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Heat disspation device and control method

Title: Heat disspation device and control method.
Abstract: A heat dissipation device for cooling a heat generating component, includes a fins module, a heat pipe, a fan, at least two temperature sensors, and a control system. The heat pipe includes an evaporation section absorbing heat from the heat generating component, and a condensation section thermally connected to the fins module. The fan is for driving airflow towards the fins module. The at least two temperature sensors are arranged on the evaporation section of the heat pipe, for continuously sensing temperatures of their respective positions on the heat pipe. The control system adjusts the speed of the fan and/or the operating power of the heat generating component according to the sensed temperatures of the at least two temperature sensors. A method for controlling the heat dissipation device is also provided. ... Browse recent Foxconn Technology Co., Ltd. patents
USPTO Applicaton #: #20120292007
Inventors: Hung-nien Chiu, Ching-bai Hwang, Nien-tien Cheng

The Patent Description & Claims data below is from USPTO Patent Application 20120292007, Heat disspation device and control method.

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stats Patent Info
Application #
US 20120292007 A1
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International Class

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Foxconn Technology Co., Ltd.

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Heat Exchange   With Timer, Programmer, Time Delay, Or Condition Responsive Control   Having Heating And Cooling Capability   Means To Control Fan Or Pump To Regulate Supply Air Flow Or Supply Water Flow   Responsive To Temperature  

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