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Structure of heat sink

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Structure of heat sink


An improved structure of heat sink, which comprising: a heat conduction layer and cooling fins; the heat conduction layer of an elongated shape is designed in a manner that a heat source is incorporated into the central zone, and convection holes with equidistant arrangement are distributed peripherally; every convection hole is of obround shape and located in parallel with the long side of the heat conduction layer; the cooling fins are arranged into sheets and attached below the heat conduction layer, with the length the same as the long side of the heat conduction layer, namely, the cooling, fins are arranged in parallel with the long side of the heat conduction layer.

Inventor: Yao-Tung Chen
USPTO Applicaton #: #20120285672 - Class: 165185 (USPTO) - 11/15/12 - Class 165 
Heat Exchange > Heat Transmitter

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The Patent Description & Claims data below is from USPTO Patent Application 20120285672, Structure of heat sink.

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BACKGROUND OF INVENTION

1. Field of the Invention

The present invention relates generally to a charging cup, and more particularly to an innovative one which is designed into an electric model.

The present invention also relates generally to an aluminum extruded heat sink, and more particularly to an innovative one which can be used to improve the heat transfer efficiency.

2. Description of Related Art

As illustrated in FIG. 1, a conventional aluminum extruded heat sink 1 structurally comprises: a heat conduction layer 2 and cooling fins 3. Of which, the heat conduction layer 2 is used for heat transfer, and the cooling fins 3 for heat dissipation; the elongated heat conduction layer 2 is designed in a manner that a heat source 20 is incorporated into the central zone, and convection holes 21 with equidistant arrangement are distributed peripherally; every convection hole is of obround shape and located in parallel with the short side of the heat conduction layer 2; the cooling fins 3 are arranged into sheets and attached below the heat conduction layer 2, with the length the same as the long side of the heat conduction layer 2, namely, the cooling fins 3 are arranged in parallel with the long side of the heat conduction layer 2, but inconsistently with the opening direction of the convection holes 21.

Said aluminum extruded heat sink is extensively applied to various electronic products, enabling rapid heat dissipation via the combination of the heat conduction layer and cooling fin; however, the following shortcomings are observed during actual applications:

Thus, to overcome said problems of the prior art, it would be an advancement if the art to provide an improved structure that can significantly improve the efficacy.

Therefore, the inventor has provided the present invention of practicability after deliberate design and evaluation based on years of experience in the production, development and design of related products.

SUMMARY

OF THE INVENTION

The primary objective of the present invention is to provide an improved structure of heat sink, which could further enhance overall heat dissipation efficiency and effect by amending the heat transfer direction of the heat conduction layer and cooling fins.

The heat sink of the present invention comprises: heat conduction layer and cooling fins; of which the elongated heat conduction layer is designed in a manner that a heat source is incorporated into the central zone, and convection holes with equidistant arrangement are distributed peripherally; every convection hole is of obround shape and located in parallel with the long side of the heat conduction layer; the cooling fins are arranged into sheets and attached below the heat conduction layer, with the length the same as the long side of the heat conduction layer, namely, the cooling fins are arranged in parallel with the long side of the heat conduction layer; with this design, as the opening direction of all convection holes on the heat conduction layer is the same as that of the cooling fins attached underneath, better heat transfer efficiency could be realized, and the heat dissipation efficiency and effect could thus be enhanced since no heat is blocked by the convection holes when the heat source is transferred to both sides or downwards under the guide of the heat conduction layer.

The purposes and efficacies of the present invention will be more readily understood upon a thoughtful deliberation of the following detailed description of a preferred embodiment of the present invention with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1: a schematic view showing the external structure and heat transfer direction of a conventional aluminum extruded heat sink.

FIG. 2: a schematic view showing partial structure based on FIG. 1.

FIG. 3: a schematic view showing the external structure and heat transfer direction of a preferred embodiment of the present invention.

FIG. 4: a schematic view showing partial structure of heat sink based on FIG. 3.

DETAILED DESCRIPTION

OF THE INVENTION

FIGS. 3˜4 illustrate a schematic view showing external structure, heat transfer direction and partial structure of a preferred embodiment of the present invention; referring to FIG. 3, the heat sink 1 comprises:

a heat conduction layer 2 of an elongated shape, which is designed in a manner that a heat source 20 is incorporated into the central zone, and convection holes 21 with equidistant arrangement are distributed. peripherally; every convection hole 21 is of obround shape and located in parallel with the long side of the heat conduction layer 2;

cooling fins 3, arranged into sheets and attached below the heat conduction layer 2, with the length the same as the long side of the heat conduction layer 2, namely, the cooling fins are arranged in parallel with the long side of the heat conduction layer 2.

Said units form an improved structure of heat sink; and referring to FIG. 4, the opening direction of all convection holes 21 on the heat conduction layer 2 is the same as that of the cooling fins attached underneath. As the heat source 20 is preset at the center of the heat conduction layer 2, the heat transfer is guided outwards or downwards from the center; and no heat transfer area is blocked to affect heat transfer since the opening direction of convection holes 21 on the heat conduction layer 2 is the same as the heat transfer direction; meanwhile, the direction of the cooling fins 3 underneath the heat conduction layer 2 is the same as the opening direction of the convection holes 21, the heat dissipation area will not be blocked, thus improving substantially the heat transfer and heat dissipation efficiency.

To sum up, the “improved structure of heat sink” of the present invention could improve actually the heat transfer and heat dissipation efficiency with great industrial benefits and applicability, and no equivalent or similar models are currently marketed, so the claims for the utility model are made hereunder.

The above-specified is only a detailed description of the preferred embodiment of the present invention. However, it is understood that all equivalent variations or changes based on the descriptions and drawings of the present invention shall be embraced within the scope of the following claims.



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Previous Patent Application:
Nanostructured composite polymer thermal/electrical interface material and method for making the same
Next Patent Application:
Thermal conductive sheet, insulating sheet, and heat dissipating member
Industry Class:
Heat exchange
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stats Patent Info
Application #
US 20120285672 A1
Publish Date
11/15/2012
Document #
13106744
File Date
05/12/2011
USPTO Class
165185
Other USPTO Classes
International Class
28F7/00
Drawings
5



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