|Electricity: electrical systems and devices patents - Monitor Patents|
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Electricity: electrical systems and devicesBelow are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 10/02/2014 > 84 patent applications in 53 patent subcategories.
20140293487 - Circuit control device, circuit system, switch state detection circuit and vehicle: A circuit control device for controlling power consumption of a plurality of circuit units includes a monitoring unit configured to monitor whether a detection temperature of each of the circuit units meets a predetermined overheat condition, and an overheat protection unit configured to execute an overheat protection operation when the... Agent: Rohm Co., Ltd.
20140293488 - Protecting against transients in a power control system: A system for providing alternating current to at least one inductive load, the system including at least one switching means for switching power to the load on and off, controller adapted for controlling the at least one switching means and a pre-magnetization device, wherein the pre-magnetization device is configured to... Agent: Vetco Gray Controls Limited
20140293489 - Systems and methods for use in identifying and responding to type of grid fault event: Systems (100), power modules (108), and methods for using in controlling a converter (110) coupled between a power generator (104) and an electric grid (102). A power module (108) includes the converter (110) configured to supply the output from the power generator (104) to the electric grid (102) and a... Agent: General Electric Company
20140293490 - Ground fault circuit interrupter (gfci) monitor: This document discusses, among other things, a self-test (ST) ground fault circuit interrupter (GFCI) monitor configured to generate a simulated ground fault starting in a first half-cycle of a first cycle of AC power and extending into a second half-cycle of the first cycle of AC power, wherein the first... Agent:
20140293491 - Active bypass diode circuit and solar power module with arc flash mitigation feature: An active bypass diode circuit that mitigates the hazard of arc flash events in a Photovoltaic (PV) solar power array, and a PV solar power module that utilizes a plurality of said active bypass circuits are disclosed The active bypass circuit comprises a diode, a switch in parallel with the... Agent: Sunfield Semiconductor Inc.
20140293492 - Protective circuit, electronic device, and method of driving a protective circuit: Provided is a method of driving a protective circuit, the protective circuit including a first clamp section and a second clamp section, the first clamp section including a first device, the first clamp section being configured to protect an entire protected circuit of a predetermined area when the first device... Agent: Sony Corporation
20140293493 - Overvoltage protection device: An overvoltage protection device capable of protecting a power supply line and including in parallel a break-over diode, a controlled switch, and a circuit for controlling the switch.... Agent: Stmicroelectronics (tours) Sas
20140293494 - Adaptive topology assisted protection and control of electric power delivery systems: Disclosed are adaptive communication assisted protection and control. Local intelligent electronic devices (IEDs) associated with local switching devices and having unique IDs may transmit switch status and unique IDs to an area IED. The area IED may calculate topology using switch status, and provide control information to local IEDs using... Agent: Schweitzer Engineering Laboratories, Inc.
20140293495 - Ptc device: The present invention relates to a new PTC device having a configuration with which protrusion of solder paste and/or an excess portion of epoxy resin do not adversely affect a jig. Such PTC device 30 includes a PTC member 32 and leads 34 and 36 electrically connected to both sides... Agent: Tyco Electronics Japan G.k.
20140293496 - Automatically balanced micro-pulsed ionizing blower: In one embodiment of the invention, a method of automatically balancing ionized air stream created in bipolar corona discharge is provided. The method comprises: providing an air moving device with at least one ion emitter and reference electrode connected to a micro-pulsed AC power source, and a control system with... Agent:
20140293498 - Lightning protection sheet with patterned discriminator: A lightning protection system is provided, typically for use on an outer surface of an aircraft, which includes the use of a lightning protection sheet that includes an electrically conductive film and at least one patterned, electrically non-conductive discriminator layer.... Agent:
20140293497 - Method and apparatus for providing a current return network in an aircraft structure: According to an embodiment a current return network assembly, for an aircraft having a predetermined potential lightning strike zone, is mounted within the predetermined potential lightning strike zone. The current return network assembly includes an electrically conductive honeycomb central core that conducts electrical current both through the assembly and through... Agent:
20140293499 - Electrodes for electronic weaponry and methods of manufacture: A deployment unit for an electronic control device (ECD) used as a weapon provides a current from a signal generator of the ECD through tissue of a human or animal target. The deployment unit includes a housing, an interface, a filament, and an electrode. The interface couples the housing to... Agent: Taser International, Inc.
20140293502 - Dielectric ceramic composition and multi-layer ceramic capacitor comprising the same: A dielectric ceramic composition including a base material represented by (Ba(1-x)+REx)mTiO(3+x) (here, 0.995≦m≦1.010, 0.001<x<0.010, and RE is at least one rare earth (RE) atom selected from a group consisting of Dy, Y, Ho, Sm, and Gd) or Bam(Ti+REx)O(3−x) (here, 0.995≦m≦1.010, 0.001<x<0.010, and RE is at least one RE atom selected... Agent: Samsung Electro-mechanics Co., Ltd.
20140293504 - High energy density storage device: A device and method for providing electrical energy storage of high specific energy density. The device contains a plurality of layers of high dielectric constant material, such as Barium Titanate or Hexagonal Barium Titanate, sandwiched between electrode layers made up of a variety of possible conducting materials. The device includes... Agent:
20140293503 - Monolithic ceramic electronic component: A monolithic ceramic electronic component includes an outer electrode including a first plating layer formed directly on a component body by electroless plating so as to cover an exposed portion distribution region including exposed portions of a plurality of inner electrodes and a second plating layer formed by electrolytic plating... Agent: Murata Manufacturing Co., Ltd.
20140293500 - Multilayer ceramic capacitor and method of manufacturing the same: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second external electrodes; first and second internal electrodes formed to be spaced apart from each other; and a first floating electrode disposed alternately with the first and second internal electrodes in... Agent: Samsung Electro-mechanics Co., Ltd.
20140293501 - Multilayer ceramic capacitor and method of manufacturing the same: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers stacked therein, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to both end surfaces of the ceramic body, and first and second external electrodes... Agent: Samsung Electro-mechanics Co., Ltd.
20140293506 - Giant dielectric constant material: Disclosed herein is a material having formula (A3+((4-5n)/3)-δB5+n)xTi1-xO2, wherein 0<n<0.8, δ and x is such that the material has a rutile structure, 0<n<0.8, δ is between 0 and 0.025 inclusive, A3+ is a trivalent positive ion and B5− is a pentavalent positive ion. A process for making the material, and... Agent: The Australian National University
20140293505 - Pzt-based ferroelectric thin film and method of forming the same: A PZT-based ferroelectric thin film is formed by coating a PZT-based ferroelectric thin film-forming composition on a lower electrode of a substrate one or two or more times, pre-baking the composition, and baking the composition to be crystallized, and this thin film includes PZT-based particles having an average particle size... Agent: Mitsubishi Materials Corporation
20140293507 - Composite electrode for lithium ion capacitor: A lithium-ion capacitor includes a cathode, an anode, and a porous separator positioned between the cathode and the anode. The cathode is formed using activated carbon, and the anode is formed from a composite material that includes lithium titanium oxide and a carbon material such as hard carbon or graphite.... Agent:
20140293509 - Electric double layer capacitor electrode and electric double layer capacitor: An electric double layer capacitor electrode includes a positive electrode having a positive electrode active material layer including a positive electrode side porous body and a negative electrode having a negative electrode active material layer including a negative electrode side porous body. An oxidation-reduction substance causing an oxidation-reduction reaction during... Agent: Funai Electric Co., Ltd.
20140293511 - Electric storage device: A device main body includes positive electrode layers, negative electrode layers, and separator layers interposed between the positive electrode layers and the negative electrode layers. A package includes a housing-shaped package main body in which the element main body is accommodated, and a package peripheral edge portion which is flat,... Agent:
20140293510 - Electric storage device and method of manufacture thereof: In an electric storage device, a terminal plate includes an element-connecting part electrically connected to a first electrode at a first end of an electric storage element, and an external terminal connected to this element-connecting part. A sealing member is on the element-connecting part, and includes a hole where the... Agent:
20140293508 - Electrode composition for supercapacitor, electrode including cured material, and supercapacitor including electrode: Disclosed in that an electrode composition including active carbon and a hardening polymer binder, a cured material of the composition, an electrode including the cured material, a supercapacitor including the electrode, and a method of manufacturing a supercapacitor.... Agent: Korea Institute Of Machinery & Materials
20140293512 - Solid electrolytic capacitor: The solid electrolytic capacitor of the present invention includes an anode, a dielectric layer formed on the anode, and a solid electrolyte layer formed on the dielectric layer. The solid electrolyte layer includes an oxide of valve metal. It is beneficial that the solid electrolyte layer contains a salt of... Agent: Sanyo Electric Co., Ltd.
20140293514 - Composition and method for forming electroactive coating comprising conjugated heteroaromatic polymer, capacitor and antistatic object comprising the electroactive coating, and solid electrolytic capacitor and method for fabricating the same: wherein X is selected from S, O, Se, Te, PR2 and NR2, Y is hydrogen (H) or a precursor of a good leaving group Y− whose conjugate acid (HY) has a pKa of less than 30, Z is hydrogen (H), silyl, or a good leaving group whose conjugate acid (HY)... Agent:
20140293513 - Graphene-based high voltage electrodes and materials: The disclosure describes an improved electrode with high voltage standoff characteristics and improved graphene-based materials and methods of making them for use therein. A graphene-based thin film material is described that may be applied or transferred to a current collector to create the improved electrode. The thin film comprises high... Agent: Custom Electronics, Inc.
20140293515 - Media appliance and method for use of same: A media appliance and method for use of the same are disclosed. In one embodiment, a housing is adapted to be mounted within a wall. A panel forms a front portion of the housing and the panel includes vents and the panel may be mounted substantially flush with the wall.... Agent:
20140293516 - Busway with integrally fusible power feeds: A power feed assembly for an electrical busway includes a housing and a fuse support coupled to the housing. The fuse support includes a non-conductive support member having a number of first conductive members and a number of second conductive members coupled thereto. Each of the first members are structured... Agent: Universal Electric Corporation
20140293518 - Display apparatus: Disclosed is a display apparatus that seals a gap space between a display panel and a cover sidewall by an upper optical film attached to an upper surface of the display panel, wherein the display apparatus may include a rear cover with a space; a guide frame received in the... Agent: Lg Display Co., Ltd.
20140293517 - Electronic apparatus and member rotating operation method: An electronic apparatus includes: a housing; a mounting member pivotably mounted to the housing; a displacing member including an L-shaped shaft hole formed in at least one of the mounting member and the housing member, and a shaft located in the shaft hole; the displacing member be configured such that... Agent: Fujitsu Limited
20140293519 - Electronic device: An electronic device is provided, including a main body, a display module, a rotary member, a slider, a first hinge, and a second hinge. The display module has a recess and a first surface. The main body, the display module, and the rotary member are pivotally connected by the first... Agent: Acer Incorporated
20140293522 - Electronic device: An electronic device is provided, comprising a display panel, a frame, wherein the display panel is fixed to the frame; and an elastic cover, wherein the elastic cover covers a first side, opposite to the display panel, of the frame. According to the present invention, the elastic cover is used... Agent: Lenovo (beijing) Co., Ltd.
20140293521 - Storage container: A storage container includes a main body and a cover. The main body includes a first recessed portion and an outer edge portion. The first recessed portion has an opening portion and is bounded by a first bottom surface portion and a first peripheral wall portion including a first wall... Agent: Brother Kogyo Kabushiki Kaisha
20140293520 - Switch structure and display device: A switch structure includes an operation key attachment, a substrate facing the operation key attachment and including a switch at least a portion of which is exposed from an opening, and an operation key including a protrusion that protrudes parallel or substantially parallel to the substrate from an opening end... Agent: Funai Electric Co., Ltd.
20140293525 - Electronic apparatus: There is provided an electronic apparatus, including a first housing, a second housing which has a display section and a support member supporting the display section, and a housing connection section which rotatably connects the second housing with respect to the first housing. The support member includes a first support... Agent: Sony Corporation
20140293527 - Multi-directional display console for an electronic equipment cabinet: An apparatus for a multi-directional display comprising, a first surface situated in an electronic equipment cabinet, wherein the first surface is capable of retracting out of a plurality of sides of the electronic equipment cabinet. A first electronic display mechanically coupled to a first hinge. A first mount mechanically coupled... Agent: International Business Machines Corporation
20140293528 - Electronic apparatus and component for electronic apparatus: An electronic apparatus includes a first casing component that is provided with a through hole and made of metal, a second casing component that is integrally molded with the first casing component and made of resin, and a third casing component that covers the second casing component, wherein the second... Agent: Fujitsu Limited
20140293529 - Method apparatus and material for radio frequency passives and antennas: A method apparatus and material are described for radio frequency passives and antennas. In one example, an electronic component has a synthesized magnetic nanocomposite material with aligned magnetic domains, a conductor embedded within the nanocomposite material, and contact pads extending through the nanocomposite material to connect to the conductor.... Agent:
20140293524 - Ejecting apparatus and electronic device employing the ejecting apparatus: An electronic device comprises a main body, a plurality of I/O interfaces, and an ejecting apparatus. The ejecting apparatus is mounted on the main body and comprises an enclosure, a supporting member received in the enclosure, a carrier secured on the supporting member to support the I/O interfaces, a first... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.
