Electricity: electrical systems and devices patents - Monitor Patents
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Electricity: electrical systems and devices

Below are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application.
  
05/14/2015 > 72 patent applications in 46 patent subcategories.

20150131185 - Configurable modular intelligent electronic overload device and system with embedded programming tool: A modular intelligent electronic overload device that requires only a single configuration file to describe the device with all of the available options. Furthermore, the modular intelligent electronic overload device contains embedded application files that provide commonly used control algorithms into the non-volatile memory of the modular intelligent electronic overload... Agent:

20150131186 - Safety device for a power transformer, and related power transformer using such a safety device: A safety device is disclosed for a power transformer containing a cooling liquid, and can include a shaped body having an inner chamber which is suitable to be at least partially immersed in cooling liquid and inside which gas can accumulate; a first floating element and a second floating element... Agent: Abb Technology Ag

20150131187 - Systems and methods for photovoltaic string protection: A system and method includes a circuit for protecting a photovoltaic string. A bypass switch connects in parallel to the photovoltaic string and a hot spot protection switch connects in series with the photovoltaic string. A first control signal controls opening and closing of the bypass switch and a second... Agent:

20150131188 - Current sensing circuit: A current sensing circuit comprises a first input terminal and a second input terminal for introducing a subject current from a device coupled between the first and second input terminals; a first amplifier having a first input node coupled to the first input terminal via a protection resistor, a second... Agent:

20150131189 - Composite high voltage dc circuit breaker: A circuit breaker for high voltage direct current (HVDC) power transmission includes a module with a pair of terminals for connection to an electrical network, and four of conduction paths. Each first conduction path includes a mechanical switch connected in series with at least one first semiconductor switch to selectively... Agent: Alstom Technology Ltd

20150131190 - Decoupling arrangement: In various embodiments, apparatuses and methods are disclosed that may be able to implement a multi-layer, three dimensional routing between a decoupling component and an input port for a SoC or MCM. A three dimensional (3D) structure may provide a defined current return path from the decoupling component to the... Agent:

20150131191 - Branching unit for an optical telecommunication link: A branching unit (1) for an optical telecommunication link (100), the unit comprising a first (2), a second (3) and a third terminal (4) for termination of conductors of respective branch cables in use, a fourth terminal (5) for connection to a sea earth (6) in use, and a circuit... Agent:

20150131192 - Grounding shoe and vehicle: A grounding shoe is provided in a vehicle so as to face a grounding rail provided on a track. The grounding shoe includes a collector unit that has an electroconductive body; and a holding part that fixes the collector unit by holding a first end of the electroconductive body in... Agent:

20150131193 - Esd protection device: An ESD protection device 1 includes a ceramic insulating material 10, first and second discharge electrodes 21 and 22, and a discharge auxiliary section 51. The discharge auxiliary section 51 is an electrode configured to reduce a discharge starting voltage between the first discharge electrode 21 and the second discharge... Agent:

20150131194 - Multilayer ceramic capacitor and board having the same mounted thereon: There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers; a capacitor part including first and second internal electrodes formed in the ceramic body; a resistor part including a first internal connection conductor, a third internal connection conductor formed on one dielectric layer... Agent: Samsung Electro-mechanics Co., Ltd.

20150131195 - Multilayer ceramic capacitor and board having the same mounted thereon: A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers and having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a capacitor part formed in the ceramic body and including first and second internal electrodes, the first... Agent: Samsung Electro-mechanics Co., Ltd.

20150131196 - Multilayer ceramic capacitor and board having the same mounted thereon: A multilayer ceramic capacitor may include: a ceramic body including dielectric layers, first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; a capacitor part including first internal electrodes and second internal electrodes; a resistor... Agent: Samsung Electro-mechanics Co., Ltd.

20150131197 - Systems and methods for calibrating a tunable component: Systems, devices, and methods for adjusting tuning settings of tunable components, such as tunable capacitors, can be configured for calibrating a tunable component. Specifically, the systems, devices and methods can measure a device response for one or more inputs to a tunable component, store a calibration code in a non-volatile... Agent:

20150131198 - Energy storage device: Embodiments of a high-permittivity, low-leakage energy storage device, such as a capacitor, and methods of making the energy storage device are disclosed. The disclosed device includes electrically conductive first and second electrodes, and a sterically constrained dielectric film disposed between the first and second electrodes. The sterically constrained dielectric film... Agent: Carver Scientific, Inc.

20150131202 - Ceramic electronic component: The present invention is ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with said terminal electrodes. The terminal electrode is formed by wrapping around a part of side... Agent:

20150131200 - Ceramic material and capacitor comprising the ceramic material: A ceramic material for capacitors uses multilayer technology of the general formula: Pb1−1.5a−0.5b+1.5d+e+0.5f)AaBb(Zr1−xTix)(1−c−d−e−f)LidCeFefSicO3+y.PBO wherein A is selected from the group consisting of La, Nd, Y, Eu, Gd, Tb, Dy, Ho, Er and Yb; B is selected from the group consisting of Na, K and Ag; C is selected from the... Agent:

20150131201 - Laminated ceramic capacitor: A laminated ceramic capacitor is characterized in that when the section constituted by two internal electrode layers positioned adjacent to each other in the laminating direction and one dielectric layer present between the two internal electrode layers is considered a unit capacitor, then the respective capacitances of the unit capacitors... Agent:

20150131199 - Multilayer ceramic electronic component and board having the same: A multilayer ceramic electronic component may include a ceramic body having a plurality of dielectric layers stacked in the ceramic body; a plurality of active layers including first and second internal electrodes disposed to be alternately exposed to the end surfaces of the ceramic body with the dielectric layers interposed... Agent: Samsung Electro-mechanics Co., Ltd.

20150131203 - Electronic devices with floating metal rings: A electronic device is provided. In one configuration, the electronic device includes a first electrode formed in a first layer; a second electrode formed in the first layer, wherein the first electrode and the second electrode are reflection symmetrically disposed; and a first floating metal ring formed in the first... Agent:

20150131204 - Vertical metal insulator metal capacitor: A capacitor structure includes at least two capacitors. A first electrode includes a bottom conductive plane and first vertical conductive structures. The bottom conductive plane is disposed over a substrate. The bottom conductive plane has a first area and a first shape. At least two second electrodes include top conductive... Agent:

20150131205 - Hybrid capacitor: Disclosed is a capacitor (200) comprising a first structured surface having a dielectric coating (230), a second structured surface having a dielectric coating (230), a separator (240) provided between the first structured surface and the second structured surface, and an electrolyte provided between the first structured surface and the second... Agent: Dyson Technology Limited

20150131206 - Tantalum capacitor and method of manufacturing the same: A tantalum capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire exposed to one end surface thereof; a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended from one leading edge of the positive electrode terminal part,... Agent: Samsung Electro-mechanics Co., Ltd.

20150131207 - Switchgear: An object is to provide a switchgear having a simple structure. To solve the problem, a switchgear according to the invention is characterized by having a fixed side electrode 3, a movable side electrode 4 configured to come into contact with or separate from the fixed side electrode 3, and... Agent:

20150131208 - Flexible cable assembly for high-power switch gear: A remote switching system for electronic switches in a cabinet provides an actuator assembly communicating through a flexible cable with a door handle. The actuator assembly on the electronic switch provides a rotatably captive threaded fastener holding the sheath of the flexible cable to the actuator assembly allow ring a... Agent: Rockwell Automation Technologies, Inc.

20150131209 - Flexible cable assembly providing local lockout: A remote switching system for electrical switches in a cabinet provides an actuator frame and slider that may be assembled to the electrical switch to engage the switch actuator for remote control. The actuator frame includes an opening allowing insertion of a lock shank through the opening to block motion... Agent: Rockwell Automation Technologies, Inc.

20150131210 - Flexible cable assembly with improved manufacturability: A remote switching system for electrical switches in a cabinet provides simplified manufacture by attaching the flexible cable sheath and flexible cable to an actuator frame and slider, respectively, by means of flange elements attached to each of the sheath and cable that fit within corresponding receiving slots in the... Agent: Rockwell Automation Technologies, Inc.

20150131213 - Display device for an aircraft: A display device for an aircraft and an aircraft including such device. An exterior first surface forms a first side of the device, and an exterior second surface forms a second side. A display is arranged as at least a portion of the first surface and an electrical and/or data... Agent:

20150131212 - Electrical connector and electronic device having the same: An electrical connector includes an insulation body that includes a base and a waterproof unit, and a plurality of conductive terminals. The base includes a terminal-holding portion and a board portion that has front and rear faces. The terminal-holding portion has first and second contact faces disposed outward of the... Agent: Wistron Corporation

20150131214 - Electronic device with support: An electronic device with supporting structure includes a connection member, a back shell, two first fixing portions, and two second fixing portions. The connection member is attached to the supporting structure and defines two connection holes. Each connection hole includes a first through hole and a second through hole. A... Agent:

20150131211 - Fixing device of electronic element: A fixing device of electronic element comprises a main body and a hook. The main body contains an electronic element and comprises a guiding groove and a block. The guiding groove is disposed at a sidewall of the main body. The block is disposed on a side of the guiding... Agent: Delta Electronics, Inc.

