FreshPatents.com Logo
stats FreshPatents Stats
n/a views for this patent on FreshPatents.com
Updated: August 24 2014
newTOP 200 Companies filing patents this week


    Free Services  

  • MONITOR KEYWORDS
  • Enter keywords & we'll notify you when a new patent matches your request (weekly update).

  • ORGANIZER
  • Save & organize patents so you can view them later.

  • RSS rss
  • Create custom RSS feeds. Track keywords without receiving email.

  • ARCHIVE
  • View the last few months of your Keyword emails.

  • COMPANY DIRECTORY
  • Patents sorted by company.

Follow us on Twitter
twitter icon@FreshPatents

Reinforcing sheet for resin molded article, reinforced structure of resin molded article, and reinforcing method

* PDF is temporarily not available for this patent. There was a technical issue with this week's patent images, we are working on getting it resolved. Please check back later. Thank you for your patience.

Title: Reinforcing sheet for resin molded article, reinforced structure of resin molded article, and reinforcing method.
Abstract: High-temperature adhesion retention ratio R=(Adhesive force A1000h after heating at 100° C. for 1000 hours/Adhesive force A1h after heating at 100° C. for 1 hour)×100 A reinforcing sheet for a resin molded article includes a constraining layer and a reinforcing layer laminated on the constraining layer. When the reinforcing sheet for a resin molded article is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet after the heating is 3 N or more and the maximum bending strength thereof is 30 N or more, and a high-temperature adhesion retention ratio R as determined by the following formula is 80% or more. ...


Browse recent Nitto Denko Corporation patents - Osaka, JP
USPTO Applicaton #: #20140116619 - Class: 1563099 (USPTO) -


Inventors: Takuya Mase, Takahiro Fujii, Asuka Gomi

view organizer monitor keywords


The Patent Description & Claims data below is from USPTO Patent Application 20140116619, Reinforcing sheet for resin molded article, reinforced structure of resin molded article, and reinforcing method.

TECHNICAL FIELD

The present invention relates to a reinforcing sheet for a resin molded article, a reinforced structure of a resin molded article, and a reinforcing method, to be specific, to a reinforcing sheet for a resin molded article, a reinforced structure of a resin molded article using the reinforcing sheet for a resin molded article, and a reinforcing method of the resin molded article.

BACKGROUND ART

Conventionally, a resin plate or a steel plate used in various industrial products has been processed into a thin plate shape so as to reduce the weight of the product.

Therefore, for example, it has been known that a rib is provided at the inside of the resin plate so as to reinforce the resin plate in a thin plate shape.

Also, for example, it has been known that a reinforcing sheet for a steel plate is provided at the inside of the steel plate so as to reinforce the steel plate in a thin plate shape.

For example, it has been proposed that a reinforcing sheet for a steel plate including a constraining layer and a reinforcing layer made of a foamable composition is attached to a body steel plate of an automobile and then, using a high temperature heat (for example, 160 to 200° C.) at the time of electrodeposition coating, the reinforcing layer is allowed to foam and cure, so that the body steel plate of the automobile is reinforced (ref: for example, the following Patent Document 1).

PRIOR ART DOCUMENT Patent Document

Patent Document 1: Japanese Unexamined Patent Publication No. 2005-41210

SUMMARY

OF THE INVENTION Problems to be Solved by the Invention

However, there is a disadvantage that the rib is usually integrally molded with the resin plate and at the time of molding thereof, a sink mark occurs in a portion, which is reinforced by the rib, at the surface of the resin plate, so that the appearance of the resin plate is damaged.

When the reinforcement is performed using the reinforcing sheet for a steel plate described in the above-described Patent Document 1, the reinforcing layer of the reinforcing sheet for a steel plate is required to be heated at 160 to 200° C. to be cured. Therefore, there is a disadvantage that when the reinforcing sheet for a steel plate is attached to the resin plate to be heated at 160 to 200° C., the resin plate is deteriorated or melted.

A reinforcing sheet including the reinforcing sheet for a steel plate, after being attached to the resin plate or the steel plate, may be placed therewith under high temperature (high temperature to such a degree that the resin plate is not melted) atmosphere for long hours. Even in such a case, it is expected that the reduction in the reinforcement force is effectively prevented.