20140293523 - Server rack and its server device: A server rack and its server device are provided. The server device includes a chassis, a motherboard module, a power-supply module, a storage array module, and a plurality of input/output interface elements. The chassis is provided with a containing space, a first opening and a second opening in which the... Agent: Quanta Computer Inc.
20140293530 - Aesthetically pleasing universal dock: An aesthetically pleasing universal dock may support a variety of electronic devices of different shapes and designs while appearing to be customized to individually support each electronic device. The universal dock may support an electronic device using a support layer that may include any suitable material, including, for example, an... Agent:
20140293531 - Server node: According to an example, a server node may include a base module and a plurality of face modules rotatably coupled to the base module to form an enclosure. The base module and a face module of the plurality of face modules may each include an inner surface that includes an... Agent: Hewlett-packard Development Company, L.p.
20140293532 - Flow-guiding hood for guiding a flow of air: A flow-guiding hood that guides a flow of air in a computer or an electronic device includes a plurality of individual parts which includes a first flow-guiding element made of a substantially planar first material that channels the flow and at least one second flow-guiding element made of a different,... Agent: Fujitsu Technology Solutions Intellectual Property
20140293533 - Cooling electronic components and supplying power to the electronic components: A mechanism is provided for cooling electronic components of a printed circuit board module and for supplying power to the electronic components of the printed circuit board module. The computer module comprises a printed circuit board module, wherein the electronic components are attached to a first side of the printed... Agent: International Business Machines Corporation
20140293537 - Electronic device: This application discloses an electronic device. The electronic device comprises a first body including an A surface and a B surface that are opposite to each other; a second body including a C surface and a D surface that are opposite to each other; and a connecting piece by means... Agent: Beijing Lenovo Software Ltd.
20140293534 - Hinge mechanism for rotatable component attachment: A hinge mechanism for rotatable component attachment is described. In at least some implementations, the hinge mechanism enables a support component to be adjustably attached to an apparatus, such as a computing device. For example, the hinge mechanism can be employed to rotatably attach a kickstand to a mobile computing... Agent: Microsoft Corporation
20140293535 - Releasing mechanism for housing of portable electronic device: A portable electronic device includes a first housing, a second housing detachably latched to the first housing through a latching tab, and a releasing mechanism. The releasing mechanism includes a button, an elastic member, and a shaft. The button surrounds the shaft and is rotatably assembled to the first housing... Agent: Chiun Mai Communication Systems, Inc.
20140293536 - Tablet computer heated case: A tablet computer heated case has a body with a cavity in which a tablet computer may be received and includes a window to allow the screen of the tablet computer to be seen and to allow input to the tablet computer. A heating element may be provided opposite the... Agent: Sealanes (1985) Pty Ltd
20140293526 - Computer housing and arrangement: A computer housing that accommodates at least one motherboard, a power supply and further modules, wherein the housing includes at least a first level and a second level, wherein the second level is arranged horizontally above the first level, and an at least two-part motherboard carrier is arranged on the... Agent:
20140293538 - Temperature regulation of inductive charging devices in extreme vehicle environments: A thermal conditioning system for an inductive charging system. An open enclosure charging unit includes at least one surface generating an electromagnetic field for inductively charging a portable device. A primary conduit coupled to the open enclosure charging unit. The primary conduit outputs conditioned air to the open enclosure charging... Agent: Gm Global Technology Operations LLC
20140293539 - Fan and electronic apparatus: A fan and an electronic apparatus are disclosed. The fan comprises a housing and a blade wheel. The housing is shaped as a hollow column, a thickness of the housing is less than a preset thickness, a radial air inlet and an air outlet are disposed in a side of... Agent: Beijing Lenovo Software Ltd.
20140293540 - Heat exchanger for aircraft application: A heat exchanger includes a plurality of mini-channel tubes. The mini-channel tubes extends for an axial length defined between two manifolds. The mini-channel tubes include a plurality of generally rectangular flow passages. The generally rectangular flow passages are aligned adjacent to each other to define a lateral dimension. A first... Agent: Hamilton Sundstrand Corporation
20140293541 - Heat pipe heat sink for high power density: A heat sink is disclosed including a cold plate, a plurality of heat pipes, and a plurality of fins. The cold plate has a first surface arranged substantially vertical and adapted to thermally couple to a heat source. Each of the plurality of heat pipes have an evaporator section arranged... Agent: Ge Energy Power Conversion Technology Ltd
20140293542 - Thermal mgmt. device for high-heat flux electronics: The invention is for an apparatus and method for removal of waste heat at high-flux from electronic, photonic, and other components. The apparatus of the present invention is a self-contained unit comprising a closed flow loop flowing liquid metal coolant pumped by an integral magneto-hydrodynamic (MHD) pump. Liquid metal coolant... Agent:
20140293543 - Silicon-based heat dissipation device for heat-generating devices: Embodiments of a silicon-based heat dissipation device and a chip module assembly utilizing the silicon-based heat dissipation device are described. In one aspect, the chip module assembly includes a chip module and a primary heat dissipation module. The chip module includes a board and at least one heat-generating device. The... Agent:
20140293545 - Electronic device enclosures and heatsink structures with thermal management features: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated... Agent: Apple Inc.
20140293544 - Energy consuming device and assembly: An energy consumption device includes a housing that supports a first and second terminal. An energy consuming module, which may include a light emitting diode array, is supported by the housing and is thermally coupled to a thermal bridge that extends below a lower surface of the housing. A cover... Agent: Molex Incorporated
20140293547 - Circuit substrate, semiconductor package and process for fabricating the same: A circuit substrate has the following elements. A stacked circuit structure has a first surface and a second surface opposite thereto surface. A first patterned inner conductive layer is disposed on the first surface and has multiple pads. A first patterned outer conductive layer is disposed on the patterned inner... Agent: Via Technologies, Inc.
20140293548 - Electric power semiconductor device and method for producing same: An electric power semiconductor device includes a power module and a heat dissipating member connected to the power module through a heat-conductive insulating resin sheet in which a mold resin part included in the power module has a protruding part in its peripheral part to prevent the heat-conductive insulating resin... Agent: Mitsubishi Electric Corporation
20140293546 - Thermal conductivity improved composition with addition of nano particles used for interface materials: A ternary particle size filler composition with addition of nano particles is provided to formulate thermally conductive interface materials such as soft gel having a high thermal conductivity, a relative low viscosity, and a low complex storage modulus. The thermally conductive material containing thermal particle composition and polymer matrix is... Agent:
20140293549 - Identifying a digital data handling unit: A digital data handling unit has a manually graspable part operable for removal of the unit from a digital data handling host. The manually graspable part includes an illuminable portion which, when illuminated, serves to distinguishably identify a particular digital data handling unit. The illuminable portion may be an illuminable... Agent: International Business Machines Corporation
20140293550 - Circuit module and production method therefor: A circuit module includes: a wiring substrate including a mounting surface having first and second areas and a terminal surface on the other side of the mounting surface; a plurality of electronic components mounted on the first and second areas; a sealing layer that covers the plurality of electronic components,... Agent: Taiyo Yuden Co., Ltd.
20140293551 - Electronic device, quantum interference device, atomic oscillator, electronic apparatus, and moving object: An atomic oscillator includes a first unit and a second unit arranged to be separated from each other and a package including an internal space in which the first unit and the second unit are housed in a state in which the internal space is decompressed to pressure lower than... Agent: Seiko Epson Corporation
20140293552 - Power semiconductor module and method of manufacturing a power semiconductor: A power semiconductor module, and method for its manufacture, comprising a first housing part having a cutout and a DC voltage load connection apparatus forming a structural unit, wherein the DC voltage load connection apparatus has first and second DC voltage load connection elements. The first DC voltage load connection... Agent: Semikron Elektronik Gmbh & Co., Kg
20140293553 - Modular solar box: The invention relates to a solar box (1) with a connection box (2) and at least one extension module (3, 20), which can be operatively connected to the connection box (2) via a first and a second connector part (9, 10) of a standardized interface (8). The connection box includes... Agent:
20140293554 - Insulated metal substrate: An insulated metal substrate (IMS) for supporting a device comprises a metallic substrate having a ceramic coating formed at least in part by oxidation of a portion of the surface of the metallic substrate. The ceramic coating has a dielectric strength of greater than 50 KV mm−1 and a thermal... Agent: Cambridge Nanotherm Limited
20140293555 - Receptacle connector and electronic device: A receptacle connector adapted to be fixed to a casing of an electronic device and electrically connected to a circuit board for enabling the receptacle connector to be adapted to connect with a plug connector is provided. The receptacle connector includes an insulating body and a plurality of conductive terminals.... Agent:
20140293557 - Housing of electronic device and electronic device: An housing of electronic device, includes a resin molded housing with an opening there through, a sheet metal positioned within the opening and a water proofing tape positioned on a side of the sheet metal, wherein a periphery of the sheet metal and an entirety of the water proofing tape... Agent: Fujitsu Limited
20140293556 - Power supply device: A power supply device includes a circuit board that has an arrangement surface and a rear surface opposite to the arrangement surface and that has a through hole. An insertion mounted circuit component, a connector and a surface mounted light emitting component that is provided for confirming an operation of... Agent: Tdk Corporation
20140293558 - Lens mount with conductive glue pocket for grounding to a circuit board: A lens mount is attached to a circuit board and covers electrical components on the circuit board. An electrically insulating device is positioned between the lens mount and the circuit board. The circuit board includes a grounding pad adjacent the electrically insulating device. The lens mount includes an aperture aligned... Agent: Stmicroelectronics Pte Ltd.
20140293560 - Substrate embedding electronic component and method of manufacturing substrate embedding electronic component: Disclosed herein is a substrate embedding an electronic component and a method of manufacturing the substrate embedding an electronic component, the substrate embedding an electronic component including a first insulating part having the electronic component positioned therein, the electronic component being provided with terminals on a surface thereof; a first... Agent: Samsung Electro-mechanics Co., Ltd.
20140293559 - Wiring board: A wiring board has a surface formed with a chip mounting area to which a chip component is mounted and includes embedded therein first and second multilayer capacitors, each of which has inner electrode layers laminated in a lamination direction. The first multilayer capacitors are embedded in a peripheral region... Agent: Ngk Spark Plug Co., Ltd.
20140293561 - Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate: A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between... Agent: Tdk Corporation
20140293562 - Fibrous laminate interface for security coatings: An integrated circuit (IC) package with a fibrous interface is provided. The package includes a substrate, a bond coat and a top coat. The substrate is configured to contain IC components and connections. The bond coat layer is configured to encapsulate the IC components. The top coat layer has at... Agent: Honeywell International Inc.
20140293565 - Electronic device, electronic apparatus, moving object, and method for manufacturing electronic device: An electronic device includes: an electronic component including an external connection terminal; and a lead frame (metal member) connected to the external connection terminal. The lead frame is disposed with a pad. The pad overlaps the external connection terminal in plan view, and at least a portion of the pad... Agent: Seiko Epson Corporation
20140293564 - Interposer and electronic component package: An interposer includes a wiring member including a first inorganic substrate, a reinforcement member including a second inorganic substrate, and an adhesive part interposed between the wiring member and the reinforcement member. Each of the first and second inorganic substrates includes first and second surfaces. Multiple inorganic insulating layers formed... Agent: Shinko Electric Industries Co., Ltd.
20140293563 - Microelectronic device attachment on a reverse microelectronic package: The present description relates to the field of fabricating microelectronic structures. The microelectronic structure may include a microelectronic substrate have an opening, wherein the opening may be formed through the microelectronic substrate or may be a recess formed in the microelectronic substrate. A microelectronic package may be attached to the... Agent:
20140293566 - Circuit board and electronic device: A circuit board includes a substrate, a first ground electrode group, and a first pair of signal electrodes. The first ground electrode group includes a plurality of first ground electrodes, where each of the plurality of the first ground electrodes is disposed at a corresponding one of vertexes of a... Agent: Fujitsu Limited
20140293567 - Support-retaining structure for interface card: A support retaining structure for interface card includes a support frame, a hook and positioning structure, an active hook, and a fixing member, wherein the support frame, the hook and positioning structure, the active hook, and the fixing member are cooperated to each other in order to make the support... Agent: Lite-on Electronics (guangzhou) Limited
20140293568 - Fixing mechanism and electronic device thereof: A fixing mechanism includes a base, a substrate and a latch. The base includes a constraining component and a contacting component. The substrate is slidably disposed on the base. The substrate includes a body, a fixing hole structure and a connecting portion. The base and the body respectively hold circuit... Agent: Wistron Corporation
20140293569 - Protective device for an electrical connector of a power electronics module: A protective device is for an electrical connector of a power electronics module inserted in a casing. The connector protrudes from one of the faces of the casing and is suitable to connect an electrical supply line to the module. The device includes at least one face for covering at... Agent: Renault S.a.s.
