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PhotocopyingBelow are recently published patent applications awaiting approval from the USPTO. Recent week's RSS XML file available below.
Listing for abstract view: USPTO application #, Title, Abstract excerpt,Patent Agent. Listing format for list view: USPTO National Class full category number, title of the patent application. 10/02/2014 > 14 patent applications in 7 patent subcategories.
20140293249 - Exposure apparatus and method for producing device: There is provided an exposure apparatus capable of forming a desirable device pattern by removing unnecessary liquid when performing exposure by projecting a pattern onto the substrate via a projection optical system and the liquid. The exposure device projects an image of the pattern onto the substrate via the projection... Agent: Nikon Corporation
20140293248 - Lithographic apparatus and device manufacturing method: In an immersion lithography apparatus or device manufacturing method, the position of focus of the projected image is changed during imaging to increase focus latitude. In an embodiment, the focus may be varied using the liquid supply system of the immersion lithographic apparatus.... Agent: Carl Zeiss Smt Ag
20140293252 - Exposure apparatus, and device manufacturing method: An exposure apparatus exposes a substrate with illumination light via a projection optical system and liquid, and includes a controller that controls movement of first and second movable members each of which can hold a substrate. The controller executes a relative movement between the first and second movable members such... Agent: Nikon Corporation
20140293250 - Focus control apparatus for photolithography: A method comprises providing a semiconductor substrate having at least one layer of a material over the substrate. A sound is applied to the substrate, such that a sound wave is reflected by a top surface of the layer of material The sound wave is detected using a sensor. A... Agent:
20140293251 - Projection system, lithographic apparatus, method of projecting a beam of radiation onto a target and device manufacturing method: A projection system is provided that includes a sensor system that measures at least one parameter that relates to the physical deformation of a frame that supports the optical elements within the projection system, and a control system that, based on the measurements from the sensor system, determines an expected... Agent: Asml Netherlands B.v.
20140293253 - Lens comprising a plurality of optical element disposed in a housing: The invention relates to a lens comprising several optical elements that are disposed in a lens housing. At least one sensor array encompassing at least one capacitive sensor unit and/or at least one inductive sensor unit is provided for determining the relative position between a first optical element and a... Agent: Carl Zeiss Smt Gmbh
20140293254 - Illumination optical device, optical unit, illumination method, and exposure method and device: An illumination device for illuminating a reticle surface as an illumination target surface with illumination light supplied from a light source is provided with a first polarization beam splitter for separating the illumination light into a first beam and a second beam with respective polarization directions orthogonal to each other;... Agent:
20140293255 - Mirror arrangement, in particular for use in a microlithographic projection exposure apparatus: The invention relates to a mirror arrangement, in particular for use in a microlithographic projection exposure apparatus, comprising a plurality of individual mirrors and a plurality of flexures, wherein each individual mirror is tiltable about at least one tilting axis via one of the flexures and wherein the flexures are... Agent:
20140293256 - Microlithography projection objective: Microlithography projection objectives for imaging into an image plane a pattern arranged in an object plane are described with respect to suppressing false light in such projection objectives.... Agent:
20140293257 - Substrate holding apparatus and method: Provided are a substrate holding apparatus and a method of using the substrate holding apparatus. According to an aspect of the present invention, there is provided a substrate holding apparatus comprising a stage on which a substrate is placed, and at least one lift bar which separates the substrate from... Agent:
20140293261 - Lithographic method to apply a pattern to a substrate and lithographic apparatus: A slit shaped area of a patterning device is illuminated to impart a radiation beam with a pattern in its cross-section. A projection system projects the patterned radiation beam onto a target portion of a substrate. As the radiation beam is scanned across the target portion of the substrate, a... Agent: Asml Netherlands B.v.
20140293258 - Manufacturing apparatus of electronic component and manufacturing method thereof: A first alignment mark is given to a substrate, and a second alignment mark is given to a mask. The mask forms an electronic circuit pattern on the substrate. A control unit performs alignment of the mask and the substrate based on the first and second alignment marks. The second... Agent: Tdk Corporation
20140293259 - Method of making nozzle chip: A method of making a nozzle chip includes a step of reduction-projection-exposing a photosensitive resin material to exposure light through a mask by using a reduction-projection-exposure apparatus, the mask having a light-transmitting pattern formed thereon; and a step of forming an ejection orifice pattern corresponding to the light-transmitting pattern on... Agent:
20140293260 - Method of manufacturing printed circuit boards: Methods and apparatus are provided to fabricate massive monolithic arrays of individually addressable light emitting diodes, assemble a plurality of such massive monolithic arrays of individually addressable light emitting diodes, control each individual light emitting diode, and to assemble the same in manner to achieve the accuracy and stability for... Agent: 4233999 Canada Inc.09/25/2014 > 11 patent applications in 6 patent subcategories.
