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Heat sink for power module




Title: Heat sink for power module.
Abstract: A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding one of the crests with the adjacent one of the troughs. Each adjacent pair of the side walls and the corresponding one of the crests or the corresponding one of the troughs arranged between the adjacent side walls form a fin. A guide that extends in the flow direction of the cooling medium and operates to stir the cooling medium is arranged in each of the fins. ...


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USPTO Applicaton #: #20140140004
Inventors: Hidehito Kubo, Masahiko Kimbara, Keiji Toh, Kota Otoshi, Eiji Kono, Katsufumi Tanaka, Nobuhiro Wakabayashi, Shintaro Nakagawa, Yuichi Furukawa, Shinobu Yamauchi


The Patent Description & Claims data below is from USPTO Patent Application 20140140004, Heat sink for power module.




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stats Patent Info
Application #
US 20140140004 A1
Publish Date
05/22/2014
Document #
13779519
File Date
02/27/2013
USPTO Class
361699
Other USPTO Classes
International Class
05K7/20
Drawings
21


Heat Sink Refrigerant

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Kabushiki Kaisha Toyota Jidoshokki


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20140522|20140140004|heat sink for power module|A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is |Kabushiki-Kaisha-Toyota-Jidoshokki
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