Heat sink device and air flow adjusting frame for the same   

Abstract: An air flow adjusting frame for a heat sink device which includes a first fixing plate and a second fixing plate is disclosed. The first fixing plate is fixed to a heat dissipation fin with the second fixing plate pivoted to the first fixing plate. Besides, the second fixing plate is for being fixed to a fan. An air flow angle of the fan is adjusted through the air flow adjusting frame.

CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 100209674 filed in Taiwan, R.O.C. on May 27, 2011, the entire contents of which are hereby incorporated by reference.

1. Technical Field

The disclosure relates to a heat sink device and an air flow adjusting frame thereof, and more particularly to a heat sink device for computer and an air flow adjusting frame thereof.

2. Related Art

In recent years, with the advanced technology, the method of developing and manufacturing electronic devices is well enhanced. Electronic devices is not only heading to the direction of being light in weight and small in size, but also to the direction of having the finest functionality at the same time.

Using computers as an example, with the advanced technology of semiconductors, the volume of the integrated circuit inside the computers is miniaturized. For the purpose of obtaining an integrated circuit capable of dealing with more data, the integrated circuit today is able to contain multiple times more of computing elements than the past integrated circuit with the same size. When the integrated circuit contains more computing elements inside, more thermal energy will be generated during the operation.

Thus, the heat sink modules for removing the heat generated by the computing elements are important. Taking the heat sink modules on display cards as an example, most of the heat sink modules are heat dissipation fins made of metal having high thermal conductivity. The heat dissipation fins are disposed on a computing chip on the display card, to absorb the heat generated by the computing chip. In order to improve the heat dissipation ability of the heat sink module, a fan is further installed on the heat dissipation fins for fan generating forced convection to dissipate the heat of the heat dissipation fin.

However, the fan is generally stacked on the heat dissipation fins, and an air exhaust direction of the fan is always vertical to a circuit board of the display card. Thus, when the air flow generated by the fan blows to the circuit board, the air flow is rebounded back due to the obstruction of the circuit board. The rebounded air flow and the air flow generated by the fan interfere with each other, so that a turbulent flow is generated between the fan and the circuit board. Thus, the heat dissipation ability of the heat sink module is greatly reduced and the operation load of the fan increases. With the increasing operation load, the service life of the fan is shortened.

SUMMARY

The disclosure is a heat sink device and an air flow adjusting frame thereof for preventing the problem that when a conventional fan blows, a turbulent flow is easily generated between the fan and the circuit board resulting in decrease of heat dissipation ability and increase of the load of the fan.

An embodiment discloses a heat sink device, which comprises a heat dissipation fin, an air flow adjusting frame, and a fan. The air flow adjusting frame comprises a first fixing plate and a second fixing plate. The first fixing plate is fixed to the heat dissipation fin, and the second fixing plate is pivoted to the first fixing plate. The fan is fixed to the second fixing plate, and an air flow angle of the fan is adjusted through the air flow adjusting frame.

Another embodiment discloses an air flow adjusting frame for connecting a heat dissipation fin with a fan to change an air flow angle of fan relative to the heat dissipation fin. The air flow adjusting frame comprises a first fixing plate and a second fixing plate. The first fixing plate is fixed to the heat dissipation fin, and the second fixing plate is pivoted to the first fixing plate and is used for fixing the fan.

According to the above heat sink device and the air flow adjusting frame for the same, the fan is enabled to pivot relative to the heat dissipation fin due to the air flow adjusting frame, so as to adjust the air flow angle of the fan. Consequently, the vertical interference of the air flow generated by the fan and the circuit board can be prevented, and the turbulent flow between the fan and the circuit board may also be reduced. Also, the heat dissipation ability of the heat sink is enhanced with the work load of the fan being reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will become more fully understood from the detailed description given herein below for illustration only, and thus are not limitative of the disclosure, and wherein:

FIG. 1 is a schematic structural view of a heat sink device according to an embodiment of the disclosure;

FIG. 2 is a schematic exploded structural view of a heat sink device according to an embodiment of the disclosure;

FIG. 3 is a schematic exploded structural view of an air flow adjusting frame according to an embodiment of the disclosure;

FIG. 4 is a schematic view of an air flow of a heat sink device according to an embodiment of the disclosure;

FIG. 5 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure;

FIG. 6 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure;

FIG. 7 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure; and

FIG. 8 is a schematic structural view of a heat sink device according to anther embodiment of the disclosure.

