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Method of polishing a workpiece with an abrasive segment comprising abrasive aggregates having silicon carbide particles

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20130005221 patent thumbnailZoom

Method of polishing a workpiece with an abrasive segment comprising abrasive aggregates having silicon carbide particles


A method of polishing a workpiece can include placing a workpiece on a support structure. In an embodiment, the method can also include contacting the workpiece with an abrasive segment. The abrasive segment can include a plurality of abrasive aggregates that include silicon carbide particles bound together in a binder material. Additionally, the method can include moving the abrasive segment and the workpiece relative to each other.
Related Terms: Gates Silicon Binder Material Silicon Carbide

Inventors: Guan Wang, Yves Boussant-Roux
USPTO Applicaton #: #20130005221 - Class: 451 41 (USPTO) - 01/03/13 - Class 451 
Abrading > Abrading Process >Glass Or Stone Abrading

Inventors:

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The Patent Description & Claims data below is from USPTO Patent Application 20130005221, Method of polishing a workpiece with an abrasive segment comprising abrasive aggregates having silicon carbide particles.

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PRIORITY CLAIM AND CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to U.S. Provisional Patent Application No. 61/503,463 filed on Jun. 30, 2011, and entitled “A Method of Polishing a Workpiece with an Abrasive Segment Comprising Silicon Carbide Abrasive Aggregates,” and naming Guan Wang et al. as inventors, which is incorporated by reference herein in its entirety. This application also claims priority to U.S. Provisional Application No. 61/529,059 filed on Aug. 30, 2011, and entitled “A Method of Polishing a Workpiece with an Abrasive Segment Comprising Silicon Carbide Abrasive Aggregates,” and naming Guan Wang et al. as inventors, which is also incorporated by reference herein in its entirety.

BACKGROUND

1. Field of the Disclosure

This disclosure, in general, relates to polishing a workpiece. More particularly, the disclosure relates to polishing a workpiece with an abrasive segment that includes abrasive aggregates having silicon carbide particles.

2. Description of the Related Art

Abrasive articles, such as coated abrasives and bonded abrasives, are used in various industries to machine workpieces, such as by, grinding, or polishing. Machining utilizing abrasive articles spans a wide industrial scope from optics industries, automotive paint repair industries, to metal fabrication industries. In each of these examples, manufacturing facilities use abrasives to remove bulk material or affect surface characteristics of products.

For example, abrasive articles, such as abrasive segments may be used when polishing or finishing certain various types of workpieces, including, for example, metal, wood, or stone. In particular instances, abrasive segments containing abrasive grit contained within a binder material may be used to effectively finish stone. However, the industry continues to demand improvements in abrasive technologies.

SUMMARY

In one aspect, the disclosure is directed to a method of polishing a workpiece. The method can include placing a workpiece on a support structure. In an embodiment, the method can also include contacting the workpiece with an abrasive segment. The abrasive segment can include a plurality of abrasive aggregates that include silicon carbide particles bound together in a binder material. Additionally, the method can include moving the abrasive segment and the workpiece relative to each other.

The above and other features described herein including various details of construction and combinations of parts, and other advantages, will now be more particularly described with reference to the accompanying drawings and pointed out in the claims. It will be understood that the particular method and article embody certain features that are shown by way of illustration and not as limitations and that the principles and features described herein may be employed in various and numerous embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure may be better understood, and its numerous features and advantages made apparent to those skilled in the art by referencing the accompanying drawings.

FIG. 1 includes a diagram of a system to make abrasive aggregates including silicon carbide in accordance with an embodiment.

FIG. 2 includes a first scanning electron microscope (SEM) image of a portion of an abrasive aggregate including silicon carbide in accordance with an embodiment.

FIG. 3 includes a second SEM image of a portion of an abrasive aggregate including silicon carbide in accordance with an embodiment.

FIG. 4 includes a third SEM image of a portion of an abrasive aggregate including silicon carbide in accordance with an embodiment.

FIG. 5 includes a fourth SEM image of a portion of an abrasive aggregate including silicon carbide in accordance with an embodiment.

FIG. 6 includes a fifth SEM image of a portion of an abrasive aggregate including silicon carbide in accordance with an embodiment.

FIG. 7 includes a flow chart illustrating a method of making an abrasive segment in accordance with an embodiment.

FIG. 8 includes a front plan view of an abrasive segment in accordance with a first embodiment.

FIG. 9 includes a side plan view of the abrasive segment of FIG. 8 in accordance with the first embodiment.

FIG. 10 includes a front plan view of an abrasive segment in accordance with a second embodiment.

FIG. 11 includes a side plan view of the second embodiment of the abrasive segment in accordance with an embodiment of FIG. 10.

