FreshPatents.com Logo
stats FreshPatents Stats
n/a views for this patent on FreshPatents.com
Updated: April 21 2014
newTOP 200 Companies filing patents this week


    Free Services  

  • MONITOR KEYWORDS
  • Enter keywords & we'll notify you when a new patent matches your request (weekly update).

  • ORGANIZER
  • Save & organize patents so you can view them later.

  • RSS rss
  • Create custom RSS feeds. Track keywords without receiving email.

  • ARCHIVE
  • View the last few months of your Keyword emails.

  • COMPANY DIRECTORY
  • Patents sorted by company.

AdPromo(14K)

Follow us on Twitter
twitter icon@FreshPatents

Liquid cooling device

last patentdownload pdfdownload imgimage previewnext patent


20120291997 patent thumbnailZoom

Liquid cooling device


A liquid cooling device includes a heat absorbing part, a first transmitting tube, a second transmitting tube, and a heat dissipation part, wherein the heat absorbing part has a heat block, a first expansion pipe, and a second expansion pipe. The heat block is connected to an external heat-generating component, and includes a plurality of flow channels to facilitate the flow of a coolant for absorbing the heat generated from the external heat-generating component. The first expansion pipe and the second expansion pipe are connected to the heat block respectively. The first transmitting tube and the second transmitting tube are connected to the heat dissipation part respectively to form a cooling cycle among the heat absorbing part, the first transmitting tube, the second transmitting tube, and the heat dissipation part for allowing the cooling fluid to circulate in the cycle.

Inventors: Chien-An Chen, Hsing-Yu Chiang
USPTO Applicaton #: #20120291997 - Class: 16510413 (USPTO) - 11/22/12 - Class 165 
Heat Exchange > Intermediate Fluent Heat Exchange Material Receiving And Discharging Heat >Plural Intermediate Fluent Heat Exchange Materials

view organizer monitor keywords


The Patent Description & Claims data below is from USPTO Patent Application 20120291997, Liquid cooling device.

last patentpdficondownload pdfimage previewnext patent

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat-dissipating device; more particularly, the present invention relates to a liquid cooling device.

2. Description of the Related Art

A heat-dissipating device is essential for cooling high performance electronic devices as well as a built-in heat-generating device to maintain normal operation of electronic devices. In a heat-dissipating device to cool a CPU of a computer, for instance, the conventional cooling method uses a liquid cooling system. There is a chamber located inside a heat-absorbing copper component, which contacts the CPU of the heat-dissipating device to allow the cooling fluid to flow and generate a heat exchange process to cool the CPU. However, this kind of cooling system is fairly large because the chamber occupies a certain volume, and the contact area of the heat-absorbing copper and the cooling fluid is limited, which can lead to insufficient cooling.

Disclosed herein is a liquid cooling device that has a chamber with multiple depressed parts inside it to increase the contact area of the cooling fluid and the heat block. However, the chamber of the prior art still occupies quite a large volume, such that the total volume of the liquid cooling device is not reduced.

Therefore, there is a need to provide a liquid cooling device which not only omits the chamber but also increases the heat exchange area of the cooling fluid and the CPU to reduce the volume and increase the heat exchange rate of the liquid cooling device.

SUMMARY

OF THE INVENTION

It is an object of the present invention to provide a liquid cooling device with a heat block that has a plurality of flow channels inside, that can increase the heat exchange area between the cooling fluid and the external heat-generating component.

To achieve the abovementioned objects, the liquid cooling device of the present invention includes: a heat absorbing part, a first transmitting tube, a second transmitting tube, and a heat dissipation part, wherein the heat absorbing part includes a heat block, a first expansion pipe, and a second expansion pipe. The heat block, which has a plurality of flow channels inside it, is used for contacting an external heat-generating component to allow the cooling fluid to flow and to absorb heat generated by the external heat-generating component during operation. The first expansion pipe, which is connected to one side of the heat block, allows the cooling fluid to flow into the plurality of flow channels. The second expansion pipe, which is connected to the other side of the heat block, allows the cooling fluid to flow out of the plurality of flow channels. The first transmitting tube is connected to the first expansion pipe. The second transmitting tube is connected to the second expansion pipe. The heat dissipation part is connected to the first transmitting tube and the second transmitting tube to form a cooling cycle among the heat absorbing part, the heat dissipation part, the first transmitting tube, and the second transmitting tube. This cooling cycle allows the cooling fluid to circulate within it.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a schematic view of the liquid cooling device according to one embodiment of the present invention.

