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Heat sink device and air flow adjusting frame for the same

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Heat sink device and air flow adjusting frame for the same


An air flow adjusting frame for a heat sink device which includes a first fixing plate and a second fixing plate is disclosed. The first fixing plate is fixed to a heat dissipation fin with the second fixing plate pivoted to the first fixing plate. Besides, the second fixing plate is for being fixed to a fan. An air flow angle of the fan is adjusted through the air flow adjusting frame.

Browse recent Micro-star Int'l Co., Ltd. patents - New Taipei, TW
Inventors: Yi-Chieh Lin, Yu-Jing Lin
USPTO Applicaton #: #20120298329 - Class: 165 96 (USPTO) - 11/29/12 - Class 165 
Heat Exchange > With Adjustor For Heat, Or Exchange Material, Flow

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The Patent Description & Claims data below is from USPTO Patent Application 20120298329, Heat sink device and air flow adjusting frame for the same.

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CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 100209674 filed in Taiwan, R.O.C. on May 27, 2011, the entire contents of which are hereby incorporated by reference.

BACKGROUND

1. Technical Field

The disclosure relates to a heat sink device and an air flow adjusting frame thereof, and more particularly to a heat sink device for computer and an air flow adjusting frame thereof.

2. Related Art

In recent years, with the advanced technology, the method of developing and manufacturing electronic devices is well enhanced. Electronic devices is not only heading to the direction of being light in weight and small in size, but also to the direction of having the finest functionality at the same time.

Using computers as an example, with the advanced technology of semiconductors, the volume of the integrated circuit inside the computers is miniaturized. For the purpose of obtaining an integrated circuit capable of dealing with more data, the integrated circuit today is able to contain multiple times more of computing elements than the past integrated circuit with the same size. When the integrated circuit contains more computing elements inside, more thermal energy will be generated during the operation.

Thus, the heat sink modules for removing the heat generated by the computing elements are important. Taking the heat sink modules on display cards as an example, most of the heat sink modules are heat dissipation fins made of metal having high thermal conductivity. The heat dissipation fins are disposed on a computing chip on the display card, to absorb the heat generated by the computing chip. In order to improve the heat dissipation ability of the heat sink module, a fan is further installed on the heat dissipation fins for fan generating forced convection to dissipate the heat of the heat dissipation fin.

However, the fan is generally stacked on the heat dissipation fins, and an air exhaust direction of the fan is always vertical to a circuit board of the display card. Thus, when the air flow generated by the fan blows to the circuit board, the air flow is rebounded back due to the obstruction of the circuit board. The rebounded air flow and the air flow generated by the fan interfere with each other, so that a turbulent flow is generated between the fan and the circuit board. Thus, the heat dissipation ability of the heat sink module is greatly reduced and the operation load of the fan increases. With the increasing operation load, the service life of the fan is shortened.

SUMMARY

The disclosure is a heat sink device and an air flow adjusting frame thereof for preventing the problem that when a conventional fan blows, a turbulent flow is easily generated between the fan and the circuit board resulting in decrease of heat dissipation ability and increase of the load of the fan.

An embodiment discloses a heat sink device, which comprises a heat dissipation fin, an air flow adjusting frame, and a fan. The air flow adjusting frame comprises a first fixing plate and a second fixing plate. The first fixing plate is fixed to the heat dissipation fin, and the second fixing plate is pivoted to the first fixing plate. The fan is fixed to the second fixing plate, and an air flow angle of the fan is adjusted through the air flow adjusting frame.

Another embodiment discloses an air flow adjusting frame for connecting a heat dissipation fin with a fan to change an air flow angle of fan relative to the heat dissipation fin. The air flow adjusting frame comprises a first fixing plate and a second fixing plate. The first fixing plate is fixed to the heat dissipation fin, and the second fixing plate is pivoted to the first fixing plate and is used for fixing the fan.

According to the above heat sink device and the air flow adjusting frame for the same, the fan is enabled to pivot relative to the heat dissipation fin due to the air flow adjusting frame, so as to adjust the air flow angle of the fan. Consequently, the vertical interference of the air flow generated by the fan and the circuit board can be prevented, and the turbulent flow between the fan and the circuit board may also be reduced. Also, the heat dissipation ability of the heat sink is enhanced with the work load of the fan being reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will become more fully understood from the detailed description given herein below for illustration only, and thus are not limitative of the disclosure, and wherein:

FIG. 1 is a schematic structural view of a heat sink device according to an embodiment of the disclosure;

FIG. 2 is a schematic exploded structural view of a heat sink device according to an embodiment of the disclosure;

FIG. 3 is a schematic exploded structural view of an air flow adjusting frame according to an embodiment of the disclosure;

FIG. 4 is a schematic view of an air flow of a heat sink device according to an embodiment of the disclosure;

FIG. 5 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure;

FIG. 6 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure;

FIG. 7 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure; and

FIG. 8 is a schematic structural view of a heat sink device according to anther embodiment of the disclosure.



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stats Patent Info
Application #
US 20120298329 A1
Publish Date
11/29/2012
Document #
13221987
File Date
08/31/2011
USPTO Class
165 96
Other USPTO Classes
International Class
28F7/00
Drawings
9



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