20150131216 - Assembled wearable electronic device: An assembled wearable electronic device including a first body and a second body is provided. The first body has a primary system and a first assembling portion. The primary system is for providing the independent operation of the first body and producing a related first data. The second body has... Agent: Compal Electronics, Inc.

20150131215 - Electronic device set, tablet computer and smart watch: An electronic device set includes a tablet computer and a smart watch. The tablet computer includes a computer casing, a computer module and at least one computer terminal. The computer casing has at least one connecting slot. The computer module is located in the computer casing. The computer terminal is... Agent: Inventec (pudong) Technology Corporation

20150131217 - Telescoping rail mounting assembly and multiple display mount system: A multiple display mount system that offers easy and efficient, independent lateral and vertical adjustment of each individual display. The system includes a base, a vertical member extending upwardly from the base, and a pair of arms extending laterally outward on opposing sides of the vertical member. A pair of... Agent:

20150131218 - Electronic device and locking structure thereof: An electronic device includes a first body, a second body, a first pivot structure, a second pivot structure, and a locking structure not in contact with the second pivot structure. The second pivot structure is pivoted to the first body along a first axis through the first pivot structure. The... Agent: Compal Electronics, Inc.

20150131219 - Grid connected keyboard apparatus: A grid connected keyboard which includes a keyboard base; and a removable keyboard positioned with respect to the keyboard base. The removable keyboard include a keyboard grid having a plurality of spaces; a plurality of keyboard keys positioned within the spaces of the keyboard grid; and fastening means between the... Agent: International Business Machines Corporation

20150131220 - Portable computing device: A portable computing device includes at least a base portion of a lightweight material that includes at least a wedge shaped top case having a trough formed at an interfacing edge thereof. The trough includes a raised portion having a first contact surface and a receiving area, and a bottom... Agent:

20150131221 - Electronic device: An electronic device includes a first housing, a printed circuit board (PCB), and a touch apparatus. The touch apparatus includes a touch assembly, a key assembly, and a mounting assembly. The touch assembly includes a touch screen having a touch portion. The mounting assembly includes a sealing frame. The key... Agent:

20150131222 - Apparatus and method of providing an apparatus comprising a bendable portion: According to various, but not necessarily all examples of the disclosure, there may be provided an apparatus and method wherein the apparatus comprises: a substrate configured to support a bendable display wherein the substrate comprises at least one bendable portion configured to enable the substrate to be moved between an... Agent:

20150131223 - Liquid cooling of multiple components on a circuit board: An apparatus includes a primary cold plate, a secondary cold plate, and spring biased retainers moveably securing the primary cold plate to the secondary cold plate. The secondary cold plate is securable to a circuit board for thermal engagement with heat-generating components on the circuit board. The primary cold plate... Agent: International Business Machines Corporation

20150131224 - Liquid cooling of multiple components on a circuit board: A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The... Agent: International Business Machines Corporation

20150131225 - Mobile terminal: A heat-dissipating mobile terminal includes a main body, a heat dissipating member positioned in the main body, and a back cover detachably connected to the main body. The main body includes a heat-producing element and the heat dissipating member includes a heat radiator arranged above the heat-producing element. The back... Agent:

20150131226 - Vehicle entertainment tablet unit and cradle: A vehicle entertainment system includes a tablet unit and a cradle. The tablet unit includes a display and a touch screen input device disposed on a front surface, a first electrical connection, a first mounting mechanism, and a wireless receiver. The wireless receiver is configured to receive media data from... Agent:

20150131227 - Latch mechanism for securing an electronic module: An apparatus includes a frame forming a bay for receiving an electronic module having a blind mate connector for coupling with a chassis connector. An actuator is slidably secured to the frame and forms a push button, an intermediate actuation member, and a distal actuation member. A spring latch is... Agent: International Business Machines Corporation

20150131228 - Heat exchange device, electronic system, and cooling method of electronic system: A heat exchange device that is coupled to an electronic device that includes an electronic component that generates heat, the heat exchange device includes: a first-channel through which a first-coolant that cools the electronic component flows; a heat-exchange-unit that performs heat exchange between the first-coolant and a second-coolant; a second-channel... Agent: Fujitsu Limited

20150131229 - Connecting structure of cooling device, cooling device, and method for connecting cooling device: It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the... Agent: Nec Corporation

20150131231 - Electronic component module and manufacturing method thereof: There are provided an electronic component module allowing for a circuit wiring to be disposed outside of a molded part by a plating process, and a manufacturing method thereof, the electronic component module including a substrate; at least one electronic component mounted on the substrate; a molded part sealing the... Agent: Samsung Electro-mechanics Co., Ltd.

20150131230 - Module ic package structure and method for manufacturing the same: A module IC package structure for increasing heat-dissipating efficiency includes a substrate unit, an electronic unit, a package unit, a first heat-dissipating unit and a second heat-dissipating unit. The substrate unit includes a circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate and... Agent: Azurewave Technologies, Inc.

20150131232 - Semiconductor device and semiconductor device connection structure: In a semiconductor device, heat radiation plates are respectively disposed on a front surface side and a rear surface side of semiconductor chips in an upper arm and a lower arm. A lead-out conductor part includes a parallel conductor that includes a positive electrode terminal, a negative electrode terminal, and... Agent:

20150131233 - Inverter device: An inverter device includes a heat dissipation casing having a principal surface, heat dissipation fins arranged on an opposite side to the principal surface, a first concave portion provided adjacent to a region corresponding to the heat dissipation fins on the principal surface, and a second concave portion provided adjacent... Agent: Mitsubishi Electric Corporation

20150131234 - Circuit board and heat dissipation device thereof: A heat dissipation device is used in a circuit board, where the circuit board includes a chip and at least one positioning hole disposed around the chip, and each of the positioning holes has a bare metal area on its periphery. The heat dissipation device includes a heat dissipation element,... Agent:

20150131235 - Electronic component module and manufacturing method thereof: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic... Agent: Samsung Electro-mechanics Co., Ltd.

20150131237 - Foldable package structure: A foldable package structure including a first substrate, a second substrate, a plurality of adhesive layers and at least one environmental-sensitive electronic component is provided. At least one of the first and second laminated substrates comprises an ultra-thin glass plate. The foldable package structure comprises a predetermined folded region and... Agent:

20150131236 - High voltage power chip module: A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A... Agent: Arkansas Power Electronics International, Inc.

20150131238 - Flexible display device: A flexible display device includes: a flexible display panel configured to display an image; a dielectric elastomer film disposed on a portion of the flexible display panel; a first electrode layer disposed on an upper portion of the dielectric elastomer film; and a second electrode layer disposed on a lower... Agent: Samsung Display Co., Ltd.

20150131239 - Three dimensional stretchable electronic device and manufacturing method comprising the same: Disclosed herein are a three-dimensional stretchable electronic device and a manufacturing method comprising the same, wherein the three-dimensional stretchable electronic device is configured such that a connection line is positioned therein and thus can be protected from the outside, and the connection line is made of a liquid metal so... Agent: Korea University Research And Business Foundation

20150131240 - Method for producing an electronic subassembly: s

20150131241 - Watertight sealing apparatus and method for electronic enclosure: An enclosure with a substantially continuous seal about its perimeter for protecting electronic components of a model vehicle, comprising a housing with one or more walls at least partially surrounding the electronic components, a cover having one or more walls surrounding the perimeter of the housing, and one or more... Agent:

20150131242 - Semiconductor device: Embodiments of the inventive concept include a semiconductor device having a circuit board including a first outer layer, a contact region in the first outer layer, a second layer formed on an opposite side of the first outer layer, a via-hole, and a plurality of inner layers formed to be... Agent:

20150131245 - Connector inserts and receptacle tongues formed using printed circuit boards: Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board... Agent: Apple Inc.

20150131244 - Electrical device and method for producing same: n

20150131243 - Noise suppression assembly and electronic device having the same: An electronic device includes a circuit board, a connector and a noise suppression assembly. The circuit board includes a substrate having a surface layer. The connector is disposed on the circuit board and has at least one electrical pin. The noise suppression assembly includes a wiring area located on the... Agent: Wistron Corp.