20140293570 - Electric shielding enclosure including power pack: An electric shielding enclosure that encloses a volume. The electric shielding enclosure includes a conductive structure that partially encloses the volume and that has an edge defining an opening into the volume. A conductive power pack surface is configured to fill at least a part of the opening and has... Agent: Research In Motion Limited09/25/2014 > 66 patent applications in 42 patent subcategories.
20140285927 - Electrical safety system with timer: An electrical safety system with an integrated timer is disclosed. The electrical safety system may have an input line connected to an output via one or more communication paths. The electrical safety system may also have a ground fault circuit interrupter module including a sensor coil for monitoring current passing... Agent: Polygroup Macau Limited (bvi)
20140285929 - Ground power leakage detection for peripheral printed circuit boards: The present invention relates to an electric appliance (100) comprising an electric load (225), and a printed circuit board assembly (115) for electronically managing the electric appliance (100); the printed circuit board assembly comprises a slave printed circuit board (220s) operatively associated with the electric load (225) for driving it,... Agent: Electrolux Home Products Corporation N.v.
20140285930 - Methods providing control for electro-permanent magnetic devices and related electro-permanent magnetic devices and controllers: Methods may be provided to control an electro-permanent magnetic device powered from an AC mains power source provided through first and second power lines of a controller, wherein a first switch is provided on the first power line between the AC mains power source and the electro-permanent magnetic device and... Agent: Wen Technology, Inc.
20140285932 - Electrostatic protection circuit: A protection circuit comprises first and second input terminals to which a power source voltage for a protected load circuit can be applied. A first transistor connected between the input terminals. The first transistor has a gate/base electrode connected to a current path electrode through a resistor. A low-pass filter... Agent: Kabushiki Kaisha Toshiba
20140285931 - Inductive isolation of capactive load in amplitude limiters: An amplitude limiter circuit includes an inductor and a shunt circuit. The inductor has a first terminal connected to an input node. The shunt circuit is connected to a second terminal of the inductor and also is connected to a low impedance node. If an overvoltage condition forms on the... Agent: Texas Instruments Incorporated
20140285933 - Method for removing electro-static discharge (eds) noise signal in electronic system including the metal-insulator transition (mit) 3-terminal device: The inventive concept shows the embodiment of t-switch which is a MIT 3-terminal device based on a Hole-driven MIT theory and a technology for removing an ESD noise signal which is one of applications of the t-switch. The t-switch includes three terminals of Inlet, Outlet and Control, and a metal-insulator... Agent: Electronics And Telecommunications Research Institute
20140285934 - Battery protection circuit and method thereof: The present disclosure discloses a battery protection circuit and a method thereof for protecting a battery pack. The battery protection circuit comprises a hardware protection circuit, a software protection circuit and a current detecting circuit. When the battery pack is not in the active status, the hardware protection circuit is... Agent: Dongguan Cellwise Microelectronics Co.,ltd.
20140285935 - Electronic fuse apparatus and method of operating the same: An electronic fuse apparatus is connected between a power side and a system side. The electronic fuse apparatus mainly includes an electronic fuse, a short-circuit protection switch, a current-sensing module, and a digital control module. The current-sensing module detects an operating current which flows from the power side to the... Agent: Delta Electronics, Inc.
20140285936 - Battery management system for electric vehicle: A battery management system for a vehicle having an electrically powered motor that is powered by a plurality of battery cells includes an electrical system for providing voltage and current from the battery cells to an electrical motor. A control is operable to at least one of (a) cause fuses... Agent: Magna E-car Systems Of America, Inc.
20140285937 - Circuit and method of over-voltage protection: A circuit and method of over-voltage protection is provided to prevent the power supply to provide an exorbitant voltage to the electronic cigarette, the electronic cigarette case or the electronic cigarette charger; said circuit comprises a DC input terminal, a DC output terminal, a voltage sampling circuit, a switch control... Agent:
20140285938 - Over-current protection device: An over-current protection device comprises a PTC device, first and second electrodes, a first welding metal plate and a second welding metal plate. The PTC device comprises a first conductive layer, at second conductive layer and a PTC polymeric material layer laminated therebetween. The first electrode electrically connects to the... Agent: Polytronics Technology Corp.
20140285939 - Breaker circuit with failure self-detection functions: A breaker circuit is provided with failure self-detection functions. The circuit may comprise line and neutral power supply lines, line and neutral power output lines, a test magnetic coil, a neutral magnetic coil, a first electronic switch, and a first rectifier DC power unit comprising a bridge rectifier and a... Agent:
20140285940 - Master-slave digital circuit breakers: An electrical system includes a first circuit breaker that digitally senses a first current to a first load, and a second circuit breaker that digitally senses a second current to a second load and provides an output to the first circuit breaker. The first circuit breaker determines an average current... Agent: Hamilton Sundstrand Corporation
20140285941 - Electronic protection component: An electronic protection component comprises an outer case bounding an outer cavity therein; a varistor with a first varistor lead connected to a first varistor electrode and a second varistor lead connected to a second varistor electrode, wherein the varistor is placed in the outer cavity; a low melting point... Agent:
20140285942 - Electronic control device: An electronic control device has a resin case to which a circuit board having a terminal contact pad is fixed; a hydraulic unit having an electromagnetic solenoid which controls a hydraulic circuit and a pressure sensor which detects a pressure of the hydraulic circuit; a motor post having a current-carrying... Agent: Hitachi Automotive Systems, Ltd.
20140285943 - Ceramic member and member for semiconductor manufacturing equipment: A member 20 for semiconductor manufacturing equipment includes a base portion 22 and a ceramic member 30 formed on the base portion 22. The ceramic member 30 of the present invention includes a ceramic base 32 containing at least one of magnesium oxide, a magnesium oxide solid solution in which... Agent: Ngk Insulators, Ltd.
20140285944 - Electrostatic capacitance element and resonance circuit: A capacitance element body 2 is configured by two or more capacitors, the capacitors being formed of a dielectric layer 3 and at least three internal electrodes, the internal electrodes each being laminated via the dielectric layer 3 and arranged to allow a center of gravity of an electrode body... Agent: Dexerials Corporation
20140285945 - Tunable capacitor: A tunable capacitor includes a first electrode and a second electrode, each being formed of a conductive material. The tunable capacitor further includes a third electrode between the first electrode and the second electrode, and a dielectric material interposed between the first electrode and the third electrode, and between the... Agent: Mcv Technologies, Inc.
20140285948 - Laminated ceramic capacitor: A laminated ceramic capacitor having a laminated body composed of a plurality of ceramic layers for inner layers; a plurality of internal electrodes at the interfaces between the plurality of ceramic layers for inner layers; and a plurality of ceramic layers for outer layers, provided on the top and bottom... Agent: Murata Manufacturing Co., Ltd.
20140285947 - Low-height multilayer ceramic capacitor: A low-height multilayer ceramic capacitor offering excellent flexure strength meets the condition “t11c<t12b,” where t11c represents the thickness of each protective dielectric layer provided on respective top and bottom sides of a dielectric chip, and t12b represents the thickness of a wraparound part of each external electrode provided at least... Agent: Taiyo Yuden Co., Ltd.
20140285946 - Multilayer ceramic electronic component and manufacturing method thereof: There are provided a multilayer ceramic electronic component and a manufacturing method thereof, such that a high capacitance multilayer ceramic electronic component having excellent reliability through the suppression of crack generation due to a step portion and an increase in an overlapped area may be provided.... Agent: Samsung Electro-mechanics Co., Ltd.
20140285949 - Hard start kit for multiple replacement applications: A hard start capacitor replacement unit has a plurality of capacitors in a container sized to fit in existing hard start capacitor space. The capacitors are 4 metallized film capacitors wound in a single cylindrical capacitive element. The container has a common terminal and capacitors value terminals for the plurality... Agent:
20140285950 - Multi-layer ceramic capacitor and method of manufacturing the same: A multi-layer ceramic capacitor is constituted by ceramic dielectric layers alternately laminated with conductive layers, wherein the ceramic dielectric layers are sintered in such a way that core-shell grains having a core-shell structure are mixed with uniform solid-solution grains resulting from uniform progression of the solid solution process. Such multi-layer... Agent: Taiyo Yuden Co., Ltd.
20140285952 - Distortion-free screen-printed anodes on ta/nb sheet: A process for producing anodes includes providing a foil comprising tantalum or niobium. A surface of the foil is oxidized so as to form oxides on the foil surface. The foil is heated so that the oxides formed on the foil surface diffuse into the foil. A paste comprising a... Agent:
20140285951 - Solid electrolytic capacitor and manufacturing method therefor: A solid electrolytic capacitor that includes: a laminated body having a plurality of capacitor elements stacked to have principal surfaces thereof overlapped with each other. The capacitor elements each include a valve-action metallic substrate having two principal surfaces opposed to each other, a dielectric oxide film covering a surface of... Agent:
20140285953 - Cover window for display device, display device including the same, and method for manufacturing the same: A cover window for a display device includes a display area and a non-display area, the cover window including a frame member disposed corresponding to the non-display area, and a protective member disposed on the frame member corresponding to the display area and the non-display area.... Agent: Samsung Display Co., Ltd.
20140285955 - Electronic device: An electronic device includes a sensor board connected to a fingerprint sensor, a switch mounted at a side of the sensor board opposite the finger print sensor, a movable portion supporting the sensor board, the fingerprint sensor and the switch, a cover member provided beneath the switch and configured to... Agent: Fujitsu Limited
20140285954 - Electronic device with latching bumper, latching bumper thereof, and stackable electronic device system: A stackable electronic device with latching bumper includes a housing, an electrical connector, a latching mechanism having a linking module, a latching module and a button. The housing has a bottom board, a side board formed with a button hole, and a bumper disposed on the bottom board formed with... Agent: Winstron Corp.
20140285956 - Fused glass device housings: An electronic device may have a glass housing structures. The glass housing structures may be used to cover a display and other internal electronic device components. The glass housing structure may have multiple glass pieces that are joined using a glass fusing process. A peripheral glass member may be fused... Agent: Apple Inc.
20140285957 - Magnetic connector for electronic device: An electrical plug and receptacle relying on magnetic force from an electromagnet to maintain contact are disclosed. The plug and receptacle can be used as part of a power adapter for connecting an electronic device, such as a laptop computer, to a power supply. The plug includes electrical contacts, which... Agent:
20140285959 - Modular technology furniture: Systems are disclosed that relate to modular furniture capable of providing conventional desk functions as well as integrated electronic components which house, store, and operate electronic devices, such as computers and associated devices. Furniture components of a traditional office are adapted to house a plurality of electronic components of a... Agent: Nati Brook Ventures, LLC
20140285961 - Cover for portable terminal: A cover for a portable terminal having a fixing part for fixing the portable terminal and a folder rotating at the fixing part to open and close the portable terminal. The cover includes an input unit and/or a display unit, and a charging unit. The input unit inputs data to... Agent:
20140285960 - Hinge configuration for an electronic device: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). The electronic device may also include a hinge assembly to secure a top... Agent:
20140285958 - Method and transmitter for securement to a panel: A transmitter and a method for mounting a transmitter on a panel, wherein the panel is a door or wall of an electrical cabinet, a display panel, a control panel or a diaphragm, wherein the transmitter includes a display module and a computer module, wherein the display module includes at... Agent: Endress + Hauser Conducta Gesellschaft Fü R Mess- Und Regeltechnik Mbh + Co. Kg
20140285962 - Housing for slate tablet computer: A housing for a slate tablet computer is composed of a frame component and an input component. The frame component is removably attached to the input component. A support mechanism attached to the input component, wherein the support mechanism extends from the input component to oppose inadvertent rotating of the... Agent:
20140285963 - Portable computer vehicle dock: An automatically-lockable, shock absorbing dock for a portable computer, the dock comprising: a top plate configured to receive a portable computer, said top plate comprising: an automatic locking mechanism for securing the portable computer to said top plate, a set of connectivity ports, and a port replicator configured to connect... Agent:
20140285964 - Airflow block response in a system: A system including a chassis (102), a vent (130,132) in the chassis to exchange air from outside the chassis with air inside the chassis, a temperature sensor (114) inside the chassis, a power supply (106) to supply power to the system, and a controller (120) coupled to the temperature sensor... Agent:
20140285965 - Systems and assemblies for cooling server racks: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member;... Agent:
20140285967 - Conformal coating including embedded thermal energy absorbing material: Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.... Agent:
20140285966 - Server cabinet: A server cabinet includes a cabinet body and a heat dissipation apparatus attached to one side of the cabinet body. The heat dissipation apparatus includes a thermal conductive film, a heat sink, and a side cover fixed to the cabinet body. The side cover defines an opening for receiving the... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.
