FreshPatents.com Logo
stats FreshPatents Stats
n/a views for this patent on FreshPatents.com
Updated: April 21 2014
newTOP 200 Companies filing patents this week


    Free Services  

  • MONITOR KEYWORDS
  • Enter keywords & we'll notify you when a new patent matches your request (weekly update).

  • ORGANIZER
  • Save & organize patents so you can view them later.

  • RSS rss
  • Create custom RSS feeds. Track keywords without receiving email.

  • ARCHIVE
  • View the last few months of your Keyword emails.

  • COMPANY DIRECTORY
  • Patents sorted by company.

AdPromo(14K)

Follow us on Twitter
twitter icon@FreshPatents

Thin heat pipe structure and manufacturing method thereof

last patentdownload pdfdownload imgimage previewnext patent


20120305223 patent thumbnailZoom

Thin heat pipe structure and manufacturing method thereof


A thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a support body. The tubular body has at least one receiving space in which a working fluid is contained. The support body is disposed in the receiving space to partition the receiving space into a first chamber and a second chamber. By means of the manufacturing method of the thin heat pipe structure, the thin heat pipe structure can be made with greatly enhanced heat transfer efficiency. In addition, in the manufacturing process, the ratio of good products is increased to lower the manufacturing cost.

Browse recent Asia Vital Components Co., Ltd. patents - New Taipei City, TW
Inventors: Hsiu-Wei Yang, Ming-Tai Weng
USPTO Applicaton #: #20120305223 - Class: 16510426 (USPTO) - 12/06/12 - Class 165 
Heat Exchange > Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat >Liquid Fluent Heat Exchange Material >Utilizing Change Of State >Utilizing Capillary Attraction

view organizer monitor keywords


The Patent Description & Claims data below is from USPTO Patent Application 20120305223, Thin heat pipe structure and manufacturing method thereof.

last patentpdficondownload pdfimage previewnext patent

This application claims the priority benefit of Taiwan patent application number 100119071 filed on May 31, 2011.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a thin heat pipe structure and a manufacturing method thereof. By means of the manufacturing method, the heat pipe structure can be made with a thin configuration and enhanced heat transfer efficiency. In addition, in the manufacturing process, the ratio of good products is increased.

2. Description of the Related Art

A heat pipe has heat conductivity several times to several tens times that of copper, aluminum or the like. Therefore, the heat pipe has excellent performance and serves as a cooling component applied to various electronic devices. As to the configuration, the conventional heat pipes can be classified into heat pipes in the form of circular tubes and heat pipes in the form of flat plates. For cooling an electronic component such as a CPU, preferably a flat-plate heat pipe is used in view of easy installation and larger contact area. To catch up the trend toward miniaturization of cooling mechanism, the heat pipe has become thinner and thinner in adaptation to the cooling mechanism.

The heat pipe is formed with an internal space as a flow path for the working fluid contained in the heat pipe. The working fluid is converted between liquid phase and vapor phase through evaporation and condensation and is transferable within the heat pipe for transferring heat. The heat pipe is formed with sealed voids in which the working fluid is contained. The working fluid is phase-changeable and transferable to transfer heat.

The heat pipe is used as a heat conduction member. The heat pipe is fitted through a radiating fin assembly. The working fluid with low boiling point is filled in the heat pipe. The working fluid absorbs heat from a heat-generating electronic component (at the evaporation end) and evaporates into vapor. The vapor goes to the radiating fin assembly and transfers the heat to the radiating fin assembly (at the condensation end). A cooling fan then carries away the heat to dissipate the heat generated by the electronic component.

The heat pipe is manufactured in such a manner that metal powder is filled into a hollow tubular body and sintered to form a capillary structure layer on the inner wall face of the tubular body. Then the tubular body is vacuumed and filled with the working fluid and then sealed. On the demand of the electronic equipment for slim configuration, the heat pipe must be made with a thin configuration.

In the conventional technique, a hollow tubular body is pressed into a flat-plate form. Then the sintered capillary body is disposed into the hollow tubular body. Then the hollow tubular body is vacuumed and filled with the working fluid. Finally, the hollow tubular body is sealed. According to such process, the heat pipe can be made with a flat configuration. However, when bending or shaping the heat pipe, the internal sintered capillary body will crack apart or detach from the tubular body. In this case, the heat pipe will become a defective product.

Alternatively, when manufacturing the thin heat pipe, the powder is first filled into the heat pipe and then sintered. Then the heat pipe is flattened. Then the heat pipe is filled with the working fluid and sealed. Alternatively, the tubular body of the heat pipe is first pressed and flattened and then the powder is filled into the tubular body and sintered. However, the internal chamber of the tubular body is extremely narrow. Therefore, it is quite hard to fill the powder into the tubular body. Moreover, the capillary structure in the heat pipe needs to provide capillary attraction for transferring the working fluid on one hand and support the tubular body on the other hand. The support effect is quite limited in such a narrow space.

Furthermore, the vapor passageways in the heat pipe are so narrow that an effective vapor/liquid circulation can be hardly achieved. Therefore, the conventional thin heat pipe and the manufacturing method thereof have many defects.

According to the above, the conventional technique has the following shortcomings:

1. It is hard to process and manufacture the thin heat pipe. 2. The capillary structure in the heat pipe is subject to damage. 3. The manufacturing cost is higher.

SUMMARY

OF THE INVENTION

A primary object of the present invention is to provide a thin heat pipe structure having a thin configuration and enhanced heat transfer efficiency.

A further object of the present invention is to provide a manufacturing method of the above thin heat pipe structure.

To achieve the above and other objects, the thin heat pipe structure of the present invention includes a tubular body and a support body.

The tubular body has at least one receiving space and a first closed end and a second closed end in communication with the receiving space. A working fluid is contained in the receiving space. The support body is disposed in the receiving space to partition the receiving space into a first chamber and a second chamber. The first and second chambers axially extend through the tubular body.

The manufacturing method of the thin heat pipe structure of the present invention includes steps of: preparing a tubular body and a support body; placing the support body into the tubular body; pressing the tubular body into a flat form; vacuuming the tubular body and filling a working fluid into the tubular body; and sealing the tubular body.

By means of the manufacturing method of the present invention, the heat pipe structure can be made with a thin configuration and greatly enhanced heat transfer efficiency.



Download full PDF for full patent description/claims.

Advertise on FreshPatents.com - Rates & Info


You can also Monitor Keywords and Search for tracking patents relating to this Thin heat pipe structure and manufacturing method thereof patent application.
###
monitor keywords



Keyword Monitor How KEYWORD MONITOR works... a FREE service from FreshPatents
1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored.
3. Each week you receive an email with patent applications related to your keywords.  
Start now! - Receive info on patent apps like Thin heat pipe structure and manufacturing method thereof or other areas of interest.
###


Previous Patent Application:
Heat spreader structure and manufacturing method thereof
Next Patent Application:
Heat sink
Industry Class:
Heat exchange
Thank you for viewing the Thin heat pipe structure and manufacturing method thereof patent info.
- - - Apple patents, Boeing patents, Google patents, IBM patents, Jabil patents, Coca Cola patents, Motorola patents

Results in 0.58196 seconds


Other interesting Freshpatents.com categories:
Tyco , Unilever , 3m -g2--0.7812
     SHARE
  
           

FreshNews promo


stats Patent Info
Application #
US 20120305223 A1
Publish Date
12/06/2012
Document #
13176754
File Date
07/06/2011
USPTO Class
16510426
Other USPTO Classes
29890032
International Class
/
Drawings
14



Follow us on Twitter
twitter icon@FreshPatents