20140285781 - Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium: A liquid immersion member used in an immersion exposure apparatus, and capable of forming a liquid immersion space on a surface of an object opposite to an emitting surface of an optical member which emits exposure light. The liquid immersion member includes a first member that includes a first part... Agent:
20140285782 - Lithographic apparatus and device manufacturing method: An exposure apparatus having a projection system configured to project a plurality of radiation beams onto a target and an image slicer. The image slicer is arranged in an inverted configuration such that, if an input image formed of a plurality of separated image regions were provided to the image... Agent: Asml Netherlands B.v.
20140285784 - Apparatus for and method of drawing: A drawing apparatus accepts a selection manipulation for selecting the type of shape of a light outgoing ratio function defining a relationship between the position of modulation units included in an optical unit as seen in the direction of the arrangement of the modulation units and a light outgoing ratio... Agent:
20140285783 - Euv-mirror arrangement, optical system with euv-mirror arrangement and associated operating method: An EUV mirror arrangement (100) has a multiplicity of mirror elements (110, 111, 112) which are arranged alongside one another and jointly form a mirror surface of the mirror arrangement. Each mirror element has a substrate (120) and a multilayer arrangement (130) applied on the substrate and having a reflective... Agent: Carl Zeiss Smt Gmbh
20140285785 - Lithographic apparatus, device manufacturing method and computer program: The invention relates to intensity values for a plurality of beams used to irradiate a plurality of locations on a target are determined with reference to the position and/or rotation of the locations. Also provided is an associated lithographic or exposure apparatus, an associated device manufacturing method and an associated... Agent: Asml Netherlands B.v.
20140285786 - Lithography apparatus, an apparatus for providing setpoint data, a device manufacturing method, a method of calculating setpoint data and a computer program: An exposure apparatus configured to project each of a plurality of radiation beams onto a respective location on a target, the plurality of radiation beams forming a desired dose pattern via a plurality of spot exposures, the nominal position of a characteristic point in the dose distribution of each of... Agent: Asml Netherlands B.v.
20140285787 - Exposure system and exposure method: According to one embodiment, an exposure system includes: a supporting stage; a plurality of masks provided on an upper side of the supporting stage; and a light source being capable of irradiating a substrate with light through the plurality of masks, the plurality of masks including: a first mask, and... Agent: Kabushiki Kaisha Toshiba
20140285789 - Lithography method and structure for resolution enhancement with a two-state mask: A lithography process in a lithography system includes loading a mask that includes two mask states defining an integrated circuit (IC) pattern. The IC pattern includes a plurality of main polygons, wherein adjacent main polygons are assigned to different mask states; and a background includes a field in one of... Agent:
20140285788 - Optical system for a microlithographic projection exposure apparatus and microlithographic exposure method: The invention relates to an optical system for a microlithographic projection exposure apparatus, and to a microlithographic exposure method. An optical system for a microlithographic projection exposure apparatus comprises a polarization-influencing optical arrangement, wherein the polarization-influencing optical arrangement comprises at least one first array of first polarization-influencing elements and a... Agent:
20140285790 - Substrate treating apparatus: A substrate treating apparatus includes a treating section for treating substrates, and an interface section disposed adjacent the treating section and adjacent an exposing machine provided separately from the apparatus. The interface section has a first treating-section-side transport mechanism, a second treating-section-side transport mechanism, and an exposing-machine-side transport mechanism. Each... Agent: Sokudo Co., Ltd.
20140285791 - Exposure apparatus, stage apparatus, and device fabrication method: The present invention provides an exposure apparatus which transfers a pattern of a reticle onto a substrate, including a stage configured to place the reticle, a holding mechanism configured to hold the reticle placed on the stage, a driving unit configured to drive the stage, a determination unit configured to... Agent: Canon Kabushiki Kaisha09/18/2014 > 19 patent applications in 7 patent subcategories.