20140285968 - Frame and handles for holding a computer: An apparatus may be used with a notebook, tablet, mobile phone, computer, or other device to provide handles for securely and comfortably holding and manipulating the notebook. The apparatus generally includes a frame, a pair of handles, and a case approximately the size of the notebook. The apparatus may be... Agent:
20140285969 - Capacitor module with temperature sensor: In a capacitor module, a capacitor, a seal member that seals the capacitor, an electronic element electrically connected to the capacitor, a temperature sensor that measures a temperature around the capacitor, and a wire member electrically connected to the temperature sensor are provided. A holder holds at least the electronic... Agent: Denso Corporation
20140285970 - Electric power conversion system: There is provided an electric power conversion system. Bus bars 160 and 161 as heat-producing elements are provided on a circuit board assembly 150, and the circuit board assembly 150 is fixed to a DC-DC converter case 110. The DC-DC converter case 110 is integrated with an inverter 200, and... Agent:
20140285971 - Hand power tool: A hand power tool, in particular an angle grinder, includes a drive unit, an electronic unit, and a cooling device configured, at least partially, to cool the drive unit and/or the electronic unit. The cooling device includes at least one cooling unit configured, at least partially, for localized cooling.... Agent: Robert Bosch Gmbh
20140285972 - Housing and power module having the same: There are provided a housing capable of evenly distributing stress generated at the time of assembly thereof and a power module having the same. The housing for a power module according to an embodiment of the invention includes: a body part having a space formed therein, the space receiving a... Agent: Samsung Electro-mechanics Co., Ltd.
20140285973 - Housing and power module having the same: There are provided housing, capable of preventing a fastening part from being damaged by stress generated at the time of assembly thereof, and a power module having the same. The housing for the power module includes a body part having a space formed therein, the space accommodating a module substrate... Agent:
20140285974 - Substrate spacing member and inverter device: A substrate spacing member includes a spacer portion which is disposed between the two substrates in contact with both edge portions thereof to keep a distance between the two substrates constant, spacer member holding portions which hold the spacer members, a frame body portion that connects the spacer member holding... Agent: Kabushiki Kaisha Toyota Jidoshokki
20140285975 - Solar panel junction box capable of integratingwith a variety of accessory modules, and method of use: A junction box is affixed to, and electrically coupled with, a solar panel. The junction box is configured to releaseably engage and disengage accessory modules, thereby allowing accessory modules to be replaced or exchanged easily. Accessory modules are electrically coupled with other accessory modules in the solar panel string. The... Agent:
20140285976 - Module, electronic apparatus, moving object, and method of manufacturing module: A module includes an insulating substrate having an upper surface as a principal surface, a lid member having an internal space with the insulating substrate, and bonded to the upper surface in a first surface, a device element housed in the internal space, a semiconductor element connected to a top... Agent: Seiko Epson Corporation
20140285978 - Display apparatus: A front cabinet includes, on each long side thereof and at a location other than a corner region thereof, a rib member that protrudes toward a display module. The front cabinet includes, on each short side thereof and at a location other than a corner region thereof, a rib member... Agent: Funai Electric Co., Ltd.
20140285977 - Electronic device: An electronic device includes an electronic module, a tray, and a carrier. The tray includes a bottom plate and two elastic members located at two opposite sides of the accommodation space. The electronic module is located between the two elastic members. Each elastic arm of each elastic member has a... Agent: Inventec (pudong) Technology Corporation
20140285980 - Conversion of strain-inducing buffer to electrical insulator: Techniques are disclosed for converting a strain-inducing semiconductor buffer layer into an electrical insulator at one or more locations of the buffer layer, thereby allowing an above device layer to have a number of benefits, which in some embodiments include those that arise from being grown on a strain-inducing buffer... Agent:
20140285979 - Minimizing printed circuit board warpage: A printed circuit board and method of manufacturing same, the printed circuit board comprising a stack of layers. The stack of layers being comprised of alternating circuit layers and insulating layers that are laminated together. The stack of layers includes an area with resin cured to a degree. The area... Agent: International Business Machines Corporation
20140285982 - Display apparatus: A display apparatus is disclosed. In one aspect, the display apparatus includes: a panel assembly outputting an image. The apparatus also includes a flexible printed circuit made of a flexible material including a combination portion having at least a portion coupled to the panel assembly, a base portion disposed to... Agent:
20140285983 - Display device, mobile device using the same, method of manufacturing the display device: A display device includes a display panel, an actuator unit including a plurality of actuator members generating vibrations and disposed to face one side of the display panel, and a support unit contacting the actuator unit to receive a vibration generating from the actuator unit and including a plurality of... Agent: Samsung Display Co., Ltd.
20140285981 - Robust wires-to-meter connection: A robust and waterproof wires-to-meter connection that provides an apparatus for conducting signals from several signal-carrying, bundled wires to a circuit member that is mounted within the interior of a sealed case, and in particular an assembly for conducting the signals while providing a robust, compact and water-resistant connection between... Agent:
20140285985 - Electronic control device and method of manufacturing electronic control device: Provided is an electronic control device, in which positioning of a case including a connector housing portion and a pin header portion of a connector mounted on an electronic circuit board may be carried out easily with high accuracy so that ease of assembly and a water-proof property of the... Agent: Mitsubish Electric Corporation
20140285986 - Electronic device for vehicle: An electronic device for a vehicle has a housing, a pair of metal rails, a circuit board, a fastening member, and a conductive member. The housing includes an attaching portion to be attached to an attaching part of the vehicle and provides an interior space therein. The circuit board has... Agent: Denso Corporation
20140285984 - Enclosure: An enclosure according to an embodiment includes an internal space, an opening, a connector base, and a relay cable. A robot controller is accommodated in the internal space. The opening is formed in an external wall having predetermined environmental resistance. The connector base includes a first connector for connecting an... Agent: Kabushiki Kaisha Yaskawa Denki
20140285987 - Electronic control device: An electronic control device having a circuit board has: an enclosure formed from a plurality of enclosure members and accommodating the circuit board inside the enclosure; and a plurality of snap-fits separately arranged at the enclosure member to hold the circuit board. The snap-fit has a supporter elastically supporting one... Agent: Hitachi Automotive Systems, Ltd.
20140285988 - Substrate with built-in electronic component: A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality... Agent: Taiyo Yuden Co., Ltd.
20140285990 - Circuit board for connecting secondary battery: A circuit board for connecting a secondary battery including a first insulation layer, a conductive layer positioned on one surface of the first insulation layer, and a pad layer positioned on the conductive layer and divided into at least two areas is disclosed. In the circuit board, the conductive layer... Agent: Samsung Sdi Co., Ltd.
20140285989 - Method of mounting semiconductor element, and semiconductor device: A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a... Agent: Fujitsu Limited
20140285991 - Guide bracket and electronic device adopting the guide bracket: According to an example, a guide bracket and an electronic device adopting the guide bracket are provided. A free end of a resilient sheet installed in a wall of the guide bracket is to be held by a snap-fit part set in a chassis beyond the external surface of the... Agent: Hangzhou H3c Technologies Co., Ltd.
20140285992 - Display device, electronic apparatus, and method for manufacturing display device: According to an aspect, a display device includes a first display panel including a first protective layer; a second display panel including a second protective layer; and a connection part that connects the first display panel and the second display panel. The connection part includes a portion of a flexible... Agent: Japan Display Inc.09/18/2014 > 197 patent applications in 100 patent subcategories.
20140268430 - Breaker design for power system resiliency: An autonomous breaker can apply a current through a high impedance source to a bus coupled to either end of a breaker in order to measure an impedance of the bus. The status of the bus can be determined from the measurement. Based on the determined status, a fault detection... Agent: Transocean Sedco Forex Ventures Limited
20140268431 - Rotating diode assembly including overvoltage protection circuit: A brushless wound field synchronous generator configured to generate an output power to drive an electrical load includes a rotating rectifier assembly. The rotating rectifier assembly includes a rotating diode assembly and a field effect transistor (FET) to control voltage across the rotating diode assembly.... Agent: Hamilton Sundstrand Corporation
20140268432 - Multimotor variable frequency overload: An apparatus for protecting a motor includes two or more motor overloads, within a motor overload enclosure, protecting two or more motors. Each motor overload includes one or more current sensors where each current sensor includes a magnetic core and each current sensor includes a conductor positioned within the magnetic... Agent: Rockwell Automation Technologies, Inc.
20140268433 - System and method for protection of a compressor with an aluminum winding motor: A compressor is provided and includes a single-phase electric motor and a protector device. The electric motor drives a compression mechanism and has a rotor and a stator. The stator is comprised of aluminum windings. The protector device is attached to the stator and is configured to disconnect the electric... Agent: Emerson Climate Technologies, Inc.
20140268435 - Current saturation detection and clamping circuit and method: A method and circuit for detecting and clamping current in a ground fault circuit interrupter circuit. In accordance with an embodiment the circuit includes an amplifier connected to a switch, where in the amplifier has an input connected to a first conduction terminal of the switch through a resistor and... Agent: Semiconductor Components Industries, LLC
20140268437 - Gfci self test software functional program for autonomous monitoring and fail safe power denial operations: Software code for operating a circuit interrupting device having an auto-monitoring circuit for automatically testing various functions and structures of the device. The auto-monitoring circuit initiates the software code which includes an auto-monitoring routine which, among other things, establishes a self-test fault during the positive or negative half-wave of an... Agent:
20140268434 - Gfci with voltage level comparison and indirect sampling: A circuit interrupting device having an auto-monitoring circuit for automatically testing various functions and structures of the device. The auto-monitoring circuit initiates an auto-monitoring routine which, among other things, establishes a self-test fault during either the positive or negative half-wave, or both, of an AC power cycle and determines whether... Agent:
20140268436 - Protective device with non-volatile memory miswire circuit: The present invention is directed to an electrical wiring device that includes a processing circuit is configured to determine the wiring state based on detecting a wiring state parameter at the plurality of line terminals during a predetermined period after the tripped state has been established. The processing circuit is... Agent:
20140268441 - Active esd protection circuit: A high-voltage gate driver circuit configured to drive a high-side power switch and a low-side power switch includes an active dv/dt triggered ESD protection circuit coupled between a protected node and a power rail node. The active dv/dt triggered ESD protection circuit includes a dv/dt circuit controlling an ESD protection... Agent: Alpha And Omega Semiconductor Incorporated
20140268438 - Apparatuses and method for over-voltage event protection: Circuits, integrated circuits, apparatuses, and methods, such as those for protecting circuits against electrostatic discharge events are disclosed. An example apparatus comprises a thyristor coupled to a node and configured to limit the voltage and discharge the current associated with an over-voltage event at the node. The over-voltage event includes... Agent: Micron Technology, Inc.
20140268449 - Circuit and method of electrically decoupling nodes: A device includes a first power node, a second power node, a first input node, a second input node, a protected circuit, and a switch circuit. The protected circuit is coupled between the first power node and the second power node, and the protected circuit is further coupled with the... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.
20140268442 - Circuit arrangement and method for evaluating a signal: Circuit arrangement including an interface, a protection circuit and a measurement circuit. The interface is configured to receive a signal. The protection circuit is coupled to the interface. The protection circuit is configured to limit a voltage provided by the interface to a protection voltage. The measurement circuit is coupled... Agent: Infineon Technologies Ag
20140268445 - Cross talk mitigation: Cross-talk is mitigated in a switching circuit. In accordance with one or more embodiments, an apparatus includes a multi-pin connector having signal-carrying electrodes that communicate with a device external to the apparatus, and respective field-effect switches that couple the signal-carrying electrodes to respective communication channels in the apparatus. The switches... Agent: Nxp B.v.
20140268439 - Electrostatic discharge (esd) control circuit: One or more electrostatic discharge (ESD) control circuit are disclosed herein. In an embodiment, an ESD control circuit has first and second trigger transistors, first and second ESD transistors, and first and second feedback transistors. The ESD transistors provide ESD current paths for ESD current generated during an ESD event.... Agent: Taiwan Semiconductor Manufacturing Company Limited
20140268452 - Electrostatic discharge connector and method for an electronic device: An illustrative electronic assembly having an electrical connector therein to ground an electronic component of the electronic assembly to a grounding feature of a printed wiring assembly (PWA) of the electronic assembly. The electronic assembly may include a housing, the PWA, the electronic component and the electrical connector. The electrical... Agent:
20140268444 - Electrostatic discharge protection circuits using carbon nanotube field effect transistor (cntfet) devices and methods of making same: Device structures and methods for providing carbon nanotube field effect transistor (CNTFET) devices with enhanced current carrying capability at lower densities are disclosed. Apparatuses and methods using CNTFET devices for providing protection from electrostatic discharge (ESD) voltages are also disclosed. According to some aspects of the present disclosure the electrostatic... Agent:
20140268451 - High holding voltage clamp: An electrostatic discharge (ESD) protection device with a high holding voltage is disclosed including at least an ESD clamp coupled to a holding voltage tuning circuit. The ESD clamp may be coupled to the holding voltage tuning circuit through a connection circuit such as a diode. The ESD clamp may... Agent: Sofics Bvba
20140268450 - High speed latch with over voltage protection and integrated summing nodes: A latch includes a current source, an input amplifier, and a latch output circuit. The current source is configured to output a current based on a voltage source. The input amplifier is configured to receive a differential analog input signal including a first differential input and a second differential input... Agent: Marvell World Trade Ltd.
