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Method and apparatus for determining a measure of a thickness of a polishing pad of a polishing machine




Title: Method and apparatus for determining a measure of a thickness of a polishing pad of a polishing machine.
Abstract: An apparatus for determining a measure of a thickness of a polishing pad of a polishing machine includes a detector and a determiner. The detector is configured to detect a position of a carrier of an element to be polished in a pressing direction while the element is pressed by the carrier in the pressing direction against the polishing pad with a defined pressure. The detector is further configured to output a signal indicative of the position of the carrier. The determiner is configured to determine the measure of the thickness of the polishing pad based on the signal indicative of the position of the carrier. ...


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USPTO Applicaton #: #20130017762
Inventors: Christian Thaldorf, Sven Hildebrandt


The Patent Description & Claims data below is from USPTO Patent Application 20130017762, Method and apparatus for determining a measure of a thickness of a polishing pad of a polishing machine.




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stats Patent Info
Application #
US 20130017762 A1
Publish Date
01/17/2013
Document #
13184338
File Date
07/15/2011
USPTO Class
451/5
Other USPTO Classes
International Class
24B49/00
Drawings
9




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Abrading   Precision Device Or Process - Or With Condition Responsive Control   Computer Controlled  

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20130117|20130017762|determining a measure of a thickness of a polishing pad of a polishing machine|An apparatus for determining a measure of a thickness of a polishing pad of a polishing machine includes a detector and a determiner. The detector is configured to detect a position of a carrier of an element to be polished in a pressing direction while the element is pressed by |Infineon-Technologies-Ag
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