20150131246 - Printed circuit boards including strip-line circuitry and methods of manufacturing same: A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first electrically-conductive layer, and a cut-out area defining a void that extends therethrough. The first electrically-insulating layer includes a first... Agent:

20150131247 - Electrically conductive frame on substrate for accommodating electronic chips: A method which comprises arranging a plurality of electronic chips in a plurality of chip accommodation cavities each defined by a respective surface portion of a substrate and a wall delimited by a respective one of a plurality of holes in an electrically conductive frame arranged on the substrate, at... Agent: Infineon Technologies Ag

20150131248 - Three-dimensional modules for electronic integration: An electronic module (20, 39, 60, 80, 132, 140, 144) includes a substrate (21), which includes a dielectric material having a cavity (40, 42, 134, 142) formed therein. First conductive contacts (44) within the cavity are configured for contact with at least one first electronic component (32) that is mounted... Agent:

20150131251 - Process for manufacturing an electrically conductive member for an electronic component comprising an end equipped with a cavity: This process for manufacturing an electrically conductive member for an electronic component comprises the following steps: providing a structure comprising at least one blind hole having a bottom and at least one internal lateral flank connected to said bottom via a base of said lateral flank; forming the member, this... Agent: Commissariat A L'energie Atomique Et Aux Energies Alternatives

20150131249 - Solder bridging prevention structures for circuit boards and semiconductor packages: A board for mechanically supporting and electrically connecting electronic components includes a non-conductive substrate, a plurality of electrically conductive traces and pads disposed on the non-conductive substrate, and a solder mask applied to the non-conductive substrate and covering the traces. Metal lines are disposed on the non-conductive substrate under the... Agent:

20150131250 - Solder void reduction for component attachment to printed circuit boards: A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of... Agent: International Business Machines Corporation

20150131252 - Multilayer ceramic electronic component and board having the same mounted thereon: A multilayer ceramic electronic component may include: a multilayer ceramic capacitor including a ceramic body, a plurality of first and second internal electrodes formed to be alternately exposed to both side surfaces of the ceramic body, having a dielectric layer therebetween, and first and second external electrodes connected to the... Agent: Samsung Electro-mechanics Co., Ltd.

20150131253 - Multilayer ceramic electronic component and board having the same mounted thereon: A multilayer ceramic electronic component may include: a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, a pair of first external electrodes and a pair of second external electrodes formed on both side surfaces of the ceramic body and extended to portions... Agent: Samsung Electro-mechanics Co., Ltd.

20150131254 - Printed circuit board, semiconductor package having the same and method for manufacturing the same: The present invention discloses a printed circuit board, a semiconductor package having the same, and a method for manufacturing the same. A printed circuit board according to an aspect of the present invention includes: a package board including a mounting area and a peripheral area, the mounting area having a... Agent: Samsung Electro-mechanics Co., Ltd.

20150131255 - Substrate for semiconductor package and semiconductor package having the same: A semiconductor package may include: a substrate including a core layer having a first surface and a second surface which is opposite to the first surface, a wiring layer formed over the first and second surfaces and in an inside of the core layer, and having a first electrode disposed... Agent: Sk Hynix Inc.

20150131256 - Blackplane board and wiring method of backplane board: The present invention is a backplane board including a first circuit board, a second circuit board, a first slot in which a first connector is connected with the first circuit board, and a second slot in which a second connector is connected with the second circuit board. The first connector... Agent:

  
05/07/2015 > 70 patent applications in 52 patent subcategories.

20150124356 - Blocker of geomagnetically induced currents (gic): A device for mitigating Geomagnetically Ground Induced Currents (GIC) flowing from the neutral of a star-connected three-phase power transformer to ground without compromising its basic insulation, operation or integrity. Resistor (R10), of an adaptive non-linear negative volt-ampere characteristic is inserted, from the transformer neutral (N) to ground (G), by opening... Agent:

20150124357 - Excitation inrush current suppressing apparatus and excitation inrush current suppressing method: According to one embodiment, an excitation inrush current suppressing apparatus comprising: bus voltage measurement equipment which measures each phase voltage of the single-phase AC-side bus; transformer voltage measurement equipment which measures a single-phase-side voltage of the transformer; phase detector which detects a cutoff phase when opening the circuit breaker by... Agent: Kabushiki Kaisha Toshiba

20150124358 - Feeder power source providing open feeder detection for a network protector by shifted neutral: A feeder power source for a network power system includes a network transformer having a delta three-phase primary winding and a three-phase secondary winding; a three-phase primary feeder electrically connected to the delta three-phase primary winding; a three-phase secondary bus electrically connected to the three-phase secondary winding; and a three-phase... Agent: Eaton Corporation

20150124359 - Combined esd active clamp for cascaded voltage pins: A combined electro static discharge clamp for cascaded voltage pins can include an electronic switch, a plurality of discharge paths, and a plurality of trigger circuits. In response to detecting a voltage event across any two voltage pins, the trigger circuitry can turn on the electronic switch causing current caused... Agent: Infineon Technologies Ag

20150124361 - Esd protection circuit: The disclosure provides an ESD protection circuit. The ESD protection circuit comprises: a clamping unit, a driving unit, a resistance unit, a switch unit, and a capacitance unit. The clamping device is coupled between a first power source and a second power source. The driving unit is coupled between the... Agent:

20150124362 - Esd protection circuit: An electrostatic discharge (ESD) protection circuit is provided. The ESD protection circuit includes an impedance device coupled between a pad and a power line and a clamp unit coupled between the pad and a ground line, wherein no ESD current flows through the impedance device when an ESD event occurs... Agent:

20150124360 - Inverter-embedded silicon controlled rectifier: Described is a low power clamp or driver comprising: an inverter; and a silicon controlled rectifier (SCR) embedded in the inverter such that the SCR is part of the inverter. The clamp offers improved conductance per area and lower leakage current compared to the traditional PMOS-based active rail clamps. The... Agent:

20150124363 - Electronic safety path: A system is described that includes a first portion including one or more components configured to implement one or more safety functions of an application. The system further includes, a second, different portion comprising one or more different components configured to activate a safety path in response to a detection... Agent: Infineon Technologies Ag

20150124364 - Lightning protection and grounding device for vehicle: The present invention relates to a lightning protection and grounding device for a vehicle including: a dipole lightning rod mounted on the vehicle to in advance remove the focusing of an electric field of a lightning strike and to induce the discharge of lightning current when the lightning strike is... Agent:

20150124365 - Lightning protection and grounding device for vehicle: The present invention relates to a lightning protection and grounding device for a vehicle including: a dipole lightning rod mounted on the vehicle to in advance remove the focusing of an electric field of a lightning strike and to induce the discharge of lightning current when the lightning strike is... Agent:

20150124366 - Anti-surge over-current protection device: An anti-surge over-current protection device comprises a PTC material layer, first and second conductive layers. The PTC material layer has opposite first and second planar surfaces. The first conductive layer is in physical contact with the first planar surface and comprises a plurality of first conductive members isolated from each... Agent: Polytronics Technology Corp.

20150124367 - Electronic device with curved bottom and operating method thereof: An electronic device includes a housing forming an exterior of the electronic device and rockable using a curved bottom, a movable object movable in the housing, a transfer means for moving the movable object to at least one eccentric location, and a control means for controlling the transfer means. Various... Agent:

20150124368 - Ionizer and control method thereof: An ionizer includes a polarity output unit that can selectively output, to a discharge unit, one of a first polarity pattern where the polarity output unit applies a positive direct-current voltage to a first group of discharge needles and applies a negative direct-current voltage to a second group of discharge... Agent: Smc Corporation

20150124369 - Electroadhesion gripper for retaining workpieces: An electroadhesion gripper for retaining workpieces includes a first spiral electrode having a plurality of turns and a second spiral electrode having a plurality of turns, the two spiral electrodes being arranged so as to be at least partially bifilar. The electroadhesion gripper has a diode by which the first... Agent:

20150124370 - Multilayer ceramic capacitor: A multilayer ceramic capacitor may include a ceramic body having a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body to be alternately exposed to the first and second end surfaces of the ceramic body, having the dielectric layers interposed therebetween; and first and second... Agent: Samsung Electro-mechanics Co., Ltd.

20150124371 - Multilayer ceramic capacitor: A multilayer ceramic capacitor may have low equivalent series inductance (ESL), in which via electrodes are opposed to each other diagonally and be off-centered from positions corresponding to center points of external electrodes, so that a distance between the via electrodes is significantly reduced and a current path is reduced.... Agent: Samsung Electro-mechanics Co., Ltd.

20150124372 - Multilayer ceramic electronic component and board having the same: A multilayer ceramic electronic component including: a ceramic body having a plurality of dielectric layers stacked therein; active layers including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layers interposed therebetween; and first and... Agent: Samsung Electro-mechanics Co., Ltd.