It is an object of the present invention to provide a reinforcing sheet for a resin molded article that is capable of easily reinforcing a resin molded article, while being light in weight and not damaging the appearance thereof and capable of preventing a deterioration or melting of the resin molded article by heating at relatively low temperature, and furthermore, is capable of effectively preventing the reduction in the reinforcement force under high temperature atmosphere after the elapse of a long period of time; a reinforced structure of the resin molded article; and a reinforcing method of the resin molded article.

Solution to the Problems

A reinforcing sheet for a resin molded article of the present invention includes a constraining layer and a reinforcing layer laminated on the constraining layer, wherein when the reinforcing sheet for a resin molded article is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet after the heating is 3 N or more and the maximum bending strength thereof is 30 N or more, and a high-temperature adhesion retention ratio R as determined by the following formula is 80% or more.

High-temperature adhesion retention ratio R=(Adhesive force A1000h after heating at 100° C. for 1000 hours/Adhesive force A1h after heating at 100° C. for 1 hour)×100

Adhesive force A1000h after heating at 100° C. for 1000 hours: the adhesive force with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes and then heated at 100° C. for 1000 hours to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min.

Adhesive force A1h after heating at 100° C. for 1 hour: the adhesive force with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes and then heated at 100° C. for 1 hour to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min.

In the reinforcing sheet for a resin molded article of the present invention, it is preferable that an adhesive force A10m with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min, is 15 N/25 mm or more.

In the reinforcing sheet for a resin molded article of the present invention, it is preferable that the adhesive force A1h after heating at 100° C. for 1 hour is 50 N/25 mm or more.

In the reinforcing sheet for a resin molded article of the present invention, it is preferable that the storage elastic modulus of the reinforcing layer at 25° C. is 500 kPa or more and that at 80° C. is 500 kPa or less.

In the reinforcing sheet for a resin molded article of the present invention, it is preferable that an adhesive force A0 at the time of normal temperature with respect to a polypropylene plate, which is measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min, is 0.3 N/25 mm or more.

In the reinforcing sheet for a resin molded article of the present invention, it is preferable that the reinforcing layer is formed of a thermally adhesive type adhesive composition; it is preferable that the adhesive composition contains a hydrogenated polymer of a monomer containing conjugated dienes; it is preferable that the adhesive composition further contains a tackifier; it is preferable that the tackifier contains an alicyclic saturated hydrocarbon resin; it is preferable that the tackifier further contains a terpene resin; and it is preferable that the mixing ratio of the tackifier is 40 to 200 parts by weight with respect to 100 parts by weight of the hydrogenated polymer.

A reinforced structure of a resin molded article of the present invention includes a reinforcement of a resin molded article obtained by attaching a reinforcing sheet for a resin molded article including a constraining layer and a reinforcing layer laminated on the constraining layer to the resin molded article to be then heated at 80° C. or more to bring the reinforcing sheet for a resin molded article into close contact with the resin molded article, wherein when the reinforcing sheet for a resin molded article is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet after the heating is 3 N or more and the maximum bending strength thereof is 30 N or more, and a high-temperature adhesion retention ratio R as determined by the following formula is 80% or more.

High-temperature adhesion retention ratio R=(Adhesive force A1000h after heating at 100° C. for 1000 hours/Adhesive force A1h after heating at 100° C. for 1 hour)×100

Adhesive force A1000h after heating at 100° C. for 1000 hours: the adhesive force with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes and then heated at 100° C. for 1000 hours to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min.

Adhesive force A1h after heating at 100° C. for 1 hour: the adhesive force with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes and then heated at 100° C. for 1 hour to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min.

In the reinforced structure of the resin molded article of the present invention, it is preferable that the reinforcing sheet for a resin molded article is heated at 80° C. or more in advance and then, the reinforcing sheet for a resin molded article is attached to the resin molded article.

A reinforcing method of a resin molded article of the present invention includes the steps of attaching a reinforcing sheet for a resin molded article including a constraining layer and a reinforcing layer laminated on the constraining layer to the resin molded article and reinforcing the resin molded article by heating the reinforcing sheet for a resin molded article and/or the resin molded article at 80° C. or more to bring the reinforcing sheet for a resin molded article into close contact with the resin molded article, wherein when the reinforcing sheet for a resin molded article is attached to a polypropylene plate having a thickness of 2.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet after the heating is 3 N or more and the maximum bending strength thereof is 30 N or more, and a high-temperature adhesion retention ratio R as determined by the following formula is 80% or more.

