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Lapping carrier and method of using the same

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Lapping carrier and method of using the same


A lapping carrier includes a base having first and second opposed major surfaces and at least one aperture extending from the first major surface to the second major surface. A wear layer is disposed on the first major surface of the base. The wear layer includes an outer polymer layer comprising at least one of polyether ether ketone or ultrahigh molecular weight polyethylene, and a first adhesive layer disposed between the outer polymer layer and the base
Related Terms: Ethylene Ketone Molecular Polymer

USPTO Applicaton #: #20130017765 - Class: 451 36 (USPTO) - 01/17/13 - Class 451 
Abrading > Abrading Process >Utilizing Fluent Abradant



Inventors: Eric C. Coad, Vincent D. Romero, Gary M. Falmgren

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The Patent Description & Claims data below is from USPTO Patent Application 20130017765, Lapping carrier and method of using the same.

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CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of U.S. Provisional Patent Application No. 61/506,253, filed Jul. 11, 2011, the disclosure of which is incorporated herein by reference.

FIELD

The present disclosure broadly relates to lapping carriers and processes for abrading a workpiece using them.

BACKGROUND

A need often arises to grind or polish flat workpieces such as disk-shaped articles (e.g., silicon wafers, sapphire disks, optical elements, or glass or aluminum substrates for magnetic recording devices like), such that the two major surfaces are both parallel and free from significant scratches. Such grinding or polishing operations, differing in the rate of material removal and final surface finish, may be referred to collectively as lapping.

A typical lapping machine used for finishing the disks may include two superposed platens respectively disposed over and under one or more of the disks, so that opposing surfaces of the disks can be ground or polished simultaneously. Moreover, the lapping machine may include lapping carriers that position and retain the disks during the grinding or polishing operation. Such lapping carriers may be adapted to rotate relative to the platens. For example, the lapping machine may also include an outer ring gear, disposed around an outer periphery of the platens, and an inner gear, that projects through a hole formed in a center of the platens. The lapping carriers can have a toothed outer periphery, which engages with the teeth or pins of the outer ring gear and the teeth or pins of the inner gear. Rotation of the inner gear and outer gear in opposite directions, for example, thus causes the lapping carrier to rotate globally around the inner gear, and about an axis of the lapping carrier. Typically, the surfaces of the platens are relatively flat and planar, and are suitable for most polishing operations using a lapping technique.

In certain lapping machines, fixed abrasive articles disposed over the working surfaces of the platens have been used to reduce maintenance costs and the accompanying unproductive time associated with periodic dressing of the platens to the necessary degree of flatness and coplanarity. In use, a workpiece is disposed within an aperture of the lapping carrier, the platens are brought together to exert a predetermined pressure upon the workpiece, and the lapping carrier and workpiece are rotated, thus planarizing, polishing, and/or thinning the surface(s) of the workpiece.

SUMMARY

During the lapping processes, flexing of the lapping carrier may cause it to contact the fixed abrasive article(s). If the lapping carrier is made of a durable material such as, for example, steel, such contact between the lapping carrier and the fixed abrasive article typically results in premature wear of the fixed abrasive article. Despite the above-mentioned publications, there remains a need for technical improvement in reducing premature wear of the fixed abrasive articles.

In one aspect, the present disclosure provides, a lapping carrier comprising: a base having first and second opposed major surfaces and at least one aperture extending from the first major surface to the second major surface; and a first wear layer disposed on the first major surface of the base, the wear layer comprising: a first outer polymer layer secured to the base, wherein the first outer polymer layer has a first exposed major surface, and wherein the first outer polymer layer comprises at least one of polyether ether ketone or ultrahigh molecular weight polyethylene; and a first adhesive layer disposed between the first outer polymer layer and the base.

In some embodiments, the lapping carrier further comprises: a second wear layer disposed on the second major surface of the base, the wear layer comprising: a second outer polymer layer secured to the base, wherein the second outer polymer layer has a second exposed major surface, and wherein the second outer polymer layer comprises at least one of polyether ether ketone or ultrahigh molecular weight polyethylene; and a second adhesive layer disposed between the first outer polymer layer and the base.

Advantageously, lapping carriers according to the present disclosure may exhibit wear characteristics during lapping-type abrading processes that are comparable or superior to those of commercial lapping carriers.

Lapping carriers according to the present disclosure are useful for lapping a workpiece. Accordingly, in another aspect, the present disclosure provides a method of lapping comprising: placing a workpiece in the at least one aperture of a lapping carrier according to the present disclosure; placing the lapping carrier into a lapping machine having at least one lapping surface; and providing relative motion between the workpiece and the at least one lapping surface thereby abrading the workpiece.

The features and advantages of the present disclosure will be further understood upon consideration of the detailed description as well as the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS



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Previous Patent Application:
Polishing pad with aperture
Next Patent Application:
Polishing pad, polishing method and polishing system
Industry Class:
Abrading
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Key IP Translations - Patent Translations


stats Patent Info
Application #
US 20130017765 A1
Publish Date
01/17/2013
Document #
13489132
File Date
06/05/2012
USPTO Class
451 36
Other USPTO Classes
451364, 451 28
International Class
/
Drawings
2


Ethylene
Ketone
Molecular
Polymer


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