20150124373 - Dielectric composition, dielectric film, and electronic component: A dielectric composition containing a crystalline phase represented by a general formula of Bi12SiO20 and a crystalline phase represented by a general formula of Bi2SiO5 as the main components. The dielectric composition contains preferably 5 mass % to 99 mass % of the Bi2SiO5 crystalline phase, and more preferably 30... Agent:

20150124374 - Solid electrolytic capacitor and improved method for manufacturing a solid electrolytic capacitor: d

20150124375 - Arc resistant electrical enclosure: Electrical enclosures are provided that include arc resistant features designed to add structural strength for arc containment, to inhibit arc propagation, and/or to direct the release of pressure within and/or from the enclosure in order to provide arc resistant electrical enclosures. In general, the arc resistant features may be designed... Agent:

20150124376 - Switchgear and switchgear assembling method: The present invention has an object to provide a switchgear capable of improving workability and a switchgear assembling method. The switchgear according to the present invention has: a plurality of switch units 2, 3, 4, 5 having a movable electrode horizontally driven and brought into contact with or opened from... Agent: Hitachi, Ltd.

20150124377 - Flexible electrical power connection: A motor drive unit including an enclosure, a bus bar supported by the enclosure, at least one modular power unit, and a flexible connector for electrically coupling the modular power unit with the bus bar. The flexible connector includes mating male and female connector portions each mounted to a respective... Agent: Rockwell Automation Technologies, Inc.

20150124379 - Fused busbar adapter: A busbar adapter is provided with a first contact connection and a second contact connection for connecting two busbars, a fuse unit having a first fuse holder and a second fuse holder, and a housing structure for accommodating the fuse unit and the first and second contact connections. The first... Agent:

20150124378 - Power supply system and rack mount apparatus: There is provided a power supply system including: a first busbar provided to extend in a predetermined direction on a first member, the first busbar being conductive and supplied with electricity; a second busbar provided to extend in the predetermined direction on a second member relatively movable with respect to... Agent:

20150124380 - Power distribution assembly and header assembly therefor: A header assembly for a power distribution assembly in which the power distribution assembly includes a mounting portion and a plurality of current carrying components. The header assembly includes a first header segment made from a first material and a second header segment disposed on the first header segment and... Agent:

20150124381 - Switchboard copper busbar heat dissipating device: A switchboard copper busbar heat dissipating device for dissipating heat from a copper busbar inside a switchboard includes a thermally-conductive electrically-insulating plate having a first surface connected to the copper busbar and a second surface; at least one heat pipe having a first end connecting to the second surface of... Agent: Chia Hsing Electrical Co., Ltd.

20150124382 - Display device and method for producing same: A display device includes: a display panel for displaying images; a transparent protective member for protecting a display surface of the display panel; an adhesive layer that is disposed between the display panel and the transparent protective member so as to bond the display panel and the transparent protective member... Agent: Panasonic Intellectual Property Management Co., Ltd.

20150124383 - Replaceable protective layer on flat screen display: A display panel assembly. A flat display panel has a front surface configured to display images and a peripheral edge surrounding the front surface. A protective film is disposed upon and in full contact with the front surface of the flat display panel. A sealant seals the protective film to... Agent:

20150124384 - Connector mechanism and electronic device using the same: An electronic device comprises a case and a connector mechanism. The case comprises a bottom plate, a lateral plate and a pivoting base. The lateral plate is connected to the bottom plate, the lateral plate has an opening and the pivoting base is connected to the lateral plate. The connector... Agent: Wistron Corp.

20150124385 - Smart electronic device: The present application is directed to a smart electronic device, including a case, a display panel, a bar, a hinge and a rotating plate. The bar includes at least a proximal bar part and a distal bar part, and a bar adjusting component configured to adjust the relative positions of... Agent:

20150124388 - Electronic device: An electronic device includes a main body, two transmitting members, a display module and two drivers. The main body has a first side and a second side opposite to each other. The two transmitting members are movably located on the first side and the second side respectively. The display module... Agent: Inventec Corporation

20150124389 - Hinge configuration for an electronic device: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). The electronic device may also include a base portion and a lid portion... Agent:

20150124390 - Environmental controls for mobile electronic devices: A mobile computing device is described. The mobile computing device includes an enclosure. A humidity sensor senses humidity inside the enclosure and generates humidity data. An internal temperature sensor senses a temperature inside the enclosure and generates internal temperature data. An external temperature sensor senses a temperature exterior to the... Agent: Symbol Technologies, Inc.

20150124386 - Sliding electronic apparatus: A slide type electronic apparatus according to the present invention has a first body 1, a second body 2, and a slide module 3. The slide type electronic apparatus has a plurality of screws 8 whose forefront portions are screwed into a slide portion 32 of the slide module 3... Agent: Kyocera Corporation

20150124391 - Compact memory device: A memory device comprising a temperature sensor mounted on a surface of a substrate, the temperature sensor in electrical communication with a heating element and configured to activate the heating element in response to detecting a temperature below a predetermined temperature threshold. The heating element is in thermal communication with... Agent: Northrop Grumman Systems Corporation

20150124392 - Combinational cooling pad structure with flash drive storage: A combinational cooling pad structure with flash drive storage comprises a cooling pad and a flash drive. The cooling pad comprises at least three combinational pads with structural surfaces. At least two connecting portions are correspondingly disposed between the combinational pads. Limiting structures are correspondingly disposed on outer sides of... Agent: Feng Chia University

20150124394 - Ruggedized computer and aspects thereof: A ruggedized computer, having a thermally conductive metal case having an interior surface and a thermal mass made of thermally conductive metal, suspended from the interior surface of the metal case. Also, a slide plate is supported within the metal case and is in thermal contact to the thermal mass;... Agent:

20150124393 - Tool-free fixation structure for data storage device: A tool-free fixation structure for a data storage device includes: a tray, a front end, center and rear end thereof being respectively formed with a position limiting portion, pressing portion, and elastic propping portion, an accepting space being formed between the position limiting portion and elastic propping portion, two propping... Agent: Cremax Tech Co., Ltd.

20150124387 - Media appliance and method for use of same: A media appliance and method for use of the same are disclosed. In one embodiment, a housing is adapted to be mounted within a wall. A panel forms a front portion of the housing and the panel includes vents and the panel may be mounted substantially flush with the wall.... Agent:

20150124395 - Modular gang box docking system for computing devices: A modular docking system for being installed adjacent to an at least one additional electrical component within a gang box. In at least one embodiment, the system provides a docking plate engagable with the gang box and configured for removably receiving an at least one mobile computing device. The docking... Agent: Switchform, LLC

20150124396 - Skin-dependent device components: Additional components or functionality can be provided for a computing device by coupling the device with one or more device skins. Each device skin can include one or more components that can be utilized by the computing device, such that a user of the computing device can obtain desired functionality... Agent:

20150124397 - Electronic assembly with thermal channel and method of manufacture thereof: In accordance with some implementations of this invention, an electronic assembly is formed with a thermal channel that controls an air flow for the purpose of dissipating heat generated in the electronic assembly. The electronic assembly includes a top board, a bottom board and a subassembly that further includes a... Agent:

20150124398 - Apparatus for supporting and cooling an electronic device: An apparatus for supporting and cooling an electronic device and methods of using the apparatus. The apparatus can include a housing for a cooling system and a support cradle for receiving the electronic device and engaging the electronic device with the cooling system.... Agent:

20150124399 - Heat dissipating assembly and electronic device using the same: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet... Agent: Acer Incorporated

20150124401 - Consumer electronics port having bulk amorphous alloy core and a ductile cladding: Disclosed herein are consumer electronics housings made from bulk-solidifying amorphous alloy materials having a ductile coating applied to all or a portion of the bulk-solidifying amorphous alloy. Also disclosed are methods of making consumer electronic housings from bulk-solidifying amorphous alloy materials such that at least a portion of the bulk-solidifying... Agent:

20150124402 - Magnetic field shielding sheet for digitizer and method of manufacturing the same and portable terminal device using the same: A magnetic field shielding sheet includes: at least one layer thin magnetic sheet made of a Fe-based amorphous alloy and flake-treated so as to be separated into a plurality of fine pieces; a protective film that is adhered on one surface of the thin magnetic sheet via a first adhesive... Agent:

20150124400 - Portable electronic apparatus: A portable electronic apparatus includes a base, two linkage assemblies disposed on two sides of the base, and a first component and a second component pivoted respectively on the base. Each linkage assembly includes a lever and a dual axis rotating module combined between a first end and a second... Agent: Acer Inc.

20150124403 - Image display device: An image display device is provided that efficiently cools a display and internal circuit components thereof. The image display device includes a display for displaying visual information, circuit components spaced apart from a rear side of the display, a fan installed on the rear side of the display that generates... Agent: Lg Electronics Inc.

20150124404 - System and apparatus for network device heat management: Embodiments relate generally to network system and apparatus for heat management of high volume network devices. More specifically, disclosed are system and apparatus that provide for improving heat dissipation of the network devices through improved air circulations, including a PCB with at least one slot and a connector cage mounted... Agent:

20150124405 - Electronic component cooling system and method: An electronic device includes a fan field replaceable unit (FRU). The fan FRU includes a fan FRU chassis defining an airflow pathway through the fan FRU. A fan within the fan FRU chassis causes air to flow along the airflow pathway. The fan FRU further includes an edge connector located... Agent: Brocade Communications Systems, Inc.