DETAILED DESCRIPTION

FIG. 1 is a schematic structural view of a heat sink device according to an embodiment of the disclosure, and FIG. 2 is a schematic exploded structural view of a heat sink device according to an embodiment of the disclosure.

As shown in FIG. 1 and FIG. 2, the heat sink device 10 of this embodiment is used to dissipate heat generated from an electronic device 20. The electronic device 20 is, but not limited to, a graphics card used inside a computer. For example, the electronic device 20 may also be a main board inside the computer. The electronic device 20 comprises a circuit board 22 and a heat source 21 located on the circuit board 22. The heat source 21 may be a computing chip, for example, a central processing unit (CPU) or graphics chip.

The heat sink device 10 of this embodiment comprises a heat dissipation fin 200, two air flow adjusting frames 100 and a fan 300. The heat dissipation fin 200 has a first side 201 facing the heat source 21 and a second side 202 opposite to the first side 201. The fan 300 is disposed on the second side 202 of the heat dissipation fin 200, and the fan 300 has an air outlet 310 and an air inlet 320 opposite to the air outlet 310. In this embodiment, the air outlet 310 faces the heat dissipation fin 200, and the air inlet 320 is opposite to the heat dissipation fin 200. It should be noted that, the position of the air outlet 310 and the air inlet 320 relative to the heat dissipation fin 200 is not intended to limit the disclosure. In some embodiments, the air outlet 310 may be opposite to the heat dissipation fin 200, and the air inlet 320 may face the heat dissipation fin 200.

The air flow adjusting frame 100 of this embodiment is fixed to the heat dissipation fin 200 and the fan 300 respectively for changing an air flow angle of the fan 300 relative to the heat dissipation fin 200. The fan 300 may be pivoted relative to the heat dissipation fin 200 due to the air flow adjusting frame 100, so as to adjust an angle of the air outlet 310 of the fan 300 to the heat dissipation fin 200. Moreover, the pivoting direction of the fan 300 relative to the heat sink fin 200 is parallel to the long side of the electronic device 20, but above pivoting direction of the fan 300 is not intended to limit this disclosure. People skilled in the art can adjust the pivoting direction of the fan 300 relative to the heat dissipation fin 200 according to actual requirements. For example, in embodiments, the pivoting direction of the fan 300 relative to the heat dissipation fin 200 may be parallel to the short side of the electronic device 20, as shown in FIG. 8.

The second side 202 of the heat dissipation fin 200 has a cone-like protruding structure, and the central portion of the second side 202 is higher than two opposite ends of the second side 202. Thus, when the fan 300 pivots an angle relative to the heat dissipation fin 200, the collision and interference of the fan 300 and the heat dissipation fin 200 are avoided.

It should be noted that, in the heat sink device 10 of this embodiment, the heat dissipation fin 200 is connected to the fan 300 through two air flow adjusting frames 100, but the number of the air flow adjusting frame 100 is not intended to limit the disclosure. In another embodiment of the disclosure, the heat sink device 10 may also have only one air flow adjusting frame 100 to connect the heat dissipation fin 200 with the fan 300.

FIG. 3 is a schematic exploded structural view of an air flow adjusting frame according to an embodiment of the disclosure.

As shown in FIG. 3 and FIG. 2, the air flow adjusting frame 100 of this embodiment comprises a first fixing plate 110 and a second fixing plate 120. The air flow adjusting frame 100 further comprises a pivot 140 and a holding plate 130. The first fixing plate 110 and the second fixing plate 120 are pivoted to each other through the pivot 140. The first fixing plate 110 is fixed to the heat dissipation fin 200, and the second fixing plate 120 and the holding plate 130 are combined together. The pivot 140 may be a damping pivot, so that the second fixing plate 120 is able to pivot relative to the first fixing plate 110 to a position desirable for a user and remain in such position.

