increase in the size of the grinding apparatus can be suppressed, and the back surface grinding of the wafer and the grinding of the peripheral edge part of the wafer...

20060009135 - Method and device for grinding a saw chain: The present invention relates to a method for grinding a saw chain (26), said saw chain (26) being clamped in a position suitable for grinding, that a rotating grinding disc (11) manually is transferred from an inactive position to an active position), and that grinding of a cutler link (39)...

20060009136 - Fixed-abrasive chemical-mechanical planarization of titanium nitride: Titanium nitride layers planarized may be utilized in the production of integrated circuits, and various apparatus utilizing such integrated circuits. Planarizing solutions may be used for removing titanium nitride from the surface of a substrate using a fixed-abrasive planarizing pad. The planarizing solutions take the form of an etchant solution...

20060009137 - Portable drill sharpener: A portable drill sharpener includes a casing, a sand-wheel, a positioning device, a first grinding unit and a second grinding unit, a holding member for positioning a drill to be ground, a first adjustment unit and a second adjustment unit respectively connected to the first and second grinding units. Each...

20060009138 - Apparatus for manual sharpening of the blades of cutting tools: p

20060009139 - Cutting machine with environment control arrangement: A cutting machine includes a bottom collecting tray, a cutting blade overhanging on a cutting table and having a cutting area defined at an outer circumferential portion thereof when the cutting blade cuts the work piece, and an environment control arrangement. The environment control arrangement includes an end collecting tray,...

20060009140 - Dental instrument sharpening stone system: A hand-held dental mirror carrying a sharpening stone for a dental instrument such as a curette, comprising a shaft supporting a mirror, a hand grip coupled to the shaft, and a sharpening stone coupled to the shaft....

20060009141 - Oval sharpening rod having interrupted diamond coated surface and process of manufacturing same: An oval rod sharpener having an interrupted diamond abrasive surface having plurality of holes forming wells for collecting filings during sharpening. The abrasive surface is formed by multiple layers of micron sized diamonds, such as monocrystalline diamonds. A plastic pad is provided on the tip end of the oval abrasive...

20060003673 - Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force...

20060003674 - Aspheric-surface processing method and aspheric-surface forming method: An aspheric-surface processing method according to the present invention, uses a cuffing apparatus including at least one turning tool movable in the same direction as the rotating axis of the work and is also movable in a direction perpendicular to the rotating axis of the work. This method includes moving...

20060003671 - Cmp apparatus and method: Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces...

20060003670 - Electrically enhanced surface planarization: A substrate processing apparatus equipped to employ electrical potential to assist in planarization and/or conditioning is provided....

20060003672 - Polishing apparatus: The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a processing section including a polishing section (1) for polishing a semiconductor wafer (6) and a cleaning section (10) for cleaning a polished semiconductor wafer, a receiving section (40)...

20060003675 - Fixed-abrasive chemical-mechanical planarization of titanium nitride: Titanium nitride layers planarized may be utilized in the production of integrated circuits, and various apparatus utilizing such integrated circuits. Planarizing solutions may be used for removing titanium nitride from the surface of a substrate using a fixed-abrasive planarizing pad. The planarizing solutions take the form of an etchant solution...

20060003676 - Drill sharpener: A drill sharpener is provided which has a point-splitting port which simplifies the procedure for producing a split point on a drill bit undergoing sharpening. The point-splitting port is positioned relative to a grinding wheel assembly such that, when the drill held by a chuck is advanced toward the grinding...

20060003677 - Polishing pad and chemical mechanical polishing apparatus comprising the same: A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper...

20060003678 - System and method for reducing surface defects in integrated circuits: The fabrication of integrated circuits entails the repeated application of many basic processing steps, for instance, planarization—the process of making a surface flat, or planar. One specific technique for making surfaces flat is chemical-mechanical planarization, which typically entails applying slurry onto a surface of an integrated circuit and polishing the...

20060003679 - Handle assembly for tool: A power sander (2) having a housing (4) and a motor within the housing is disclosed. A gripping portion adapted to be engaged by a hand of a user of the sander comprises blister packs (30), (36) comprising first and second flexible sheets defining a gel-containing chamber therebetween and containing...

20060003680 - Power tool: A power sander (2) has a housing (4) supporting a mounting platen (6) for supporting a sanding head for oscillatory orbital motion of the platen (6) and sanding head relative to the housing. The housing has side surfaces, a curved front surface (14) containing an on/off switch (16) for switching...