20150124406 - Heat-receiving device, cooling device, and electronic device: A heat-receiving device includes: a plurality of heat receivers into which a refrigerant flows; a series path that comprises a connection path connecting adjacent heat receivers among the plurality of heat receivers, that connects the plurality of heat receivers in series, and into which the refrigerant flows; a bypass path... Agent: Fujitsu Limited

20150124407 - High-temperature environment electronic chassis: An electrical chassis for use in high temperature environments is disclosed. The electrical chassis may be employed, for example, in close proximity to the combustion chamber of a jet engine. The electrical chassis is constructed with a substrate formed from a material with low thermal conductivity and low electrical conductivity,... Agent: Hamilton Sundstrand Corporation

20150124408 - Management of exterior temperatures encountered by user of a portable electronic device in response to an inferred user contact with the portable electronic device: Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component... Agent:

20150124409 - Composite module: A wireless LAN module as a composite module according to the present invention includes a first substrate 26 and a second substrate 28 that is so disposed as opposed to the other principal surface 48b of the first substrate 26. An external connector 66 for the connection with an electronic... Agent:

20150124410 - Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit package: In one embodiment, an apparatus includes a printed circuit board, and a circuit package mounted to the printed circuit board. The circuit package has a thermal pad. A first heat sink structure of the module is associated with the printed circuit board and has a wall defining a contact surface... Agent: Cisco Technology, Inc.

20150124411 - Method for manufacturing an electronic module and electronic module: This publication discloses an electronic module, comprising a first conductive pattern layer and a first insulating-material layer on at least one surface of the first conductive pattern layer, at least one opening in the first insulating-material layer that extends through the first insulating-material layer, a component having a contact surface... Agent:

20150124412 - Systems and methods for manufacturing a pre-charge circuit module: Systems, methods, and devices are provided for coupling a direct current (DC) pre-charging circuit to a motor drive. In one embodiment, an industrial automation device may include an enclosed module that may include a pre-charge circuit. The pre-charge circuit may pre-charge a direct current (DC) bus. Further, the DC bus... Agent: Rockwell Automation Technologies, Inc.

20150124413 - Display unit and electronic apparatus: A display unit includes: a display section displaying an image; a base film having a first surface provided with a drive circuit, the drive circuit controlling the display section; and a sheet antistatic-finished and bonded to a second surface opposite to the first surface of the base film, in which... Agent:

20150124414 - Integrated controller for electronic apparatuses: An integrated controller for electronic apparatuses includes a host and an AC/DC converting module. The host includes at least one power terminal set to connect to an electronic apparatus. The power terminal set includes a power input terminal, a power output terminal and a power neutral terminal. The power input... Agent:

20150124415 - Protective covering for wearable devices: Embodiments of the present application relate generally to personal electronics, portable electronics, wearable electronics, and more specifically to a structure and method for a protective covering for a wearable device. Interior and exterior structures of the wearable device are configured to be flexed into a configuration and to retain the... Agent: Aliphcom

20150124417 - Electronic component package: An electronic component package includes a substrate having at least one electronic circuit; a sealing resin for sealing the electronic circuit, at least one filler on which at least one crack is formed being filled in the sealing; and a metal film formed on a top surface of the sealing... Agent: Sae Magnetics (h.k.) Ltd.

20150124416 - Printed circuit board having electronic component embedded and manufacturing method thereof: A printed circuit board having an electronic component embedded and a method making the same are disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has... Agent: Sunasic Technologies, Inc.

20150124418 - Embedded layered inductor: An embedded layered inductor is provided that includes a first inductor layer and a second inductor layer coupled to the first inductor layer. The first inductor layer comprises a patterned metal layer that may also be patterned to form pads. The second inductor layer comprises metal deposited in a dielectric... Agent: Qualcomm Incorporated

20150124420 - Electronic device and method of fabricating an electronic device: An electronic device may comprise a semiconductor element and a wire bond connecting the semiconductor element to a substrate. Using a woven bonding wire may improve the mechanical and electrical properties of the wire bond. Furthermore, there may be a cost benefit. Woven bonding wires may be used in any... Agent:

20150124421 - Electronic modules having grounded electromagnetic shields: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is... Agent:

20150124419 - Partially depopulated interconnection arrays for packaged semiconductor devices and printed circuit boards: In one embodiment, a ball grid array (BGA) of a packaged semiconductor device and a corresponding landing pad array of a printed circuit board each have a layout defined by an interconnection array having (i) an inner sub-array of locations having connectors arranged in rows and columns separated by a... Agent: Lattice Semiconductor Corporation

20150124422 - Electronic device mounting board and electronic apparatus: There are provided an electronic device mounting board and an electronic apparatus that can be made lower in profile. An electronic device mounting board includes an insulating substrate having an opening in which an electronic device is disposed so as to lie over the opening as seen in a transparent... Agent: Kyocera Corporation

20150124423 - Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device: A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first... Agent:

20150124424 - Display apparatus and hot stamping system for the same: Disclosed are a display apparatus including a display panel on which an image is displayed, a cover including a side portion configured to cover upper and lower side surfaces and left and right side surfaces of the display panel and a rear portion configured to cover an outer peripheral region... Agent: Samsung Electronics Co., Ltd.

20150124425 - Conductive gasket: An apparatus may be provided. The apparatus may comprise a core and a covering material disposed on a portion of the core. At least one opening may be disposed in the core. The at least one opening may expose at least one interior surface on the core. The at least... Agent: Cisco Technology, Inc.

  
04/30/2015 > 106 patent applications in 67 patent subcategories.

20150116871 - Terminal protection method, apparatus, and electronic device: A terminal protection method that is applied to a terminal is provided. In the method, an air pressure change value collected by an air pressure sensor is obtained; the air pressure change value is compared with a preset air pressure change threshold; and when the air pressure change value exceeds... Agent:

20150116872 - Arc fault circuit interrupter: An arc fault circuit interrupter includes: an insulating casing, electrical input terminals and electrical output terminals, first and second electrical path connected between the electrical input terminals and electrical output terminals, and a movement mechanism. The movement mechanism includes: first and second moving contact arms, electrically coupled to the first... Agent:

20150116873 - Crowbar device for voltage transient circuit protection: A circuit protection component including a crowbar device for protecting electronic devices from transients is generally disclosed. The circuit protection component may include a steering diode bridge and a crowbar device electrically connected to the steering diode bridge. The crowbar device may have a base and an emitter formed on... Agent: Littelfuse, Inc.

20150116874 - Overvoltage protection circuit: An overvoltage protection device uses a varistor coupled in series with a switch between two terminals provided for connection to a circuit device or element to be protected. A control circuit controls actuation of the switch in response to sensing voltage at or between the two terminals in excess of... Agent: Stmicroelectronics (tours) Sas

20150116875 - Safety device for a high-voltage system and method for safeguarding a high-voltage system: The invention relates to a safety device for a high-voltage system, having a coupling device which switchably couples high-voltage components of the high-voltage system to external components, and which is designed to electrically separate the high-voltage components from the external components depending on actuation of a safety switch, having a... Agent:

20150116876 - Method of fault clearance: There is a method of fault clearance for a DC power grid (10), wherein the DC power grid (10) includes: a plurality of DC terminals (12a,12b,12c,12d); a plurality of DC power transmission media (14a,14b, 14c,14d) to interconnect the plurality of DC terminals (12a, 12b, 12c, 12d); and a plurality of... Agent:

20150116877 - Power distribution systems and methods of testing a power distribution system: Power distribution systems and methods are described. In one example, a method of testing a power distribution zone select interlocking system including a first circuit protection device and a second circuit protection device coupled to the first circuit protection device downstream of the first circuit protection device is described. The... Agent: General Electric Company

20150116878 - Droput recloser: A dropout recloser is capable of in accordance with its operating programming after a predetermined number of fault interrupting operations, e.g., 1, 2, 3 or more but typically 3, to drop out of a cutout and hang freely in a hinge contact of the cutout providing sectionalization with an observable... Agent: S&c Electric Company

20150116879 - In-rush current limiting switch control: A subsystem is configured to apply a voltage source to a gated circuit domain in a manner that limits in-rush current and affords minimal time delay. A control signal turns on a wake-up switch that connects the voltage source to the domain. The equivalent series resistance of the wake-up switch... Agent: Nvidia Corporation

20150116880 - Inductor protection device: An inductor protection device includes a single chip microcomputer (SCM) and an input unit. The protection device is used for protecting an inductor in a circuit, the circuit includes a controller configured for triggering on or cutting off the circuit. The SCM sets a limiting voltage according to parameters input... Agent: Hong Fu Jin Precision Industry (shenzhen) Co., Ltd.

