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Polishing pad and method of making the same

Title: Polishing pad and method of making the same.
Abstract: The disclosure is directed to polishing pads with porous polishing layers, methods of making such polishing pads, and methods of using such pads in a polishing process. The polishing pad includes a compliant layer having first and second opposing sides and a porous polishing layer disposed on the first side of the compliant layer. The porous polishing layer includes a crosslinked network comprising a thermally cured component and a radiation cured component, wherein the radiation cured component and the thermally cured component are covalently bonded in the crosslinked network. The porous polishing layer also includes polymer particles dispersed within the crosslinked network, wherein the polymer particles comprise at least one of thermoplastic polymers or thermoset polymers. The porous polishing layer typically also includes closed cell pores dispersed within the crosslinked network. ...
USPTO Applicaton #: #20130012108

The Patent Description & Claims data below is from USPTO Patent Application 20130012108, Polishing pad and method of making the same.

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Polishing pad and production method therefor, and production method for semiconductor device
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stats Patent Info
Application #
US 20130012108 A1
Publish Date
Document #
File Date
451 59
Other USPTO Classes
451539, 451532, 451529, 51296
International Class

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