20140268074 - Lithography system with an embedded cleaning module: The present disclosure provides a lithography system. The lithography system includes an exposing module configured to perform a lithography exposing process using a mask secured on a mask stage; and a cleaning module integrated in the exposing module and designed to clean at least one of the mask and the... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.
20140268075 - Source, target and mask optimization by incorporating countour based assessments and integration over process variations: Methods and systems for determining a source shape, a mask shape and a target shape for a lithography process are disclosed. One such method includes receiving source, mask and target constraints and formulating an optimization problem that is based on the source, mask and target constraints and incorporates contour-based assessments... Agent: International Business Machines Corporation
20140268076 - Self-aligned dynamic pattern generator device and method of fabrication: A dynamic pattern generator (DPG) device and method of making a DPG device are disclosed. The DPG device is used in semiconductor processing tools that require multiple electron-beams, such as direct-write lithography. The device is a self-aligned DPG device that enormously reduces the required tolerances for aligning the various electrode... Agent: Corporation For National Research Initiatives
20140268077 - A flow lithography technique to form microstructures using optical arrays: A continuous flow projection lithography system to form microstructures using an optical array incorporated in a continuous coating process is provided. A mask is placed at a distance from the array. Each element of the array projects one image of the mask onto a substrate, effectively forming an array thereon.... Agent: Palo Alto Research Center Incorporated
20140268081 - Amorphous layer extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor: An integrated extreme ultraviolet blank production system includes: a vacuum chamber for placing a substrate in a vacuum; a deposition system for depositing a multi-layer stack without removing the substrate from the vacuum; and a treatment system for treating a layer on the multi-layer stack to be deposited as an... Agent: Applied Materials, Inc.
20140268078 - Electron beam lithography systems and methods including time division multiplex loading: The present disclosure provides a systems and methods for e-beam lithography. One system includes an electron source operable to produce a beam and an array of pixels operable to pattern the beam. Control circuitry is spaced a distance from and coupled to the array of pixels. The control circuitry uses... Agent:
20140268079 - Particle counter and immersion exposure system including the same: A particle counter may include a housing having an inlet, an outlet, and a window therebetween. The inlet and the outlet may be configured such that a fluid can be flowed therethrough. A plurality of light sources may be arranged outside the housing to provide lights of different wavelengths into... Agent: Samsung Electronics Co., Ltd.
20140268080 - Planarized extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor: An integrated extreme ultraviolet (EUV) blank production system includes: a vacuum chamber for placing a substrate in a vacuum; a first deposition system for depositing a planarization layer having a planarized top surface over the substrate; and a second deposition system for depositing a multi-layer stack on the planarization layer... Agent: Applied Materials, Inc.
20140268084 - Projection lens with wavefront manipulator: A projection lens for imaging a pattern arranged in an object plane of the projection lens into an image plane of the projection lens via electromagnetic radiation having an operating wavelength λ<260 nm has a multiplicity of optical elements having optical surfaces which are arranged in a projection beam path... Agent:
20140268083 - Ultra-smooth layer ultraviolet lithography mirrors and blanks, and manufacturing and lithography systems therefor: An extreme ultraviolet mirror or blank production system includes: a first deposition system for depositing a planarization layer over a semiconductor substrate; a second deposition system for depositing an ultra-smooth layer over the planarization layer, the ultra-smooth layer having reorganized molecules; and a third deposition system for depositing a multi-layer... Agent: Applied Materials, Inc.
20140268082 - Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor: A photoresist vapor deposition system includes: a vacuum chamber having a heating element and cooled chuck for holding a substrate, the vacuum chamber having a heated inlet; and a vapor deposition system connected to the heated inlet for volatilizing a precursor into the vacuum chamber for condensing a photoresist over... Agent: Applied Materials, Inc.
20140268086 - Extreme ultraviolet lithography process and mask: The present disclosure is directed towards lithography processes. In one embodiment, a patterned mask is provided. An information of a position of diffraction light (PDL) on a pupil plane of a projection optics box (POB) is used to define as a light-transmitting region of a pupil filter. The patterned mask... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.