20150116881 - High voltage dc circuit breaker apparatus: A circuit breaker apparatus for use in high voltage direct current (HVDC) power transmission is provided. The circuit breaker apparatus has one module or a plurality of series-connected modules, the or each module including: first, second, third and fourth conduction paths and first and second terminals for connection to an... Agent: Alstom Technology Ltd

20150116882 - Apparatus and method for time-delayed thermal overload protection: Apparatus and methods for time-delayed thermal overload protection are provided. In one aspect, an integrated circuit includes a primary circuit disposed in a primary circuit region on a substrate, and a thermal protection circuit disposed in a thermal protection circuit region on the substrate and in thermal communication with the... Agent: Analog Devices, Inc.

20150116883 - Electric-wire protection device: An electric-wire protection device that protects an electric wire by cutting off power to the wire when its temperature is elevated above a predetermined value is presented. The device includes switching means to control the conduction of power to the wire, current measuring means to measure a current in the... Agent: Sumitomo Wiring Systems. Ltd.

20150116884 - Electronic safety shutoff with dual redundancy: Electronic safety shutoff with dual redundancy is provided for use in combination with an electronic device to prevent fire, explosion, electrocution or shock. In one embodiment, four sensors, including two smoke sensors and two temperature sensors provide input to the logic gate circuit. The logic gate circuit determines the output... Agent:

20150116885 - Semiconductor device: A fuse, a resistor, and a transistor, which serve as an abnormality history setting unit, are provided in series between external terminals. The transistor receives a specific abnormality detection signal on its base from an abnormality detection circuit. The specific abnormality detection signal becomes “H” level in order to bring... Agent: Mitsubishi Electric Corporation

20150116886 - Multiphase circuit breaker system having a short-circuit link: The circuit breaker system contains a plurality of phase conductors, a circuit breaker having a plurality of breaker poles, and a short-circuit link having a star point and a plurality of link conductors combined at the star point. Each of the phase conductors is electrically conductively connected to in each... Agent: Abb Technology Ag

20150116887 - Method and apparatus for producing an asymmetric magnetic field: A system for generating an asymmetric magnetic field. The system includes a drive circuit and a stacked winding structure coupled to the drive circuit. The stacked winding structure includes a plurality of winding layers. The plurality of winding layers includes a first winding layer including a first conductive winding having... Agent: Massachusetts Institute Of Technology

20150116888 - Corona ignition device: Described is a corona ignition device comprising an insulator, a housing that is closed at its front end by the insulator, a center electrode that protrudes out of a front end of the insulator and has at least one ignition tip, wherein the insulator protrudes out of the housing and... Agent:

20150116889 - Electrostatic chuck and method of manufacturing electrostatic chuck: An electrostatic chuck and a manufacturing method are disclosed in which drawbacks of using an adhesive are not existent and a freedom degree of design is high. The electrostatic chuck includes a substrate part constituting a main chuck body, a first insulating layer of a spray coating formed to the... Agent: Tocalo Co., Ltd.

20150116890 - Internal combustion engine ignition device: There is provided an internal combustion engine ignition device which comprises a switching element for causing or interrupting flow of a current through a primary coil of an ignition coil; a secondary current detection circuit connected to a secondary coil for detecting a secondary current flowing at the time of... Agent: Mitsubishi Electric Corporation

20150116891 - Composite electronic component and board for mounting the same: A composite electronic component may include: a composite body including a combination of a capacitor formed of a ceramic body including a plurality of dielectric layers and first and second internal electrodes disposed to face one another with the dielectric layers interposed therebetween, and an inductor formed of a magnetic... Agent: Samsung Electro-mechanics Co., Ltd.

20150116892 - Multilayer ceramic capacitor and board having the same: A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; a capacitor part including a first internal electrode formed in the ceramic body and a second internal electrode formed in the ceramic body; a resistor part including a first internal connection conductor formed in the... Agent: Samsung Electro-mechanics Co., Ltd.

20150116893 - Electrostatic actuator, variable capacitance capacitor, electric switch, and method for driving electrostatic actuator: An electrostatic actuator includes: a fixed driving electrode that is disposed on a silicon substrate; a movable driving electrode that is disposed so as to face the fixed driving electrode and approaches the fixed driving electrode with an electrostatic force generated between the movable driving electrode and the fixed driving... Agent:

20150116901 - Ceramic electronic component: A ceramic electronic component includes a first fired electrode layer disposed on top of a ceramic body. The first fired electrode layer includes first to fifth portions that are separate from each other. The first portion is disposed on top of a first end surface. The second portion is disposed... Agent:

20150116903 - Composite sheet, multilayer ceramic electronic component, and method for manufacturing the multilayer ceramic electronic component: A composite sheet includes a ceramic green sheet having a lengthwise direction and a conductor film printed on the ceramic green sheet. The conductor film has a shape that has a longitudinal dimension extending in the lengthwise direction and a lateral dimension perpendicular or substantially perpendicular to the longitudinal direction.... Agent:

20150116895 - Conductive paste composition for external electrode, multilayer ceramic electronic component using the same, and manufacturing method thereof: There are provided a conductive paste composition for an external electrode, a multilayer ceramic electronic component using the same, and a manufacturing method thereof, and more specifically, a conductive paste composition for an external electrode, allowing for decreased blister and glass beading defects by improving a removal of residual carbon... Agent: Samsung Electro-mechanics Co., Ltd.

20150116897 - Electronic component: In an electronic component, a first terminal electrode is disposed on a first side surface and extends to a second principal surface. A second terminal electrode is disposed on a second side surface and extends to the second principal surface. A third terminal electrode is disposed on a third side... Agent:

20150116899 - Electronic component: An electronic component has dimensions (length×width×thickness) of about 0.6 mm to about 1.0 mm×about 0.3 mm to about 0.5 mm×about 0.07 mm to about 0.15 mm. An area of a triangle defined by a first hypothetical straight line being in contact with the top of a portion of an outer... Agent:

20150116900 - Laminated electronic component manufacturing method, and laminated electronic component: In a method of manufacturing a laminated electronic component, a position of a second green sheet with respect to a first green sheet is determined such that an overall width of a first portion printed on the first green sheet and a second portion printed on the second green sheet... Agent:

20150116896 - Monolithic ceramic capacitor: A monolithic ceramic capacitor includes an element body including a multilayer portion including a plural conductor layers and plural ceramic dielectric layers alternately stacked in a thickness direction. The element body is divided in the thickness direction into thickness-direction first and outer layer portions made of the ceramic dielectric layers,... Agent:

20150116898 - Monolithic ceramic capacitor: A monolithic ceramic capacitor includes an element body having therein a multilayer portion formed of a plurality of conductor layers and a plurality of ceramic dielectric layers alternately stacked in a thickness direction; and a first outer electrode and a second outer electrode provided on an outer portion of the... Agent:

20150116902 - Multilayer ceramic electronic component and mother ceramic multilayer body: A multilayer ceramic electronic component includes a ceramic body, first and second outer electrodes, and a plurality of first and second inner electrodes opposing each other across ceramic layers in a lamination direction of the ceramic body. At least two inner electrodes among the plurality of first and second inner... Agent:

20150116894 - Plzt capacitor on glass substrate: A lead-lanthanum-zirconium-titanate (PLZT) capacitor on a substrate formed of glass. The first metallization layer is deposited on a top side of the substrate to form a first electrode. The dielectric layer of PLZT is deposited over the first metallization layer. The second metallization layer deposited over the dielectric layer to... Agent:

20150116904 - Film capacitor: A film capacitor includes a first electrode layer, a second electrode layer, and a dielectric film disposed between the first and second electrode layers. The dielectric film mainly contains a styrene polymer having a syndiotactic structure. The first electrode layer includes first small electrode segments and a first fuse which... Agent:

20150116907 - Capacitor: f

20150116908 - Nanofeatured electrodes and energy storage coaxial cables therefrom: A method of fabricating electrodes having protruding nanofeatures includes growing metal oxide nanofeatures on a metal or metal alloy wire using a heat treatment in an oxidizing environment. An electrically conducting material is deposited on the nanofeatures to form coated nanofeatures. An electrochemically active material (active material) is deposited to... Agent:

20150116906 - Two-dimensional transition metal dichalcogenide sheets and methods of preparation and use: Methods of forming two-dimensional transition metal dichalcogenide sheets are provided. The methods include adding a cross-linking agent to an activating agent to form a solution and mixing a two-dimensional transition metal dichalcogenide with the solution to form a mixture. The methods also include adding a cleaving agent to the mixture... Agent:

20150116905 - Ultracapacitor with improved aging performance: An energy storage device such as an electric double layer capacitor has positive and negative electrodes, each including a blend of respective first and second activated carbon materials having distinct pore size distributions. The blend (mixture) of first and second activated carbon materials may be equal in each electrode.... Agent: Corning Incorporated

20150116909 - Tantalum capacitor and method of manufacturing the same: There is provided a tantalum capacitor including: a capacitor body containing tantalum powder and having a tantalum wire exposed to one end thereof; a positive electrode lead frame including a positive electrode terminal part and a positive electrode connection part formed by upwardly bending a portion of the positive electrode... Agent: Samsung Electro-mechanics Co., Ltd.

