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Method for fabricating fluid ejection device




Title: Method for fabricating fluid ejection device.
Abstract: Disclosed is a method for fabricating a fluid ejection device that includes forming a drive circuitry layer on a substrate and fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and filling each slot of the at least one slot with a protective material. Additionally, the method includes grinding the substrate from a bottom portion thereof. Moreover, the method includes removing the protective material from the each slot. Further, the method includes depositing a layer of a polymeric bonding material on a bottom surface of the substrate. Furthermore, the method includes attaching a manifold chip to the layer of the polymeric bonding material. The method also includes laminating a flow feature layer and a nozzle plate over the substrate. Further disclosed are an ejection chip and a method for fabricating the ejection chip. ...


USPTO Applicaton #: #20120273594
Inventors: David Bernard, Andrew Mcnees, James Mrvos


The Patent Description & Claims data below is from USPTO Patent Application 20120273594, Method for fabricating fluid ejection device.




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stats Patent Info
Application #
US 20120273594 A1
Publish Date
11/01/2012
Document #
13097566
File Date
04/29/2011
USPTO Class
239390
Other USPTO Classes
298901
International Class
/
Drawings
12




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Fluid Sprinkling, Spraying, And Diffusing   Plural Interchangeable Discharge Modifiers, Outlet Arrangements Or Coupling Means  

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20121101|20120273594|fabricating fluid ejection device|Disclosed is a method for fabricating a fluid ejection device that includes forming a drive circuitry layer on a substrate and fabricating at least one fluid ejection element on the substrate. Furthermore, the method includes forming at least one slot within a top portion of the substrate, and filling each |
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