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Thermal interface materials and methods for processing the same


Title: Thermal interface materials and methods for processing the same.
Abstract: A thermal interface material is provided for use to fill a gap between surfaces in a thermal transfer system to transfer heat between the surfaces. The thermal interface material includes a base material and thermally conductive particles dispersed within the base material. The thermal interface material is conditioned under reduced pressure (e.g., prior to being placed in the gap between the surfaces, while being placed in the gap, after being placed in the gap, etc.) and, within about forty-eight hours or less of conditioning, the conditioned thermal interface material is either positioned in a container that inhibits ambient gas from contacting it (either alone or applied to the surfaces), or used to transfer heat between the surfaces. As such, the thermal interface material is substantially free of cracks following exposure to thermal cycling comprising a temperature change of at least about 100 degrees Celsius for at least about 10 cycles. ... Browse recent Laird Technologies, Inc. patents
USPTO Applicaton #: #20120292005
Inventors: Karen Bruzda, Richard F. Hill, Brian Jones, Michael D. Craig



The Patent Description & Claims data below is from USPTO Patent Application 20120292005, Thermal interface materials and methods for processing the same.




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stats Patent Info
Application #
US 20120292005 A1
Publish Date
11/22/2012
Document #
13111735
File Date
05/19/2011
USPTO Class
165185
Other USPTO Classes
International Class
28F7/00
Drawings
11


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