FIG. 12 includes a first SEM image of a portion of an abrasive segment in accordance with an embodiment.

FIG. 13 includes a second SEM image of a portion of an abrasive a segment in accordance with an embodiment.

FIG. 14 includes a flow chart illustrating a method of polishing a workpiece in accordance with an embodiment.

FIG. 15 includes a bar chart illustrating weight loss and surface roughness of a workpiece after conducting a polishing process in accordance with an embodiment.

FIG. 16 includes a bar chart illustrating weight loss and surface roughness of a workpiece after conducting a polishing process in accordance with an embodiment.

FIG. 17 includes a bar chart illustrating weight loss and surface roughness of a workpiece after conducting a polishing process in accordance with an embodiment.

FIG. 18 includes a first SEM image for a used abrasive segment containing abrasive grits.

FIG. 19 includes a second SEM image for a used abrasive segment containing abrasive aggregates in accordance with an embodiment.

DETAILED DESCRIPTION

Referring initially to FIG. 1, a method of making abrasive aggregates is shown and is generally designated 100. The method 100 commences at 102 by forming a mixture of silicon carbide particles and a binder material in a mixer. In a particular aspect, the mixer may be a paddle mixer. The paddle mixer may include a high shear Eirich mixer or a Rippon mixer. At 102, the silicon carbide particles and the binder material can be dry mixed in order to form a dry mixture and can be mixed to uniformly disperse the components relative to each other.

In a particular aspect, the silicon carbide particles and the binder material may be mixed for at least about 2 minutes. In another aspect, the silicon carbide particles and the binder material may be mixed for at least about 3 minutes, such as at least about 4 minutes, or even at least about 5 minutes. In another aspect, the silicon carbide particles and the binder material may be mixed for no greater than about 30 minutes, such as no greater than about 25 minutes, no greater than about 20 minutes, or even no greater than about 15 minutes. It will be appreciated that the mixing time can be within a range between any of the minimum and maximum times noted above.

In a particular aspect, the silicon carbide particles can include silicon carbide particles having an average primary particle size of at least about 0.5 microns. In another aspect, the silicon carbide particles can include silicon carbide particles having an average primary particle size of at least about 1 micron, at least about 10 microns, at least about 20 microns, at least about 30 microns, at least about 40 microns, or even at least about 50 microns. In another aspect, the silicon carbide particles can include silicon carbide particles having an average primary particle size of no greater than about 1500 microns, such as no greater than about 1200 microns, no greater than about 1000 microns, no greater than about 500 microns, no greater than about 300 microns, or even no greater than about 100 microns. It will be appreciated that the average particle size of the silicon carbide particles can be within a range between any of the minimum and maximum dimensions noted above.

In another particular aspect, the binder material can include a frit material which is suitable for forming an amorphous material (i.e., a glass material) after further processing. Further, the frit material may include an oxide. The oxide may include a silicate. Moreover, the oxide may include an alkali material, an alkaline earth material, or a combination thereof. In another aspect at least a portion of the oxide may include sodium. Further, the oxide may consist essentially of a sodium silicate.

In some instances, the dry mixture can include at least about 0.5 wt % of a frit material for a total weight of the dry mixture, at least about 3 wt % of a frit material for a total weight of the dry mixture, or at least about 5 wt % of a frit material for a total weight of the dry mixture. In other situations, the dry mixture can include no greater than about 15 wt % of a frit material for a total weight of the dry mixture, no greater than about 10 wt % of a frit material for a total weight of the dry mixture, or no greater than about 7 wt % of a frit material for a total weight of the dry mixture. It will be appreciated that the amount of frit material can be within a range between any of the minimum and maximum percentages noted above.

In one embodiment, the binder material can also include an organic material. For example, the binder material can include a polymeric component. In a particular illustrative embodiment, the organic material can include dextrin.

In an embodiment, the dry mixture can include at least about 0.5 wt % of an organic material for a total weight of the dry mixture, at least about 3 wt % of an organic material for a total weight of the dry mixture, or at least about 5 wt % of an organic material for a total weight of the dry mixture. In other situations, the dry mixture can include no greater than about 15 wt % of an organic material for a total weight of the dry mixture, no greater than about 10 wt % of an organic material for a total weight of the dry mixture, or no greater than about 7 wt % of an organic material for a total weight of the dry mixture. It will be appreciated that the amount of organic material can be within a range between any of the minimum and maximum percentages noted above.

In another aspect, the binder material may also include an inorganic mineral component, such as clay, which may be a crystalline material. The inorganic mineral component may include an oxide or a hydroxide. Further, the inorganic mineral component may include an alkali material, an alkaline earth material, alumina, silica, or a combination thereof. In a particular aspect, the inorganic mineral component may include a silicate. Further, the inorganic mineral component may include an alumina silicate. In another aspect, the inorganic mineral component can include an aluminum silicate hydroxide, which may be referred to as a kaolin clay. Further, the inorganic mineral component may consist essentially of a kaolin clay.

