newTOP 200 Companies
filing patents this week

stats FreshPatents Stats
 1  views for this patent on
2013: 1 views

Advertise Here
Promote your product, service and ideas.

    Free Services  

  • Enter keywords & we'll notify you when a new patent matches your request (weekly update).

  • Save & organize patents so you can view them later.

  • View the last few months of your Keyword emails.

  • Patents sorted by company.

Follow us on Twitter
twitter icon@FreshPatents

Browse patents:
Next →
← Previous

Polishing slurry and polishing method therefor

last patentdownload pdfdownload imgimage previewnext patent

20130012102 patent thumbnailZoom

Polishing slurry and polishing method therefor

The present invention provides a polishing technique which enables polishing of silicon carbide, which is difficult to be polished, with high efficiency and high surface accuracy. The present invention relates to a polishing slurry for polishing a substrate, which comprises abrasive particles containing manganese oxide as a main component and in which the content of the abrasive particles is less than 10% by weight based on the polishing slurry. The polishing slurry of the present invention has a pH of preferably 7 or more. It is particularly preferable to use manganese...
Related Terms: Manganese Manganese Dioxide Silicon Silicon Carbide

USPTO Applicaton #: #20130012102

view organizer monitor keywords

The Patent Description & Claims data below is from USPTO Patent Application 20130012102, Polishing slurry and polishing method therefor.

last patentpdficondownload pdfimage previewnext patent

← Previous       Next → Advertise on - Rates & Info

You can also Monitor Keywords and Search for tracking patents relating to this Polishing slurry and polishing method therefor patent application.
monitor keywords

Keyword Monitor How KEYWORD MONITOR works... a FREE service from FreshPatents
1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored.
3. Each week you receive an email with patent applications related to your keywords.  
Start now! - Receive info on patent apps like Polishing slurry and polishing method therefor or other areas of interest.

Previous Patent Application:
Cushioning underwire assembly and underwire bra with the same
Next Patent Application:
Mobile cleaning and blasting cubicle
Industry Class:
Thank you for viewing the Polishing slurry and polishing method therefor patent info.
- - -

Results in 0.06541 seconds

Other interesting categories:
Nokia , SAP , Intel , NIKE ,


Data source: patent applications published in the public domain by the United States Patent and Trademark Office (USPTO). Information published here is for research/educational purposes only. FreshPatents is not affiliated with the USPTO, assignee companies, inventors, law firms or other assignees. Patent applications, documents and images may contain trademarks of the respective companies/authors. FreshPatents is not responsible for the accuracy, validity or otherwise contents of these public document patent application filings. When possible a complete PDF is provided, however, in some cases the presented document/images is an abstract or sampling of the full patent application for display purposes. Terms/Support
Next →
← Previous

stats Patent Info
Application #
US 20130012102 A1
Publish Date
Document #
File Date
451 36
Other USPTO Classes
International Class

Your Message Here(14K)

Manganese Dioxide
Silicon Carbide

Follow us on Twitter
twitter icon@FreshPatents

Abrading   Abrading Process   Utilizing Fluent Abradant  

Browse patents:
Next →
← Previous