20150116910 - Tantalum capacitor and method of manufacturing the same: A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to... Agent: Samsung Electro-mechanics Co., Ltd.

20150116911 - Arc deflecting and ventilation assembly for electrical enclosures and systems for arc deflecting and ventilation: t

20150116912 - Circuit breakers having enlarged pressure relief valves and related electrical distribution panels and systems: Circuit breakers are provided including a pressure release valve. The pressure release valve includes a vent portion and barrier portion. The barrier portion is configured to open when exposed to excessive heat generated by an arc and allow gases to escape from the circuit breaker. Related electrical distribution panels and... Agent:

20150116913 - System for sharing power of rack mount server and operating method thereof: Disclosed herein are a system for sharing power of rack mount server and an operating method thereof. The system for sharing power of a rack mount server according to the present invention comprises: a plurality of servers installed inside a rack main frame and mounted with a power sharing backplane;... Agent: Electronics And Telecommunications Research Institute

20150116915 - Manufacturing method of electronic device, electronic device, electronic apparatus, moving object, and lid body: A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on a surface which is welded with the base,... Agent:

20150116914 - Remote control attachable to surface of metal shell and an electric appliance with such remote control: The present disclosure discloses a remote control attachable to a surface of a metal shell. The remote control comprises a shell, a remote panel provided on a front face of the shell, and a magnet built-in inside the shell. The remote control according to the present disclosure can avoid being... Agent: Ningbo Smal Electrics Co., Ltd.

20150116916 - Extendable wireless power delivery for small devices: In various embodiments, an electronic device such as a portable computer has a structure that extends from the device to wirelessly transfer electrical power between itself and an external device. The structure may be placed in a non-extended position when not being used for such power transfer. In some embodiments... Agent: Intel Corporation

20150116917 - Information processing apparatus: An information processing apparatus includes a first case and a second case. A connection assembly connects the first case to the second case such that the cases are rotatable about a shaft member disposed in the connection assembly. The connection assembly includes a first link member attached at one end... Agent: Sony Corporation

20150116918 - Dust-resistant keyboard assembly: A dust-resistant keyboard assembly includes a keyboard body and a dust-resistant cover. The dust-resistant cover connects to the keyboard body and is moveable from a first state where the dust-resistant cover is positioned above the keyboard body to a second state where the dust-resistant cover abuts the keyboard body.... Agent:

20150116920 - Flexible electronic devices: Flexible electronic devices may be provided. A flexible electronic device may include a flexible display, a flexible housing and one or more flexible internal components configured to allow the flexible electronic device to be deformed. Flexible displays may include flexible display layers, flexible touch-sensitive layers, and flexible display cover layers.... Agent:

20150116919 - Techniques for strengthening glass covers for portable electronic devices: Apparatus, systems and methods for improving strength of a thin glass cover for an electronic device are disclosed. In one embodiment, the glass member can have improved strength by forming its edges with a predetermined geometry and/or by chemically strengthening the edges. Advantageously, the glass member can be not only... Agent:

20150116921 - Electronic device: An electronic device includes a first body, a second body, a first rotary shaft and a flexible display panel. The second body is movably connected to the first body and is adapted to lean against the first body or separate from the first body. The first rotary shaft is pivotally... Agent: Wistron Corporation

20150116923 - Cable backplane assembly and method: An electronic device includes a bulkhead assembly. The bulkhead assembly includes a bulkhead and one or more cable cassettes coupled to the bulkhead. The cable cassettes include floating connectors. The cable cassettes are modular assemblies that contain all the wiring and connectors. As the connectors float in the cable cassettes,... Agent:

20150116922 - Structure of screw-free adaptation rack: The present invention relates to a structure of a screw-free adaptation rack, which includes a main casing including a carrying section to define an upper portion of the main casing as a primary accommodation space and a lower potion as a secondary accommodation space. A partition plate is arranged in... Agent: Cremax Tech Co., Ltd.

20150116924 - Mounting device for hard disk drive: A mounting device for mounting a hard disk drive (HDD) includes a frame and a fixing member. The frame includes two side boards and a connecting board connected between the side boards. Each side board defines a latching hole and a positioning hole. The fixing member includes two arms fixed... Agent: Hong Fu Jin Precision Industry (wuhan) Co., Ltd.

20150116925 - Docking station and electronic apparatus: The disclosure discloses a docking station that includes a housing, a circuit board, a base end electrical connector, a screw, and a resilient member. The housing has a stud. The circuit board is supported on the stud and has a through hole. The through hole is aligned with and communicated... Agent: Wistron Corp.

20150116926 - Portable electronic device case, folio, and dock: A docking system for a portable electronic device includes a dock having a housing and a lock mechanism supported by the housing. The housing is configured to couple to the portable electronic device. The lock mechanism is operable to secure the portable electronic device to the housing. The docking system... Agent:

20150116927 - Portable electronic device case, folio, and dock: A system for use with a portable electronic device includes a case having a body configured to receive the portable electronic device, a first attachment structure formed on the body, and a second attachment structure formed on the body. The system also includes a folio having a cover and an... Agent:

20150116928 - Centrifugal fan with integrated thermal transfer unit: Disclosed herein are computing devices, and methods of manufacturing computing devices, that have a cooling fan and integrated thermal transfer unit. A centrifugal fan unit includes a rotatable hub, a plurality of blades disposed on the rotatable hub, and a motor coupled to the rotatable hub. The motor causes the... Agent: Microsoft Corporation

20150116929 - Backflow prevention for computing devices: Embodiments of the invention are directed to methods and systems for backflow prevention for computing devices. In an embodiment, a system of sensors, processors, and airflow stimulation devices, such as fans, are used to prevent backflow of high temperature gasses through a server housing. The backflow of high temperature gasses... Agent: Dell Products, L.p.

20150116930 - Cooling apparatus and cooling method: A cooling apparatus that cools an electronic apparatus accommodated in a cabinet, the cooling apparatus includes: a plurality of cooling fans attached to the cabinet; and a control unit that controls a rotation speed of the cooling fans that have been grouped into a plurality of groups, for each of... Agent: Fujitsu Limited

20150116933 - Case including metal for an electronic device and electronic device having the same: A case including metal for an electronic device and an electronic device having the same are provided. The electronic device includes a case comprising an injection-molded part including a plurality of holes, and a metal part formed under the injection-molded part, and the metal part being partially exposed through the... Agent: Samsung Electronics Co., Ltd.

20150116932 - Computer device: A computer device includes a main casing, a computer body disposed in the main casing, a linkage mechanism including first and second sheets and a first shape-memory alloy, and a movable casing pivoted to the main casing. The main casing is for engaging with the movable casing to position the... Agent: Wistron Corporation

20150116931 - Mobile computing device with a combined housing and connector port: Mobile computing devices that include an exterior housing and a port. The housing is configured to form a guide portion of the port. More particularly, the port includes a cavity formed in the housing. The cavity includes interior walls that extend inward from an exterior wall of the housing. The... Agent: Sony Corporation

20150116934 - Power system enclosure: A power system enclosure is provided. The power system enclosure includes a housing accommodating a power source. The power system enclosure further includes an enclosure inlet connected to the housing to allow entry of an intake fluid into the housing. An enclosure exhaust is connected to the housing to route... Agent: Solar Turbines Inc.

20150116935 - Slant angle vent plate pattern and method: An electronic device includes a chassis base and a chassis cover which define an electronic enclosure. The chassis base includes a slant angle venting plate extending at an angle from a chassis base sidewall of the chassis base. The slant angle venting plate has a slant angle vent plate pattern... Agent:

20150116937 - Electronic device with waterproof enclosure: An electronic device including a sealed enclosure, the electronic components arranged inside the sealed enclosure and including high-loss high-temperature components, a main heat sink including ribs, wherein the high-loss high-temperature components are attached to the main heat sink and the ribs of the main heat sink are arranged outside the... Agent: Abb Oy

20150116936 - Operating a current converter at a path of travel of land vehicles or at a parking space of a land vehicle: The invention relates to an arrangement for operating a current converter, in particular an inverter, wherein the converter is located at a path of travel of land vehicles or at a parking space of a land vehicle, the converter being adapted to support operation of at least one vehicle, the... Agent:

20150116939 - Auto-compensating temperature valve controller for electro-rheological fluid micro-channel cooled integrated circuit: A structure and method of using the structure. The structure including an integrated circuit chip having a set of micro-channels; an electro-rheological coolant fluid filling the micro-channels; first and second parallel channel electrodes on opposite sides of at least one micro-channel, the first channel electrode connected to an output of... Agent: International Business Machines Corporation

20150116938 - Heat sink device for power modules of power converter assembly: A heat sink for power modules can be incorporated into a power module of a machine. In embodiments, an alloy is extruded to form a body with a plurality of divider webs integral thereto and defining a plurality of longitudinal passage segments inside the body. The body is machined to... Agent: Caterpillar Inc.