In a particular aspect, the binder material can include at least about 50 wt % sodium silicate for the total weight of the binder material. For example, the binder material can include, at least about 60 wt % sodium silicate, or even at least about 70 wt % sodium silicate. In another aspect, the binder material may include no greater than about 100 wt % sodium silicate, such as no greater than about 90 wt % sodium silicate, or even no greater than about 75 wt % sodium silicate. It will be appreciated that the amount of sodium silicate can be within a range between any of the minimum and maximum percentages noted above.

In another particular aspect, the binder material can include at least about 50 wt % aluminum silicate hydroxide for the total weight of the binder material, such as at least about 60 wt % aluminum silicate hydroxide, or even at least about 70 wt % aluminum silicate hydroxide. In yet another aspect, the binder material may include no greater than about 100 wt % aluminum silicate hydroxide, such as no greater than about 90 wt % aluminum silicate hydroxide, or even no greater than about 75 wt % aluminum silicate hydroxide. It will be appreciated that the amount of aluminum silicate hydroxide can be within a range between any of the minimum and maximum percentages noted above.

Moving to 104, a liquid carrier may be added to the dry mixture within the mixer. Thereafter, the liquid carrier and the dry mixture may be mixed to form a wet mixture that includes silicon carbide particles, the binder material, and the liquid carrier.

In a particular aspect, the liquid carrier may be aqueous. Further, in a particular aspect, the ratio of dry mixture to liquid carrier may be at least about 15:1, such as at least about 17:1, at least about 18:1, or even at least about 19:1. Moreover, in another aspect, the ratio of dry mixture to liquid carrier may be no greater than about 30:1, such as no greater than about 25:1, or even no greater than about 20:1. It will be appreciated that the ratio of dry mixture to liquid carrier can within a range between any of the minimum and maximum ratios noted above.

In an embodiment, the wet mixture can include at least about 0.5 wt % of a liquid carrier for a total weight of the wet mixture, at least about 3 wt % of a liquid carrier for a total weight of the wet mixture, or at least about 5 wt % of a liquid carrier for a total weight of the wet mixture. In other cases, the wet mixture can include no greater than about 18 wt % of a liquid carrier for a total weight of the wet mixture, no greater than about 12 wt % of a liquid carrier for a total weight of the wet mixture, or no greater than about 9 wt % of a liquid carrier for a total weight of the wet mixture. It will be appreciated that the amount of the liquid carrier can within a range between any of the minimum and maximum ratios noted above.

In another particular aspect, the dry mixture and the liquid carrier may be mixed for at least about 2 minutes, such as at least about 3 minutes, at least about 4 minutes, or even at least about 5 minutes. In another aspect, the dry mixture and the liquid carrier may be mixed for no greater than about 30 minutes, such as no greater than about 25 minutes, no greater than about 20 minutes, or even no greater than about 15 minutes. It will be appreciated that the mixing time of the dry mixture and the liquid carrier can be within a range between any of the minimum and maximum times noted above. In a particular illustrative embodiment, the dry mixture and the liquid carrier may be mixed for a duration within a range of about 4 minutes to about 12 minutes.

At 106, the method 100 may include shaping the wet mixture to form green granules. In a particular aspect, the wet mixture may be shaped into green granules by screening, pressing, sieving, extruding, segmenting, casting, stamping, cutting, or a combination thereof. In particular, the wet mixture may be shaped into the green granules by pushing, or otherwise moving, the wet mixture through a screen. In an illustrative embodiment, a vibratory screening machine can be utilized to carry out the shaping operation.

In a particular aspect, the screen can include a US mesh size of at least about 8, such as at least about 10, such as at least about 12, or even at least about 14. In another aspect, the screen can include a US mesh size no greater than about 25, such as no greater than about 20, no greater than about 18, or even no greater than about 16. It will be appreciated that the screen size can include a range between any of the minimum and maximum values noted above.

After forming the green granules, at 108, the green granules may be placed on a platen. For example, the green granules may fall through a hopper onto the platen. In a particular aspect, the platen may include a vibratory hot table that is vibrated and heated. The heated and vibrated platen may serve to stabilize the green granules.



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stats Patent Info
Application #
US 20130005221 A1
Publish Date
01/03/2013
Document #
13539172
File Date
06/29/2012
USPTO Class
451 41
Other USPTO Classes
451 28
International Class
/
Drawings
16


Gates
Silicon
Binder Material
Silicon Carbide


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