20140268443 - Input power protection: In one general aspect, an apparatus can include an input terminal, an output terminal and a ground terminal. The apparatus can also include an overcurrent protection device coupled between the input terminal and the output terminal. The apparatus can further include a thermal shunt device coupled between the output terminal... Agent: Fairchild Semiconductor Corporation
20140268448 - Method and apparatus of esd protection in stacked die semiconductor device: An apparatus includes an interposer and a plurality of dies stacked on the interposer. The interposer includes a first conductive network of a first trigger bus. Each of the plurality of dies includes a second conductive network of a second trigger bus, and an ESD detection circuit and an ESD... Agent:
20140268440 - Micromachined high breakdown voltage esd protection device for light emitting diode and method of making the same: This invention relates to a micromachined ESD protection device and its microfabrication method for light emitting diode (LEDs) chips. The LEDs is coupled to the ESD protection device in a shunt connection to absorb and eliminate the electrostatic charges induced by human contact or other voltage spike sources. The ESD... Agent: Wisenstech Inc.
20140268446 - Radio frequency integrated circuit (rfic) charged-device model (cdm) protection: An apparatus is described. The apparatus includes an input device. The apparatus also includes a positive supply voltage pad. The apparatus further includes an input signal pad. The apparatus also includes a ground pad. The apparatus further includes charged-device model protection circuitry that protects the input device from electrostatic discharge.... Agent: Qualcomm Incorporated
20140268447 - Radio frequency integrated circuit (rfic) charged-device model (cdm) protection: An apparatus is described. The apparatus includes an input device. The apparatus also includes a positive supply voltage pad. The apparatus further includes an input signal pad. The apparatus also includes a ground pad. The apparatus further includes charged-device model protection circuitry that protects the input device from electrostatic discharge.... Agent: Qualcomm Incorporated
20140268453 - Superconducting fault current limiter system: A current limiter system includes a superconducting fault current limiter (SCFCL) operative to conduct load current during a normal operation state in which the SCFCL is in a superconducting state. The current limiter system also includes a shunt reactor connected in an electrically parallel fashion to the SCFCL and configured... Agent: Varian Semiconductor Equipment Associates, Inc.
20140268454 - Systems and methods for power interruption: A power interruption circuit for use in a power distribution module is provided. The power interruption circuit is configured to provide power to a load and includes a shunt resistor, a plurality of switches, and microprocessor. The microprocessor is configured to determine a digitized value of a current flowing through... Agent: General Electric Company
20140268456 - Relay device: A relay device includes a relay circuit to which driving current is supplied from a battery, a driving circuit configured to drive the relay circuit, and a protecting circuit having a Schottky diode and a voltage suppressing element. The battery, the relay circuit, the driving circuit, and the protecting circuit... Agent: Yazaki Corporation
20140268455 - Reverse battery protection for battery-powered devices: Reverse battery protection circuits for devices powered by batteries coupled in parallel can include both P-channel and N-channel MOSFETs. Each positive battery terminal connector of a battery-powered device can be coupled to a gate of an N-channel MOSFET or to both a gate of an N-channel MOSFET and a gate... Agent: Bayer Healthcare LLC
20140268457 - High voltage protection apparatus and method: An apparatus includes first and second switches. The first switch is for coupling a first node to a second node responsive to a first control signal having a first value, and for decoupling these nodes responsive to the first control signal having a second value. The second switch is for... Agent: Taiwan Semiconductor Manufacturing Co., Ltd.
20140268458 - Systems and methods for detecting and determining sources of power disturbances in connection with effective remediation: Apparatus and methods for selective protection of an electrical load from disturbances on an input power line. A power protection circuit includes a selectively variable inrush current limiting circuit and a switch for disconnecting the input power line from the load. A control circuit determines that the electrical load is... Agent: Innovolt, Inc.
20140268461 - Control circuit for electric power circuit switch: A control circuit for an electric power circuit switch includes: a sampling/hold circuit section configured to sample a period of a detection signal of a current of an electric power system and provide a sampled signal; a discrete Fourier transforming (abbreviated as DFT) circuit section perform DFT on the one-period... Agent: Lsis Co., Ltd.
20140268459 - Methods and apparatus for dynamically adjusting an over-current protection threshold: Methods and apparatus for dynamically adjusting an over-current protection threshold (514) are disclosed. A dynamic over-current protection circuit (104) receives a first trigger to switch to a high discharge current mode. The dynamic over-current protection circuit (104) starts a high-current timer (210) and increases the over-current protection threshold (514) in... Agent: Motorola Mobility LLC
20140268460 - Methods and apparatus for protection in a multi-phase machine: In some embodiments, a system includes multiple coils of a multi-phase machine in which the coils are each associated with a different phase. Associated with each coil is a protective element such that each protective element is associated with a different coil. When its associated protective element is in a... Agent: Boulder Wind Power, Inc.
20140268462 - Methods and apparatus related to a precision input power protection device: In one general aspect, an apparatus can include an input terminal and an overvoltage protection device coupled to the input terminal and configured to receive energy via the input terminal. The overvoltage protection device can have a breakdown voltage at an ambient temperature less than a target maximum operating voltage... Agent: Fairchild Semiconductor Corporation
20140268464 - Output over-voltage protection circuit for power factor correction: An output over-voltage protection circuit for power factor correction, which includes a chip external compensation network, a chip external resistor divider network, a static over-voltage detection circuit, a dynamic over-voltage detection circuit and a compare circuit; The chip external compensation network is connected between the chip external resistor divider network... Agent: Csmc Technologies Fab2 Co., Ltd.
20140268463 - Overvoltage protection circuit: Universal Serial Bus (USB) protection circuits are provided. A circuit includes a plurality of first transistors connected in series between a pad and ground. The circuit also includes a plurality of second transistors connected in series between the pad and a supply voltage. The circuit further includes a control circuit... Agent: International Business Machines Corporation
20140268465 - System and method for providing optically triggered circuit breaker: A system/method for providing an optically triggered circuit breaker is provided. The system comprises a junction field-effect transistor (JFET) and gate drive coupled to the JFET's gate. The gate drive applies voltage bias (VG) to the gate and the gate drive is configured to bias VG so that the system... Agent: Northrop Grumman Systems Corporation
20140268466 - Power protection circuit: A power protection circuit includes a power source, a first voltage division module, a second voltage division module, a comparison module, an electronic switch, and a power module. The first voltage division module divides a voltage from the power source and outputs a first voltage. The second voltage division module... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.
20140268467 - Methods and apparatus to provide transient event protection for circuits: Methods and apparatus to provide transient event protection for circuits are disclosed. An example apparatus includes a first clamp circuit. The first power circuit provides a first reference voltage. The first clamp circuit directs energy from a signal node to the first power circuit in response to a transient resulting... Agent: The Boeing Company
20140268468 - Direct current breaker and electrical power system comprising such direct current breaker: A direct current breaker for a high voltage direct current application includes: two high voltage electron tubes arranged in an anti-parallel connection, and a control circuit for receiving, from a control system, infrared pulses including control information, the control circuit further including a device configured to convert the infrared pulses... Agent: Abb Technology Ag
20140268469 - Surge protection device and method: A surge protection device includes, in one embodiment, a reversible surge responder operative to engage an inner conductor engager during a protect mode and disengage the inner conductor engager during a normal mode. The surge responder returns to the normal mode from the protect mode without the intervention of an... Agent: John Mezzalingua Associates, LLC
20140268470 - Surge protection for an electronic device: A surge protection circuit for an electronic device such as an HVAC controller. In one example, the surge protection circuit may include a first voltage clamp, a second voltage clamp, a resistor, and an output port. The first voltage clamp may provide a first clamping voltage between a power input... Agent:
20140268471 - R-stack arrester: An elbow arrester with a T-body is disclosed capable of coupling with an apparatus for protection from transient over voltage, and coupling with additional cable accessories, without having to loosen the initial connection with the coupled apparatus. The elbow body of the T-body arrester has a first portion, and a... Agent: Richards Manufacturing Company
20140268472 - Mobile eas deactivator: A deactivator device for a mobile Point of Sale (mPOS) systems includes a pair of spaced apart, fixed position electromagnets positioned and configured such that magnetic fields generated by the electromagnets aid one another to form a combined magnetic field; a battery; a capacitor; and an electronics assembly including a... Agent: Tyco Fire & Security Gmbh
20140268473 - Electric vehicle support equipment having a smart plug with a relay control circuit: A smart plug for coupling an electric vehicle to a power supply includes a relay including contacts, the relay configured to operate in a closed state to enable power to be supplied to the electric vehicle and an open state to prohibit power from being supplied to the electric vehicle.... Agent: Tyco Electronics Corporation
20140268474 - Method of closing a relay switch and appartus thereof: A load control device for controlling an amount of power delivered from an alternating current (AC) power source to an electrical load includes a relay operable to be coupled in series electrical connection between the AC power source and the electrical load. The relay has one or more relay contacts.... Agent: Lutron Electronics Inc., Co.
20140268475 - Ionizer: An ionizer includes an electrode shaft, a fixing bar, a driver, and a controller. The electrode shaft includes first and second electrode rows, the first electrode row having a plurality of ionizer electrodes arranged in a first direction and the second electrode row having a plurality of ionizer electrodes arranged... Agent: Samsung Display Co., Ltd.
20140268476 - Method and system for significantly improving charge probabilities of nanometer aerosol particles: The various embodiments described herein significantly increase charge probabilities of nanoparticles by first growing them to larger droplets using a diethylene glycol-based preconditioner, neutralizing the droplets with a bipolar charger, and then removing the condensed liquid to recover the original aerosol particles. The small droplet size is an important element... Agent: Tsi Incorporated
20140268477 - Personal defense accessory for a mobile communications device: A personal defense accessory for interaction with a mobile communications device includes a main housing. A pair of electrodes are disposed in the main housing. A controller is disposed with the main housing and connected to the pair of electrodes to deliver a stun rated shock.... Agent:
20140268478 - Methods and apparatus for electrostatic chuck repair and refurbishment: In one embodiment of the invention, a substrate support assembly comprises an electrostatic chuck having an electrode embedded therein and having an aperture disposed therethrough, a conductive liner disposed on the surface of the electrostatic chuck within the aperture, a conductive tubing extending from a lower surface of the electrostatic... Agent:
20140268479 - Substrate support chuck cooling for deposition chamber: A substrate support chuck for use in a substrate processing system is provided herein. In some embodiments, a substrate support for use in a substrate processing chamber may include an electrostatic chuck having a top substrate support surface and a bottom surface, and a cooling ring assembly having a central... Agent: Applied Materials, Inc.
20140268480 - High voltage connection sealing method for corona ignition coil: A corona igniter assembly 20 comprises an ignition coil assembly 22, a firing end assembly 24, and a metal tube 26 connecting the ignition coil assembly 22 to the firing end assembly 24. A rubber boot 28 is disposed in the metal tube 26 and compressed symmetrically between a coil... Agent: Federal-mogul Ignition Company
20140268481 - Complex oxide, thin-film capacitive element, liquid droplet discharge head, and method of producing complex oxide: A complex oxide includes a chemical compound represented by ABO3 (Chemical Formula 1). In the Chemical Formula 1, A is one or more elements selected from Ba, Ca, and Sr; and B is one or more elements selected from Ti, Zr, Hf, and Sn. When a field having a size... Agent: Ricoh Company, Ltd.
20140268482 - Actuator plate partitioning and control devices and methods: Devices and methods of operating partitioned actuator plates to obtain a desirable shape of a movable component of a micro-electro-mechanical system (MEMS) device. The subject matter described herein can in some embodiments include a micro-electro-mechanical system (MEMS) device including a plurality of actuation electrodes attached to a first surface, where... Agent:
20140268483 - Ferroelectric capacitor with improved fatigue and breakdown properties: Disclosed is a ferroelectric material and methods for its use in capacitors that includes a polymer blend of at least two polymers, wherein the first polymer is a ferroelectric polymer and the second polymer has a low dielectric constant.... Agent: Saudi Basic Industries Corporation
20140268485 - Conductive paste for external electrodes and multilayer ceramic electronic component using the same: There are provided a conductive paste for external electrodes and a multilayer ceramic electronic component using the same. The conductive paste includes a conductive metal powder including conductive metal particles; and a conductive amorphous metal powder including amorphous metal particles having a(Si, B)-b(Li, K)-c(V, Mn) in which a+b+c=100, 20≦a≦60, 10≦b≦40,... Agent:
20140268489 - Dielectric ceramic and laminated ceramic capacitor: A laminated ceramic capacitor which has a long high temperature load life, small variations in life, large capacitance, high electrical insulation property, and favorable capacitance temperature characteristics, even when high strength electric field is applied while reducing the thickness of dielectric ceramic layers uses a dielectric ceramic represented by the... Agent: Murata Manufacturing Co., Ltd.