20150116940 - Circuit card assembly and method of fabricating the same: A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame.... Agent: General Electric Company

20150116941 - Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader: Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area... Agent:

20150116942 - Cooling member: A cooling member includes a heat-transfer member, a refrigerant introducing pipe and a covering material. The heat-transfer member has a surface with a groove opened to the surface of the heat-transfer member. The refrigerant introducing pipe is pressed into the groove. The covering material coats the surface of the heat-transfer... Agent:

20150116943 - Thermoelectric heat pump with a surround and spacer (sas) structure: A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings.... Agent:

20150116944 - Electrical assembly with a solder sphere attached heat spreader: An electrical assembly that includes a circuit board, an electrical device, a heat spreader, and a solder sphere. The electrical device is a surface mount type package attached to the circuit board. The heat spreader overlies and extends beyond the outline of the device, and is in thermal contact the... Agent:

20150116945 - Semiconductor device and method for manufacturing same: A semiconductor device includes: a block module which internally includes a power semiconductor element and a first heatsink, and from which a main circuit terminal and a control terminal are drawn; a control substrate connected to the control terminal; a package in which the block module and the control substrate... Agent:

20150116946 - Electronic component, electronic apparatus, and method for manufacturing the electronic component: An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame... Agent:

20150116947 - Advanced grounding scheme: A laminate substrate may include a slug positioned within a cavity of a laminate core. The laminate substrate may have routing layers on either side of the laminate core, at least one of which is coplanar with an outer side of the slug. A capping layer may then be applied... Agent: Triquint Semiconductor, Inc.

20150116948 - Electronic device and electromagnetic wave shielding module thereof: An electronic device including a circuit board, a heat generating component and an electromagnetic wave shielding module is provided. The circuit board has a ground plane. The heat generating component is disposed on the circuit board. The electromagnetic wave shielding module includes a plurality of conductive components and a heat... Agent: Wistron Corporation

20150116950 - Coil component, manufacturing method thereof, coil component-embedded substrate, and voltage adjustment module having the same: A coil component may be capable of being easily manufactured and significantly decreasing direct current (DC) resistance of its wiring. The coil component may include a coil assembly including a core substrate and coil patterns formed on the core substrate; and a magnetic material part embedding the coil assembly therein.... Agent:

20150116949 - Electric component: The electric component includes first and second members 30 and 40, at least one of which being used as an electric conductor. The first member includes a bus bar 31 and a resin member 32 for covering the bar and has a predetermined area where they expose to the exterior.... Agent: Toyota Jidosha Kabushiki Kaisha

20150116951 - Manufacturing method of electronic device, electronic device, electronic apparatus, moving object, and lid body: A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on the rear surface which is welded with the... Agent:

20150116952 - Apparatus for performing communication control: An apparatus for performing communication control includes a control module implemented with at least one integrated circuit (IC) whose package includes a plurality of sets of terminals, each set of the plurality of sets of terminals corresponding to one of a plurality of sub-modules of the control module, and within... Agent:

20150116953 - Electronic media production system and system for use therewith: A system comprising modules. Each module includes: a presentation system including one or more of a speaker and a video screen; and a port. In use, if the presentation system includes the speaker, the system produces sounds derived from data obtained via the port. If the presentation system includes the... Agent:

20150116954 - Image sensor module: An image sensor module is provided. The image sensor module includes a circuit board, a flat material, an image sensing chip, a holder and a covering plate. The flat material disposed on an assembling surface of the circuit board has a supporting surface and a bottom surface opposite thereto. The... Agent: Larview Technologies Corp.

20150116955 - Engine control unit: An engine control unit including a substantially rectangular printed circuit board in which a microcontroller is mounted. The printed circuit board includes a connector portion in which connection terminals are provided to be arranged in one side edge portion along the longitudinal direction thereof. The connection terminals of the connector... Agent: Mikuni Corporation

20150116956 - Semiconductor device: It is an object of the present invention to provide an easily assemblable semiconductor device including a cover that covers a top of a case and is reliably fixed to the case defining an outline of the semiconductor device. A semiconductor device according to the present invention includes: a case... Agent: Mitsubishi Electric Corporation

20150116958 - Circuit board modules having mechanical features: A modularized printed circuit board including mechanical features. The modularized printed circuit board may include a printed circuit board, at least one electronic component affixed to the printed circuit board, and an overmold material adjacent at least a portion of the printed circuit board and defining a region of overmold... Agent:

20150116957 - Electronic assembly and electronic apparatus: An electronic apparatus includes a rear casing, a front cover, and an electronic assembly that includes a display module, a host module, a battery module, and an expansion module. The rear casing has a front opening. The front cover is located on the front opening; the front cover and the... Agent: Htc Corporation

20150116959 - Display devices and methods of manufacturing display devices: A display device having a base film, a display structure, and a window, the base film including a first bending region having a wrinkled portion and a first region adjacent to the first bending region, a display structure disposed on a first face of the base film, and a window... Agent: Samsung Display Co., Ltd.

20150116960 - Electronic package structure: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the... Agent:

20150116962 - Circuit board and electronic device: An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of... Agent:

20150116961 - Method and structure for inhibiting dendrite formation: A circuit includes a structure for inhibiting dendrite formation. The circuit includes a first electrode disposed within a first area of the circuit, wherein the first electrode is configured to be coupled to an ionic source that forms ions when a first electric potential is applied to the first electrode.... Agent:

20150116963 - Coil-integrated printed circuit board and magnetic device: A coil-integrated printed circuit board includes: a first outer layer which includes a first outer thick electric conductor made of a thick metallic foil and a first outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the first outer thick electric conductor,... Agent: Omron Automotive Electronics Co., Ltd.

20150116964 - Component-embedded substrate: A component-embedded substrate includes a substrate portion, an embedded electronic component, and a resin portion. The substrate portion has inner electrodes on an inner principal surface. The embedded electronic component has terminal electrodes and is mounted to the substrate portion via solder fillets adhering to the respective terminal electrodes and... Agent:

20150116966 - Composite electronic component and board having the same mounted thereon: There is provided a composite electronic component including a composite body having a capacitor and an inductor coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes facing each other with the dielectric layers interposed therebetween are... Agent: Samsung Electro-mechanics Co., Ltd.

20150116965 - Embedded bridge structure in a substrate: Some novel features pertain to a substrate that includes a first dielectric layer and a bridge structure. The bridge structure is embedded in the first dielectric layer. The bridge structure is configured to provide an electrical connection between a first die and a second die. The first and second dies... Agent: Qualcomm Incorporated

20150116968 - Semiconductor integrated circuit device: A semiconductor integrated circuit chip, in which multi-core processors are integrated, is usually mounted over an organic wiring board by FC bonding to form a BGA package by being integrated with the substrate. In such a structure, power consumption is increased, and hence the power supplied only from a peripheral... Agent: Renesas Electronics Corporation

20150116967 - Wiring board and method of manufacturing the same: Provided is a wiring board including: an insulating board having a mounting portion configured such that a semiconductor element is mounted on an upper surface thereof; a semiconductor element connection pad formed on the mounting portion; a conductor pillar formed on the semiconductor element connection pad; and a solder resist... Agent: Kyocera Circuit Solutions, Inc.

20150116969 - Electronic device and method of manufacturing electronic device: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed; an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate; a lid which accommodates the electronic element and... Agent:

20150116970 - Mounting structure and method for manufacturing same: A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101)... Agent:

20150116971 - Electronic device and method of manufacturing electronic device: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and... Agent:

20150116972 - Dc-dc converter assembly with an output inductor accommodating a power stage attached to a circuit board: A DC-DC converter assembly includes a board having a first side and a second side opposite the first side, a power stage die of a DC-DC converter attached to the first side of the board, and an output inductor electrically connected to an output of the power stage die and... Agent:

20150116973 - Electronic package structure: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the... Agent:

20150116974 - Method of manufacturing electronic device, electronic device, electronic apparatus, moving object, and lid body: A method of manufacturing an electronic device in which a gyro element as an electronic component is accommodated in an internal space provided by a base and a lid as a lid body, includes: preparing the lid as the lid body in which a groove is provided in the surface... Agent:

20150116975 - Electronic component, electronic device, method of manufacturing mounted member, and method of manufacturing electronic component: A frame member includes a first portion, a second portion, and a third portion located between the first portion and the second portion, and wherein the lengths of the first portion and the second portion in a circumferential direction are longer than the length of the third portion in the... Agent:

20150116976 - Cable assembly for a cable backplane system: A cable assembly for a cable backplane system includes a tray having a frame and spacer assemblies coupled to the frame that hold cable tray connectors in fixed positions relative to the frame. Each cable tray connector has a housing holding a plurality of contacts and cables extending rearward from... Agent: Tyco Electronics Corporation

  
04/25/2015 > 106 patent applications in 67 patent subcategories.
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