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Heat sink

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Heat sink


A heat sink provided. In the heat sink in accordance with an embodiment of the present invention, a heat dissipation plate forms a channel between each of stages by isolating a plurality of heat dissipating fins in equal intervals and arranging the heat dissipating fins in a multi-stage circle shape. Then, the heat sink forms a path between the sequentially isolated heat dissipating fins at each of the stages. Also, a centrifugal fan alternatively blocks the channel and path at each of the stages through a rotation by a plurality of blades arranged in a multi-stage circle shape to be positioned between the channels. Then, the centrifugal fan is capable of inflowing outer air to discharge the air by generating a pressure difference of inter/outer air through a combination of the blade and the heat dissipation plate.
Related Terms: Centrifugal Fan

Browse recent Korea Advanced Institute Of Science And Technology patents - Yuseong-gu, Daejeon, KR
Inventors: Sung Jin Kim, Juwan Kim, Dong-Kwon Kim
USPTO Applicaton #: #20120305224 - Class: 16510434 (USPTO) - 12/06/12 - Class 165 
Heat Exchange > Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat >Including Means To Move Gaseous Heat Exchange Material

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The Patent Description & Claims data below is from USPTO Patent Application 20120305224, Heat sink.

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BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to heat sinks. More particularly, the invention relates to a heat sink for enhancing cooling efficiency due to the improvement of air flow generated by splitting zones of heat dissipation fins, which are configured with a multi-stage concentric circle shape after the heat dissipation fins and blades are arranged in a multi-stage circle shape and mutually combined.

2. Description of the Related Art

Due to the current trend toward highly integration, highly efficiency, miniaturization of semiconductor chips, packages, and the like, electronic components become highly efficient rapidly. Accordingly, there have been various attempts to maintain efficiency of electronic components by efficiently and rapidly discharging heat generated while operating the electronic components. This heat discharging is associated with the development in the electronic components.

Particularly, as the capacity of CPUs and peripheral electronic elements become relatively large, heat amount is extremely increased.

To stably secure functions of electronic components, cooling means have been adopted.

To solve the aforementioned problems in the prior art, Korean Laid-Open Patent Publication No. 2004-52010 entitled “Apparatus for cooling electronic chip” that was previously proposed discloses a terminal base transfers the heat by directly contacting to a heated element such as a CPU. Heat pipes are soldered to an upper part of the terminal base. Heat radiating blocks are soldered to an end of the heat pipe. A fan motor supplies a cooling fluid to the heat radiating block by placing to a center of the heat radiating block. A base frame fixes the fan motor and the terminal base. A fan cover efficiently inflows/discharges the cooling fluid by blocking a majority portion excepting the upper center of the part installing the fan motor. The fan cover formed to a lower side of the heat pipe is formed as one body by soldering to the heat pipe. Thus, the heat of the heat pipe is transferred/discharged to the air.

In the above mentioned apparatus, heat generated from heating elements such as CPUs is conducted through the terminal base to the heat pipes, and then moved to the heat radiating blocks that are formed at each of ends of the heat pipes. The heat moved to the heat radiating blocks drive the fan motor and creates a forced convection current to be cooled.

Also, Korean Laid-Open Patent Publication No. 2004-52010 entitled “Apparatus for cooling computer parts and method of manufacturing the same” that was previously proposed discloses The apparatus includes a heat transferring block capable of being thermally coupled to the heat generating parts to conduct the heat generated by the heat dissipating parts, at least one heat pipe, each including a block coupling portion thermally coupled to the heat transferring block and a fin coupling portion formed of a generally curved shape composed essentially of one or more circular arc portions, and a plurality of heat dissipating fins, each having at least one perforation hole. The geometry of the curvature of the entirety of the fin coupling portion is shaped so that the geometry alone would not allow the heat pipe to be inserted through the perforation hole of the heat dissipating fins. The fin coupling portion of the heat pipe passes through each of the at least one perforation hole of the plurality of heat dissipating fins. Each of the heat dissipating fins are spaced apart from one another along the fin coupling portion and positioned to the fin coupling portion.

When heat is transferred to the heat transferring block, it escapes through the air through the heat pipe at parts excepting combination parts with the heat transferring block. As a result, the heat is cooled. The plurality of heat dissipating fins can cool electronic components by passing air flow generated from a cooling fan thereinto and discharging the air flow to the outside in a spiral shape with respect to a rotary shaft of the cooling fan.

However, in the above-mentioned apparatus for cooling, there is a problem in that outer air inflows according to a rotary shaft of a fan employing an axial fan and passes heat dissipating fins to be discharged toward an axial direction, thereby reducing cooling efficiency.