20140268087 - Lithography and mask for resolution enhancement: A lithography process in a lithography system includes loading a mask having multiple mask states and having a mask pattern consisting of a plurality of polygons and a field. Different mask states are assigned to adjacent polygons and the field. The lithography process further includes configuring an illuminator to generate... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.
20140268085 - Optical system for a microlithographic projection exposure apparatus: The invention relates to an optical system for a microlithographic projection exposure apparatus, comprising an optical system axis (OA) and a polarization-influencing optical arrangement, wherein the polarization-influencing optical arrangement comprises a first polarization-influencing element, which is produced from optically uniaxial crystal material and has a first orientation of the optical... Agent:
20140268088 - Mechanically produced alignment fiducial method and device: The technology disclosed relates to methods and systems that can be used to reduce visible artifacts know as mura. In particular, it relates to producing alignment marks by physically modifying appearance of a layer of exposure or radiation sensitive material on a workpiece, then using those alignment marks or transferred... Agent: Micronic Mydata Ab
20140268089 - Pattern forming apparatus, mark detecting apparatus, exposure apparatus, pattern forming method, exposure method, and device manufacturing method: While a wafer stage linearly moves in a Y-axis direction, a multipoint AF system detects surface position information of the wafer surface at a plurality of detection points that are set at a predetermined distance in an X-axis direction and also a plurality of alignment systems that are arrayed in... Agent: Nikon Corporation
20140268090 - Cross technology reticle (ctr) or multi-layer reticle (mlr) cdu, registration, and overlay techniques: Methods for reducing reticle transmission differences and for optimizing layer placement for overlay in MTRs and CTRs are disclosed. Embodiments include providing a reticle having a prime area and a frame area surrounding the prime area; determining RT differences across the prime area; and providing RT adjustment structures on the... Agent: Globalfoundries Singapore Pte. Ltd.
20140268091 - Extreme ultraviolet lithography process and mask: A system and process of an extreme ultraviolet lithography (EUVL) is disclosed. The system and process includes receiving a mask with two states, which have 180 degree phase difference to each other. These different states are assigned to adjacent main polygons and adjacent assist polygons of the mask. A nearly... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.
20140268092 - Extreme ultraviolet lithography process and mask: A process of an extreme ultraviolet lithography (EUVL) is disclosed. The process includes receiving an extreme ultraviolet (EUV) mask with multiple states. These different states of the EUV mask are assigned to adjacent polygons and adjacent assist polygons. The EUV mask is exposed by a nearly on-axis illumination (ONI) with... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.09/11/2014 > 34 patent applications in 7 patent subcategories.
20140253887 - Contamination prevention for photomask in extreme ultraviolet lithography application: Embodiments of the present invention provide methods and apparatus for removing debris particles using a stream of charged species. In one embodiment, an apparatus for removing debris particles from a beam of radiation includes a mask station comprising a chamber body, a mask stage disposed in the mask station, and... Agent: Applied Materials, Inc.
20140253886 - Exposure apparatus, exposing method, device manufacturing method, program, and recording medium: An exposure apparatus exposes a substrate by exposure light via liquid between an emitting surface of an optical member and the substrate. The exposure apparatus includes: a liquid immersion member configured to form an immersion liquid space on an object and including a first and second member, the first being... Agent:
20140253889 - Exposure apparatus, exposure method, and method for producing device: An exposure apparatus includes a projection system having a final element that projects exposure light to an upper surface of a substrate through liquid between the final element and the substrate. A liquid confinement member has a recovery outlet, via which the liquid is removed along with gas, arranged such... Agent: Nikon Corporation
20140253888 - Liquid jet and recovery system for immersion lithography: A liquid immersion lithography apparatus includes a projection system, an opening from which liquid is supplied to a space under the projection system, the opening being connectable to a liquid source via a flow passage to supply the liquid to the space and the opening being connectable to a vacuum... Agent: Nikon Corporation
20140253890 - Lithographic apparatus and device manufacturing method: A substrate table of an immersion lithographic apparatus is disclosed which comprises a barrier configured to collect liquid. The barrier surrounds the substrate and is spaced apart from the substrate. In this way any liquid which is spilt from the liquid supply system can be collected to reduce the risk... Agent: Asml Netherlands B.v.
