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Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate




Title: Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate.
Abstract: Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided. ...


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USPTO Applicaton #: #20120276392
Inventors: Yoshihiro Takahashi, Yasuo Kamigata, Hikari Murai, Masahiro Aoshima, Shinji Tsuchikawa, Masato Miyatake, Tomohiko Kotake, Hiroyuki Izumi


The Patent Description & Claims data below is from USPTO Patent Application 20120276392, Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate.




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stats Patent Info
Application #
US 20120276392 A1
Publish Date
11/01/2012
Document #
13518578
File Date
12/24/2010
USPTO Class
428418
Other USPTO Classes
524105, 523455, 156 60, 427 58, 428457
International Class
/
Drawings
0


Varnish

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20121101|20120276392|thermosetting resin composition, producing resin composition varnish, prepreg and laminate|Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting |Hitachi-Chemical-Company-Ltd
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