20140268484 - Dielectric ceramic composition and multilayer ceramic capacitor including the same: A dielectric ceramic composition includes: a base material powder BamTiO3 (0.995≦m≦1.010); 0.2 to 2.0 moles of a first accessory ingredient, an oxide or carbide containing at least one of Ba and Ca, based on 100 moles of the base material powder; a second accessory ingredient, an oxide containing Si or... Agent:
20140268486 - Electronic component: An electronic component includes a laminated capacitor and a substrate-type terminal on which the laminated capacitor is mounted, with an viscoelastic resin located in a space between the laminated capacitor and the substrate-type terminal. The substrate-type terminal includes a substrate body, component connecting electrodes to mount the laminated capacitor are... Agent: Murata Manufacturing Co., Ltd.
20140268487 - Electronic component, substrate-type terminal included therein, and electronic component mounted structure: A substrate-type terminal includes a first major surface with a first mounting electrode and a second mounting electrode. The substrate-type terminal includes a second major surface with a first connecting electrode and a second connecting electrode. The substrate-type terminal includes a first slit located between the first mounting electrode and... Agent: Murata Manufacturing Co., Ltd.
20140268488 - Monolithic capacitor: A monolithic capacitor includes a multilayer body including a plurality of stacked dielectric layers, first and second capacitor electrodes inside the multilayer body, and outer electrodes on at least one surface of the multilayer body. The first and second capacitor electrodes are arranged perpendicularly or substantially perpendicularly to first and... Agent: Murata Manufacturing Co., Ltd.
20140268490 - Super capacitor and method for manufacturing the same: The invention provides a super capacitor, comprising: a bottom electrode, made of metal that has a sponge-like porous bicontinuous structure wherein the porous bicontinuous structure comprises a plurality of continuous nano pores; a dielectric layer, made of material with high dielectric constant and disposed on the bottom electrode wherein the... Agent: National Taiwan University
20140268491 - Capacitors using porous alumina structures: Capacitors and methods of making the same are disclosed herein. In one embodiment, a capacitor comprises a structure having first and second oppositely facing surfaces and a plurality of pores each extending in a first direction from the first surface towards the second surface, and each having pore having insulating... Agent: Invensas Corporation
20140268492 - Barium calcium tin titanate powder, dielectric composition and multilayer ceramic capacitor: There is provided a dielectric composition containing barium calcium tin titanate powder composed of (Ba(1-x-y)CaxSny)zTiO3, satisfying 0.01≦x≦0.15, 0.01≦y≦0.20, and 0.99≦z≦1.01.... Agent: Samsung Electro-mechanics Co., Ltd.
20140268493 - Biaxially stretched polypropylene film for capacitor, metallized film, and film capacitor: Provided is a biaxially stretched polypropylene film for capacitors which has high withstand voltage characteristics when used as a dielectric for capacitors and which has highly suitable processability into elements. The biaxially stretched polypropylene film for capacitors has projections on both surfaces and has a thickness (t1, μm) of 4-20... Agent: Toray Industries, Inc.
20140268494 - Low energy milling to produce flake powders: A method for increasing surface area of a valve metal particle is provided as is an improved valve metal particle provided thereby. The method includes charging a mill apparatus with a valve metal powder and a media wherein the media has an average diameter of at least 0.01 cm to... Agent: Kemet Electronics Corporation
20140268496 - Electrical energy storage device and manufacturing method thereof: Disclosed is an electrical energy storage device provided with a metallic casing to receive a bare cell and first and second terminals located outside of the metallic casing corresponding to each electrode of the bare cell, including a plate-like member provided on at least one of the first and second... Agent: Ls Mtron Ltd.
20140268495 - Electrodes for capacitors from mixed carbon compositions: Wet carbon paper processing, wet carbon papers, electrodes prepared from such wet carbon papers, and capacitors prepared from such electrodes.... Agent:
20140268499 - Flat capacitor for an implantable medical device: One aspect provides a capacitor feedthrough assembly having an electrically conductive member dimensioned to extend at least partially through a feedthrough hole of a case of the capacitor, the conductive member having a passage therethrough.... Agent: Cardiac Pacemakers, Inc.
20140268497 - Wet electrolytic capacitor: A wet electrolytic capacitor that contains electrodes (i.e., anode and cathode) and a working electrolyte is provided. The anode and optionally the cathode include a wire assembly containing two or more individual wires. A particulate material is also disposed in contact with at least a portion of the wire assembly.... Agent: Avx Corporation
20140268498 - Wet electrolytic capacitor for use at high temperatures: A wet electrolytic capacitor that contains an anode formed from an anodically oxidized sintered porous body and a fluidic working electrolyte is provided. The casing contains a metal substrate coated an electrochemically-active material. Through a unique and controlled combination of features relating to the capacitor configuration and sealing assembly, the... Agent: Avx Corporation
20140268500 - Winding-type solid electrolytic capacitor package structure using a lead frame and method of manufacturing the same: A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface.... Agent: Apaq Technology Co., Ltd.
20140268501 - Solid electrolytic capacitor for use in extreme conditions: A capacitor assembly that is capable of performing under extreme conditions, such as at high temperatures and/or high voltages, is provided. The ability to perform at high temperature is achieved in part by enclosing and hermetically sealing the capacitor element within a housing in the presence of a gaseous atmosphere... Agent: Avx Corporation
20140268502 - Solid electrolytic capacitor: A capacitor for use in relatively high voltage environments is provided. The solid electrolyte is formed from a plurality of pre-polymerized particles in the form of a dispersion. In addition, the anode is formed such that it contains at least one longitudinally extending channel is recessed therein. The channel may... Agent: Avx Corporation
20140268503 - Winding-type solid electrolytic capacitor package structure without using a lead frame and method of manufacturing the same: A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative... Agent: Apaq Technology Co., Ltd.
20140268504 - Modular wire harness arrangements and methods of using same for backside to frontside power and data distribution safety schemes: A large format billboard type electronic sign includes at least one structural frame member mounted to a front side of a planar mounting structure that defines a plurality of structural bay members configured for receiving and removably supporting therein a corresponding plurality of weatherized display modules to conceal and protect... Agent: Adti Media, LLC
20140268505 - Arc chute assembly for an automatic transfer switch system and methods of assembling the same: An arc chute assembly for use in an automatic transfer switch includes a housing including a pair of opposing sidewalls and a primary deionization plate coupled between the pair of opposing sidewalls. The primary deionization plate includes a tongue portion oriented substantially midway between the opposing sidewalls and extending toward... Agent: General Electric Company
20140268506 - Utility meter box and meter box cover: Provided is a meter box, a meter box cover and methods and apparatuses related to meter boxes and meter box covers. The meter box and meter box cover may include features which allow the meter box and meter box cover to be secured to each other and may be manufactured... Agent: Trumbull Manufacturing, Inc.
20140268507 - Cable protector for utility meter: Techniques for the construction and use of cable protectors are described herein. The cable protectors may be used to protect cables in a wide variety of applications, locations and environments, including a utility (e.g., water or gas) metering application. In one example, the cable protector may protect a cable connecting... Agent: Itron, Inc.
20140268516 - Biometric and proximity sensor compatible protective case for mobile device: A protective case can be used with a mobile device having front and back surfaces and side surfaces extending between the front and back surfaces, including a top side, a bottom side, a right side, and a left side, the mobile device having a screen on the front surface. The... Agent: Incipio Technologies, Inc.
20140268512 - Calabria din rail mount bracket: A bracket may be provided. The bracket may comprise a main plate comprising a bend. In addition, the bracket may comprise a slider plate configured to movably slide against the main plate. The slider plate may further comprise an offset that may be substantially parallel with the bend. The bracket... Agent: Cisco Technology, Inc.
20140268525 - Case, method of manufacturing case, and electronic device: A case for an electronic device includes an injection preform having a recess on at least one portion of a surface thereof, a deposition layer deposited on a surface of the injection preform, and a paint layer formed on the deposition layer. The deposition layer may directly contact a surface... Agent: Samsung Electronics Co., Ltd.
20140268526 - Combining different types of moisture-resistant materials: Protective coatings, including moisture-resistant coatings, that include two or more different types of moisture-resistant materials are disclosed, as are moisture-sensitive substrates that include such protective coatings. Moisture-sensitive substrates that include different types of moisture-resistant coatings on different elements are also disclosed.... Agent: Hzo, Inc.
20140268511 - Control box mounting bracket: A bracket configured to mount a control box to a television mount used to carry a television. An example bracket may have a bracket plate, a bracing element, and attachment elements. The bracing element is attached to a back side of the bracket plate, and the bracing element is attachable... Agent: Related Visual Services, Inc.
20140268513 - Display screen assembly having a selectively engageable mount assembly: A display screen assembly is provided. The display screen defines a channel for allowing selective engagement of the display screen. A mount assembly is provided and includes a base for supporting the display screen assembly about a support surface, and a locking assembly that selectively engages the channel to thereby... Agent: Toshiba Global Commerce Solutions Holdings Corporation
20140268524 - Distributed sensor system: A distributed sensor system is disclosed that provides spatial and temporal data in an operating environment. The distributed sensor nodes can be coupled together to form a distributed sensor system. For example, a distributed sensor system comprises a collection of Sensor Nodes (SN) that are physically coupled and are able... Agent:
20140268518 - Durable protective battery case: A durable and water-resistant or water-proof communication accessory with a built-in battery for a mobile communication device capable of enclosing, powering, and protecting a mobile device and protecting it from dirt, water, weather, bumps, and scratches. The built-in battery can extend the life of mobile communication device while protecting the... Agent: Mophie, Inc.
20140268521 - Electronic device: An electronic device includes: a first case that includes a first inner surface; a second case that includes a second inner surface that are opposed to the first inner surface; and a packing member that includes a packing portion formed along an entire inner circumference of the first inner surface... Agent: Fujitsu Limited
20140268522 - Electronic device: An electronic device is an electronic device that measures biological information. The electronic device includes a biological-information sensor section configured to measure the biological information and an armor case configured to house the biological-information sensor section. The armor case includes a case main body section and a rear lid section.... Agent: Seiko Epson Corporation
20140268517 - Electronic device with protective case and operating method thereof: An electronic device is provided. The electronic device includes a connector detachable from part of an electronic device including a display, and a cover connected to the connector, wherein the cover is capable of covering at least part of the display of the electronic device, and wherein the cover includes... Agent: Samsung Electronics Co., Ltd.
20140268508 - Framework for tailored personal electronics: One embodiment of the practical framework for production of apparel articles incorporating electronic devices such as wired speakers. This framework securely locates the desired electronic (1) and applique elements (9, 10). The materials of which the substrate (3, 4, 6, 7) is comprised possess distinct qualities enabling it to be... Agent:
20140268514 - Ihs accessible rack securing system: A rack securing system includes a rack having a plurality of posts that are oriented to house a plurality of device chassis. Each of the plurality of posts includes a plurality of post apertures that are operable to receive a fastener to couple an edge of a device chassis to... Agent:
20140268527 - Image reproduction assembly having a front pane fastened in a space-saving manner: An image reproduction assembly having a two-dimensional image presentation matrix bounded by edges and by means of the matrix elements of which images are presented, fastening elements attached adjacent to edges of the matrix, a front pane fastened to the fastening elements, which is fixed in a plane in front... Agent: Tridelity Ag
20140268515 - Magnetic and electrostatic vibration-driven haptic touchscreen: A system adapted for selectively attracting an object to and moving the object on a surface. The system includes an oscillating element including a contact surface such as a computer tablet with a touch screen or a table with a ferrous surface. The system includes a drive (or vibration inducing)... Agent: Disney Enterprises, Inc.
20140268520 - Method of manufacturing member with sealing material layer, member with sealing material layer, and manufacturing apparatus: A method of manufacturing a member with a sealing material layer has a substrate preparation step, a coating step, a firing step, and a pre-process step. In the substrate preparation step, a substrate having a frame-shaped sealing region is prepared. In the coating step, a sealing material paste is applied... Agent: Asahi Glass Company, Limited
20140268509 - Portable device holding apparatus: An apparatus for holding a portable device is provided which includes a cradle for holding the portable device. A support member is operatively coupled to the cradle and includes an inserting member. The inserting member may be received by a receiving member coupled to a base member, wherein the base... Agent: Ford Global Technologies, LLC
20140268519 - Protective case for mobile device: Disclosed is durable and water-resistant or water-proof communication accessory with a built-in battery for a mobile communication device capable of enclosing, powering, and protecting a mobile device and protecting it from dirt, water, weather, bumps, and scratches. The built-in battery can extend the battery operating time of mobile communication device... Agent: Mophie, Inc.
20140268510 - Support module and support device having multiple degrees of freedom: A support device having multiple degrees of freedom includes a base unit, a first support unit, a second support unit and a hinge unit. The base unit includes a base body. The first support unit includes a first support structure disposed on the base body. The second support unit includes... Agent: Flytech Technology Co., Ltd.
20140268523 - Wearable device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor: A wearable device is provided having multiple sensors configured to detect and measure different parameters of interest. The wearable device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS... Agent:
20140268528 - Rack adapter apparatus and method: Embodiments of the present disclosure disclose a rack adapter apparatus. The rack adapter apparatus includes a shelf configured to be mounted in a rack frame having a front opening of a first width and a rear opening of the first width, the shelf being further configured to support a computing... Agent: Rackspace Us, Inc.