The first fixing plate 110 of this embodiment has two fixing holes 112, and the first fixing plate 110 is fastened on the heat dissipation fin 200 through two locking members 111 penetrating the two fixing holes 112. The fixing hole 112 may be, but not limited to, a screw hole, and the locking member 111 may be, but not limited to, a screw.

The holding plate 130 comprises a body 1301 and two fixing portions 134 located at two opposite ends of the body 1301. The body 1301 has two fixing holes 133 thereon, and the second fixing plate 120 has two fixing holes 122. In the air flow adjusting frame 100, holding plate 130 and the second fixing plate 120 are combined together through two locking members 121 penetrating the fixing hole 133 and the fixing hole 122. The fixing hole 122 and the fixing holes 133 may be, but not limited to, a through hole, and the locking member 121 may be, but not limited to, a rivet. The two fixing portions 134 of the holding plate 130 each have a fixing hole 132, and the air flow adjusting frame 100 is fastened on the fan 300 through the two locking members 131 penetrating the fixing hole 132 so that the fan 300 and the air flow adjusting frame 100 are combined together.

The distance between the two fixing portions 134 of the holding plate 130 is designed according to the size of the fan 300. A holding plate 130 with greater interval between the two fixing portions 134 will be used, when the fan 300 is big. On the other hand, another holding plate 130 with smaller interval between the two fixing portions 134 will be used, when the fan 300 is small. That is, the holding plates 130 having different intervals between the two fixing portions 134 may be prepared to cooperate with fans 300 of various sizes.

It should be noted that, the above air flow adjusting frame 100 having the holding plate 130 is not intended to limit the disclosure. In some embodiments, the air flow adjusting frame 100 does not have any holding plate 130, and the second fixing plate 120 are directly combined to the fan 300.

FIG. 4 is a schematic view of an air flow of a heat sink device according to an embodiment of the disclosure. As shown in FIG. 4, in this embodiment, the circuit board 22 is horizontally disposed. The fan 300 of this embodiment is able to pivot relative to the heat dissipation fin 200 due to the air flow adjusting frame 100, so that an angle θ is formed between a side face of the fan 300 having the air outlet 310 and a horizontal plane. Furthermore, the angle θ is an acute angle. In other words, an acute angle is formed between the side of the fan 300 having the air outlet 310 and the circuit board 22, so that an incident angle from the air flow path, generated by the fan 300, to the circuit board 22 is an acute angle rather than a right angle. When the air flow blows from the air outlet 310 to the heat source 21 and hits the circuit board 22, the air flow rebounds off the circuit board 22 at an acute emergent angle because of the acute incident angle from the air flow path to the circuit board 22. Thus, the interference between the air flow rebounded by the circuit board 22 and the air flow generated by the fan 300 is avoided. The turbulent flow between the fan 300 and the circuit board 22 is then reduced, thereby the heat dissipation ability is improved. Therefore, according to the heat sink device 100 of this embodiment, the pivoting angle of the fan 300 relative to the heat dissipation fin 200 may be adjusted according to various heat sink conditions, so as to enable the heat sink device 100 to achieve the optimal heat dissipation ability.

The heat-dissipation structure 10 of this embodiment further has a heat conducting plate 210 and a plurality of heat conducting pipes 220, such as heat pipes. The heat conducting plate 210 is thermally contacted with the heat source 21, and the heat conducting pipe 220 is connected to the heat conducting plate 210 and the heat dissipation fin 200. The heat conducting plate 210 absorbs the heat from the heat source 21 and transfers the heat to the heat dissipation fin 200 through the heat conducting pipes 220. It should be noted that, in some embodiments, the heat dissipation fin 200 may also be directly formed on the heat conducting plate 210.