FIG. 2 illustrates an exploded schematic view of the heat absorbing part of the liquid cooling device according to one embodiment of the heat absorbing part of the present invention.

FIG. 3 illustrates another exploded schematic view of the heat absorbing part of the liquid cooling device according to another embodiment of the heat absorbing part of the present invention.

FIG. 4 illustrates a schematic view of the heat block according to another embodiment of the heat block of the present invention.

FIG. 5 illustrates another schematic view of the heat block according to a further embodiment of the heat block of the present invention.

FIG. 6 illustrates another schematic view of the liquid cooling device according to another embodiment of the present invention.

DETAILED DESCRIPTION

OF THE PREFERRED EMBODIMENT

The advantages and innovative features of the invention will become more apparent from the following detailed descriptions when taken together with the accompanying drawings.

Please refer to FIG. 1, which illustrates the liquid cooling device according to one embodiment of the present invention, wherein FIG. 1 illustrates a schematic view of the liquid cooling device.

As shown in FIG. 1, the liquid cooling device 1 is used for contacting an external heat-generating component 90 to dissipate heat generated by the external heat-generating component 90. The liquid cooling device 1 comprises a heat absorbing part 10, a first transmitting tube 20, a second transmitting tube 30, and a heat dissipation part 40, such that a cooling cycle is formed for allowing a cooling fluid 60 to circulate within the cooling cycle along the direction indicated by the arrow in FIG. 1.

In one embodiment of the present invention, the heat block 10 is made of, but not limited to, copper. The heat block 10 can be made of any material with high thermal conductivity. In one embodiment of the present invention, the first transmitting tube 20 and the second transmitting tube 30 can be made of either plastic or copper. The cooling fluid 60 can be a coolant or fluorinert electronic liquid such as FC72. In this embodiment, the heat dissipation part 40 includes a fan 41 and cooling fins 42, which are located next to the fan 41. The cooling fins 42 are connected to the first transmitting tube 20 and the second transmitting tube 30. The fan 41 and the cooling fans 42 are used for cooling the cooling fluid 60, and then the cooled cooling fluid 60 is transmitted into the heat absorbing part 10 again via the first transmitting tube 20 to cool the external heat-generating component 90 continuously. In one embodiment of the present invention, the external heat-generating component 90, which is in contact with the liquid cooling device 1, is a Central Processing Unit (CPU), but the present invention is not limited to that application. The liquid cooling device 1 can be in contact with any heat-generating device, such as a graphics processing chip, a south bridge chip, a north bridge chip, or other similar devices, for dissipating heat generated by the heat-generating device.



Download full PDF for full patent description/claims.

Advertise on FreshPatents.com - Rates & Info


You can also Monitor Keywords and Search for tracking patents relating to this Liquid cooling device patent application.
###
monitor keywords



Keyword Monitor How KEYWORD MONITOR works... a FREE service from FreshPatents
1. Sign up (takes 30 seconds). 2. Fill in the keywords to be monitored.
3. Each week you receive an email with patent applications related to your keywords.  
Start now! - Receive info on patent apps like Liquid cooling device or other areas of interest.
###


Previous Patent Application:
Intercooler system
Next Patent Application:
Microchannel hybrid evaporator
Industry Class:
Heat exchange
Thank you for viewing the Liquid cooling device patent info.
- - - Apple patents, Boeing patents, Google patents, IBM patents, Jabil patents, Coca Cola patents, Motorola patents

Results in 0.50355 seconds


Other interesting Freshpatents.com categories:
QUALCOMM , Monsanto , Yahoo , Corning , -g2-0.2268
     SHARE
  
           

FreshNews promo


stats Patent Info
Application #
US 20120291997 A1
Publish Date
11/22/2012
Document #
13431478
File Date
03/27/2012
USPTO Class
16510413
Other USPTO Classes
16510421
International Class
28D15/00
Drawings
6



Follow us on Twitter
twitter icon@FreshPatents