20140268531 - Television receiving box docking station rack and system: A cable box docking station rack includes a frame carrying a series of shelves, and each shelf including a series of docking stations for connection with cable boxes. Each docking station includes a fixed back plate and a slide plate in sliding relation. The back plate includes a series of... Agent:
20140268532 - Flexible electronic display and stand: An electronic display assembly may comprise a flexible electronic display screen that may be rolled onto a reel in a retracted configuration and extend from the reel in an extended configuration. Additionally, some electronic display stands are capable of connecting to and supporting a flexible electronic display screen in an... Agent:
20140268533 - Information handling system housing lid with synchronized motion: An information handling system converts from a closed position to a tablet position by rotating a lid with a display 360 degrees about a hinge having synchronized and continuous motion. The hinge has first and second axles held distal by a spacer. A synchronizer translates motion of each axle to... Agent:
20140268535 - Chopped-fibers with axial property gradient for molded parts: A portable computing device includes a processor, a memory, and a portable computing device case that encloses one or more integrated circuits, including at least the processor and the memory. The case includes a molded fiber-reinforced polymer (FRP) material that includes a polymer material and elongated fibers that adhere to... Agent: Google Inc.
20140268536 - High density server storage unit: A rack mountable 1U storage unit includes a plurality of memory modules arranged in two groups. The storage unit also has control circuitry. The memory modules have a dedicated exhaust channel to draw heat away from the memory modules. The exhaust channel for the memory modules is disposed over and... Agent: Skyera, Inc.
20140268534 - Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming an opening in a dielectric material of a package substrate, and then plating a conductive interconnect structure in the opening utilizing a plating process. The plating process may comprises... Agent:
20140268537 - In-package fly-by signaling: In-package fly-by signaling can be provided in a multi-chip microelectronic package having address lines on a package substrate configured to carry address information to a first connection region on the substrate having a first delay from terminals of the package, and the address lines being configured to carry the address... Agent: Invensas Corporation
20140268538 - Jbod cable: Embodiments of the invention include a plurality of flexible electrical conductors configured as a cable wherein a plurality of signal pairs connect printed circuit boards in an array of data storage devices or just a bunch of disks (JBOD) enclosure. By controlling various specific dimensions relating to each signal pair... Agent:
20140268540 - Fixing mechanism and related electronic device: A detachable fixing mechanism includes a supporter, a contacting component, a fixing component, a track component and an ejecting component. An electronic component is hold be the supporter. The supporter includes a base, a rear wall and two lateral walls. The rear wall and the lateral walls are disposed on... Agent: Wistron Corporation
20140268539 - Toolless hot swappable storage module: A toolless hot-swappable storage module system includes a base plate for mounting within a computer enclosure and a toolless hot-swappable storage module. The storage module includes a sled that is removably coupled to the base plate. The storage module further includes a printed circuit board (PCB) that is disposed on... Agent: Silicon Graphics International Corp.
20140268529 - Array of elements and a human-computer interface device: A human-computer interface device comprising an array of elements wherein each element is pivotally coupled to an adjacent first element by a first pivotal coupling and to an adjacent second element by a second pivotal coupling, the first pivotal coupling being operable to pivot about an axis which is substantially... Agent:
20140268542 - Docking apparatus of electronic apparatus: A docking apparatus of an electronic apparatus that can support the electronic apparatus is provided. The docking apparatus of an electronic apparatus may include a body that forms an exterior of the docking apparatus, a support portion rotatably coupled to the body, and an interface module coupled to the body... Agent: Samsung Electronics Co., Ltd.
20140268541 - System for mobile device cradle and tube gripper of non-destructive testing inspection device: A system includes a mobile handset with a handle portion and a gripper portion coupled to the handle portion. The handle portion includes a first dock configured to removably receive a user interface device. The gripper portion is configured to receive an insertion tube of a non-destructive testing (NDT) inspection... Agent: General Electric Company
20140268543 - Docking station for portable electronics: Disclosed is a docking station for holding a plurality of external connectors in position to interface with an electronic device including a main body having a first side and a second side, a positioning member extending vertically from the first side of the main body for receiving the electronic device,... Agent:
20140268544 - Pivotal vehicle mounting system for mobile computing devices: A mounting device includes a cradle including a first recess and configured to be mounted in a vehicle, a pivotable hinge member coupled to the cradle, and a docking tray coupled to the pivotable hinge member. The docking tray is configured to lock in a first position within the first... Agent: Voxx International Corporation
20140268549 - Device for cooling an electronic component in a data center: A device for cooling an electronic component in a data center is provided. The device includes a closed loop, a first area, a second area, and a barrier. The closed loop includes a first portion and a second portion. The liquid flows around the closed loop. The first area is... Agent: Hewlett-packard Development Company, L.p.
20140268547 - Electronic device rack and information processing apparatus: An electronic device rack includes a plurality of panels surrounding a first space. Moreover, the electronic device rack includes: an electronic-device housing unit disposed in the first space and configured to house electronic devices; a heat exchanger disposed in the first space at a position away from the electronic-device housing... Agent: Fujitsu Limited
20140268546 - Heat and airflow management in a data storage device: A chassis sub-assembly for computing devices includes a first heat sink plate and a second heat sink plate. The first heat sink plate includes a first plurality of perforations and the second heat sink plate includes a second plurality of perforations. The chassis sub-assembly also includes a first computing device... Agent: Evtron, Inc.
20140268545 - Modular synthetic jet ejector and systems incorporating the same: A synthetic jet ejector (501) is provided which includes a diaphragm (503) and a chassis (505). The chassis has first and second major surfaces which are equipped with a set of interlocking features (509) such that a first instance of the synthetic jet ejector releasably attaches to a second instance... Agent: Nuventix, Inc.
20140268548 - Thermosiphon systems for electronic devices: A thermosiphon system includes a condenser and an evaporator fluidically coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a... Agent: Google Inc.
20140268551 - Enclosure high pressure push-pull airflow: High pressure fans are mounted in the middle of an enclosure to create a low pressure zone and a high pressure zone within the enclosure. The high pressure fans pull air through high density sets of hard disk drives in the back of an enclosure and push air through high... Agent: Silicon Graphics International Corp.
20140268550 - Server with heat pipe cooling: A server includes a tray that has a front portion and a back portion. A motherboard is disposed in the front portion of the tray and the motherboard is coupled to a heat sink. A fan is disposed in the back portion of the tray. A hard drive is disposed... Agent: Silicon Graphics International Corp.
20140268530 - Data center facility design configuration: The methods and apparatuses described herein is a data center. In one embodiment is described a data center comprising: a building having a plurality of rooms and first and second exterior load walls disposed on opposite sides of the building; a plurality of air handler and fluid cooler devices disposed... Agent: Switch Communications Group LLC
20140268552 - Server with heat baffle cooling: A server provides for improved cooling using one or more baffles. The baffles allow for increased cooling efficiencies by directing heat in such a manner as to reduce heat exposure for temperature sensitive hardware and data center employees. The baffle may be disposed within a server and direct hot air... Agent: Silicon Graphics International Corp.
20140268553 - System for cooling multiple in-line central processing units in a confined enclosure: A system for cooling multiple in-line CPUs in a confined enclosure is provided. In an embodiment, the system may include a front CPU and a front heat sink that may be coupled to the front CPU. The front heat sink may have a plurality of fins and a corresponding fin... Agent:
20140268554 - Stackable computing system: Systems and methods providing for stackable rack-based computing systems are discussed herein. A stackable rack-based computing system may include a plurality of stackable shelf frames. Each stackable shelf frame may include a module and one or more cooling elements to cool the module from a first side. The stackable shelf... Agent: Birchbridge Incorporated
20140268556 - Detachable computing system having dual batteries: A computing system may include a base portion to receive one or more first batteries, and a tablet portion having one or more electronic components and the tablet portion to receive one or more second batteries. The tablet portion may be configured to be coupled to and detached from the... Agent:
20140268558 - Electrical assembly having impedance controlled signal traces: An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In accordance with one embodiment, there is provided a portable electronic device, comprising an electrical assembly, comprising: a chassis made from a conductive material and forming... Agent:
20140268557 - Information processing apparatus, electronic apparatus, and frame unit for information processing apparatus: An information processing apparatus includes a body, a frame, and a hinge that allows the frame to be attached to a side face of the body in such a manner as to be rotatable and stoppable at any angle.... Agent: Fujitsu Limited
20140268555 - Locking mechanism for hinge assembly: In one embodiment a locking mechanism for a hinge, comprises a housing defining a chamber which is to contain a magnetorheological (MR) fluid, a bias mechanism which disposed at a first end of the chamber, a piston disposed at a second end of the chamber, the piston to be coupled... Agent:
20140268559 - Pcb mounted cover activated intrusion detection switch: An intrusion detection switch is attached directly to a printed circuit board and utilized within an enclosure. Wires are not used to extend the switch to the top of the enclosure. An extension mechanism is used to extend a triggering portion of the intrusion detection switch to an engaging surface... Agent:
20140268560 - Motorized mount for seating system: The present disclosure illustrates a motorized mount with a plurality of degrees of freedom coupled to a seating system.... Agent: Purdue Research Foundation
20140268561 - Electronic equipment and heat receiving device: a heat receiving device, wherein the heat receiving device includes: a case including a contacting surface which contacts the heat generating component; a flow passage, formed within the case, configured to flow a coolant flows, and an inflow port and an outflow port of the flow passage formed in an... Agent: Fujitsu Limited
20140268562 - Compound structural frame and method of using same for efficient retrofitting: Supports for plural billboard display modules include one or more structural frames mountable to existing billboard poster panels and other planar structural surfaces; each individual structural frame having a sufficient number of frame cutout areas to minimize frame weight to no greater than fifty pounds for hand lifting and mounting... Agent: Adti Media, LLC
20140268563 - Method and apparatus for controlling heat in power conversion systems: A power module includes a housing and an AC/DC converter within the housing. The AC/DC converter is configured to convert an AC input signal into a DC output signal. The power module also includes an actuated heat removal device. The actuated heat removal device is configured to remove heat produced... Agent:
20140268564 - Method and apparatus for controlling heat in power conversion systems: A power conversion module, such as a power adapter, includes a heat removal system such as an active heat removal system, a passive heat removal system or a hybrid heat removal system. A small-size power conversion module having a heat removal system is described.... Agent:
20140268565 - Sectional sign assembly and installation kit and method of using same: A modification kit for converting an existing signage mounting structure to an electronic sign generally includes a plurality of weatherized display modules; a plurality of sign sections each having a front-facing portion and a rear-facing portion, the front facing portion defining a two dimensional array of bays arranged in a... Agent: Adti Media, LLC
20140268566 - Digital subscriber line access multiplexer enclosures having onboard power: A system includes a digital subscriber line access multiplexer (DSLAM) enclosure having a power area for housing power components and a component area for housing components configured to receive power from the power components. The system further includes at least one DSLAM positioned in the component area of the DSLAM... Agent: Emerson Network Power, Energy Systems, North America, Inc.
20140268567 - Electronic device enclosure: An electronic device enclosure includes a casing, an air duct mounted in the casing, and a latching member. The air duct includes a receiving bracket formed on the air duct for receiving an uninterruptible power supply module. The latching member is covered on the receiving bracket to position the uninterruptible... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.
20140268568 - Board unit and electronic device: A board unit includes a board to have an object to be cooled, the object being implemented on the board, a baffle plate to be rotatably coupled to the board and to be displaced to a first rotary position to guide a cooling air, flowing from a first direction to... Agent: Fujitsu Limited
20140268569 - Method and system for providing a customized storage container: A method and system for providing a customized storage container includes a generally rectangular housing and at least one printed circuit board contained within the rectangular housing. The customized storage container encloses a first row of interconnector modules that are positioned adjacent to a first, open end of the rectangular... Agent: Netapp, Inc.
20140268570 - Power pole isolated heat pipe inverter assembly: A power pole inverter is provided. The power pole inverter includes a housing assembly, a capacitor assembly, a number of arm assemblies, a number of heat sinks, and a support assembly. The housing assembly includes a number of sidewalk. The housing assembly sidewalls defining an enclosed space. The capacitor assembly... Agent: Eaton Corporation
20140268571 - System and method for cooling heat generating components: An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components... Agent: Aavid Thermalloy, LLC
20140268572 - Advanced cooling for power module switches: A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader, and a heat sink with microchannels running through it attached to a bottom end of the... Agent: Hamilton Sundstrand Corporation
20140268573 - Management of exterior temperatures encountered by user of a portable electronic device in response to an inferred user contact with the portable electronic device: Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component... Agent: Elwha LLC
20140268574 - Component built-in board and method of manufacturing the same, and component built-in board mounting body: A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring... Agent: Fujikura Ltd.