20140253891 - Tunable wavelength illumination system: A lithographic apparatus comprises an alignment system including a tunable narrow pass-band filter configured to receive a broad-band radiation and to filter the broad-band radiation into narrow-band linearly polarized radiation. The tunable narrow pass-band filter is further configured to modulate an intensity and wavelength of the narrow-band radiation and to... Agent: Asml Netherlands B.v.
20140253892 - Extreme ultraviolet lithography projection optics system and associated methods: The present disclosure provides an extreme ultraviolet lithography system. The extreme ultraviolet lithography system includes a projection optics system to image a pattern of a mask on a wafer. The projection optics system includes between two to five mirrors. The two to five mirrors are designed and configured to have... Agent: Taiwan Semiconductor Manufacturing Company, Ltd.
20140253893 - Cylindrical reticle system, exposure apparatus and exposure method: An exposure apparatus is provided for performing a unidirectional scan-exposure. The exposure apparatus includes a base and a plurality of wafer stages on the base for loading/unloading wafers and successively moving from a first position to a second position of the base cyclically. The exposure apparatus also includes alignment detection... Agent: Semiconductor Manufacturing International (shanghai) Corporation
20140253894 - Radiation source: A radiation source having a fuel stream generator (110) that generates and directs a fuel stream (102) along a trajectory towards a plasma formation location (104). A pre-pulse laser radiation assembly directs a first beam of laser radiation (100) at the fuel stream at the plasma formation location to generate... Agent: Asml Netherland B.v.
20140253895 - Cylindrical reticle system, exposure apparatus and exposure method: A cylindrical reticle system is provided for performing a unidirectional scan-exposure. The cylindrical reticle system includes a base and a center shaft fixed a one side of the base. The cylindrical reticle system also includes a first bearing fixed at the end of the center shaft near to the base... Agent: Semiconductor Manufacturing International (shanghai) Corporation
20140253896 - Exposure apparatus and exposure method thereof: An exposure apparatus is provided for performing an unidirectional scan-exposure. The exposure apparatus includes a base and a wafer stage group having a plurality of wafer stages on the base for holding wafers and successively moving from a first position to a second position of the base cyclically. The exposure... Agent: Semiconductor Manufacturing International (shanghai) Corporation
20140253897 - Exposure apparatus and exposure method thereof: A wafer alignment system is provided for performing a unidirectional scan-exposure. The wafer alignment system includes a plurality of wafer stages successively moving from a first position to a second position of a base cyclically. The wafer alignment method also includes an encoder plate having a first opening and a... Agent: Semiconductor Manufacturing International (shanghai) Corporation
20140253900 - Chuck, a chuck control system, a lithography apparatus and a method of using a chuck: A chuck, chuck control system, lithographic apparatus and method of using a chuck are disclosed. In an embodiment, there is provided a chuck (43) for use in holding a patterning device (MA) or a substrate (W) onto a supporting table (MT, WT) of a lithography apparatus (100) by electrostatic force,... Agent: Asml Netherlands B.v.
20140253898 - Pellicle mounting system and method: A pellicle mounting method is provided. The method includes aligning a mounting apparatus with a top surface of a pellicle frame, the mounting apparatus having a continuous duct extending therethrough and a plurality of contact pins projecting from the mounting apparatus. The method also includes introducing a pressurizing fluid into... Agent:
20140253899 - Substrate processing apparatus, lithography apparatus, and method of manufacturing article: The present invention provides a substrate processing apparatus for performing a process of reducing warpage of a substrate, comprising a substrate stage configured to hold the substrate, a pressing member including a portion formed to press a peripheral portion of the substrate against the substrate stage, an obtaining unit configured... Agent: Canon Kabushiki Kaisha
20140253902 - Multiple patterning process for forming trenches or holes using stitched assist features: One illustrative method disclosed herein involves identifying an overall target pattern comprised of at least one hole-type feature, decomposing the overall target pattern into at least a first sub-target pattern and a second sub-target pattern, wherein the first sub-target pattern and the second sub-target pattern each comprise at least one... Agent: Globalfoundries Inc.
20140253901 - Two-dimensional marks: A method for controlling semiconductor production through use of a Focus Exposure Matrix (FEM) model includes taking measurements of characteristics of a two-dimensional mark formed onto a substrate, the two-dimensional mark including two different patterns along two different cut-lines, and comparing the measurements with a FEM model to determine focus... Agent:Previous industry: Optics: image projectors
Next industry: Optics: measuring and testing
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