FIG. 5 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure. As this embodiment has the similar structure of the embodiment in FIG. 3, the same parts will not be repeated herein.

As shown in FIG. 5 together with FIG. 2, the holding plate 130 comprises a body 1301 and two fixing portions 134 located at two opposite ends of the body 1301. The fixing portions 134 and the body 1301 are independent members. The body 1301 has two slots 137, and each fixing portion 134 further has a fixing hole 1341 corresponding to one slot 137. The fixing portion 134 is fastened to the body 1301 through a locking member 135 penetrating the slot 137 and the fixing hole 1341. Furthermore, the slot 137 is an elongated slot, and the position of the fixing portion 134 relative to the body 1301 may be changed with the displacement of fixing portion 134 along the slot 137. Therefore, by changing the positions of the two fixing portion 134 fixed to the body 1301 to adjust the distance between the two fixing portions 134, the distance between the two fixing portions 134 may be adjusted so that the holding plate 130 can cooperate with various sizes of fans 300.

FIG. 6 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the present disclosure. As this embodiment has the similar structure of the embodiment in FIG. 3, the same parts will not be repeated herein.

As shown in FIG. 6 and FIG. 2, the air flow adjusting frame 100 of this embodiment comprises a first fixing plate 110 and a second fixing plate 120. The air flow adjusting frame 100 further comprises a pivot 140 and a holding plate 130.

The holding plate 130 comprises a body 1301 and two fixing portions 134 located at two opposite ends of the body 1301. The body 1301 has two slots 138, and two fixing holes 122 of the second fixing plate 120 correspond to the slots 138. The holding plate 130 is fastened on the second fixing plate 120 through the locking member 121 penetrating the slot 138 and the fixing hole 122. Furthermore, the slot 138 is an elongated slot in the horizontal direction, and the position of second fixing plate 120 relative to the slot 138 may be changed with the displacement of the holding plate 130. Therefore, by changing the relative position of the second fixing plate 120 with respect to the holding plate 130, the displacement of the fan 300 relative to the heat dissipation fin 200 in the horizontal direction is adjusted to achieve the optimal heat dissipation effect of the heat sink device 10.

FIG. 7 is a schematic exploded structural view of an air flow adjusting frame according to another embodiment of the disclosure. As this embodiment has the similar structure of the embodiment in FIG. 3, the same parts will not be repeated herein.

As shown in FIG. 7 and FIG. 2, the air flow adjusting frame 100 of this embodiment comprises a first fixing plate 110 and a second fixing plate 120. The air flow adjusting frame 100 further comprises a pivot 140 and a holding plate 130.

The holding plate 130 comprises a body 1301 and two fixing portions 134 located at two opposite ends of the body 1301. The body 1301 has two slots 139, and the two fixing holes 122 of the second fixing plate 120 correspond to the slots 139. The holding plate 130 is fastened to the second fixing plate 120 by the locking members 121 penetrating the slots 139 and the fixing holes 122. Furthermore, the slot 139 is an elongated slot in the vertical direction, and the position of the second fixing plate 120 relative to the holding plate 130 may be changed with the displacement of the second fixing plate 120 along the slot 139. Therefore, by changing the relative position of the second fixing plate 120 and the holding plate 130, the displacement of the fan 300 relative to the heat dissipation fin 200 in the vertical direction is adjusted achieve the optimal heat dissipation effect of the heat sink device 10.

According to the heat sink device and the air flow adjusting frame for the heat sink device of above embodiments, the fan is enabled to pivot relative to the heat dissipation fin to adjust the air flow angle of the fan due to the air flow adjusting frame. Thus, the problems including the air flow path generated by the fan being perpendicular to the circuit board, the collision of the air flow generated by the fan and the air flow rebounded off the circuit board, and the turbulent flow generated between the fan and the circuit board may be prevented. Therefore, due to the design of the air flow adjusting frame of above embodiments, the turbulent flow between the fan and the circuit board can be reduced, thereby the heat dissipation effect of the heat sink device is improved and the work load of the fan is reduced.