20140268575 - Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint: A method and apparatus are provided for implementing enhanced heat sink loading for cooling an electronic module having one or more semiconductor chips. The apparatus includes an electronic module having one or more semiconductor chips; a heat sink; a heat sink load bearing member further comprising raised points; a load... Agent: International Business Machines Corporation
20140268576 - Line replaceable unit with universal heat sink receptacle: A line replaceable unit includes a universal heat sink receptacle formed in an inner surface of a wall of an enclosure. The universal heat sink receptacle is configured to receive a heat spreader for any standard or custom COM Express module so that the line replaceable unit may be efficiently... Agent: Gogo LLC
20140268577 - Chip package connector assembly: This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts. The chip package assembly may include a chip package including a first side and a second side, the second side including a first plurality of... Agent:
20140268578 - Electronic device with heat dissipating electromagnetic interference shielding structures: An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within... Agent: Apple Inc.
20140268579 - Electronic devices assembled with heat absorbing and/or thermally insulating composition: Provided herein are electronic devices assembled with a heat absorbing and/or thermally insulating composition.... Agent: Henkel Corporation
20140268580 - Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board: In one embodiment, a printed circuit board (PCB) assembly includes a PCB, the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement and a surface mount component.... Agent: Cisco Technology, Inc.
20140268581 - Wiring substrate and manufacturing method thereof: Disclosed is a wiring substrate and method of manufacturing thereof, the wiring substrate including: a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a connection terminal... Agent: Yazaki Corporation
20140268582 - Electronic device enclosure system and method: An enclosure for storing more than one electronic device. The enclosure includes a frame having a rear surface to be in apposition to a support surface, a rack supported within the frame, the racking having at least one slot for receiving an electronic device, and a door supported by the... Agent: Ergotron, Inc.
20140268584 - Display apparatus: A display apparatus includes a display module for displaying an image, and a variable member for varying a shape of the display module. The variable member includes a first portion capable of varying in shape, and a second portion having opposite ends respectively fixed to opposite ends of the first... Agent: Lg Electronics Inc.
20140268583 - Electrical gasket and electronic module having electrical gasket: An electrical gasket provides an electrical seal between first and second components in an electrical module. The electrical gasket includes an attachment portion for fixedly attaching the electrical gasket to one of the first and second components and a plurality of spring members for engaging the other of the first... Agent:
20140268585 - Electronic module and electronic device: An electronic device including a rear cover, a transparent front cover, a first electronic element, a second electronic element, a conductive tape, and an elastomer is provided. The transparent front cover is disposed on the rear cover. The first electronic element is disposed between the transparent front cover and the... Agent: Htc Corporation
20140268587 - Module and method of manufacturing the same: An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating... Agent: Murata Manufacturing Co., Ltd.
20140268588 - Portable terminal and method of manufacturing a module thereof: A portable terminal including a module, in which one or more storage members are disposed, and a method for manufacturing the portable terminal are provided. The portable terminal includes a first assembly that includes a shield can and a flexible circuit board attached to a surface of the shield can.... Agent: Samsung Electronics Co., Ltd.
20140268586 - Semiconductor package and printed circuit board: A substrate of a semiconductor package comprises a conductor pattern which is formed in a surface layer, and is electrically connected to one terminal out of a power terminal and a ground terminal of a semiconductor element. The substrate also comprises in the surface layer a conductor pattern which is... Agent: Canon Kabushiki Kaisha
20140268592 - Assembling and handling edge interconnect packaging system: Apparatuses and methods related to the field of microchip assembly and handling, in particular to devices and methods for assembling and handling microchips manufactured with solid edge-to-edge interconnects, such as Quilt Packaging® interconnect technology. Specialized assembly tools are configured to pick up one or more microchips, place the microchips in... Agent: Indiana Integrated Circuits, LLC
20140268589 - Circuit board and electronic device provided with same: A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in... Agent: Kyocera Corporation
20140268591 - Printing complex electronic circuits: A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are... Agent: Nthdegree Technologies Worldwide Inc.
20140268590 - Window member and method of manufacturing the same: A window member includes: a glass member; a display member wherein the glass member has a bottom surface which faces and overlays the display member and a pattern layer provided on a first surface of the glass member and having a fine pattern. The pattern layer is silk-screen printed on... Agent: Samsung Electronics Co., Ltd.
20140268595 - Flexible display device: A flexible display device includes a flexible display panel, a flexible printed circuit board extending from the display panel, an integrated circuit chip that is mounted on at least one surface of the flexible printed circuit board and is configured to drive the display panel, and a protection member attached... Agent: Samsung Electronics Co., Ltd.
20140268593 - Flexible interconnect structure for a sensor assembly: This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple... Agent: Kulite Semiconductor Products, Inc.
20140268594 - Method of embedding a pre-assembled unit including a device into a flexible printed circuit and corresponding assembly: A flexible printed circuit assembly, having a first flexible printed circuit having a first conductive layer and a device that is connected the first conductive layer; and a second flexible printed circuit having a second conductive layer, an insulating center layer, and a third conductive layer, the insulating center layer... Agent:
20140268596 - Flexible metal interconnect structure: A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside... Agent: Palo Alto Research Center Incorporated
20140268599 - Data transfer device with configurable slot sizes and methods of using the same: A data transfer device that comprises: a chassis; a backplane; a slot arranged within the chassis and configured to hold a card; and a connector system integrated on the backplane and configured to electrically couple the card with the backplane; wherein the connector system includes a group of connectors arranged... Agent: Mrv Communications Americas, Inc.
20140268598 - Electronic device having connector with integrated shielding: An electronic device may have a housing in which electrical components on a printed circuit board are mounted. A connector may be mounted to the edge of the printed circuit board using solder. The connector may have a threaded portion that protrudes through the housing. A threadless portion of the... Agent: Apple Inc.
20140268601 - Filter packaging for system for wireless, motion and position-sensing, integrating radiation sensor for occupational and environmental dosimetry: A device comprising: a printed circuit board (PCB); a sensor package mounted on a first side of the PCB; electronics mounted on a second side of the PCB; and one or more filters, wherein the sensor package comprises one or more radiation sensors mounted therein, wherein each of the one... Agent: Landauer, Inc.
20140268600 - Housing for an electronic device internal walls: An electronic device may include a housing and a printed circuit board, where the housing has a front cover and a back cover that at least substantially enclose the printed circuit board. In some instances, the back cover may include an outer shell and one or more inward extending walls... Agent:
20140268597 - Metro cell aggregator enclosure: A telecommunications aggregator enclosure includes a housing and a cover movably connected thereto. The cover is movable between open and closed positions. A printed circuit board is disposed in the housing. At least one first optical termination is connected to the printed circuit board to receive cables from a base... Agent: Hubbell Incorporated
20140268602 - Electronic device and methods: An electronic assembly may have a display, a display holder, and a printed circuit board (PCB). The display may have a front side for viewing the display, a back side, and side walls extending between the front side and the back side. The display holder may have a recess for... Agent:
20140268603 - Area array device connection structures with complimentary warp characteristics: A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics... Agent: International Business Machines Corporation
20140268605 - Electronic package mounting: An assembly and method for mounting an electronic package to a printed circuit board (PCB) in which a gasket is shaped to fit tightly around and under a perimeter edge of an electronic package.... Agent:
20140268604 - Methods and systems for embedding filaments in 3d structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices: The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh... Agent: Board Of Regents, The University Of Texas System
20140268606 - Package of environmentally sensitive electronic device and fabricating method thereof: A package of an environmentally sensitive electronic device and a fabricating method thereof are provided, wherein the package may include a first substrate, a second substrate, the environmentally sensitive electronic device, a packaging body, and a filler. In one or more embodiments, the environmentally sensitive electronic device may be disposed... Agent: Industrial Technology Research Institute
20140268608 - Component holding structures, system, and method: A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in... Agent: General Electric Company
20140268607 - Methods and systems for connecting inter-layer conductors and components in 3d structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices: The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.... Agent: Board Of Regents, The University Of Texas System
20140268609 - Support structure for integrated circuitry: Among other things, one or more support structures for integrated circuitry and techniques for forming such support structures are provided. A support structure comprises one or more trench structures, such as a first trench structure and a second trench structure formed around a periphery of integrated circuitry. In some embodiments,... Agent: Taiwan Semiconductor Manufacturing Company Limited
20140268610 - Method and system for forming a microvia in a printed circuit board: A method for forming vias in a multilayered printed circuit board is disclosed, which includes providing a multilayered printed circuit board having at least two or more layers; placing a donut pad on an upper layer of at least one layer of the multilayered printed circuit board for forming a... Agent:
20140268613 - Apparatus for improved power distribution in an electrical component board: Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This... Agent: R&d Circuits,inc.
20140268612 - Coreless substrate with passive device pads: Embodiments of the present disclosure are directed towards coreless substrates with passive device pads, as well as methods for forming coreless substrates with passive device pads and package assemblies and systems incorporating such coreless substrates. A coreless substrate may comprise a plurality of build-up layers, such as bumpless build-up layers... Agent:
20140268611 - System for applying power directly into power connectors for modular systems: A system for providing electrical power connection across components mounted to a backplane of an electrical chassis includes a backplane having multiple apertures and front and rear faces. A daughter board faces the front face of the backplane. The daughter board has multiple traces with individual conductive pads. A power... Agent: Emerson Network Power - Embedded Computing, Inc.
20140268616 - Capacitor with a dielectric between a via and a plate of the capacitor: In a particular embodiment, a device includes a substrate, a via that extends at least partially through the substrate, and a capacitor. A dielectric of the capacitor is located between the via and a plate of the capacitor, and the plate of the capacitor is external to the substrate and... Agent: Qualcomm Incorporated
20140268614 - Coupled vias for channel cross-talk reduction: Capacitively coupled vertical transitions may be configured with a desired amount of mutual capacitance to at least partially cancel crosstalk for an overall channel crosstalk (e.g., FEXT) reduction. In embodiments, capacitive coupling of adjacent vertical transitions is achieved with overlapping metal surfaces within the vertical transitions. In embodiments, one or... Agent:
20140268617 - Supercapacitor structures: Supercapacitor structures are provided which include, for example: one or more layers of supercapacitors; and one or more contact tabs. The one or more contact tabs electrically contact and extend outward from the supercapacitor structure to facilitate electrical connection to the supercapacitor structure, and the one or more contact tabs... Agent: The Paper Battery Co.
20140268615 - Two-stage power delivery architecture: A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage... Agent: Qualcomm Incorporated
20140268619 - Method of manufacturing substrate for chip packages and method of manufacturing chip package: Provided are a method of manufacturing a substrate for chip packages and a method of manufacturing a chip package, the method of manufacturing the substrate including: forming a lower adhesive layer in a lower part of an insulation film; forming an upper adhesive layer in an upper part of the... Agent: Lg Innotek Co., Ltd.
20140268618 - Printed board, printed board unit, and method of manufacturing printed board: A printed-board includes a first conductor-layer, a second conductor-layer provided to a layer different from the first conductor-layer, an insulation-layer provided between the first conductor-layer and the second conductor-layer, a plurality of through-holes that pass through the first conductor-layer, the second conductor-layer, and the insulation-layer, and a plurality of vias... Agent: Fujitsu Limited
20140268620 - Expandable backplane: An expandable backplane is provided. The expandable backplane includes a baseboard management controller for connecting several disks, a first expansion board, a second expansion board, and a multiplexer. The multiplexer is connected between the baseboard management controller, the first expansion board, and the second expansion board. The multiplexer is used... Agent: Hon Hai Precision Industry Co., Ltd.
20140268621 - Edge mounting for printed circuit: An electric apparatus is adapted to be electrically coupled to a target platform. The electric apparatus includes a first printed circuit including a first surface parallel to a first plane and a second surface parallel to a second plane perpendicular to the first plane. The first surface has a first... Agent: Wintec Industries, Inc.
20140268622 - Fixing mechanism for fixing an portable electronic device and related electronic apparatus: The present invention discloses a fixing mechanism including a base, a cover, a connecting component, at least one resilient component and a pushing component. The base is for containing a portable electronic device. The cover is pivoted to the base. The connecting component is disposed on the base for engaging... Agent: Wistron Corporation
20140268623 - Mobile terminal: Disclosed is a mobile terminal, comprising: a display; a metal frame coupled to a rear surface of the display by an adhesive tape, and having a screw-coupling groove on a rear surface thereof; a front case coupled to the rear surface of the metal frame, and having a screw-coupling hole;... Agent: Lg Electronics Inc.
20140268624 - Carrier for mounting a piezoelectric device on a circuit board and method for mounting a piezoelectric device on a circuit board: A carrier for mounting a piezoelectric device, e.g., a surface acoustic wave (SAW) device, on a circuit board and a method of mounting a piezoelectric device on a circuit board using such a carrier are disclosed. The carrier includes a carrier bottom, a plurality of metal contacts, and a carrier... Agent: Adaptive Methods, Inc.
20140268625 - Formulation for packaging an electronic device and assemblies made therefrom: Disclosed and claimed herein is a formulation for packaging an electronic device and assemblies made therefrom.... Agent:
20140268626 - Antenna mechanical faceplate design: A faceplate configured for attachment to a communications module may be provided. The faceplate may comprise a first surface arranged in a vertical direction relative to the chassis and a second surface arranged at an angle to the first surface. The second surface may comprise a connector for attachment to... Agent: Cisco Technology, Inc.Previous industry: Dynamic magnetic information storage or retrieval
Next industry: Illumination
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