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Heat sink for power module

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Heat sink for power module

A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding...
Related Terms: Heat Sink Refrigerant
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USPTO Applicaton #: #20140140004
Inventors: Hidehito Kubo, Masahiko Kimbara, Keiji Toh, Kota Otoshi, Eiji Kono, Katsufumi Tanaka, Nobuhiro Wakabayashi, Shintaro Nakagawa, Yuichi Furukawa, Shinobu Yamauchi

The Patent Description & Claims data below is from USPTO Patent Application 20140140004, Heat sink for power module.

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Previous Patent Application:
Electronic device and housing thereof
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Power electronics device
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Electricity: electrical systems and devices
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stats Patent Info
Application #
US 20140140004 A1
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