High-temperature adhesion retention ratio R=(Adhesive force A1000h after heating at 100° C. for 1000 hours/Adhesive force A1h after heating at 100° C. for 1 hour)×100

Adhesive force A1000h after heating at 100° C. for 1000 hours: the adhesive force with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes and then heated at 100° C. for 1000 hours to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min.

Adhesive force A1h after heating at 100° C. for 1 hour: the adhesive force with respect to a polypropylene plate, which is obtained by attaching the reinforcing layer to the polypropylene plate to be heated at 80° C. for 10 minutes and then heated at 100° C. for 1 hour to be thereafter measured by a 90-degree peeling test based on JIS Z0237 (in 2000) at a peeling rate of 300 mm/min.

In the reinforcing method of the resin molded article of the present invention, it is preferable that in the step of attaching the reinforcing sheet for a resin molded article to the resin molded article, the reinforcing sheet for a resin molded article is heated at 80° C. or more in advance and then, the reinforcing sheet for a resin molded article is attached to the resin molded article.

Effect of the Invention

According to the reinforced structure and the reinforcing method of the resin molded article of the present invention using the reinforcing sheet for a resin molded article of the present invention, the reinforcing layer of the reinforcing sheet for a resin molded article is attached to the resin molded article to heat the resin molded article and/or the reinforcing sheet for a resin molded article at relatively low temperature, so that the constraining layer and the resin molded article can be tightly brought into close contact with each other by the reinforcing layer and the stiffness of the reinforcing sheet for a resin molded article can be improved. Therefore, the resin molded article can be surely reinforced by the reinforcing sheet for a resin molded article.

Among all, the reinforcing sheet for a resin molded article is attached to only a portion requiring to be reinforced in the resin molded article to be heated, so that the portion only can be easily reinforced.

Also, by a simple configuration of including the constraining layer and the reinforcing layer, the resin molded article can be reinforced while the thinning and lightening can be achieved.

Additionally, in the reinforcing sheet for a resin molded article of the present invention, the high-temperature adhesion retention ratio R of the reinforcing layer is within a specific range, so that after the constraining layer and the resin molded article are allowed to be in close contact with each other by the above-described heating at relatively low temperature, the adhesion between the constraining layer and the resin molded article can be excellently maintained even under high temperature atmosphere after the elapse of a long period of time or the adhesion therebetween can be improved.

Therefore, the reduction in the reinforcing properties of the reinforcing sheet for a resin molded article with respect to the resin molded article can be effectively prevented.



Download full PDF for full patent description/claims.

Advertise on FreshPatents.com - Rates & Info


You can also Monitor Keywords and Search for tracking patents relating to this Reinforcing sheet for resin molded article, reinforced structure of resin molded article, and reinforcing method patent application.
###
monitor keywords



Keyword Monitor How KEYWORD MONITOR works... a FREE service from FreshPatents
1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored.
3. Each week you receive an email with patent applications related to your keywords.  
Start now! - Receive info on patent apps like Reinforcing sheet for resin molded article, reinforced structure of resin molded article, and reinforcing method or other areas of interest.
###


Previous Patent Application:
Method for manufacturing polarizing plate
Next Patent Application:
Plasma processing apparatus
Industry Class:
Adhesive bonding and miscellaneous chemical manufacture
Thank you for viewing the Reinforcing sheet for resin molded article, reinforced structure of resin molded article, and reinforcing method patent info.
- - - Apple patents, Boeing patents, Google patents, IBM patents, Jabil patents, Coca Cola patents, Motorola patents

Results in 0.71264 seconds


Other interesting Freshpatents.com categories:
Electronics: Semiconductor Audio Illumination Connectors Crypto

###

Data source: patent applications published in the public domain by the United States Patent and Trademark Office (USPTO). Information published here is for research/educational purposes only. FreshPatents is not affiliated with the USPTO, assignee companies, inventors, law firms or other assignees. Patent applications, documents and images may contain trademarks of the respective companies/authors. FreshPatents is not responsible for the accuracy, validity or otherwise contents of these public document patent application filings. When possible a complete PDF is provided, however, in some cases the presented document/images is an abstract or sampling of the full patent application for display purposes. FreshPatents.com Terms/Support
-g2-0.2487
     SHARE
  
           

FreshNews promo


stats Patent Info
Application #
US 20140116619 A1
Publish Date
05/01/2014
Document #
14149517
File Date
01/07/2014
USPTO Class
1563099
Other USPTO Classes
1563082
International Class
32B37/06
Drawings
3


Adhesion
Resin


Follow us on Twitter
twitter icon@FreshPatents