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Heat disspation device and control method

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Heat disspation device and control method

A heat dissipation device for cooling a heat generating component, includes a fins module, a heat pipe, a fan, at least two temperature sensors, and a control system. The heat pipe includes an evaporation section absorbing heat from the heat generating component, and a condensation section thermally connected to the fins module. The fan is for driving airflow towards the fins module. The at least two temperature sensors are arranged on the evaporation section of the heat pipe, for continuously sensing temperatures of their respective positions on the heat pipe. The control system adjusts the speed of the fan and/or the operating power of the heat generating component according to the sensed temperatures of the at least two temperature sensors. A method for controlling the heat dissipation device is also provided.

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USPTO Applicaton #: #20120292007 - Class: 165247 (USPTO) - 11/22/12 - Class 165 
Heat Exchange > With Timer, Programmer, Time Delay, Or Condition Responsive Control >Having Heating And Cooling Capability >Means To Control Fan Or Pump To Regulate Supply Air Flow Or Supply Water Flow >Responsive To Temperature

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The Patent Description & Claims data below is from USPTO Patent Application 20120292007, Heat disspation device and control method.

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1. Technical Field

The present disclosure generally relates to heat dissipation devices, and control method for the heat dissipation devices.

2. Description of Related Art

During operation of electronic devices such as computer central processing units (CPUs), a large amount of heat is often produced. The heat must be quickly removed from the electronic devices to prevent them from becoming unstable or being damaged. Many heat dissipation devices are employed to dissipate heat produced by the electric device. A heat dissipation device generally comprises a base attached to the electric device, a plurality of fins thermally connected to the base by heat pipes, and a fan for driving airflow towards the fins. The base is intimately attached to the CPU for absorbing the heat generated by the CPU. Most of the heat accumulated on the base is transferred to the fins by the heat pipes and then the fins are cooled by airflow driven by the fan.

To achieve high efficiency heat transfer, a fan speed of the heat dissipation device is high, which is not energy saving.

Therefore, what is needed is to provide a heat dissipation device capable of effectively improving heat dissipating efficiency under different temperatures.


Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure.

FIG. 1 is a schematic view of a heat dissipation device in accordance with an embodiment of the present disclosure.

FIG. 2 is similar to FIG. 1, but showing another aspect of the heat dissipation device.

FIG. 3 is an exploded view of the heat dissipation device of FIG. 1.

FIG. 4 is a function block diagram of the circuit of the mobile phone of FIG. 1.

FIG. 5 is a plot of the thermal resistance versus the fan speed of the heat dissipation device.

FIG. 6 is a flowchart illustrating a principle of fan speed and processor power adjustment of the heat dissipation device.


Reference will now be made to the drawings to describe the present embodiment of a heat dissipation device, in detail.

Referring to FIGS. 1-4, a heat dissipation device 10 according to an embodiment includes a fan 11, a fins module 12, a heat pipe 13, a base 14, two fixing plates 15, and a control system 16.

The fan 11 is for driving airflow towards the fins module 12. The fan 11 includes a housing 111, a hub 112 and a plurality of blades 113 radially and extending outward from the hub 112. The housing 111 defines an air outlet 1111 at a lateral side. The hub 112 and the plurality of blades 113 are received in the housing 111.

The fins module 12 is arranged adjacent to the air outlet 1111. The fins module 12 includes a plurality of fins 121 arranged in parallel to each other. Air channels 122 are formed between each two neighboring fins 121. The fins 121 each define a rectangular through hole 123 with a size matching the heat pipe 13. The through holes 123 of the plurality of fins 121 are arranged in alignment, thereby the heat pipe 13 can penetrate through the plurality of fins 121 via the through holes 123.

The heat pipe 13 has a curved shape with a flat profile. The heat pipe 13 is made of metal pipe with excellent heat conductivity and phase-change media sealed in the metal pipe. The heat pipe 13 includes an evaporation section 131 and a condensation section 132.

The evaporation section 131 of the heat pipe 13 is thermally attached to a central portion of the base 14 and fixed to the base 14 by the fixing plate 15. At least two temperature sensors 133 are arranged at different positions of the evaporation section 131. At the position where each temperature sensor 133 sits, a temperature is sensed, and a sensed result is sent to the control system 16, by the temperature sensor 133. The number of temperature sensors 133 can be two, three, four, or more. In this embodiment, there are three temperature sensors 133 arranged on the evaporation section 131.

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