In other words, the temperature of the heat dissipating fins is cooled through the axial fan, which is mounted on upper parts of the heat dissipating fins where the heat generated from heating components such as CPUs is transferred. The upper parts of the heat dissipating fins first face with wind created by the axial fan to be cooled, and then lower parts thereof become cooled sequentially.

In this case, the power of the wind by the axial fan is decreased by interference of the heat dissipating fins, thereby reducing cooling efficiency.

Due to the interference of the heat dissipating fins, the cooling power on the lower parts of the heat dissipating fins positioned at a region close to a CPU is reduced. For this reason, the temperature is high on the lower parts of the heat dissipating fins located at a region close to a CPU. To the contrary, on upper parts of the heat dissipating fins located at a region far from the CPU, the temperature is relatively low. As a result, heat discharging efficiency is reduced.

BRIEF

SUMMARY

OF THE INVENTION

Accordingly, the present invention is to address the above-mentioned problems and/or disadvantages and to offer at least the advantages described below.

An aspect of the present invention is to provide a heat sink. Particularly, one aspect of the present invention is to provide a heat sink for improving inflow and discharging of air by repeatedly splitting each of stages of heat dissipation fins by rotating a centrifugal fan after the centrifugal fan for arranging the heat dissipation fins in a multi-stage concentric circle shape and a heat dissipation plate are mutually combined.

Embodiments of the present invention provide a heat sink comprising: a heat dissipation plate forming a channel between each of stages by isolating a plurality of heat dissipating fins in equal intervals and arranging the heat dissipating fins in a multi-stage circle shape, forming a path between the sequentially isolated heat dissipating fins at each of the stages; and a centrifugal fan alternatively blocking the channel and path at each of the stages through a rotation by a plurality of blades arranged in a multi-stage circle shape to be positioned between the channels, inflowing outer air to discharge the air by generating a pressure difference of inter/outer air through a combination of the blade and the heat dissipation plate.

In some embodiments of the present invention, the heat dissipation plate includes a second flange in which the heat dissipation fins are mounted vertically upward with respect to the second flange, and a motor is set vertically upward on an upper surface of the second flange.

In some embodiments of the present invention, the centrifugal fan prepares a first flange in which the blades are mounted vertically downward with respect to the blade to form an inflow hole and is rendered to be rotated by fixing a rotary shaft of the motor by a connection hole of a combination block after positioning the combination block supported by a rib at a center of the inflow hole.

In some embodiments of the present invention, the path is a space between the sequentially isolated heat dissipation fins at equal intervals and has a virtual arc shape which is radiated outwardly from a center of the second flange under the condition that the heat dissipation fins are arranged in a multi-stage concentric circle shape.

In some embodiments of the present invention, the blades are arranged to be crossed between the channels and paths of each of stages in the heat dissipation plate.

In some embodiments of the present invention, the heat dissipation fins and blades have an incline line on one side thereof, and the incline lines has an angle inside from outside thereof toward a rotational direction of the heat dissipation plate.

Other aspects, advantages, and salient features of the invention will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses exemplary embodiments of the invention.

ADVANTAGEOUS EFFECTS

As above mentioned, a heat sink according to the present invention, after the centrifugal fan for arranging heat dissipation fins in a multi-stage concentric circle shape and a heat dissipation plate are mutually combined, repeatedly splits each of stages of heat dissipation fins by rotating a centrifugal fan to generate an internal/external pressure difference of the heat sink, so that external air flow is increased, thereby improving cooling efficiency.

Furthermore, the heat sink according to the present invention is formed by superimposing the centrifugal fan and dissipation plate, thereby minimizing a volume. As a result, the miniaturization of products is possible.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded, perspective view illustrating a heat sink in accordance with an embodiment of the present invention.

FIG. 2 is a perspective view illustrating a heat sink in accordance with an embodiment of the present invention.

FIG. 3 is a side sectional view illustrating a heat sink in accordance with an embodiment of the present invention.

FIG. 4 is a front view illustrating a heat dissipation plate of a heat sink in accordance with an embodiment of the present invention.

FIG. 5 is a front view illustrating a centrifugal fan of a heat sink in accordance with an embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating a heat sink in accordance with an embodiment of the present invention.

FIG. 7 is a photograph showing an experimental test of a heat sink in accordance with an embodiment of the present invention.

<Brief explanation of essential parts of the drawings>

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Previous Patent Application:
Thin heat pipe structure and manufacturing method thereof
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stats Patent Info
Application #
US 20120305224 A1
Publish Date
12/06/2012
Document #
13513507
File Date
12/02/2009
USPTO Class
16510434
Other USPTO Classes
International Class
28D15/00
Drawings
8


Centrifugal Fan


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