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Processing condition inspection and optimization method of damage recovery process, damage recovering system and storage medium


Title: Processing condition inspection and optimization method of damage recovery process, damage recovering system and storage medium.
Abstract: A processing condition inspection method of a damage recovery process for reforming a film having OH groups generated by damages from a predetermined process by using a processing gas includes preparing a substrate having an OH group containing resin film, measuring an initial film thickness of the OH group containing resin film, performing a damage recovery process on the substrate after measuring the initial film thickness, measuring a film thickness of the OH group containing resin film after the damage recovery process, calculating a film thickness difference of the OH group containing resin film before and after the damage recovery process, and determining whether processing conditions of the damage recovery process are appropriate or inappropriate based on the film thickness difference. ...
USPTO Applicaton #: #20130025537
Inventors: Reiko Sasahara, Jun Tamura, Shigeru Tahara



The Patent Description & Claims data below is from USPTO Patent Application 20130025537, Processing condition inspection and optimization method of damage recovery process, damage recovering system and storage medium.




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stats Patent Info
Application #
US 20130025537 A1
Publish Date
01/31/2013
Document #
13632770
File Date
10/01/2012
USPTO Class
118697
Other USPTO Classes
International Class
23C16/52
Drawings
12


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Coating Apparatus   Program, Cyclic, Or Time Control   Having Prerecorded Program Medium  

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