This application claims the priority benefit of Taiwan patent application number 100119071 filed on May 31, 2011.
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OF THE INVENTION
1. Field of the Invention
The present invention relates to a thin heat pipe structure and a manufacturing method thereof. By means of the manufacturing method, the heat pipe structure can be made with a thin configuration and enhanced heat transfer efficiency. In addition, in the manufacturing process, the ratio of good products is increased.
2. Description of the Related Art
A heat pipe has heat conductivity several times to several tens times that of copper, aluminum or the like. Therefore, the heat pipe has excellent performance and serves as a cooling component applied to various electronic devices. As to the configuration, the conventional heat pipes can be classified into heat pipes in the form of circular tubes and heat pipes in the form of flat plates. For cooling an electronic component such as a CPU, preferably a flat-plate heat pipe is used in view of easy installation and larger contact area. To catch up the trend toward miniaturization of cooling mechanism, the heat pipe has become thinner and thinner in adaptation to the cooling mechanism.
The heat pipe is formed with an internal space as a flow path for the working fluid contained in the heat pipe. The working fluid is converted between liquid phase and vapor phase through evaporation and condensation and is transferable within the heat pipe for transferring heat. The heat pipe is formed with sealed voids in which the working fluid is contained. The working fluid is phase-changeable and transferable to transfer heat.
The heat pipe is used as a heat conduction member. The heat pipe is fitted through a radiating fin assembly. The working fluid with low boiling point is filled in the heat pipe. The working fluid absorbs heat from a heat-generating electronic component (at the evaporation end) and evaporates into vapor. The vapor goes to the radiating fin assembly and transfers the heat to the radiating fin assembly (at the condensation end). A cooling fan then carries away the heat to dissipate the heat generated by the electronic component.
The heat pipe is manufactured in such a manner that metal powder is filled into a hollow tubular body and sintered to form a capillary structure layer on the inner wall face of the tubular body. Then the tubular body is vacuumed and filled with the working fluid and then sealed. On the demand of the electronic equipment for slim configuration, the heat pipe must be made with a thin configuration.
In the conventional technique, a hollow tubular body is pressed into a flat-plate form. Then the sintered capillary body is disposed into the hollow tubular body. Then the hollow tubular body is vacuumed and filled with the working fluid. Finally, the hollow tubular body is sealed. According to such process, the heat pipe can be made with a flat configuration. However, when bending or shaping the heat pipe, the internal sintered capillary body will crack apart or detach from the tubular body. In this case, the heat pipe will become a defective product.
Alternatively, when manufacturing the thin heat pipe, the powder is first filled into the heat pipe and then sintered. Then the heat pipe is flattened. Then the heat pipe is filled with the working fluid and sealed. Alternatively, the tubular body of the heat pipe is first pressed and flattened and then the powder is filled into the tubular body and sintered. However, the internal chamber of the tubular body is extremely narrow. Therefore, it is quite hard to fill the powder into the tubular body. Moreover, the capillary structure in the heat pipe needs to provide capillary attraction for transferring the working fluid on one hand and support the tubular body on the other hand. The support effect is quite limited in such a narrow space.
Furthermore, the vapor passageways in the heat pipe are so narrow that an effective vapor/liquid circulation can be hardly achieved. Therefore, the conventional thin heat pipe and the manufacturing method thereof have many defects.
According to the above, the conventional technique has the following shortcomings:
1. It is hard to process and manufacture the thin heat pipe.
2. The capillary structure in the heat pipe is subject to damage.
3. The manufacturing cost is higher.
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OF THE INVENTION
A primary object of the present invention is to provide a thin heat pipe structure having a thin configuration and enhanced heat transfer efficiency.
A further object of the present invention is to provide a manufacturing method of the above thin heat pipe structure.
To achieve the above and other objects, the thin heat pipe structure of the present invention includes a tubular body and a support body.
The tubular body has at least one receiving space and a first closed end and a second closed end in communication with the receiving space. A working fluid is contained in the receiving space. The support body is disposed in the receiving space to partition the receiving space into a first chamber and a second chamber. The first and second chambers axially extend through the tubular body.
The manufacturing method of the thin heat pipe structure of the present invention includes steps of: preparing a tubular body and a support body; placing the support body into the tubular body; pressing the tubular body into a flat form; vacuuming the tubular body and filling a working fluid into the tubular body; and sealing the tubular body.
By means of the manufacturing method of the present invention, the heat pipe structure can be made with a thin configuration and greatly enhanced heat transfer efficiency.
BRIEF DESCRIPTION OF THE DRAWINGS
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The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
FIG. 1a is a perspective exploded view of a first embodiment of the thin heat pipe structure of the present invention;
FIG. 1b is a perspective assembled view of the first embodiment of the thin heat pipe structure of the present invention;
FIG. 2a is a perspective view of the support body of the first embodiment of the thin heat pipe structure of the present invention in a first aspect;
FIG. 2b is a perspective view of the support body of the first embodiment of the thin heat pipe structure of the present invention in a second aspect;
FIG. 2c is a perspective view of the support body of the first embodiment of the thin heat pipe structure of the present invention in a third aspect;
FIG. 3 is a sectional view of the tubular body of a second embodiment of the thin heat pipe structure of the present invention;
FIG. 4 is a sectional view of the tubular body of a third embodiment of the thin heat pipe structure of the present invention;